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B131014

包装:散装 类别:静电控制,防静电,ESD,无尘室产品 静电控制屏蔽包,防静电袋、物料 描述:B131014 CLEAR SILVER SHIELD-IT M

Botron Company Inc.

Botron Company Inc.

Botron Company Inc.

B131024

包装:袋 类别:静电控制,防静电,ESD,无尘室产品 静电控制屏蔽包,防静电袋、物料 描述:B131024 CLEAR SILVER SHIELD-IT M

Botron Company Inc.

Botron Company Inc.

Botron Company Inc.

B131030

包装:袋 类别:静电控制,防静电,ESD,无尘室产品 静电控制屏蔽包,防静电袋、物料 描述:B131030 CLEAR SILVER SHIELD-IT M

Botron Company Inc.

Botron Company Inc.

Botron Company Inc.

C1310

SurfaceMountPackageReflowProcessCompatibleAT-CutCrystalSONETMinimumClockSpecification

Features SurfaceMountPackage ReflowProcessCompatible AT-CutCrystal SONETMinimumClockSpecification LowPhaseNoise TightTolerances TypicalApplications BaseStations TestEquipment Synthesizers)

Vectron

Vectron International, Inc

C1310

TypicalApplications

Vectron

Vectron International, Inc

C1310

CONTROLCABLE

6C20AWG26/34TCRUBBEROASRUBBERCONTROLCABLE

GENERALGeneral Electric

通用电气公司美国通用电气公司

CC1310

SimpleLinkUltralowPowerSub-1-GHzWirelessMCU

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CC1310

CC2652R7SimpleLink??Multiprotocol2.4GHzWirelessMCU

TITexas Instruments

德州仪器美国德州仪器公司

CC1310

CC2651P3SimpleLink??Single-Protocol2.4GHzWirelessMCUWithIntegratedPowerAmplifier

TITexas Instruments

德州仪器美国德州仪器公司

CC1310

CC2652PSIPSimpleLink??Multiprotocol2.4-GHzWirelessSystem-in-PackageWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4Fprocessor •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •Dynamicmultiprotocolmanager(

TITexas Instruments

德州仪器美国德州仪器公司

CC1310

CC2642R-Q1SimpleLink™Bluetooth®5.2LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Powerful48-MHzArm®Cortex®-M4processor •EEMBCCoreMark®score:148 •352KBflashprogrammemory •256KBofROMforprotocolsandlibraryfunctions •8KBofcacheSRAM •80KBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation •2-

TITexas Instruments

德州仪器美国德州仪器公司

CC1310

CC2674R10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CC1310

UltraLowPowersub1GHzMultichannelsRadioTransceiver

Feature: IEEE802.15.4gmodeswitchsupport UltraLowconsumptiontechnology PowerfulARMCortexM3 SupportedbytheopenplatformContiki6LoWPAN. VerySmallsize

ETC1List of Unclassifed Manufacturers

etc未分类制造商未分类制造商

CC1310

CC2674P10SimpleLink™High-PerformanceMultiprotocol2.4-GHzWirelessMCUwithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TITexas Instruments

德州仪器美国德州仪器公司

CC1310

CC1354P10SimpleLink™High-PerformanceMulti-bandWirelessMCUWithIntegratedPowerAmplifier

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CC1310

CC2340R5-Q1SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •AEC-Q100Grade2qualifiedforAutomotive applications •Optimized48-MHzArm®Cortex®-M0+processor •512KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •36KBofultra-lowleakageSRAM.FullRAM retentioninstandbymod

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CC1310

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CC1310

CC2340R2SimpleLink™Bluetooth®5.3LowEnergyWirelessMCU

1Features Wirelessmicrocontroller •Optimized48-MHzArm®Cortex®-M0+processor •256KBofin-systemprogrammableflash •12KBofROMforbootloaderanddrivers •28KBofultra-lowleakageSRAM.FullRAM retentioninstandbymode •2.4GHzRFtransceivercompatiblewith Bluetooth®5.3

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CC1310

CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU

1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis

TI1Texas Instruments(TI)

德州仪器德州仪器 (TI)

CCM1310

PowerEntryModules

MACOM

Tyco Electronics

产品属性

  • 产品编号:

    B131024

  • 制造商:

    Botron Company Inc.

  • 类别:

    静电控制,防静电,ESD,无尘室产品 > 静电控制屏蔽包,防静电袋、物料

  • 系列:

    B13000

  • 包装:

  • 类型:

    静电屏蔽袋

  • 金属层:

    内层

  • 静电放电屏蔽:

    <50nJ

  • 闭合系统:

    用户定义的 - 夹,热密封,磁带

  • 厚度:

    3.0 mil(76.2 微米)

  • 长度 - 内部:

    24"(609.6mm)

  • 宽度 - 内部:

    10"(254mm)

  • 拉伸强度:

    5500 psi

  • 颜色:

  • 描述:

    B131024 CLEAR SILVER SHIELD-IT M

供应商型号品牌批号封装库存备注价格
CANADA
21+
BGA
20000
全新原装 公司现货 价优
询价
CANADA
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
CANADA
22+
BGA
50000
只做原装正品,假一罚十,欢迎咨询
询价
DBLECTRO
23+
原厂原包
29960
只做进口原装 终端工厂免费送样
询价
General Devices
132
公司优势库存 热卖中!!
询价
MITSUBISHI
TO-220F
68900
原包原标签100%进口原装常备现货!
询价
MITSUBISHI
2023+
TO-220F
8700
原装现货
询价
2016+
5632
只做进口原装正品!现货或者订货一周货期!只要要网上有
询价
2023+
SOP
80000
一级代理/分销渠道价格优势 十年芯程一路只做原装正品
询价
23+
原厂正规渠道
5000
专注配单,只做原装进口现货
询价
更多B1310供应商 更新时间2024-11-22 18:42:00