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产品型号CBGA的Datasheet PDF文件预览

CERAMIC / HERMETIC  
data sheet  
CBGA  
The CBGA offers a variety of features. From  
innovative designs and expanding package  
offerings, Amkor provides a platform from  
prototype-to-production.  
Ceramic Ball Grid Array  
Features:  
Package (CBGA)  
Amkor's CBGAs incorporate the most advanced  
assembly processes and designs for today and  
tomorrow's cost/performance applications. This  
advanced IC package technology allows  
application and design engineers to optimize  
innovations while maximizing the performance  
characteristics of semiconductors (Si & GaAs).  
Amkor's CBGAs are designed for low inductance,  
improved thermal operation and enhanced  
SMT-ability. Custom performance enhancements,  
such as ground and power planes, are available  
for significant improvements in electrical response  
demanded by advancing electronics. Additionally,  
these CBGAs utilize industry proven, semiconductor  
grade materials for reliable, long-term operation  
while providing the user flexible design parame-  
ters. The CBGA is a ceramic substrate package. It  
consist of a ceramic substrate which is covered  
with a B-Staged epoxy lid or by encapsulating it.  
Flexible ball counts  
10mm to 35mm body sizes  
1.0, 1.27, 1.5mm ball pitch available  
Eutectic (63/37) solder balls  
Perimeter, stagger and full ball arrays  
Special packaging for memory available  
6 mil coplanarity  
Multi-layer, ground/power  
Cavity lid seal or encapsulation  
Full in-house design capability  
JEDEC MO-151 standard outlines  
High thermal conductive ceramic  
Applications:  
Semiconductor technologies find enhanced  
performance by using the integrated design  
features of Amkor's CBGAs. Microprocessors/con-  
trollers, ASICs, Gate Arrays, memory, DSPs and PC  
chip sets find Amkor's CBGA family to be an ideal  
package. Applications requiring improved  
portability, form-factor/size and high-performance  
such as cellular, wireless, PCMCIA cards, laptop  
PC's, video cameras, disc drives, power amplifiers  
and other similar products benefit from Amkor's  
CBGA attributes.  
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND  
TO VIEW THE MOST CURRENT PRODUCT INFORMATION  
.
DS800  
Rev Date: 08’02  
www.amkor.com  
配单直通车
CBG201209U500产品参数
型号:CBG201209U500
生命周期:Active
IHS 制造商:FENGHUA ADVANCED TECHNOLOGY
Reach Compliance Code:unknown
风险等级:5.77
滤波器类型:FERRITE CHIP
Base Number Matches:1
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