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  • 北京元坤伟业科技有限公司

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产品型号CD4001BMTE4的Datasheet PDF文件预览

The CD4001B, CD4002B, and CD4025B  
types are supplied in 14-lead hermetic  
dual-in-line ceramic packages (F3A  
suffix), 14-lead dual-in-line plastic  
packages (E suffix), 14-lead small-outline  
packages (M, MT, M96, and NSR suffixes),  
and 14-lead thin shrink small-outline  
packages (PW and PWR suffixes).  
Copyright © 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
7704403CA  
89263AKB3T  
CD4001BE  
ACTIVE  
OBSOLETE  
ACTIVE  
CDIP  
CFP  
J
WR  
N
14  
16  
14  
14  
14  
14  
14  
14  
1
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
PDIP  
PDIP  
CDIP  
CDIP  
CDIP  
SOIC  
25  
25  
1
Pb-Free (RoHS)  
Pb-Free (RoHS)  
TBD  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CD4001BEE4  
CD4001BF  
ACTIVE  
N
ACTIVE  
J
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
CD4001BF3A  
CD4001BF3AS2534  
CD4001BM  
ACTIVE  
J
1
TBD  
OBSOLETE  
ACTIVE  
J
TBD  
Call TI  
D
50  
2500  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CD4001BM96  
CD4001BM96E4  
CD4001BM96G4  
CD4001BME4  
CD4001BMG4  
CD4001BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
50  
Green (RoHS  
& no Sb/Br)  
D
250  
250  
250  
2000  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CD4001BMTE4  
CD4001BMTG4  
CD4001BNSR  
CD4001BNSRE4  
CD4001BNSRG4  
CD4001BPW  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
NS  
NS  
PW  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CD4001BPWE4  
CD4001BPWG4  
CD4001BPWR  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
14  
14  
14  
14  
14  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CD4001BPWRE4  
CD4001BPWRG4  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CD4002BE  
CD4002BEE4  
CD4002BF  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
CDIP  
CDIP  
SOIC  
N
N
J
14  
14  
14  
14  
14  
25  
25  
1
Pb-Free (RoHS)  
Pb-Free (RoHS)  
TBD  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
CD4002BF3A  
CD4002BM  
J
1
TBD  
D
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CD4002BM96  
CD4002BM96E4  
CD4002BM96G4  
CD4002BME4  
CD4002BMG4  
CD4002BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
50  
Green (RoHS  
& no Sb/Br)  
D
250  
250  
250  
2000  
Green (RoHS  
& no Sb/Br)  
CD4002BMTE4  
CD4002BMTG4  
CD4002BNSR  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CD4002BNSRE4  
CD4002BNSRG4  
CD4002BPW  
SO  
NS  
NS  
14  
14  
14  
14  
14  
14  
14  
14  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
SO  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
PW  
Green (RoHS  
& no Sb/Br)  
CD4002BPWE4  
CD4002BPWG4  
CD4002BPWR  
CD4002BPWRE4  
CD4002BPWRG4  
90  
Green (RoHS  
& no Sb/Br)  
90  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CD4025BE  
CD4025BEE4  
CD4025BF  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
CDIP  
CDIP  
SOIC  
N
N
J
14  
14  
14  
14  
14  
25  
25  
1
Pb-Free (RoHS)  
Pb-Free (RoHS)  
TBD  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
CD4025BF3A  
CD4025BM  
J
1
TBD  
D
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CD4025BM96  
CD4025BM96E4  
CD4025BM96G4  
CD4025BME4  
CD4025BMG4  
CD4025BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
2500  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
50  
Green (RoHS  
& no Sb/Br)  
250  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CD4025BMTE4  
CD4025BMTG4  
CD4025BNSR  
SOIC  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
250  
250  
2000  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
D
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
NS  
NS  
NS  
PW  
PW  
PW  
Green (RoHS  
& no Sb/Br)  
CD4025BNSRE4  
CD4025BNSRG4  
CD4025BPW  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
Green (RoHS  
& no Sb/Br)  
CD4025BPWE4  
CD4025BPWG4  
90  
Green (RoHS  
& no Sb/Br)  
90  
Green (RoHS  
& no Sb/Br)  
JM38510/05252BCA  
JM38510/05254BCA  
M38510/05252BCA  
M38510/05254BCA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
J
J
J
J
14  
14  
14  
14  
1
1
1
1
TBD  
TBD  
TBD  
TBD  
A42  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Jan-2012  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF CD4001B, CD4001B-MIL, CD4002B, CD4002B-MIL, CD4025B, CD4025B-MIL :  
Catalog: CD4001B, CD4002B, CD4025B  
Military: CD4001B-MIL, CD4002B-MIL, CD4025B-MIL  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 5  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4001BM96  
CD4001BMT  
CD4001BNSR  
CD4001BPWR  
CD4002BM96  
CD4002BMT  
CD4002BNSR  
CD4002BPWR  
CD4025BM96  
CD4025BMT  
CD4025BNSR  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
250  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
16.4  
6.5  
6.5  
8.2  
6.9  
6.5  
6.5  
8.2  
6.9  
6.5  
6.5  
8.2  
9.0  
9.0  
2.1  
2.1  
2.5  
1.6  
2.1  
2.1  
2.5  
1.6  
2.1  
2.1  
2.5  
8.0  
8.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
NS  
PW  
D
2000  
2000  
2500  
250  
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SOIC  
SO  
9.0  
8.0  
D
9.0  
8.0  
NS  
PW  
D
2000  
2000  
2500  
250  
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SOIC  
SO  
9.0  
8.0  
D
9.0  
8.0  
NS  
2000  
10.5  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4001BM96  
CD4001BMT  
CD4001BNSR  
CD4001BPWR  
CD4002BM96  
CD4002BMT  
CD4002BNSR  
CD4002BPWR  
CD4025BM96  
CD4025BMT  
CD4025BNSR  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
38.0  
35.0  
38.0  
38.0  
38.0  
35.0  
38.0  
38.0  
38.0  
NS  
PW  
D
2000  
2000  
2500  
250  
TSSOP  
SOIC  
SOIC  
SO  
D
NS  
PW  
D
2000  
2000  
2500  
250  
TSSOP  
SOIC  
SOIC  
SO  
D
NS  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
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配单直通车
CD4001BMTE4产品参数
型号:CD4001BMTE4
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:SOIC
包装说明:GREEN, PLASTIC, SOIC-14
针数:14
Reach Compliance Code:unknown
HTS代码:8542.39.00.01
风险等级:5.03
Is Samacsys:N
系列:4000/14000/40000
JESD-30 代码:R-PDSO-G14
JESD-609代码:e4
长度:8.65 mm
负载电容(CL):50 pF
逻辑集成电路类型:NOR GATE
湿度敏感等级:1
功能数量:4
输入次数:2
端子数量:14
最高工作温度:125 °C
最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP14,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260
电源:5/15 V
Prop。Delay @ Nom-Sup:250 ns
传播延迟(tpd):250 ns
认证状态:Not Qualified
施密特触发器:NO
座面最大高度:1.75 mm
子类别:Gates
最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:CMOS
温度等级:MILITARY
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mm
Base Number Matches:1
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