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产品型号CD4001UBM96的概述

芯片CD4001UBM96的概述 CD4001UBM96是一款经典的数字集成电路,属于CD40XX系列。该系列的芯片广泛应用于各种数学运算和逻辑控制结构中。CD4001UBM96包含四个双输入的与非门(NAND Gate),每个与非门都能实现逻辑运算,使其在数字逻辑设计中扮演重要角色。随着电子技术的快速发展,该芯片仍然占据了一定的市场份额,适用于多种应用场景,包括计算机接口、信号处理和控制系统。 芯片CD4001UBM96的详细参数 CD4001UBM96的参数如下: 1. 工作电压范围:3V至15V 2. 输入电流:最大为1µA 3. 输出电流:最大为25mA 4. 逻辑功能:四个双输入的与非门 5. 扇出(Fan-out):可驱动两个相同或四个不同的负载 6. 工作温度范围:-55°C至125°C 7. 封装类型:14引脚双列直插式封装 8. 功耗:低功耗设计,适合移动设备和电池供...

产品型号CD4001UBM96的Datasheet PDF文件预览

The CD4001UB types are supplied in  
14-lead hermetic dual-in-line ceramic  
packages (F3A suffix), 14-lead dual-in-line  
plastic packages (E suffix), 14-lead  
small-outline packages (M, MT, M96, and  
NSR suffixes), and 14-lead thin shrink  
small-outline packages (PW and PWR  
suffixes).  
Copyright © 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Nov-2009  
PACKAGING INFORMATION  
Orderable Device  
CD4001UBE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4001UBEE4  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4001UBF  
CD4001UBF3A  
CD4001UBM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4001UBM96  
CD4001UBM96E4  
CD4001UBM96G4  
CD4001UBME4  
CD4001UBMG4  
CD4001UBMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4001UBMTE4  
CD4001UBMTG4  
CD4001UBPW  
SOIC  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4001UBPWE4  
CD4001UBPWR  
CD4001UBPWRE4  
CD4001UBPWRG4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Nov-2009  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4001UBM96  
CD4001UBMT  
CD4001UBPWR  
SOIC  
SOIC  
D
D
14  
14  
14  
2500  
250  
330.0  
330.0  
330.0  
16.4  
16.4  
12.4  
6.5  
6.5  
6.9  
9.0  
9.0  
5.6  
2.1  
2.1  
1.6  
8.0  
8.0  
8.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
TSSOP  
PW  
2000  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4001UBM96  
CD4001UBMT  
CD4001UBPWR  
SOIC  
SOIC  
D
D
14  
14  
14  
2500  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
35.0  
TSSOP  
PW  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
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Communications and Telecom www.ti.com/communications  
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Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
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Microcontrollers  
RFID  
power.ti.com  
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www.ti.com/video  
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Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  
配单直通车
CD4001UBM96产品参数
型号:CD4001UBM96
Brand Name:Texas Instruments
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:SOIC
包装说明:SOP, SOP14,.25
针数:14
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
Factory Lead Time:6 weeks
风险等级:0.68
系列:4000/14000/40000
JESD-30 代码:R-PDSO-G14
JESD-609代码:e4
长度:8.65 mm
负载电容(CL):50 pF
逻辑集成电路类型:NOR GATE
最大I(ol):0.0068 A
湿度敏感等级:1
功能数量:4
输入次数:2
端子数量:14
最高工作温度:125 °C
最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP14,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
包装方法:TR
峰值回流温度(摄氏度):260
电源:5/15 V
最大电源电流(ICC):0.03 mA
Prop。Delay @ Nom-Sup:120 ns
传播延迟(tpd):120 ns
认证状态:Not Qualified
施密特触发器:NO
座面最大高度:1.75 mm
子类别:Gates
最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:CMOS
温度等级:MILITARY
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.91 mm
Base Number Matches:1
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