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产品型号CD4043BPWRE4的Datasheet PDF文件预览

The CD4043B and CD4044B types are supplied  
in 16-lead hermetic dual-in-line ceramic  
packages (F3A suffix), 16-lead dual-in-line  
plastic  
packages  
(E  
suffix),  
16-lead  
small-outline packages (D, DR, DT, DW, DWR,  
and NSR suffixes), and 16-lead thin shrink  
small-outline packages (PW and PWR  
suffixes).  
Copyright 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Nov-2009  
PACKAGING INFORMATION  
Orderable Device  
CD4043BD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4043BDE4  
CD4043BDG4  
CD4043BDR  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4043BDRE4  
CD4043BDRG4  
CD4043BDT  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4043BDTE4  
CD4043BDTG4  
CD4043BDW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
DW  
DW  
DW  
DW  
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4043BDWE4  
CD4043BDWG4  
CD4043BDWR  
CD4043BDWRE4  
CD4043BDWRG4  
CD4043BE  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
25  
1
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4043BEE4  
N
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4043BF3A  
CD4043BF3AS2534  
CD4043BM  
ACTIVE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
SOIC  
SO  
J
J
16  
16  
16  
16  
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
Call TI  
Call TI  
Call TI  
D
Call TI  
CD4043BNSR  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4043BNSRE4  
CD4043BNSRG4  
CD4043BPWR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
NS  
16  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4043BPWRE4  
CD4043BPWRG4  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Nov-2009  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
CD4044BD  
CD4044BDE4  
CD4044BDG4  
CD4044BDR  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4044BDRE4  
CD4044BDRG4  
CD4044BDT  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4044BDTE4  
CD4044BDTG4  
CD4044BDW  
CD4044BDWE4  
CD4044BDWG4  
CD4044BE  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
DW  
N
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4044BEE4  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4044BF  
CD4044BF3A  
CD4044BF3AS2534  
CD4044BM  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CDIP  
SOIC  
SO  
J
J
16  
16  
16  
16  
16  
1
1
TBD  
TBD  
TBD  
TBD  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
A42  
OBSOLETE  
OBSOLETE  
ACTIVE  
J
Call TI  
Call TI  
D
Call TI  
CD4044BNSR  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4044BNSRE4  
CD4044BNSRG4  
CD4044BPWR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
NS  
16  
16  
16  
16  
16  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4044BPWRE4  
CD4044BPWRG4  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Nov-2009  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-Jul-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4043BDR  
CD4043BDWR  
CD4043BNSR  
CD4043BPWR  
CD4044BDR  
SOIC  
SOIC  
SO  
D
16  
16  
16  
16  
16  
16  
16  
2500  
2000  
2000  
2000  
2500  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
6.5  
10.3  
2.1  
2.7  
2.5  
1.6  
2.1  
2.5  
1.6  
8.0  
12.0  
12.0  
8.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
DW  
NS  
PW  
D
10.75 10.7  
8.2  
7.0  
6.5  
8.2  
7.0  
10.5  
5.6  
TSSOP  
SOIC  
SO  
10.3  
10.5  
5.6  
8.0  
CD4044BNSR  
CD4044BPWR  
NS  
PW  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-Jul-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4043BDR  
CD4043BDWR  
CD4043BNSR  
CD4043BPWR  
CD4044BDR  
SOIC  
SOIC  
SO  
D
16  
16  
16  
16  
16  
16  
16  
2500  
2000  
2000  
2000  
2500  
2000  
2000  
333.2  
346.0  
346.0  
346.0  
333.2  
346.0  
346.0  
345.9  
346.0  
346.0  
346.0  
345.9  
346.0  
346.0  
28.6  
33.0  
33.0  
29.0  
28.6  
33.0  
29.0  
DW  
NS  
PW  
D
TSSOP  
SOIC  
SO  
CD4044BNSR  
CD4044BPWR  
NS  
PW  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
PACKAGING INFORMATION  
Orderable Device  
CD4043BD  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
CDIP  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
A42  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
CD4043BM  
CD4043BDG4  
CD4043BDR  
CD4043BDRG4  
CD4043BDT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
40  
2500  
2500  
250  
40  
Green (RoHS  
& no Sb/Br)  
CD4043BM  
CD4043BM  
CD4043BM  
CD4043BM  
CD4043BM  
CD4043BM  
CD4043BM  
CD4043BE  
CD4043BE  
CD4043BF3A  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
CD4043BDW  
CD4043BDWE4  
CD4043BDWR  
CD4043BE  
DW  
DW  
DW  
N
Green (RoHS  
& no Sb/Br)  
40  
Green (RoHS  
& no Sb/Br)  
2000  
25  
Green (RoHS  
& no Sb/Br)  
Pb-Free  
(RoHS)  
CD4043BEE4  
CD4043BF3A  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
J
1
TBD  
N / A for Pkg Type  
CD4043BF3AS2534  
CD4043BM  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
SOIC  
SO  
J
D
16  
16  
16  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-55 to 125  
-55 to 125  
CD4043BNSR  
NS  
2000  
2000  
2000  
2000  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
CD4043B  
CD4043B  
CM043B  
CD4043BNSRE4  
CD4043BPWR  
CD4043BPWRE4  
CD4044BD  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
PW  
PW  
D
16  
16  
16  
16  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
TSSOP  
TSSOP  
SOIC  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CM043B  
Green (RoHS  
& no Sb/Br)  
CD4044BM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
CD4044BDG4  
CD4044BDR  
CD4044BDRE4  
CD4044BDT  
CD4044BDW  
CD4044BE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
D
16  
16  
16  
16  
16  
16  
16  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
CD4044BM  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
2500  
2500  
250  
40  
Green (RoHS  
& no Sb/Br)  
CD4044BM  
CD4044BM  
CD4044BM  
CD4044BM  
CD4044BE  
CD4044BE  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
DW  
N
Green (RoHS  
& no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CD4044BEE4  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
CD4044BF  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
16  
16  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4044BF  
CD4044BF3A  
TBD  
CD4044BF3A  
CD4044BF3AS2534  
CD4044BM  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
SOIC  
SO  
J
D
16  
16  
16  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-55 to 125  
-55 to 125  
CD4044BNSR  
NS  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
CD4044B  
CM044B  
CM044B  
CD4044BPWR  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
16  
16  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
CD4044BPWRG4  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Jun-2014  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF CD4043B, CD4043B-MIL, CD4044B, CD4044B-MIL :  
Catalog: CD4043B, CD4044B  
Military: CD4043B-MIL, CD4044B-MIL  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4043BDR  
CD4043BDWR  
CD4043BNSR  
CD4043BPWR  
CD4044BDR  
SOIC  
SOIC  
SO  
D
16  
16  
16  
16  
16  
16  
16  
2500  
2000  
2000  
2000  
2500  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
6.5  
10.3  
2.1  
2.7  
2.5  
1.6  
2.1  
2.5  
1.6  
8.0  
12.0  
12.0  
8.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
DW  
NS  
PW  
D
10.75 10.7  
8.2  
6.9  
6.5  
8.2  
6.9  
10.5  
5.6  
TSSOP  
SOIC  
SO  
10.3  
10.5  
5.6  
8.0  
CD4044BNSR  
CD4044BPWR  
NS  
PW  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4043BDR  
CD4043BDWR  
CD4043BNSR  
CD4043BPWR  
CD4044BDR  
SOIC  
SOIC  
SO  
D
16  
16  
16  
16  
16  
16  
16  
2500  
2000  
2000  
2000  
2500  
2000  
2000  
333.2  
367.0  
367.0  
367.0  
333.2  
367.0  
367.0  
345.9  
367.0  
367.0  
367.0  
345.9  
367.0  
367.0  
28.6  
38.0  
38.0  
35.0  
28.6  
38.0  
35.0  
DW  
NS  
PW  
D
TSSOP  
SOIC  
SO  
CD4044BNSR  
CD4044BPWR  
NS  
PW  
TSSOP  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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Copyright © 2014, Texas Instruments Incorporated  
配单直通车
CD4043BPWRE4产品参数
型号:CD4043BPWRE4
Brand Name:Texas Instruments
是否Rohs认证: 符合
生命周期:Obsolete
零件包装代码:TSSOP
包装说明:TSSOP, TSSOP16,.25
针数:16
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
风险等级:5.48
系列:4000/14000/40000
JESD-30 代码:R-PDSO-G16
JESD-609代码:e4
长度:5 mm
负载电容(CL):50 pF
逻辑集成电路类型:R-S LATCH
湿度敏感等级:1
位数:4
功能数量:1
端子数量:16
最高工作温度:125 °C
最低工作温度:-55 °C
输出特性:3-STATE
输出极性:TRUE
封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP
封装等效代码:TSSOP16,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260
电源:5/15 V
Prop。Delay @ Nom-Sup:300 ns
传播延迟(tpd):300 ns
认证状态:Not Qualified
座面最大高度:1.2 mm
子类别:FF/Latches
最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:CMOS
温度等级:MILITARY
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:HIGH LEVEL
宽度:4.4 mm
Base Number Matches:1
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