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    产品型号CD4077BM96G4的Datasheet PDF文件预览

    CD4070B,  
    CD4077B  
    Data sheet acquired from Harris Semiconductor  
    SCHS055E  
    CMOS Quad Exclusive-OR  
    and Exclusive-NOR Gate  
    January 1998 - Revised September 2003  
    Features  
    Ordering Information  
    • High-Voltage Types (20V Rating)  
    • CD4070B - Quad Exclusive-OR Gate  
    • CD4077B - Quad Exclusive-NOR Gate  
    • Medium Speed Operation  
    TEMP. RANGE  
    o
    PART NUMBER  
    CD4070BE  
    ( C)  
    PACKAGE  
    14 Ld PDIP  
    [ /Title  
    (CD40  
    70B,  
    CD407  
    7B)  
    /Sub-  
    ject  
    (CMO  
    SQuad  
    Exclu-  
    sive-  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    -55 to 125  
    CD4070BF3A  
    CD4070BM  
    14 Ld CERDIP  
    14 Ld SOIC  
    14 Ld SOIC  
    14 Ld SOIC  
    14 Ld SOP  
    - t  
    , t  
    PHL PLH  
    = 65ns (Typ) at V = 10V, C = 50pF  
    DD L  
    • 100% Tested for Quiescent Current at 20V  
    • Standardized Symmetrical Output Characteristics  
    • 5V, 10V and 15V Parametric Ratings  
    CD4070BMT  
    CD4070BM96  
    CD4070BNSR  
    CD4070BPW  
    CD4070BPWR  
    CD4077BE  
    • Maximum Input Current of 1µA at 18V Over Full  
    Package Temperature Range  
    o
    - 100nA at 18V and 25 C  
    14 Ld TSSOP  
    14 Ld TSSOP  
    14 Ld PDIP  
    14 Ld CERDIP  
    14 Ld SOIC  
    14 Ld SOIC  
    14 Ld SOIC  
    14 Ld SOP  
    • Noise Margin (Over Full Package Temperature Range)  
    OR  
    and  
    - 1V at V  
    DD  
    = 5V, 2V at V  
    DD  
    = 10V, 2.5V at V  
    = 15V  
    DD  
    • Meets All Requirements of JEDEC Standard No. 13B,  
    “Standard Specifications for Description of ‘B’ Series  
    CMOS Devices  
    Exclu-  
    sive-  
    NOR  
    Gate)  
    /Autho  
    r ()  
    /Key-  
    words  
    (Har-  
    ris  
    Semi-  
    con-  
    CD4077BF3A  
    CD4077BM  
    Applications  
    CD4077BMT  
    CD4077BM96  
    CD4077BNSR  
    CD4077BPW  
    CD4077BPWR  
    • Logical Comparators  
    • Adders/Subtractors  
    • Parity Generators and Checkers  
    14 Ld TSSOP  
    14 Ld TSSOP  
    Description  
    The Harris CD4070B contains four independent Exclusive-  
    OR gates. The Harris CD4077B contains four independent  
    Exclusive-NOR gates.  
    NOTE: When ordering, use the entire part number. The suffixes 96  
    and R denote tape and reel. The suffix T denotes a small-quantity  
    reel of 250.  
    ductor,  
    CD400  
    0,  
    The CD4070B and CD4077B provide the system designer  
    with a means for direct implementation of the Exclusive-OR  
    and Exclusive-NOR functions, respectively.  
    metal  
    gate,  
    CMOS  
    , pdip,  
    cerdip,  
    mil,  
    CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
    Copyright © 2003, Texas Instruments Incorporated  
    1
    CD4070B, CD4077B  
    Pinouts  
    CD4070B  
    (PDIP, CERDIP, SOIC, SOP, TSSOP)  
    TOP VIEW  
    CD4077B  
    (PDIP, CERDIP, SOIC, SOP, TSSOP)  
    TOP VIEW  
    A
    B
    B
    D
    C
    D
    1
    2
    3
    4
    5
    6
    7
    14  
    13  
    12  
    V
    A
    B
    B
    D
    C
    D
    1
    2
    3
    4
    5
    6
    7
    14  
    13  
    12  
    V
    DD  
    DD  
    H
    G
    H
    G
    J = A  
    K = C  
    J = A  
    11 M = G  
    10 L = E  
    H
    K = C  
    11 M = G  
    10 L = E  
    H
    F
    F
    9
    8
    F
    E
    9
    8
    F
    E
    V
    V
    SS  
    SS  
    Functional Diagrams  
    CD4070B  
    CD4077B  
    1
    1
    2
    A
    3
    4
    A
    B
    3
    J
    2
    J
    B
    J = A  
    B
    D
    J = A  
    K = C  
    B
    5
    6
    C
    5
    6
    K =  
    C
    D
    C
    D
    4
    D
    K
    L
    K
    L
    M = G  
    L = E  
    H
    F
    8
    9
    8
    9
    E
    F
    M = G  
    L = E  
    H
    F
    10  
    11  
    E
    F
    10  
    11  
    V
    V
    = 7  
    = 14  
    SS  
    DD  
    12  
    13  
    12  
    13  
    G
    H
    G
    H
    M
    M
    2
    CD4070B, CD4077B  
    V
    DD  
    V
    DD  
    V
    DD  
    p
    n
    V
    DD  
    p
    B †  
    p
    B †  
    n
    2(5,9,12)  
    p
    n
    V
    n
    2(5,9,12)  
    n
    V
    p
    SS  
    DD  
    p
    p
    SS  
    DD  
    J
    V
    p
    p
    J
    V
    p
    p
    n
    3(4,10,11)  
    n
    A †  
    3(4,10,11)  
    n
    A †  
    1(6,8,13)  
    n
    n
    1(6,8,13)  
    n
    V
    SS  
    V
    SS  
    V
    V
    DD  
    DD  
    V
    V
    SS  
    SS  
    † INPUTS PROTECTED  
    BY CMOS PROTECTION  
    NETWORK  
    † INPUTS PROTECTED  
    BY CMOS PROTECTION  
    NETWORK  
    V
    V
    SS  
    SS  
    FIGURE 1. SCHEMATIC DIAGRAM FOR CD4070B  
    (1 OF 4 IDENTICAL GATES)  
    FIGURE 2. SCHEMATIC DIAGRAM FOR CD4077B  
    (1 OF 4 IDENTICAL GATES)  
    CD4070B TRUTH TABLE (1 OF 4 GATES)  
    CD4077B TRUTH TABLE (1 OF 4 GATES)  
    A
    0
    1
    0
    1
    B
    0
    0
    1
    1
    J
    0
    1
    1
    0
    A
    B
    0
    0
    1
    1
    J
    1
    0
    0
    1
    0
    1
    0
    1
    NOTE:  
    NOTE:  
    1 = High Level  
    0 = Low Level  
    1 = High Level  
    0 = Low Level  
    J = A  
    B
    J = A  
    B
    3
    CD4070B, CD4077B  
    Absolute Maximum Ratings  
    Thermal Information  
    DC Supply Voltage Range (V ) . . . . . . . . . . . . . . . . . -0.5V to 20V  
    DD  
    Package Thermal Impedance, θ (see Note 1):  
    JA  
    E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80 C/W  
    M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86 C/W  
    NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 C/W  
    PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 113 C/W  
    Maximum Junction Temperature (Hermetic Package or Die) . 175 C  
    Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C  
    Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
    o
    Input Voltage Range, All Inputs . . . . . . . . . . . . . . -0.5V to V  
    0.5V  
    DD  
    o
    DC Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 10mA  
    o
    o
    Operating Conditions  
    o
    o
    o
    Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
    A
    o
    Supply Voltage Range (Typical) . . . . . . . . . . . . . . . . . . . . 3V to 18V  
    o
    o
    CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
    of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
    NOTE:  
    1. The package thermal impedance is calculated in accordance with JESD 51-7.  
    DC Electrical Specifications  
    o
    LIMITS AT INDICATED TEMPERATURES ( C)  
    CONDITIONS  
    25  
    V
    V
    V
    DD  
    O
    IN  
    PARAMETER  
    (V)  
    (V)  
    0, 5  
    0, 10  
    0, 15  
    0, 20  
    0, 5  
    0, 10  
    0, 15  
    0, 5  
    0, 5  
    0, 10  
    0, 15  
    0, 5  
    0, 10  
    0, 15  
    0, 5  
    0, 10  
    0, 15  
    -
    (V)  
    -55  
    0.25  
    0.5  
    1
    -40  
    0.25  
    0.5  
    1
    85  
    7.5  
    15  
    125  
    7.5  
    MIN  
    TYP  
    0.01  
    0.01  
    0.01  
    0.02  
    1
    MAX  
    UNITS  
    µA  
    µA  
    µA  
    µA  
    mA  
    mA  
    mA  
    mA  
    mA  
    mA  
    mA  
    V
    Quiescent Device Current  
    -
    5
    -
    0.25  
    I
    Max  
    DD  
    -
    10  
    15  
    20  
    5
    15  
    -
    0.5  
    -
    30  
    30  
    -
    -
    1
    -
    5
    5
    150  
    0.42  
    1.1  
    2.8  
    -0.42  
    -1.3  
    -1.1  
    -2.8  
    0.05  
    0.05  
    0.05  
    4.95  
    9.95  
    14.95  
    1.5  
    3
    150  
    0.36  
    0.9  
    5
    Output Low (Sink) Current  
    Min  
    0.4  
    0.64  
    1.6  
    4.2  
    -0.64  
    -2  
    0.61  
    1.5  
    4
    0.51  
    1.3  
    3.4  
    -0.51  
    -1.6  
    -1.3  
    -3.4  
    -
    -
    I
    OL  
    0.5  
    10  
    15  
    5
    2.6  
    6.8  
    -1  
    -
    1.5  
    2.4  
    -
    Output High (Source) Current  
    Min  
    4.6  
    -0.61  
    -1.8  
    -1.5  
    -4  
    -0.36  
    -1.15  
    -0.9  
    -2.4  
    0.05  
    0.05  
    0.05  
    4.95  
    9.95  
    14.95  
    1.5  
    -
    I
    OH  
    2.5  
    5
    -3.2  
    -2.6  
    -6.8  
    0
    -
    9.5  
    10  
    15  
    5
    -1.6  
    -4.2  
    0.05  
    0.05  
    0.05  
    4.95  
    9.95  
    14.95  
    1.5  
    3
    -
    13.5  
    -
    Output Voltage: Low Level,  
    Max  
    -
    0.05  
    0.05  
    0.05  
    4.95  
    9.95  
    14.95  
    1.5  
    3
    0.05  
    V
    OL  
    -
    10  
    15  
    5
    -
    0
    0.05  
    V
    -
    -
    0
    0.05  
    V
    Output Voltage: High Level,  
    Min  
    -
    4.95  
    9.95  
    14.95  
    -
    5
    -
    V
    V
    OH  
    -
    -
    10  
    15  
    5
    10  
    15  
    -
    -
    V
    -
    V
    Input Low Voltage,  
    Max  
    0.5, 4.5  
    1, 9  
    1.5  
    V
    V
    IL  
    -
    10  
    15  
    5
    3
    -
    -
    3
    V
    1.5, 13.5  
    0.5, 4.5  
    1, 9  
    -
    4
    4
    4
    4
    -
    -
    4
    V
    Input High Voltage,  
    Min  
    -
    3.5  
    7
    3.5  
    7
    3.5  
    7
    3.5  
    3.5  
    7
    -
    -
    V
    V
    IH  
    -
    10  
    15  
    18  
    7
    -
    -
    -
    V
    1.5, 13.5  
    -
    -
    11  
    11  
    11  
    11  
    11  
    -
    -
    V
    -5  
    ±10  
    Input Current, I Max  
    IN  
    0, 18  
    ±0.1  
    ±0.1  
    ±1  
    ±1  
    ±0.1  
    µA  
    4
    CD4070B, CD4077B  
    o
    AC Electrical Specifications  
    T = 25 C, Input t , t = 20ns, C = 50pF, R = 200kΩ  
    A
    r
    f
    L
    L
    TEST CONDITIONS  
    LIMITS ON ALL TYPES  
    PARAMETER  
    SYMBOL  
    V
    (V)  
    TYP  
    140  
    65  
    MAX  
    280  
    130  
    100  
    200  
    100  
    80  
    UNITS  
    ns  
    DD  
    Propagation Delay Time  
    t
    , t  
    PHL PLH  
    5
    10  
    15  
    5
    ns  
    50  
    ns  
    Transition Time  
    t
    , t  
    THL TLH  
    100  
    50  
    ns  
    10  
    15  
    ns  
    40  
    ns  
    Input Capacitance  
    C
    Any Input  
    5
    7.5  
    pF  
    IN  
    Typical Performance Curves  
    o
    o
    T
    = 25 C  
    T = 25 C  
    A
    A
    30  
    25  
    20  
    15  
    10  
    5
    GATE TO SOURCE VOLTAGE (V ) = 15V  
    GS  
    15  
    12.5  
    10  
    GATE TO SOURCE VOLTAGE (V ) = 15V  
    GS  
    10V  
    10V  
    7.5  
    5
    5V  
    5V  
    2.5  
    0
    0
    0
    0
    5
    10  
    15  
    5
    10  
    15  
    V
    , DRAIN TO SOURCE VOLTAGE (V)  
    V , DRAIN TO SOURCE VOLTAGE (V)  
    DS  
    DS  
    FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT  
    CHARACTERISTICS  
    FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT  
    CHARACTERISTICS  
    V
    , DRAIN TO SOURCE VOLTAGE (V)  
    DS  
    V
    , DRAIN TO SOURCE VOLTAGE (V)  
    DS  
    -15  
    -10  
    -5  
    0
    -15  
    -10  
    -5  
    0
    0
    0
    o
    o
    T
    = 25 C  
    A
    T
    = 25 C  
    A
    -5  
    GATE TO SOURCE VOLTAGE (V ) = -5V  
    GS  
    GATE TO SOURCE VOLTAGE (V ) = -5V  
    GS  
    -10  
    -15  
    -20  
    -25  
    -30  
    -5  
    -10V  
    -10V  
    -10  
    -15  
    -15V  
    -15V  
    FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT  
    CHARACTERISTICS  
    FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT  
    CHARACTERISTICS  
    5
    Typical Performance Curves (Continued)  
    o
    T
    = 25 C  
    A
    o
    T
    = 25 C  
    A
    300  
    200  
    100  
    0
    200  
    150  
    100  
    50  
    SUPPLY VOLTAGE (V ) = 5V  
    DD  
    SUPPLY VOLTAGE (V ) = 5V  
    DD  
    10V  
    10V  
    15V  
    15V  
    0
    0
    20  
    40  
    60  
    80  
    100  
    0
    20  
    40  
    60  
    80  
    100  
    110  
    C , LOAD CAPACITANCE (pF)  
    C , LOAD CAPACITANCE (pF)  
    L
    L
    FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF  
    LOAD CAPACITANCE  
    FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A  
    FUNCTION OF LOAD CAPACITANCE  
    5
    10  
    o
    o
    T
    = 25 C  
    T
    = 25 C  
    A
    A
    LOAD CAPACITANCE C = 50pF  
    L
    4
    3
    2
    10  
    10  
    10  
    300  
    200  
    100  
    0
    10V  
    C
    = 50pF  
    L
    10V  
    = 15pF  
    C
    L
    10  
    1
    5V  
    -1  
    10  
    -1  
    2
    3
    4
    0
    5
    10  
    15  
    20  
    10  
    1
    10  
    10  
    10  
    10  
    V
    , SUPPLY VOLTAGE (V)  
    f , INPUT FREQUENCY (kHz)  
    DD  
    I
    FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A  
    FUNCTION OF SUPPLY VOLTAGE  
    FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A  
    FUNCTION OF INPUT FREQUENCY  
    6
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    15-Oct-2009  
    PACKAGING INFORMATION  
    Orderable Device  
    CD4070BE  
    Status (1)  
    ACTIVE  
    ACTIVE  
    Package Package  
    Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
    Qty  
    Type  
    Drawing  
    PDIP  
    N
    14  
    25  
    Pb-Free  
    (RoHS)  
    CU NIPDAU N / A for Pkg Type  
    CD4070BEE4  
    PDIP  
    N
    14  
    25  
    Pb-Free  
    (RoHS)  
    CU NIPDAU N / A for Pkg Type  
    CD4070BF  
    CD4070BF3A  
    ACTIVE  
    ACTIVE  
    CDIP  
    CDIP  
    CDIP  
    SOIC  
    J
    J
    14  
    14  
    14  
    14  
    1
    1
    TBD  
    TBD  
    TBD  
    A42  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    Call TI  
    CD4070BF3AS2534  
    CD4070BM  
    OBSOLETE  
    ACTIVE  
    J
    Call TI  
    D
    50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4070BM96  
    CD4070BM96E4  
    CD4070BM96G4  
    CD4070BME4  
    CD4070BMG4  
    CD4070BMT  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SO  
    D
    D
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4070BMTE4  
    CD4070BMTG4  
    CD4070BNSR  
    CD4070BNSRE4  
    CD4070BNSRG4  
    CD4070BPW  
    D
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    NS  
    NS  
    NS  
    PW  
    PW  
    PW  
    PW  
    PW  
    PW  
    N
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SO  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SO  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    PDIP  
    90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4070BPWE4  
    CD4070BPWG4  
    CD4070BPWR  
    CD4070BPWRE4  
    CD4070BPWRG4  
    CD4077BE  
    90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    25  
    Pb-Free  
    (RoHS)  
    CU NIPDAU N / A for Pkg Type  
    CD4077BEE4  
    PDIP  
    N
    25  
    Pb-Free  
    (RoHS)  
    CU NIPDAU N / A for Pkg Type  
    CD4077BF  
    ACTIVE  
    ACTIVE  
    CDIP  
    CDIP  
    J
    J
    14  
    14  
    1
    1
    TBD  
    TBD  
    A42  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    CD4077BF3A  
    Addendum-Page 1  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    15-Oct-2009  
    Orderable Device  
    Status (1)  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    Package Package  
    Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
    Qty  
    Type  
    Drawing  
    CD4077BM  
    CD4077BM96  
    SOIC  
    D
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SO  
    D
    D
    2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4077BM96E4  
    CD4077BM96G4  
    CD4077BME4  
    2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4077BMG4  
    CD4077BMT  
    D
    50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4077BMTE4  
    CD4077BMTG4  
    CD4077BNSR  
    D
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    D
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    NS  
    NS  
    NS  
    PW  
    PW  
    PW  
    PW  
    PW  
    PW  
    J
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4077BNSRE4  
    CD4077BNSRG4  
    CD4077BPW  
    SO  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SO  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    CDIP  
    90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    CD4077BPWE4  
    CD4077BPWG4  
    CD4077BPWR  
    CD4077BPWRE4  
    CD4077BPWRG4  
    JM38510/17203BCA  
    90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    1
    TBD  
    A42  
    N / A for Pkg Type  
    (1) The marketing status values are defined as follows:  
    ACTIVE: Product device recommended for new designs.  
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
    a new design.  
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
    OBSOLETE: TI has discontinued the production of the device.  
    (2)  
    Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
    http://www.ti.com/productcontent for the latest availability information and additional product content details.  
    TBD: The Pb-Free/Green conversion plan has not been defined.  
    Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
    for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
    at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
    Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
    package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
    Addendum-Page 2  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    15-Oct-2009  
    compatible) as defined above.  
    Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
    retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
    (3)  
    MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
    temperature.  
    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
    provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
    accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
    reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
    incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
    information may not be available for release.  
    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
    to Customer on an annual basis.  
    Addendum-Page 3  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    11-Mar-2008  
    TAPE AND REEL INFORMATION  
    *All dimensions are nominal  
    Device  
    Package Package Pins  
    Type Drawing  
    SPQ  
    Reel  
    Reel  
    A0 (mm)  
    B0 (mm)  
    K0 (mm)  
    P1  
    W
    Pin1  
    Diameter Width  
    (mm) W1 (mm)  
    (mm) (mm) Quadrant  
    CD4070BM96  
    CD4070BNSR  
    CD4070BPWR  
    CD4077BM96  
    CD4077BNSR  
    CD4077BPWR  
    SOIC  
    SO  
    D
    14  
    14  
    14  
    14  
    14  
    14  
    2500  
    2000  
    2000  
    2500  
    2000  
    2000  
    330.0  
    330.0  
    330.0  
    330.0  
    330.0  
    330.0  
    16.4  
    16.4  
    12.4  
    16.4  
    16.4  
    12.4  
    6.5  
    8.2  
    7.0  
    6.5  
    8.2  
    7.0  
    9.0  
    10.5  
    5.6  
    2.1  
    2.5  
    1.6  
    2.1  
    2.5  
    1.6  
    8.0  
    12.0  
    8.0  
    16.0  
    16.0  
    12.0  
    16.0  
    16.0  
    12.0  
    Q1  
    Q1  
    Q1  
    Q1  
    Q1  
    Q1  
    NS  
    PW  
    D
    TSSOP  
    SOIC  
    SO  
    9.0  
    8.0  
    NS  
    PW  
    10.5  
    5.6  
    12.0  
    8.0  
    TSSOP  
    Pack Materials-Page 1  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    11-Mar-2008  
    *All dimensions are nominal  
    Device  
    Package Type Package Drawing Pins  
    SPQ  
    Length (mm) Width (mm) Height (mm)  
    CD4070BM96  
    CD4070BNSR  
    CD4070BPWR  
    CD4077BM96  
    CD4077BNSR  
    CD4077BPWR  
    SOIC  
    SO  
    D
    14  
    14  
    14  
    14  
    14  
    14  
    2500  
    2000  
    2000  
    2500  
    2000  
    2000  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    346.0  
    33.0  
    33.0  
    29.0  
    33.0  
    33.0  
    29.0  
    NS  
    PW  
    D
    TSSOP  
    SOIC  
    SO  
    NS  
    PW  
    TSSOP  
    Pack Materials-Page 2  
    MECHANICAL DATA  
    MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
    PW (R-PDSO-G**)  
    PLASTIC SMALL-OUTLINE PACKAGE  
    14 PINS SHOWN  
    0,30  
    0,19  
    M
    0,10  
    0,65  
    14  
    8
    0,15 NOM  
    4,50  
    4,30  
    6,60  
    6,20  
    Gage Plane  
    0,25  
    1
    7
    0°–8°  
    A
    0,75  
    0,50  
    Seating Plane  
    0,10  
    0,15  
    0,05  
    1,20 MAX  
    PINS **  
    8
    14  
    16  
    20  
    24  
    28  
    DIM  
    3,10  
    2,90  
    5,10  
    4,90  
    5,10  
    4,90  
    6,60  
    6,40  
    7,90  
    9,80  
    9,60  
    A MAX  
    A MIN  
    7,70  
    4040064/F 01/97  
    NOTES: A. All linear dimensions are in millimeters.  
    B. This drawing is subject to change without notice.  
    C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
    D. Falls within JEDEC MO-153  
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    25-Jan-2012  
    PACKAGING INFORMATION  
    Status (1)  
    Eco Plan (2)  
    MSL Peak Temp (3)  
    Samples  
    Orderable Device  
    Package Type Package  
    Drawing  
    Pins  
    Package Qty  
    Lead/  
    Ball Finish  
    (Requires Login)  
    CD4070BE  
    CD4070BEE4  
    CD4070BF  
    ACTIVE  
    ACTIVE  
    PDIP  
    PDIP  
    CDIP  
    CDIP  
    CDIP  
    SOIC  
    N
    N
    J
    14  
    14  
    14  
    14  
    14  
    14  
    25  
    25  
    1
    Pb-Free (RoHS)  
    Pb-Free (RoHS)  
    TBD  
    CU NIPDAU N / A for Pkg Type  
    CU NIPDAU N / A for Pkg Type  
    ACTIVE  
    A42  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    Call TI  
    CD4070BF3A  
    CD4070BF3AS2534  
    CD4070BM  
    ACTIVE  
    J
    1
    TBD  
    OBSOLETE  
    ACTIVE  
    J
    TBD  
    Call TI  
    D
    50  
    2500  
    2500  
    2500  
    50  
    Green (RoHS  
    & no Sb/Br)  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CD4070BM96  
    CD4070BM96E4  
    CD4070BM96G4  
    CD4070BME4  
    CD4070BMG4  
    CD4070BMT  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SO  
    D
    D
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    Green (RoHS  
    & no Sb/Br)  
    Green (RoHS  
    & no Sb/Br)  
    D
    Green (RoHS  
    & no Sb/Br)  
    D
    Green (RoHS  
    & no Sb/Br)  
    D
    50  
    Green (RoHS  
    & no Sb/Br)  
    D
    250  
    250  
    250  
    2000  
    2000  
    2000  
    90  
    Green (RoHS  
    & no Sb/Br)  
    CD4070BMTE4  
    CD4070BMTG4  
    CD4070BNSR  
    CD4070BNSRE4  
    CD4070BNSRG4  
    CD4070BPW  
    D
    Green (RoHS  
    & no Sb/Br)  
    D
    Green (RoHS  
    & no Sb/Br)  
    NS  
    NS  
    NS  
    PW  
    PW  
    Green (RoHS  
    & no Sb/Br)  
    SO  
    Green (RoHS  
    & no Sb/Br)  
    SO  
    Green (RoHS  
    & no Sb/Br)  
    TSSOP  
    TSSOP  
    Green (RoHS  
    & no Sb/Br)  
    CD4070BPWE4  
    90  
    Green (RoHS  
    & no Sb/Br)  
    Addendum-Page 1  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    25-Jan-2012  
    Status (1)  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    Eco Plan (2)  
    MSL Peak Temp (3)  
    Samples  
    Orderable Device  
    Package Type Package  
    Drawing  
    Pins  
    Package Qty  
    Lead/  
    Ball Finish  
    (Requires Login)  
    CD4070BPWG4  
    CD4070BPWR  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    PW  
    PW  
    PW  
    PW  
    14  
    14  
    14  
    14  
    90  
    Green (RoHS  
    & no Sb/Br)  
    CU NIPDAU Level-1-260C-UNLIM  
    2000  
    2000  
    2000  
    Green (RoHS  
    & no Sb/Br)  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CD4070BPWRE4  
    CD4070BPWRG4  
    Green (RoHS  
    & no Sb/Br)  
    Green (RoHS  
    & no Sb/Br)  
    CD4077BE  
    CD4077BEE4  
    CD4077BF  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    PDIP  
    PDIP  
    CDIP  
    CDIP  
    SOIC  
    N
    N
    J
    14  
    14  
    14  
    14  
    14  
    25  
    25  
    1
    Pb-Free (RoHS)  
    Pb-Free (RoHS)  
    TBD  
    CU NIPDAU N / A for Pkg Type  
    CU NIPDAU N / A for Pkg Type  
    A42  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    CD4077BF3A  
    CD4077BM  
    J
    1
    TBD  
    D
    50  
    Green (RoHS  
    & no Sb/Br)  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CD4077BM96  
    CD4077BM96E4  
    CD4077BM96G4  
    CD4077BME4  
    CD4077BMG4  
    CD4077BMT  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SO  
    D
    D
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    2500  
    2500  
    2500  
    50  
    Green (RoHS  
    & no Sb/Br)  
    Green (RoHS  
    & no Sb/Br)  
    D
    Green (RoHS  
    & no Sb/Br)  
    D
    Green (RoHS  
    & no Sb/Br)  
    D
    50  
    Green (RoHS  
    & no Sb/Br)  
    D
    250  
    250  
    250  
    2000  
    2000  
    Green (RoHS  
    & no Sb/Br)  
    CD4077BMTE4  
    CD4077BMTG4  
    CD4077BNSR  
    CD4077BNSRE4  
    D
    Green (RoHS  
    & no Sb/Br)  
    D
    Green (RoHS  
    & no Sb/Br)  
    NS  
    NS  
    Green (RoHS  
    & no Sb/Br)  
    SO  
    Green (RoHS  
    & no Sb/Br)  
    Addendum-Page 2  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    25-Jan-2012  
    Status (1)  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    Eco Plan (2)  
    MSL Peak Temp (3)  
    Samples  
    Orderable Device  
    Package Type Package  
    Drawing  
    Pins  
    Package Qty  
    Lead/  
    Ball Finish  
    (Requires Login)  
    CD4077BNSRG4  
    CD4077BPW  
    SO  
    NS  
    PW  
    PW  
    PW  
    14  
    14  
    14  
    14  
    2000  
    90  
    Green (RoHS  
    & no Sb/Br)  
    CU NIPDAU Level-1-260C-UNLIM  
    TSSOP  
    TSSOP  
    TSSOP  
    Green (RoHS  
    & no Sb/Br)  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CU NIPDAU Level-1-260C-UNLIM  
    CD4077BPWE4  
    CD4077BPWG4  
    90  
    Green (RoHS  
    & no Sb/Br)  
    90  
    Green (RoHS  
    & no Sb/Br)  
    JM38510/17203BCA  
    M38510/17203BCA  
    ACTIVE  
    ACTIVE  
    CDIP  
    CDIP  
    J
    J
    14  
    14  
    1
    1
    TBD  
    TBD  
    A42  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    (1) The marketing status values are defined as follows:  
    ACTIVE: Product device recommended for new designs.  
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
    OBSOLETE: TI has discontinued the production of the device.  
    (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
    information and additional product content details.  
    TBD: The Pb-Free/Green conversion plan has not been defined.  
    Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
    lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
    Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
    the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
    Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
    in homogeneous material)  
    (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
    provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
    continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
    TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
    OTHER QUALIFIED VERSIONS OF CD4070B, CD4070B-MIL, CD4077B, CD4077B-MIL :  
    Addendum-Page 3  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    25-Jan-2012  
    Catalog: CD4070B, CD4077B  
    •
    Military: CD4070B-MIL, CD4077B-MIL  
    •
    NOTE: Qualified Version Definitions:  
    Catalog - TI's standard catalog product  
    •
    Military - QML certified for Military and Defense Applications  
    •
    Addendum-Page 4  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    14-Jul-2012  
    TAPE AND REEL INFORMATION  
    *All dimensions are nominal  
    Device  
    Package Package Pins  
    Type Drawing  
    SPQ  
    Reel  
    Reel  
    A0  
    B0  
    K0  
    P1  
    W
    Pin1  
    Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
    (mm) W1 (mm)  
    CD4070BM96  
    CD4070BMT  
    CD4070BNSR  
    CD4070BPWR  
    CD4077BM96  
    CD4077BMT  
    CD4077BNSR  
    SOIC  
    SOIC  
    SO  
    D
    D
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    2500  
    250  
    330.0  
    330.0  
    330.0  
    330.0  
    330.0  
    330.0  
    330.0  
    16.4  
    16.4  
    16.4  
    12.4  
    16.4  
    16.4  
    16.4  
    6.5  
    6.5  
    8.2  
    6.9  
    6.5  
    6.5  
    8.2  
    9.0  
    9.0  
    2.1  
    2.1  
    2.5  
    1.6  
    2.1  
    2.1  
    2.5  
    8.0  
    8.0  
    16.0  
    16.0  
    16.0  
    12.0  
    16.0  
    16.0  
    16.0  
    Q1  
    Q1  
    Q1  
    Q1  
    Q1  
    Q1  
    Q1  
    NS  
    PW  
    D
    2000  
    2000  
    2500  
    250  
    10.5  
    5.6  
    12.0  
    8.0  
    TSSOP  
    SOIC  
    SOIC  
    SO  
    9.0  
    8.0  
    D
    9.0  
    8.0  
    NS  
    2000  
    10.5  
    12.0  
    Pack Materials-Page 1  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    14-Jul-2012  
    *All dimensions are nominal  
    Device  
    Package Type Package Drawing Pins  
    SPQ  
    Length (mm) Width (mm) Height (mm)  
    CD4070BM96  
    CD4070BMT  
    CD4070BNSR  
    CD4070BPWR  
    CD4077BM96  
    CD4077BMT  
    CD4077BNSR  
    SOIC  
    SOIC  
    SO  
    D
    D
    14  
    14  
    14  
    14  
    14  
    14  
    14  
    2500  
    250  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    367.0  
    38.0  
    38.0  
    38.0  
    35.0  
    38.0  
    38.0  
    38.0  
    NS  
    PW  
    D
    2000  
    2000  
    2500  
    250  
    TSSOP  
    SOIC  
    SOIC  
    SO  
    D
    NS  
    2000  
    Pack Materials-Page 2  
    IMPORTANT NOTICE  
    Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
    changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
    issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
    complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
    supplied at the time of order acknowledgment.  
    TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
    and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
    to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
    performed.  
    TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
    applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
    adequate design and operating safeguards.  
    TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
    other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
    published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
    endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
    third party, or a license from TI under the patents or other intellectual property of TI.  
    Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
    and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
    documentation. Information of third parties may be subject to additional restrictions.  
    Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
    voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
    TI is not responsible or liable for any such statements.  
    Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
    concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
    that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
    anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
    harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
    of any TI components in safety-critical applications.  
    In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
    help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
    requirements. Nonetheless, such components are subject to these terms.  
    No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
    have executed a special agreement specifically governing such use.  
    Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
    military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
    which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
    regulatory requirements in connection with such use.  
    TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which  
    have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such  
    components to meet such requirements.  
    Products  
    Applications  
    Audio  
    www.ti.com/audio  
    amplifier.ti.com  
    dataconverter.ti.com  
    www.dlp.com  
    Automotive and Transportation www.ti.com/automotive  
    Communications and Telecom www.ti.com/communications  
    Amplifiers  
    Data Converters  
    DLP® Products  
    DSP  
    Computers and Peripherals  
    Consumer Electronics  
    Energy and Lighting  
    Industrial  
    www.ti.com/computers  
    www.ti.com/consumer-apps  
    www.ti.com/energy  
    dsp.ti.com  
    Clocks and Timers  
    Interface  
    www.ti.com/clocks  
    interface.ti.com  
    logic.ti.com  
    www.ti.com/industrial  
    www.ti.com/medical  
    Medical  
    Logic  
    Security  
    www.ti.com/security  
    Power Mgmt  
    Microcontrollers  
    RFID  
    power.ti.com  
    Space, Avionics and Defense  
    Video and Imaging  
    www.ti.com/space-avionics-defense  
    www.ti.com/video  
    microcontroller.ti.com  
    www.ti-rfid.com  
    www.ti.com/omap  
    OMAP Applications Processors  
    Wireless Connectivity  
    TI E2E Community  
    e2e.ti.com  
    www.ti.com/wirelessconnectivity  
    Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
    Copyright © 2012, Texas Instruments Incorporated  
    配单直通车
    CD4077BM96G4产品参数
    型号:CD4077BM96G4
    Brand Name：Texas Instruments
    是否Rohs认证： 符合
    生命周期：Obsolete
    IHS 制造商：TEXAS INSTRUMENTS INC
    零件包装代码：SOIC
    包装说明：SOP, SOP14,.25
    针数：14
    Reach Compliance Code：compliant
    HTS代码：8542.39.00.01
    风险等级：5.16
    系列：4000/14000/40000
    JESD-30 代码：R-PDSO-G14
    JESD-609代码：e4
    长度：8.65 mm
    负载电容（CL）：50 pF
    逻辑集成电路类型：XNOR GATE
    湿度敏感等级：1
    功能数量：4
    输入次数：2
    端子数量：14
    最高工作温度：125 °C
    最低工作温度：-55 °C
    封装主体材料：PLASTIC/EPOXY
    封装代码：SOP
    封装等效代码：SOP14,.25
    封装形状：RECTANGULAR
    封装形式：SMALL OUTLINE
    包装方法：TAPE AND REEL
    峰值回流温度（摄氏度）：260
    电源：5/15 V
    Prop。Delay @ Nom-Sup：280 ns
    传播延迟（tpd）：280 ns
    认证状态：Not Qualified
    施密特触发器：NO
    座面最大高度：1.75 mm
    子类别：Gates
    最大供电电压 (Vsup)：18 V
    最小供电电压 (Vsup)：3 V
    标称供电电压 (Vsup)：5 V
    表面贴装：YES
    技术：CMOS
    温度等级：MILITARY
    端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
    端子形式：GULL WING
    端子节距：1.27 mm
    端子位置：DUAL
    处于峰值回流温度下的最长时间：NOT SPECIFIED
    宽度：3.9 mm
    Base Number Matches：1
    •  
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