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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • CD4556BM96G4
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  • QQ:857273081QQ:857273081 复制
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  • CD4556BM96G4图
  • 上海振基实业有限公司

     该会员已使用本站13年以上
  • CD4556BM96G4
  • 数量3076 
  • 厂家TI 
  • 封装原厂封装 
  • 批号23+ 
  • 全新原装现货/另有约30万种现货,欢迎来电!
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  • CD4556BM96G4图
  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
  • CD4556BM96G4
  • 数量49 
  • 厂家TI 
  • 封装SOIC16 
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产品型号CD4556BM96G4的Datasheet PDF文件预览

The CD4555B and CD4556B types are  
supplied in 16-lead hermetic dual-in-line  
ceramic packages (F3A suffix), 16-lead  
dual-in-line plastics packages (E suffix), and  
16-lead small-outline packages (M, M96, and  
MT suffixes). The CD4555B is also supplied  
in 16-lead small-outline packages (NSR  
suffix) and 16-lead thin shrink small-outline  
packages (PW and PWR suffixes.)  
Copyright © 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
PACKAGING INFORMATION  
Orderable Device  
7704701EA  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
CDIP  
CDIP  
PDIP  
PDIP  
CDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
J
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
1
TBD  
A42  
N / A for Pkg Type  
7704701EA  
CD4555BF3A  
7704801EA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
N
1
TBD  
A42  
N / A for Pkg Type  
7704801EA  
CD4556BF3A  
CD4555BE  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
CU NIPDAU  
A42  
N / A for Pkg Type  
CD4555BE  
CD4555BEE4  
CD4555BF3A  
CD4555BM  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
CD4555BE  
J
1
TBD  
N / A for Pkg Type  
7704701EA  
CD4555BF3A  
D
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555BM  
CD4555B  
CD4555BM96  
CD4555BM96E4  
CD4555BM96G4  
CD4555BME4  
CD4555BMG4  
CD4555BMT  
D
2500  
2500  
2500  
40  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
40  
Green (RoHS  
& no Sb/Br)  
D
250  
250  
250  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CD4555BMTE4  
CD4555BMTG4  
CD4555BNSR  
CD4555BNSRE4  
CD4555BNSRG4  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
NS  
NS  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
CD4555B  
SO  
Green (RoHS  
& no Sb/Br)  
CD4555B  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
CD4555BPW  
CD4555BPWE4  
CD4555BPWG4  
CD4555BPWR  
CD4555BPWRE4  
CD4555BPWRG4  
CD4556BE  
ACTIVE  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
PW  
16  
16  
16  
16  
16  
16  
16  
16  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
CM555B  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PW  
PW  
PW  
PW  
PW  
N
90  
90  
Green (RoHS  
& no Sb/Br)  
CM555B  
Green (RoHS  
& no Sb/Br)  
CM555B  
2000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CM555B  
Green (RoHS  
& no Sb/Br)  
CM555B  
Green (RoHS  
& no Sb/Br)  
CM555B  
Pb-Free  
(RoHS)  
CD4556BE  
CD4556BE  
CD4556BF  
CD4556BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
CD4556BF  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
16  
16  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4556BF3A  
TBD  
7704801EA  
CD4556BF3A  
CD4556BF3AS2283  
CD4556BM  
OBSOLETE  
ACTIVE  
CDIP  
SOIC  
J
16  
16  
TBD  
Call TI  
Call TI  
D
40  
2500  
2500  
2500  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
CD4556BM  
CD4556BM  
CD4556BM  
CD4556BM  
CD4556BM  
CD4556BM  
CD4556BM  
CD4556BM96  
CD4556BM96E4  
CD4556BM96G4  
CD4556BME4  
CD4556BMG4  
CD4556BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
16  
16  
16  
16  
16  
16  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
40  
Green (RoHS  
& no Sb/Br)  
250  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
CD4556BMTE4  
CD4556BMTG4  
ACTIVE  
SOIC  
SOIC  
D
16  
16  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
CD4556BM  
CD4556BM  
ACTIVE  
D
250  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
-55 to 125  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF CD4555B, CD4555B-MIL, CD4556B, CD4556B-MIL :  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Catalog: CD4555B, CD4556B  
Military: CD4555B-MIL, CD4556B-MIL  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4555BM96  
CD4555BNSR  
CD4555BPWR  
CD4556BM96  
SOIC  
SO  
D
NS  
PW  
D
16  
16  
16  
16  
2500  
2000  
2000  
2500  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
12.4  
16.4  
6.5  
8.2  
6.9  
6.5  
10.3  
10.5  
5.6  
2.1  
2.5  
1.6  
2.1  
8.0  
12.0  
8.0  
16.0  
16.0  
12.0  
16.0  
Q1  
Q1  
Q1  
Q1  
TSSOP  
SOIC  
10.3  
8.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4555BM96  
CD4555BNSR  
CD4555BPWR  
CD4556BM96  
SOIC  
SO  
D
NS  
PW  
D
16  
16  
16  
16  
2500  
2000  
2000  
2500  
333.2  
367.0  
367.0  
333.2  
345.9  
367.0  
367.0  
345.9  
28.6  
38.0  
35.0  
28.6  
TSSOP  
SOIC  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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配单直通车
CD4556BM96G4产品参数
型号:CD4556BM96G4
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:SOIC
包装说明:GREEN, PLASTIC, MS-012AC, SOIC-16
针数:16
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.27
Is Samacsys:N
系列:4000/14000/40000
输入调节:STANDARD
JESD-30 代码:R-PDSO-G16
JESD-609代码:e4
长度:9.9 mm
负载电容(CL):50 pF
逻辑集成电路类型:OTHER DECODER/DRIVER
湿度敏感等级:1
功能数量:2
端子数量:16
最高工作温度:125 °C
最低工作温度:-55 °C
输出极性:INVERTED
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP16,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260
电源:5/15 V
Prop。Delay @ Nom-Sup:440 ns
传播延迟(tpd):440 ns
认证状态:Not Qualified
座面最大高度:1.75 mm
子类别:Decoder/Drivers
最大供电电压 (Vsup):18 V
最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:CMOS
温度等级:MILITARY
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mm
Base Number Matches:1
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