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    产品型号CXD3400的Datasheet PDF文件预览

    CXD3400N  
    6-channel CCD Vertical Clock Driver  
    Description  
    20 pin SSOP (Plastic)  
    The CXD3400N is a vertical clock driver for CCD  
    image sensor. This IC is composed of 6 channels  
    which supports high frame rate readout mode.  
    Features  
    • Composition  
    Vertical transfer output  
    3 levels driver × 4  
    2 levels driver × 2  
    Electronic shutter output 2 levels driver × 1  
    • Suitable drive capability for high-pixel CCD  
    (40% improved compared to current device)  
    • Small package (20-pin SSOP)  
    • 2.7 to 5.5V supported input interface  
    Applications  
    Digital still camera  
    Structure  
    CMOS  
    Absolute Maximum Ratings  
    • Supply voltage  
    • Supply voltage  
    • Supply voltage  
    • Input voltage  
    VDD  
    VL  
    GND – 0.3 to +7.0  
    GND to –10  
    V
    V
    VH  
    VL + 26  
    V
    VIN  
    GND – 0.3V to VDD + 0.3  
    –20 to +75  
    V
    • Operating temperature Topr  
    • Storage temperature Tstg  
    °C  
    °C  
    –55 to +150  
    Recommended Operating Conditions  
    • Supply voltage  
    • Supply voltage  
    • Supply voltage  
    VDD  
    VL  
    2.7 to 5.5  
    –5.0 to –9.0  
    11.5 to 15.5  
    –20 to +75  
    V
    V
    VH  
    V
    • Operating temperature Topr  
    °C  
    Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by  
    any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the  
    operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.  
    – 1 –  
    E98Y42A9X  
    CXD3400N  
    Block Diagram  
    VDD  
    XSHT  
    XV3  
    SHT  
    20  
    1
    2
    Input Buffer  
    19 V3B  
    18 VL  
    3
    XSG3B  
    XSG3A  
    XV1  
    4
    17 V3A  
    16 V1B  
    15 VH  
    5
    6
    XSG1B  
    XSG1A  
    XV4  
    7
    14 V1A  
    13 V4  
    8
    9
    12 V2  
    XV2  
    10  
    11 GND  
    Pin Description  
    Pin  
    Symbol  
    No.  
    I/O  
    Functions  
    1
    2
    VDD  
    —
    I
    Input power supply (3.3V system)  
    SHT pulse input  
    XSHT  
    XV3  
    3
    I
    V3A and V3B transfer pulse input  
    V3B readout pulse input  
    V3A readout pulse input  
    V1A and V1B readout pulse input  
    V1B readout pulse input  
    V1A readout pulse input  
    V4 transfer pulse input  
    V2 transfer pulse input  
    GND (= VM)  
    4
    XSG3B  
    XSG3A  
    XV1  
    I
    5
    I
    6
    I
    7
    XSG1B  
    XSG1A  
    XV4  
    I
    8
    I
    9
    I
    10  
    11  
    12  
    13  
    14  
    15  
    16  
    17  
    18  
    19  
    20  
    XV2  
    I
    GND  
    V2  
    —
    O
    O
    O
    —
    O
    O
    —
    O
    O
    High voltage output (2 levels: VM, VL)  
    High voltage output (2 levels: VM, VL)  
    High voltage output (3 levels: VH, VM, VL)  
    V4  
    V1A  
    VH  
    Positive power supply for high voltage output (15V system)  
    High voltage output (3 levels: VH, VM, VL)  
    High voltage output (3 levels: VH, VM, VL)  
    Negative power supply for high voltage output (–7.5V system)  
    High voltage output (3 levels: VH, VM, VL)  
    High voltage output (2 levels: VH, VL)  
    V1B  
    V3A  
    VL  
    V3B  
    SHT  
    – 2 –  
    CXD3400N  
    Truth Table  
    Input  
    Output  
    XV1, 3  
    XSG1A, 1B, 3A, 3B  
    XV2, 4  
    XSHT  
    V1A, 1B, 3A, 3B  
    V2, 4  
    X
    SHT  
    L
    L
    L
    H
    L
    X
    X
    X
    X
    L
    X
    X
    X
    X
    X
    X
    L
    VH  
    VM  
    Z
    X
    X
    X
    H
    H
    X
    X
    X
    X
    X
    X
    H
    X
    X
    X
    X
    VL  
    X
    X
    X
    VM  
    VL  
    X
    X
    H
    X
    X
    X
    X
    X
    VH  
    VL  
    H
    X
    X
    Z: High impedance X: Don't care  
    Electrical Characteristics  
    DC Characteristics  
    (VDD = 3.3V, VH = 15V, VM = GND, VL = –8.5V)  
    Item  
    Symbol  
    VIH  
    VIL  
    Conditions  
    Min.  
    0.7VDD  
    —
    Typ.  
    —
    Max.  
    —
    Unit  
    V
    "H" level input voltage  
    "L" level input voltage  
    Input current  
    —
    0.3VDD  
    10  
    V
    IIN  
    VIN = GND to 5V  
    –10  
    —
    0.0  
    0.10  
    0.25  
    –5.5  
    —
    µA  
    1
    Operating supply current  
    Operating supply current  
    Operating supply current  
    Output current  
    IH  
    0.20  
    0.50  
    —
    mA  
    mA  
    mA  
    mA  
    mA  
    mA  
    mA  
    mA  
    mA  
    1
    1
    IDD  
    —
    IL  
    –8.5  
    10  
    IOL  
    V1A, 1B, 3A, 3B, V2, 4 = –8.25V  
    V1A, 1B, 3A, 3B, V2, 4 = –0.25V  
    V1A, 1B, 3A, 3B = 0.25V  
    V1A, 1B, 3A, 3B = 14.75V  
    SHT = –8.25V  
    —
    Output current  
    IOM1  
    IOM2  
    IOH  
    —
    —
    –5.0  
    —
    Output current  
    5.0  
    —
    —
    Output current  
    —
    –7.2  
    —
    Output current  
    IOSL  
    IOSH  
    5.4  
    —
    —
    Output current  
    SHT = 14.75V  
    —
    –4.0  
    1
    See Measurement Circuit. Shutter speed 1/10000  
    Note) Current direction +: inflow to IC; –: outflow from IC  
    – 3 –  
    CXD3400N  
    Switching Characteristics  
    (VDD = 3.3V, VH = 15V, VM = GND, VL = –7.5V)  
    Item  
    Symbol  
    TPLM  
    TPMH  
    TPLH  
    TPML  
    TPHM  
    TPHL  
    TTLM  
    TTMH  
    TTLH  
    Conditions  
    Min.  
    50  
    Typ.  
    70  
    Max.  
    100  
    100  
    100  
    50  
    Unit  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    ns  
    V
    1
    1
    1
    1
    1
    1
    Propagation delay time  
    Propagation delay time  
    Propagation delay time  
    Propagation delay time  
    Propagation delay time  
    Propagation delay time  
    Rise time  
    50  
    70  
    50  
    70  
    10  
    30  
    10  
    30  
    50  
    10  
    30  
    50  
    1
    VL → VM  
    VM → VH  
    VL → VH  
    VM → VL  
    VH → VM  
    200  
    200  
    30  
    350  
    350  
    60  
    500  
    500  
    90  
    1
    Rise time  
    1
    1
    Rise time  
    Fall time  
    TTML  
    TTHM  
    TTHL  
    200  
    200  
    30  
    350  
    350  
    60  
    500  
    500  
    90  
    1
    Fall time  
    1
    Fall time  
    VH → VL  
    2
    Output noise voltage  
    Output noise voltage  
    Output noise voltage  
    Output noise voltage  
    1
    VCLH  
    VCLL  
    VCMH  
    VCML  
    —
    —
    1.0  
    1.0  
    1.0  
    1.0  
    2
    2
    2
    —
    —
    V
    —
    —
    V
    —
    —
    V
    See Switching Waveform.  
    See Noise on a Waveform.  
    2
    Note) Each item is evaluated by Measurement Circuit.  
    Notes on Operation (See Application Circuit.)  
    1. Be sure to protect against static electricity because this IC is MOS structure.  
    2. A bypass capacitor (0.1µF or more) is connected between GND and near each power supply (VH, VDD, VL).  
    3. In order to protect CCD image sensor, input SHT pin output to SUB pin of CCD image sensor after that has  
    been clamped at VH.  
    – 4 –  
    CXD3400N  
    Switching Waveform  
    VDD (3.3V)  
    50%  
    XV1 to 4  
    GND  
    VDD (3.3V)  
    50%  
    XSG1A, 1B, 3A, 3B  
    V1A, 1B, 3A, 3B  
    TPHM  
    TTHM  
    GND  
    VH  
    TPMH  
    TTMH  
    90%  
    TTLM  
    TTML  
    TPML  
    TPLM  
    10%  
    VM  
    VL  
    90%  
    10%  
    TTLM  
    TTML  
    TPLM  
    TPML  
    VM  
    VL  
    90%  
    V2, 4  
    10%  
    VDD (3.3V)  
    XSHT  
    50%  
    GND  
    VH  
    TTHL  
    TTLH  
    TPLH  
    TPHL  
    90%  
    SHT  
    10%  
    VL  
    Noise on a Waveform  
    VCHH  
    VCHH  
    VCHL  
    VCHL  
    VM  
    VL  
    VCLH  
    VCLL  
    – 5 –  
    CXD3400N  
    Measurement Circuit  
    C1  
    R1  
    C1  
    R1  
    C1  
    C2  
    C2  
    C2  
    R1  
    C2  
    C2  
    C2  
    C2  
    C2  
    C2  
    C2  
    C1  
    R1  
    C2  
    C2  
    R1  
    C1  
    C2  
    C2  
    R2  
    C2  
    C1  
    R1  
    –7.5V  
    15V  
    0V  
    Between vertical transfer clock and GND  
    Capacitance between vertical transfer clocks  
    C1 3300pF  
    C2 560pF  
    C3  
    Capacitance between substrate clock and GND C3 820pF  
    20 19 18 17 16 15 14 13 12 11  
    Vertical transfer clock series resistor  
    Vertical transfer clock ground resistor  
    R1  
    R2  
    30Ω  
    10Ω  
    CXD3400N  
    1
    2
    3
    4
    5
    6
    7
    8
    9
    10  
    3.3V  
    Timing Generator  
    – 6 –  
    CXD3400N  
    Application Circuit  
    15V  
    3.3V  
    0.1µ  
    2200p  
    1M  
    100k  
    1µ/35V  
    1
    2
    20  
    19  
    18  
    17  
    16  
    15  
    14  
    13  
    12  
    11  
    0.1µ  
    –7.5V  
    3
    SUB  
    V3B  
    V3A  
    V1B  
    V1A  
    V4  
    0.1µ  
    4
    5
    6
    0.1µ  
    7
    8
    9
    V2  
    10  
    CCD  
    from Timing Generator  
    CXD3400N  
    See with drive circuit of CCD image sensor.  
    Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for  
    any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.  
    Note with Power-on Sequence  
    To protect CCD image sensor, rise two power supplies, VL and VH as follows.  
    Note that rise VDD first.  
    VH  
    t1  
    20%  
    VM  
    20%  
    t2  
    VL  
    t2 ≥ t1  
    – 7 –  
    CXD3400N  
    Package Outline  
    Unit: mm  
    20PIN SSOP (PLASTIC)  
    + 0.2  
    1.25 – 0.1  
    6.5 ± 0.1  
    0.1  
    11  
    20  
    A
    1
    10  
    0.65  
    b
    0.13  
    M
    b=0.22 ± 0.03  
    0.1 ± 0.1  
    DETAIL B : PALLADIUM  
    NOTE: Dimension “ ” does not include mold protrusion.  
    0° to 10°  
    PACKAGE STRUCTURE  
    DETAIL A  
    PACKAGE MATERIAL  
    LEAD TREATMENT  
    EPOXY RESIN  
    PALLADIUM PLATING  
    COPPER ALLOY  
    0.1g  
    SONY CODE  
    EIAJ CODE  
    SSOP-20P-L01  
    SSOP020-P-0044  
    LEAD MATERIAL  
    PACKAGE MASS  
    JEDEC CODE  
    – 8 –  
    配单直通车
    CXD3400N产品参数
    型号:CXD3400N
    是否无铅： 不含铅
    是否Rohs认证： 符合
    生命周期：Active
    IHS 制造商：SONY CORP
    零件包装代码：SSOP
    包装说明：LSSOP,
    针数：20
    Reach Compliance Code：unknown
    HTS代码：8542.39.00.01
    风险等级：5.64
    Is Samacsys：N
    JESD-30 代码：R-PDSO-G20
    长度：6.5 mm
    逻辑集成电路类型：LOGIC CIRCUIT
    功能数量：1
    端子数量：20
    最高工作温度：75 °C
    最低工作温度：-20 °C
    输出特性：3-STATE
    封装主体材料：PLASTIC/EPOXY
    封装代码：LSSOP
    封装形状：RECTANGULAR
    封装形式：SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
    峰值回流温度（摄氏度）：NOT SPECIFIED
    认证状态：Not Qualified
    座面最大高度：1.45 mm
    最大供电电压 (Vsup)：5.5 V
    最小供电电压 (Vsup)：2.7 V
    标称供电电压 (Vsup)：3.3 V
    表面贴装：YES
    技术：CMOS
    温度等级：COMMERCIAL EXTENDED
    端子形式：GULL WING
    端子节距：0.65 mm
    端子位置：DUAL
    处于峰值回流温度下的最长时间：NOT SPECIFIED
    宽度：4.4 mm
    Base Number Matches：1
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