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产品型号AT28HC256-90FM/883的Datasheet PDF文件预览

Features  
Fast Read Access Time - 70 ns  
Automatic Page Write Operation  
– Internal Address and Data Latches for 64 Bytes  
– Internal Control Timer  
Fast Write Cycle Times  
– Page Write Cycle Time: 3 ms or 10 ms Maximum  
– 1 to 64-Byte Page Write Operation  
Low Power Dissipation  
– 80 mA Active Current  
– 3 mA Standby Current  
256 (32K x 8)  
High Speed  
Parallel  
Hardware and Software Data Protection  
DATA Polling for End of Write Detection  
High Reliability CMOS Technology  
– Endurance: 104 or 105 Cycles  
– Data Retention: 10 Years  
Single 5V ± 10% Supply  
CMOS and TTL Compatible Inputs and Outputs  
JEDEC Approved Byte-Wide Pinout  
Full Military, Commercial, and Industrial Temperature Ranges  
EEPROMs  
AT28HC256  
Description  
The AT28HC256 is a high-performance Electrically Erasable and Programmable  
Read Only Memory. Its 256K of memory is organized as 32,768 words by 8 bits. Man-  
ufactured with Atmel’s advanced nonvolatile CMOS technology, the AT28HC256  
(continued)  
Pin Configurations  
TSOP  
Top View  
Pin Name  
A0 - A14  
CE  
Function  
Addresses  
OE  
A11  
A9  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
A10  
CE  
2
Chip Enable  
Output Enable  
Write Enable  
Data Inputs/Outputs  
No Connect  
3
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
GND  
I/O2  
I/O1  
I/O0  
A0  
A8  
4
OE  
A13  
WE  
VCC  
A14  
A12  
A7  
5
6
WE  
7
8
I/O0 - I/O7  
NC  
9
10  
11  
12  
13  
14  
A6  
A5  
DC  
Don’t Connect  
A4  
A1  
A3  
A2  
LCC, PLCC  
Top View  
CERDIP, PDIP, FLATPACK  
Top View  
PGA  
Top View  
A14  
A12  
A7  
1
2
3
4
5
6
7
8
9
28 VCC  
27 WE  
26 A13  
25 A8  
A6  
A5  
A4  
A3  
A2  
5
6
7
8
9
29 A8  
28 A9  
27 A11  
26 NC  
25 OE  
24 A10  
23 CE  
22 I/O7  
21 I/O6  
A6  
A5  
24 A9  
A4  
23 A11  
22 OE  
21 A10  
20 CE  
19 I/O7  
18 I/O6  
17 I/O5  
16 I/O4  
15 I/O3  
A3  
A2  
A1 10  
A0 11  
A1  
A0 10  
I/O0 11  
I/O1 12  
I/O2 13  
GND 14  
NC 12  
I/O0 13  
Rev. 0007G–10/98  
Note: PLCC package pins 1 and  
17 are DON’T CONNECT.  
1
offers access times to 70 ns with power dissipation of just  
440 mW. When the AT28HC256 is deselected, the standby  
current is less than 5 mA.  
polling of I/O7. Once the end of a write cycle has been  
detected a new access for a read or write can begin.  
Atmel’s 28HC256 has additional features to ensure high  
quality and manufacturability. The device utilizes internal  
error correction for extended endurance and improved data  
retention characteristics. An optional software data protec-  
tion mechanism is available to guard against inadvertent  
writes. The device also includes an extra 64 bytes of  
EEPROM for device identification or tracking.  
The AT28HC256 is accessed like a Static RAM for the read  
or write cycle without the need for external components.  
The device contains a 64-byte page register to allow writing  
of up to 64 bytes simultaneously. During a write cycle, the  
address and 1 to 64 bytes of data are internally latched,  
freeing the addresses and data bus for other operations.  
Following the initiation of a write cycle, the device will auto-  
matically write the latched data using an internal control  
timer. The end of a write cycle can be detected by DATA  
Block Diagram  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability  
Temperature Under Bias................................ -55°C to +125°C  
Storage Temperature..................................... -65°C to +150°C  
All Input Voltages  
(including NC Pins)  
with Respect to Ground...................................-0.6V to +6.25V  
All Output Voltages  
with Respect to Ground.............................-0.6V to VCC + 0.6V  
Voltage on OE and A9  
with Respect to Ground...................................-0.6V to +13.5V  
AT28HC256  
2
AT28HC256  
occur during transition of the host system power supply.  
Atmel has incorporated both hardware and software fea-  
tures that will protect the memory against inadvertent  
writes.  
Device Operation  
READ: The AT28HC256 is accessed like a Static RAM.  
When CE and OE are low and WE is high, the data stored  
at the memory location determined by the address pins is  
asserted on the outputs. The outputs are put in the high  
impedance state when either CE or OE is high. This dual-  
line control gives designers flexibility in preventing bus con-  
tention in their system.  
HARDWARE PROTECTION: Hardware features protect  
against inadvertent writes to the AT28HC256 in the follow-  
ing ways: (a) VCC sense—if VCC is below 3.8V (typical) the  
write function is inhibited; (b) VCC power-on delay—once  
VCC has reached 3.8V the device will automatically time out  
5 ms typical) before allowing a write; (c) write inhibit—hold-  
ing any one of OE low, CE high or WE high inhibits write  
cycles; and (d) noise filter—pulses of less than 15 ns (typi-  
cal) on the WE or CE inputs will not initiate a write cycle.  
BYTE WRITE: A low pulse on the WE or CE input with CE  
or WE low (respectively) and OE high initiates a write cycle.  
The address is latched on the falling edge of CE or WE,  
whichever occurs last. The data is latched by the first rising  
edge of CE or WE. Once a byte write has been started it  
will automatically time itself to completion. Once a pro-  
gramming operation has been initiated and for the duration  
of tWC, a read operation will effectively be a polling opera-  
tion.  
SOFTWARE DATA PROTECTION: A software controlled  
data protection feature has been implemented on the  
AT28HC256. When enabled, the software data protection  
(SDP), will prevent inadvertent writes. The SDP feature  
may be enabled or disabled by the user; the AT28HC256 is  
shipped from Atmel with SDP disabled.  
PAGE WRITE: The page write operation of the  
AT28HC256 allows 1 to 64 bytes of data to be written into  
the device during a single internal programming period. A  
page write operation is initiated in the same manner as a  
byte write; the first byte written can then be followed by 1 to  
63 additional bytes. Each successive byte must be written  
within 150 µs (tBLC) of the previous byte. If the tBLC limit is  
exceeded the AT28C256 will cease accepting data and  
commence the internal programming operation. All bytes  
during a page write operation must reside on the same  
page as defined by the state of the A6 - A14 inputs. That is,  
for each WE high to low transition during the page write  
operation, A6 - A14 must be the same.  
SDP is enabled by the host system issuing a series of three  
write commands; three specific bytes of data are written to  
three specific addresses (refer to Software Data Protection  
Algorithm). After writing the 3-byte command sequence  
and after tWC the entire AT28HC256 will be protected  
against inadvertent write operations. It should be noted,  
that once protected the host may still perform a byte or  
page write to the AT28HC256. This is done by preceding  
the data to be written by the same 3-byte command  
sequence.  
Once set, SDP will remain active unless the disable com-  
mand sequence is issued. Power transitions do not disable  
SDP and SDP will protect the AT28HC256 during power-up  
and power-down conditions. All command sequences must  
conform to the page write timing specifications. It should  
also be noted that the data in the enable and disable com-  
mand sequences is not written to the device and the mem-  
ory addresses used in the sequence may be written with  
data in either a byte or page write operation.  
The A0 to A5 inputs are used to specify which bytes within  
the page are to be written. The bytes may be loaded in any  
order and may be altered within the same load period. Only  
bytes which are specified for writing will be written; unnec-  
essary cycling of other bytes within the page does not  
occur.  
DATA POLLING: The AT28HC256 features DATA Polling  
to indicate the end of a write cycle. During a byte or page  
write cycle an attempted read of the last byte written will  
result in the complement of the written data to be presented  
on I/O7. Once the write cycle has been completed, true  
data is valid on all outputs, and the next write cycle may  
begin. DATA Polling may begin at anytime during the write  
cycle.  
After setting SDP, any attempt to write to the device without  
the three byte command sequence will start the internal  
write timers. No data will be written to the device; however,  
for the duration of tWC, read operations will effectively be  
polling operations.  
DEVICE IDENTIFICATION: An extra 64 bytes of EEPROM  
memory are available to the user for device identification.  
By raising A9 to 12V ± 0.5V and using address locations  
7FC0H to 7FFFH the additional bytes may be written to or  
read from in the same manner as the regular memory  
array.  
TOGGLE BIT: In addition to DATA Polling the AT28HC256  
provides another method for determining the end of a write  
cycle. During the write operation, successive attempts to  
read data from the device will result in I/O6 toggling  
between one and zero. Once the write has completed, I/O6  
will stop toggling and valid data will be read. Testing the  
toggle bit may begin at any time during the write cycle.  
OPTIONAL CHIP ERASE MODE: The entire device can  
be erased using a 6-byte software code. Please see Soft-  
ware Chip Erase application note for details.  
DATA PROTECTION: If precautions are not taken, inad-  
vertent writes to any 5-volt-only nonvolatile memory may  
3
DC and AC Operating Range  
AT28HC256-70  
0°C - 70°C  
AT28HC256-90  
0°C - 70°C  
AT28HC256-12  
0°C - 70°C  
Com.  
Operating  
Temperature (Case)  
Ind.  
-40°C - 85°C  
-40°C - 85°C  
-55°C - 125°C  
5V ± 10%  
-40°C - 85°C  
-55°C - 125°C  
5V ± 10%  
Mil.  
VCC Power Supply  
5V ± 10%  
Operating Modes  
Mode  
CE  
VIL  
VIL  
VIH  
X
OE  
VIL  
VIH  
X(1)  
X
WE  
VIH  
VIL  
X
I/O  
DOUT  
DIN  
Read  
Write(2)  
Standby/Write Inhibit  
Write Inhibit  
Write Inhibit  
Output Disable  
High Z  
VIH  
X
X
VIL  
VIH  
X
X
High Z  
High Z  
(3)  
Chip Erase  
VIL  
VH  
VIL  
Notes: 1. X can be VIL or VIH.  
2. Refer to AC Programming Waveforms.  
3. VH = 12.0V ± 0.5V.  
DC Characteristics  
Symbol  
Parameter  
Condition  
Min  
Max  
10  
Units  
ILI  
Input Load Current  
Output Leakage Current  
VIN = 0V to VCC + 1V  
VI/O = 0V to VCC  
µA  
µA  
mA  
mA  
µA  
mA  
V
ILO  
10  
AT28HC256-90, -12  
AT28HC256-70  
3
ISB1  
VCC Standby Current TTL  
CE = 2.0V to VCC + 1V  
60  
ISB2  
ICC  
VCC Standby Current CMOS  
VCC Active Current  
CE = -3.0V to VCC + 1V AT28HC256-90, -12  
f = 5 MHz; IOUT = 0 mA  
300  
80  
VIL  
Input Low Voltage  
0.8  
VIH  
VOL  
VOH  
Input High Voltage  
2.0  
2.4  
V
Output Low Voltage  
Output High Voltage  
IOL = 6.0 mA  
IOH = -4 mA  
0.45  
V
V
AT28HC256  
4
AT28HC256  
AC Read Characteristics  
AT28HC256-70  
AT28C256-90  
AT28HC256-12  
Symbol  
tACC  
Parameter  
Address to Output Delay  
CE to Output Delay  
Min  
Max  
70  
Min  
Max  
Min  
Max  
120  
120  
50  
Units  
ns  
90  
90  
40  
40  
(1)  
tCE  
tOE  
tDF  
70  
ns  
(2)  
OE to Output Delay  
0
0
35  
0
0
0
0
ns  
(3)(4)  
CE or OE to Output Float  
35  
50  
ns  
Output Hold from OE, CE or Address,  
whichever occurred first  
tOH  
0
0
0
ns  
AC Read Waveforms(1)(2)(3)(4)  
Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC  
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change  
without impact on tACC  
.
.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).  
4. This parameter is characterized and is not 100% tested.  
Input Test Waveforms and  
Measurement Level  
Output Test Load  
tR, tF < 5 ns  
Pin Capacitance  
f = 1 MHz, T = 25°C(1)  
Symbol  
CIN  
Typ  
4
Max  
6
Units  
pF  
Conditions  
VIN = 0V  
COUT  
8
12  
pF  
VOUT = 0V  
Note:  
1. This parameter is characterized and is not 100% tested.  
5
AC Write Characteristics  
Symbol  
Parameter  
Min  
0
Max  
Units  
ns  
t
AS, tOES  
Address, OE Set-up Time  
Address Hold Time  
tAH  
tCS  
tCH  
tWP  
tDS  
50  
0
ns  
Chip Select Set-up Time  
Chip Select Hold Time  
Write Pulse Width (WE or CE)  
Data Set-up Time  
ns  
0
ns  
100  
50  
0
ns  
ns  
t
DH, tOEH  
Data, OE Hold Time  
ns  
tDV  
Time to Data Valid  
NR(1)  
Note:  
1. NR = No Restriction.  
AC Write Waveforms  
WE Controlled  
CE Controlled  
AT28HC256  
6
AT28HC256  
Page Mode Write Characteristics  
Symbol  
Parameter  
Min  
Typ  
5
Max  
10  
Units  
ms  
ms  
ns  
AT28HC256  
tWC  
Write Cycle Time  
AT28HC256F  
2
3.0  
tAS  
Address Set-up Time  
Address Hold Time  
Data Set-up Time  
0
50  
50  
0
tAH  
ns  
tDS  
ns  
tDH  
Data Hold Time  
ns  
tWP  
tBLC  
tWPH  
Write Pulse Width  
Byte Load Cycle Time  
Write Pulse Width High  
100  
ns  
150  
µs  
50  
ns  
Page Mode Write Waveforms(1)(2)  
Notes: 1. A6 through A14 must specify the same page address during each high to low transition of WE (or CE).  
2. OE must be high only when WE and CE are both low.  
Chip Erase Waveforms  
tS = tH = 5 µsec (min.)  
tW = 10 msec (min.)  
VH = 12.0V ± 0.5V  
7
Software Data Protection  
Enable Algorithm(1)  
Software Data Protection  
Disable Algorithm(1)  
LOAD DATA AA  
TO  
LOAD DATA AA  
TO  
ADDRESS 5555  
ADDRESS 5555  
LOAD DATA 55  
TO  
LOAD DATA 55  
TO  
ADDRESS 2AAA  
ADDRESS 2AAA  
LOAD DATA A0  
TO  
LOAD DATA 80  
TO  
ADDRESS 5555  
ADDRESS 5555  
WRITES ENABLED(2)  
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
LOAD DATA AA  
TO  
ADDRESS 5555  
LOAD LAST BYTE  
TO  
LOAD DATA 55  
TO  
LAST ADDRESS  
ADDRESS 2AAA  
ENTER DATA  
PROTECT STATE  
LOAD DATA 20  
TO  
Notes for software program code:  
ADDRESS 5555  
1. Data Format: I/O7 - I/O0 (Hex);  
Address Format: A14 - A0 (Hex).  
EXIT DATA  
PROTECT STATE(3)  
LOAD DATA XX  
TO  
ANY ADDRESS(4)  
2. Write Protect state will be activated at end of  
write even if no other data is loaded.  
3. Write Protect state will be deactivated at end of  
write period even if no other data is loaded.  
LOAD LAST BYTE  
TO  
4. 1 to 64 bytes of data are loaded.  
LAST ADDRESS  
Software Protected Write Cycle Waveforms(1)(2)  
Notes: 1. A6 through A14 must specify the same page address during each high to low transition of WE (or CE) after the software  
code has been entered.  
2. OE must be high only when WE and CE are both low.  
AT28HC256  
8
AT28HC256  
Data Polling Characteristics(1)  
Symbol  
Parameter  
Min  
0
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
tOEH  
tOE  
OE Hold Time  
0
ns  
OE to Output Delay(2)  
Write Recovery Time  
ns  
tWR  
0
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See AC Read Characteristics.  
Data Polling Waveforms  
Toggle Bit Characteristics(1)  
Symbol  
Parameter  
Min  
10  
Typ  
Max  
Units  
ns  
tDH  
Data Hold Time  
OE Hold Time  
tOEH  
tOE  
tOEHP  
tWR  
10  
ns  
OE to Output Delay(2)  
ns  
OE High Pulse  
150  
0
ns  
Write Recovery Time  
ns  
Notes: 1. These parameters are characterized and not 100% tested.  
2. See AC Read Characteristics.  
Toggle Bit Waveforms  
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.  
2. Beginning and ending state of I/O6 will vary.  
3. Any address location may be used but the address should not vary.  
9
AT28HC256  
10  
AT28HC256  
Ordering Information(1)  
I
Active  
80  
CC (mA)  
tACC  
(ns)  
Standby  
Ordering Code  
Package  
Operation Range  
70  
60  
0.3  
0.3  
AT28HC256(E,F)-70JC  
AT28HC256(E,F)-70PC  
32J  
Commercial  
28P6  
(0°C to 70°C)  
AT28HC256(E,F)-70JI  
AT28HC256(E,F)-70PI  
32J  
Industrial  
28P6  
(-40°C to 85°C)  
90  
80  
AT28HC256(E,F)-90JC  
AT28HC256(E,F)-90PC  
32J  
Commercial  
28P6  
(0°C to 70°C)  
AT28HC256(E,F)-90JI  
AT28HC256(E,F)-90PI  
32J  
Industrial  
28P6  
(-40°C to 85°C)  
80  
80  
80  
80  
0.3  
0.3  
0.3  
0.3  
AT28HC256(E,F)-90DM/883  
AT28HC256(E,F)-90FM/883  
AT28HC256(E,F)-90LM/883  
AT28HC256(E,F)-90UM/883  
28D6  
28F  
Military/883C  
Class B, Fully Compliant  
(-55°C to 125°C)  
32L  
28U  
120  
AT28HC256(E,F)-12JC  
AT28HC256(E,F)-12PC  
AT28HC256(E,F)-12SC  
AT28HC256(E,F)-12TC  
32J  
Commercial  
28P6  
28S  
28T  
(0°C to 70°C)  
AT28HC256(E,F)-12JI  
AT28HC256(E,F)-12PI  
AT28HC256(E,F)-12SI  
AT28HC256(E,F)-12TI  
32J  
Industrial  
28P6  
28S  
28T  
(-40°C to 85°C)  
AT28HC256(E,F)-12DM/883  
AT28HC256(E,F)-12FM/883  
AT28HC256(E,F)-12LM/883  
AT28HC256(E,F)-12UM/883  
28D6  
28F  
Military/883C  
Class B, Fully Compliant  
(-55°C to 125°C)  
32L  
28U  
Package Type  
28D6  
28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip)  
28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)  
32-Lead, Plastic J-Leaded Chip Carrier (PLCC)  
32-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)  
28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)  
28-Lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)  
28-Lead, Plastic Thin Small Outline Package (TSOP)  
28-Pin, Ceramic Pin Grid Array (PGA)  
28F  
32J  
32L  
28P6  
28S  
28T  
28U  
W
Die  
Options  
Blank  
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms  
High Endurance Option: Endurance = 100K Write Cycles  
Fast Write Option: Write Time = 3 ms  
E
F
11  
Ordering Information(1) (Continued)  
I
Active  
80  
CC (mA)  
tACC  
(ns)  
Standby  
Ordering Code  
Package  
Operation Range  
90  
0.3  
0.3  
0.3  
0.3  
5962-88634 03 UX  
5962-88634 03 XX  
5962-88634 03 YX  
5962-88634 03 ZX  
28U  
28D6  
32L  
Military/883C  
Class B, Fully Compliant  
(-55°C to 125°C)  
28F  
80  
80  
80  
5962-88634 04 UX  
5962-88634 04 XX  
5962-88634 04 YX  
5962-88634 04 ZX  
28U  
28D6  
32L  
Military/883C  
Class B, Fully Compliant  
(-55°C to 125°C)  
28F  
120  
5962-88634 01 UX  
5962-88634 01 XX  
5962-88634 01 YX  
5962-88634 01 ZX  
28U  
28D6  
32L  
Military/883C  
Class B, Fully Compliant  
(-55°C to 125°C)  
28F  
5962-88634 02 UX  
5962-88634 02 XX  
5962-88634 02 YX  
5962-88634 02 ZX  
28U  
28D6  
32L  
Military/883C  
Class B, Fully Compliant  
(-55°C to 125°C)  
28F  
Note:  
1. See Valid Part Numbers table on next page.  
Package Type  
28D6  
28-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline Package (Cerdip)  
28-Lead, Non-Windowed, Ceramic Bottom-Brazed Flat Package (Flatpack)  
32-Lead, Plastic J-Leaded Chip Carrier (PLCC)  
32-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC)  
28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)  
28-Lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)  
28-Lead, Plastic Thin Small Outline Package (TSOP)  
28-Pin, Ceramic Pin Grid Array (PGA)  
28F  
32J  
32L  
28P6  
28S  
28T  
28U  
W
Die  
Options  
Blank  
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms  
High Endurance Option: Endurance = 100K Write Cycles  
Fast Write Option: Write Time = 3 ms  
E
F
AT28HC256  
12  
AT28HC256  
Ordering Information Note  
Previous data sheets included the low power suffixes L, LE and LF on the At28HC256 for 120 ns and 90 ns speeds.  
The low power parameters are now standard; therefore, the L, LE and LF suffixes are no longer required.  
Valid Part Numbers  
The following table lists standard Atmel products that can be ordered:  
Device Numbers  
AT28HC256  
Speed  
70  
Package and Temperature Combinations  
JC, JI, PC, PI  
AT28HC256  
90  
JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883  
JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883  
JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883  
JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883  
JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883  
JC, JI, PC, PI, TC, TI, DM/883, FM/883, UM/883  
AT28HC256E  
AT28HC256F  
AT28HC256  
90  
90  
12  
AT28HC256E  
AT28HC256F  
12  
12  
Die Products  
Reference Section: Parallel EEPROM Die Products  
13  
Packaging Information  
28D6, 28-Lead, 0.600" Wide, Non-Windowed,  
28F, 28-Lead, Non-Windowed, Ceramic Bottom-  
Ceramic Dual Inline Package (Cerdip)  
Dimensions in Inches and (Millimeters)  
MIL-STD-1835 D-10 CONFIG A  
Brazed Flat Package (Flatpack)  
Dimensions in Inches and (Millimeters)  
MIL-STD-1835 F-12 CONFIG B  
1.49(37.9)  
1.44(36.6)  
PIN  
1
.370(9.40)  
PIN #1 ID  
.250(6.35)  
.019(.483)  
.015(.381)  
.610(15.5)  
.510(13.0)  
.050(1.27) BSC  
.728(18.5)  
.712(18.1)  
.098(2.49)  
MAX  
1.300(33.02) REF  
.045(1.14) MAX  
.005(.127)  
MIN  
.225(5.72)  
MAX  
.416(10.6)  
.384(9.75)  
SEATING  
PLANE  
.200(5.08)  
.060(1.52)  
.015(.381)  
.023(.584)  
.014(.356)  
.125(3.18)  
.006(.152)  
.004(.102)  
.119(3.02)  
.087(2.21)  
.065(1.65)  
.045(1.14)  
.110(2.79)  
.090(2.29)  
.620(15.7)  
.590(15.0)  
.077(1.96)  
.043(1.09)  
0
15  
REF  
.045(1.14)  
.026(.660)  
.286(7.26)  
.274(6.96)  
.015(.381)  
.008(.203)  
.700(17.8) MAX  
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)  
Dimensions in Inches and (Millimeters)  
JEDEC STANDARD MS-016 AE  
32L, 32-Pad, Non-Windowed, Ceramic Leadless  
Chip Carrier (LCC)  
Dimensions in Inches and (Millimeters)*  
MIL-STD-1835 C-12  
.025(.635) X 30° - 45°  
.045(1.14) X 45° PIN NO. 1  
.012(.305)  
IDENTIFY  
.008(.203)  
.530(13.5)  
.553(14.0)  
.490(12.4)  
.547(13.9)  
.032(.813)  
.021(.533)  
.013(.330)  
.595(15.1)  
.026(.660)  
.585(14.9)  
.030(.762)  
.015(3.81)  
.095(2.41)  
.060(1.52)  
.140(3.56)  
.120(3.05)  
.050(1.27) TYP  
.300(7.62) REF  
.430(10.9)  
.390(9.90)  
AT CONTACT  
POINTS  
.022(.559) X 45° MAX (3X)  
.453(11.5)  
.447(11.4)  
.495(12.6)  
.485(12.3)  
*Controlling dimension: millimeters  
AT28HC256  
14  
AT28HC256  
Packaging Information  
28P6, 28-Lead, 0.600" Wide, Plastic Dual Inline  
Package (PDIP)  
28S, 28-Lead, 0.300" Wide, Plastic Gull Wing Small  
Outline (SOIC)  
Dimensions in Inches and (Millimeters)  
JEDEC STANDARD MS-011 AB  
Dimensions in Inches and (Millimeters)  
1.47(37.3)  
1.44(36.6)  
PIN  
1
.566(14.4)  
.530(13.5)  
.090(2.29)  
MAX  
1.300(33.02) REF  
.220(5.59)  
MAX  
.005(.127)  
MIN  
SEATING  
PLANE  
.065(1.65)  
.015(.381)  
.022(.559)  
.014(.356)  
.161(4.09)  
.125(3.18)  
.065(1.65)  
.041(1.04)  
.110(2.79)  
.090(2.29)  
.630(16.0)  
.590(15.0)  
0
15  
REF  
.012(.305)  
.008(.203)  
.690(17.5)  
.610(15.5)  
28T, 28-Lead, Plastic Thin Small Outline Package  
(TSOP)  
28U, 28-Pin, Ceramic Pin Grid Array (PGA)  
Dimensions in Inches and (Millimeters)  
Dimensions in Millimeters and (Inches)*  
INDEX  
MARK  
AREA  
13.7 (0.539)  
13.1 (0.516)  
11.9 (0.469)  
11.7 (0.461)  
0.27 (0.011)  
0.18 (0.007)  
0.55 (0.022)  
BSC  
7.15 (0.281)  
REF  
8.10 (0.319)  
7.90 (0.311)  
1.25 (0.049)  
1.05 (0.041)  
0.20 (0.008)  
0.10 (0.004)  
0
REF  
5
0.20 (0.008)  
0.15 (0.006)  
0.70 (0.028)  
0.30 (0.012)  
*Controlling dimension: millimeters  
15  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL (408) 441-0311  
FAX (408) 487-2600  
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Colorado Springs, CO 80906  
TEL (719) 576-3300  
FAX (719) 540-1759  
Europe  
Atmel U.K., Ltd.  
Atmel Rousset  
Zone Industrielle  
Coliseum Business Centre  
Riverside Way  
Camberley, Surrey GU15 3YL  
England  
13106 Rousset Cedex, France  
TEL (33) 4 42 53 60 00  
FAX (33) 4 42 53 60 01  
TEL (44) 1276-686677  
FAX (44) 1276-686697  
Asia  
Atmel Asia, Ltd.  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road  
Tsimshatsui East  
Kowloon, Hong Kong  
TEL (852) 27219778  
FAX (852) 27221369  
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Atmel Japan K.K.  
Tonetsu Shinkawa Bldg., 9F  
1-24-8 Shinkawa  
Chuo-ku, Tokyo 104-0033  
Japan  
TEL (81) 3-3523-3551  
FAX (81) 3-3523-7581  
Fax-on-Demand  
North America:  
1-(800) 292-8635  
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e-mail  
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Web Site  
http://www.atmel.com  
BBS  
1-(408) 436-4309  
© Atmel Corporation 1998.  
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war-  
ranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for  
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without  
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual prop-  
erty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are  
not authorized for use as critical components in life support devices or systems.  
®
Marks bearing and/or are registered trademarks and trademarks of Atmel Corporation.  
Terms and product names in this document may be trademarks of others.  
Printed on recycled paper.  
0007G–05/98/xM  
配单直通车
AT28HC256-90FM/883产品参数
型号:AT28HC256-90FM/883
是否无铅: 含铅
是否Rohs认证: 不符合
生命周期:Active
IHS 制造商:MICROCHIP TECHNOLOGY INC
包装说明:FP-28
Reach Compliance Code:not_compliant
Factory Lead Time:21 weeks
风险等级:5.67
最长访问时间:90 ns
其他特性:AUTOMATIC WRITE
命令用户界面:NO
数据轮询:YES
耐久性:10000 Write/Erase Cycles
JESD-30 代码:R-CDFP-F28
JESD-609代码:e0
长度:18.285 mm
内存密度:262144 bit
内存集成电路类型:EEPROM
内存宽度:8
功能数量:1
端子数量:28
字数:32768 words
字数代码:32000
工作模式:ASYNCHRONOUS
最高工作温度:125 °C
最低工作温度:-55 °C
组织:32KX8
输出特性:3-STATE
封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP
封装等效代码:FL28,.4
封装形状:RECTANGULAR
封装形式:FLATPACK
页面大小:64 words
并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V
编程电压:5 V
认证状态:Not Qualified
筛选级别:MIL-STD-883 Class C
座面最大高度:3.02 mm
最大待机电流:0.0003 A
子类别:EEPROMs
最大压摆率:0.08 mA
最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:CMOS
温度等级:MILITARY
端子面层:TIN LEAD
端子形式:FLAT
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:YES
宽度:10.16 mm
最长写入周期时间 (tWC):10 ms
Base Number Matches:1
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