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产品型号B57371V2103+060的Datasheet PDF文件预览

NTC thermistors for  
temperature measurement  
SMD NTC thermistors,  
case size 0603 (1608), standard series  
Series/Type:  
B573**V2  
Date:  
January 2016  
© EPCOS AG 2016. Reproduction, publication and dissemination of this publication, enclosures hereto and the  
information contained therein without EPCOS' prior express consent is prohibited.  
EPCOS AG is a TDK Group Company.  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Applications  
Dimensional drawing  
Temperature measurement and  
compensation  
Features  
Multilayer SMD NTC with inner electrodes  
Nickel barrier termination  
Excellent long-term aging stability in high  
temperature environment  
UL approval (E69802)  
Options  
Alternative resistance ratings, resistance  
tolerances and B value tolerances available  
on request.  
Dimensions in mm  
Approx. weight 6 mg  
Delivery mode  
Cardboard tape, 180-mm reel (standard);  
330-mm reel (on request)  
General technical data  
Operating temperature range  
Max. power  
Top  
55 ... 125  
180  
°C  
mW  
%
°C  
mW/K  
s
1)  
(at 25 °C, on PCB) P25  
Resistance tolerance  
Rated temperature  
Dissipation factor  
Thermal cooling time constant  
Heat capacity  
RR/RR ±1, ±3, ±5  
TR  
25  
1)  
(on PCB)  
(on PCB)  
δth  
approx. 3  
approx. 4  
approx. 12  
1)  
τc  
1)  
Cth  
mJ/K  
1) Depends on mounting situation  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 2 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Electrical specification and ordering codes  
RR/RR  
%
R25  
No. of R/T  
characteristic  
B25/50  
K
B25/85  
K
B25/100  
K
Ordering code  
1.0 k  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±1  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±3, ±5  
±1  
8502  
8502  
8500  
8507  
8509  
8509  
8500  
8502  
8507  
8502  
8507  
8502  
8507  
8507  
8507  
8507  
8507  
8507  
3940  
3940  
3590  
4386  
3380  
3380  
3590  
3940  
4386  
3940  
4386  
3940  
4386  
4386  
4386  
4386  
4386  
4386  
3980  
3980  
3635  
4455  
3435  
3435  
3635  
3980  
4455  
3980  
4455  
3980  
4455  
4455  
4455  
4455  
4455  
4455  
4000 ±3% B57321V2102+060  
4000 ±3% B57321V2222+060  
3650 ±3% B57301V2472+060  
4480 ±3% B57371V2682+060  
3455 ±1% B57330V2103F260  
3455 ±1% B57330V2103+260  
3650 ±3% B57301V2103+060  
4000 ±3% B57321V2103+060  
4480 ±3% B57371V2103+060  
4000 ±3% B57321V2223+060  
4480 ±3% B57371V2223+060  
4000 ±3% B57321V2473+060  
4480 ±3% B57371V2473+060  
4480 ±3% B57371V2683+060  
4480 ±1% B57374V2104F060  
4480 ±1% B57374V2104+060  
4480 ±3% B57371V2104+060  
4480 ±3% B57371V2474+060  
2.2 k  
4.7 k  
6.8 k  
10 k  
10 k  
10 k  
10 k  
10 k  
22 k  
22 k  
47 k  
47 k  
68 k  
100 k  
100 k  
100 k  
470 k  
±3, ±5  
±3, ±5  
±3, ±5  
+ = Resistance tolerance  
F = ±1% (only for B57330V2103F260 and B57374V2104F060)  
H = ±3%  
J = ±5%  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 3 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Reliability data  
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a  
standardized PCB in accordance with IEC 60539-1.  
Test  
Standard  
Test conditions  
R25/R25  
Remarks  
(typical)  
Storage in  
dry heat  
IEC  
60068-2-2  
Storage at upper  
category temperature  
< 2%  
JIS C 0021 T: (125 ±2) °C  
t: 1000 h  
Storage in damp  
heat, steady state  
IEC  
Temperature of air: (40 ±2) °C  
< 2%  
60068-2-78 Relative humidity of air:  
JIS C 0022 (93 +2/3)%  
Duration: 56 days  
Rapid temperature IEC  
Lower test temperature: 55 °C < 2%  
cycling  
60068-2-14 Upper test temperature: 125 °C  
JIS C 0025 Number of cycles: 100  
Endurance  
Pmax: 180 mW  
T: (65 ±2) °C  
t: 1000 h  
< 2%  
Solderability  
IEC  
Solderability:  
95% of  
60068-2-58 (215 ±3) °C, (3 ±0.3) s  
JIS C 0054 (245 ±5) °C, (3 ±0.3) s  
terminations  
wetted  
Resistance to soldering heat:  
(260 ±5) °C, (10 ±1) s  
Resistance drift  
after soldering  
Reflow soldering profile  
Wave soldering profile  
< 1%  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 4 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
R/T characteristics  
8500  
8502  
R/T No.  
T (°C)  
B25/100 = 3650 K  
RT/R25  
B25/100 = 4000 K  
α (%/K) RT/R25  
α (%/K)  
55.0 63.917  
50.0 45.889  
45.0 33.344  
40.0 24.504  
35.0 18.201  
6.8  
6.5  
6.3  
6.1  
5.8  
96.158  
66.892  
47.127  
33.606  
24.243  
7.4  
7.1  
6.9  
6.6  
6.4  
30.0 13.657  
25.0 10.347  
5.6  
5.5  
5.3  
5.1  
4.9  
17.681  
13.032  
9.702  
7.2923  
5.5314  
6.2  
6.0  
5.8  
5.6  
5.4  
20.0  
15.0  
10.0  
7.9114  
6.1019  
4.7454  
5.0  
0.0  
5.0  
10.0  
15.0  
3.7198  
2.938  
2.3372  
1.8722  
1.5096  
4.8  
4.6  
4.5  
4.4  
4.2  
4.2325  
3.2657  
2.54  
1.9907  
1.5716  
5.3  
5.1  
4.9  
4.8  
4.7  
20.0  
25.0  
30.0  
35.0  
40.0  
1.2249  
1.0000  
0.82111  
0.67798  
0.56279  
4.1  
4.0  
3.9  
3.8  
3.7  
1.2494  
1.0000  
0.80552  
0.65288  
0.53229  
4.5  
4.4  
4.3  
4.1  
4.0  
45.0  
50.0  
55.0  
60.0  
65.0  
0.46958  
0.39374  
0.33171  
0.28073  
0.23863  
3.6  
3.5  
3.4  
3.3  
3.2  
0.43645  
0.35981  
0.29819  
0.24837  
0.20787  
3.9  
3.8  
3.7  
3.6  
3.5  
70.0  
75.0  
80.0  
85.0  
90.0  
0.2037  
3.1  
3.0  
3.0  
2.9  
2.8  
0.17479  
0.14763  
0.12523  
0.10667  
0.091227  
3.4  
3.3  
3.2  
3.2  
3.1  
0.17459  
0.15022  
0.12975  
0.11247  
95.0  
100.0  
105.0  
110.0  
115.0  
0.097838  
0.085396  
0.074781  
0.065691  
0.057883  
2.8  
2.7  
2.6  
2.6  
2.5  
0.078319  
0.067488  
0.058363  
0.050647  
0.044098  
3.0  
2.9  
2.9  
2.8  
2.7  
120.0  
125.0  
130.0  
135.0  
140.0  
0.051153  
0.045335  
0.040289  
0.0359  
2.4  
2.4  
2.3  
2.3  
2.2  
0.03852  
2.7  
2.6  
2.6  
2.5  
2.4  
0.033752  
0.029663  
0.026146  
0.023111  
0.032071  
145.0  
150.0  
0.028723  
0.025786  
2.2  
2.1  
0.020484  
0.018203  
2.4  
2.3  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 5 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
R/T characteristics  
8507  
8509  
R/T No.  
T (°C)  
B25/100 = 4480 K  
RT/R25  
B25/100 = 3455 K  
α (%/K) RT/R25  
α (%/K)  
55.0 142.71  
7.9  
7.6  
7.4  
7.1  
6.9  
44.605  
33.281  
25.044  
19.003  
14.536  
5.9  
5.8  
5.6  
5.4  
5.3  
50.0  
45.0  
40.0  
35.0  
96.913  
66.637  
46.366  
32.629  
30.0  
25.0  
20.0  
15.0  
10.0  
23.213  
16.686  
12.115  
8.8803  
6.5692  
6.7  
6.5  
6.3  
6.1  
5.9  
11.206  
8.7041  
6.8104  
5.3665  
4.2576  
5.1  
5.0  
4.8  
4.7  
4.6  
5.0  
0.0  
5.0  
10.0  
15.0  
4.9025  
3.6896  
2.7994  
2.1406  
1.6492  
5.8  
5.6  
5.4  
5.3  
5.1  
3.4001  
2.7326  
2.2096  
1.7973  
1.4703  
4.4  
4.3  
4.2  
4.1  
4.0  
20.0  
25.0  
30.0  
35.0  
40.0  
1.2798  
1.0000  
0.78663  
0.62277  
0.4961  
5.0  
4.9  
4.7  
4.6  
4.5  
1.2093  
1.0000  
0.83113  
0.69418  
0.58255  
3.9  
3.7  
3.6  
3.6  
3.5  
45.0  
50.0  
55.0  
60.0  
65.0  
0.39757  
0.32044  
0.2597  
0.21161  
0.17331  
4.4  
4.3  
4.1  
4.0  
3.9  
0.49112  
0.41587  
0.35365  
0.30197  
0.25888  
3.4  
3.3  
3.2  
3.1  
3.0  
70.0  
75.0  
80.0  
85.0  
90.0  
0.14265  
0.11799  
0.098035  
0.081823  
0.068589  
3.8  
3.8  
3.7  
3.6  
3.5  
0.22278  
0.19243  
0.16681  
0.1451  
3.0  
2.9  
2.8  
2.8  
2.7  
0.12663  
95.0  
100.0  
105.0  
110.0  
115.0  
0.057735  
0.048796  
0.041403  
0.035263  
0.030143  
3.4  
3.3  
3.2  
3.2  
3.1  
0.11088  
2.6  
2.6  
2.5  
2.4  
2.4  
0.097381  
0.085788  
0.075795  
0.067155  
120.0  
125.0  
130.0  
135.0  
140.0  
0.025858  
0.022258  
0.019223  
0.016655  
0.014476  
3.0  
3.0  
2.9  
2.8  
2.8  
0.059663  
0.053146  
0.047463  
0.042493  
0.038134  
2.3  
2.3  
2.2  
2.2  
2.1  
145.0  
150.0  
0.012619  
0.011033  
2.7  
2.7  
0.034302  
0.030925  
2.1  
2.1  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 6 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Taping and packing  
1
Taping of SMD NTC thermistors  
1.1  
Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3)  
Dimensions (mm)  
Case size  
Case size  
0603  
Tolerance  
0402  
(8-mm tape)  
(8-mm tape)  
A0 × B0  
T2  
0.60 × 1.15  
0.70  
0.95 × 1.80  
1.10  
±0.2  
T
0.60  
0.95  
max.  
D0  
P0  
P2  
P1  
W
1.50  
1.50  
±0.10  
±0.101)  
±0.05  
±0.10  
±0.30  
±0.10  
±0.05  
min.  
4.00  
4.00  
2.00  
2.00  
2.00  
4.00  
8.00  
8.00  
E
1.75  
1.75  
F
3.50  
3.50  
G
0.75  
0.75  
1) 0.2 mm over 10 sprocket holes.  
Please read Cautions and warnings and  
Page 7 of 22  
Important notes at the end of this document.  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
1.2  
Blister tape for case size 0805 and 1206 (taping to IEC 60286-3)  
Dimensions (mm)  
Case size  
Case size  
1206  
Tolerance  
0805  
(8-mm tape)  
(8-mm tape)  
A0 × B0  
K0  
T2  
1.50 × 2.30  
1.40  
1.80 × 3.40  
1.40  
±0.2  
max.  
2.5  
2.5  
max.  
D0  
D1  
P0  
P2  
P1  
W
1.50  
1.50  
+0.10/–0  
min.  
0.30  
0.30  
4.00  
4.00  
±0.102)  
±0.05  
±0.10  
±0.30  
±0.10  
±0.05  
min.  
2.00  
2.00  
4.00  
4.00  
8.00  
8.00  
E
1.75  
1.75  
F
3.50  
3.50  
G
0.75  
0.75  
2) 0.2 mm over 10 sprocket holes.  
Please read Cautions and warnings and  
Page 8 of 22  
Important notes at the end of this document.  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
1.3  
Reel packing  
Dimensions in mm  
8-mm tape  
180-mm reel  
180 +0/3  
8.4 +1.5/0  
14.4 max.  
330-mm reel  
A
330 +0/2.0  
8.4 +1.5/0  
14.4 max.  
W1  
W2  
Leader, trailer  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 9 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
1.4  
Packing units for discrete chip and array chip  
Case size Chip thickness  
Cardboard tape Blister tape  
180-mm reel  
pcs.  
10000  
4000  
4000  
3000  
3000  
3000  
330-mm reel  
inch/mm  
th  
0.5 mm  
W
W
pcs.  
50000  
16000  
16000  
12000  
12000  
12000  
0402/1005  
0603/1608  
0805/2012  
8 mm  
0.8 mm  
0.8 mm  
1.2 mm  
0.8 mm  
1.2 mm  
8 mm  
8 mm  
8 mm  
8 mm  
8 mm  
8 mm  
1206/3216  
2
Packing codes  
The last two digits of the complete ordering code state the packing mode:  
Last two digits  
60  
62  
70  
72  
SMD  
SMD  
SMD  
SMD  
Cardboard tape  
Blister tape  
180-mm reel packing  
180-mm reel packing  
330-mm reel packing  
330-mm reel packing  
Cardboard tape  
Blister tape  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 10 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Mounting instructions  
1
Soldering  
1.1  
SMD NTC thermistors  
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with  
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-  
ed as well as a proper cleaning of the PCB.  
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the  
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.  
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The  
nickel barrier termination is suitable for all commonly-used soldering methods.  
Note: SMD NTCs with AgPd termination are not approved for lead-free soldering.  
Figure 1  
SMD NTC thermistors, structure of nickel barrier termination  
1.1.1 Solderability (test to IEC 60068-2-58)  
Preconditioning: Immersion into flux F-SW 32.  
Evaluation criterion: Wetting of soldering areas 95%.  
Solder  
Bath temperature (°C)  
215 ±3  
Dwell time (s)  
3 ±0.3  
SnPb 60/40  
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)  
245 ±3  
3 ±0.3  
1.1.2 Resistance to soldering heat (test to IEC 60068-2-58)  
Preconditioning: Immersion into flux F-SW 32.  
Evaluation criterion: Leaching of side edges 1/3.  
Solder  
Bath temperature (°C)  
Dwell time (s)  
10 ±1  
SnPb 60/40  
260 ±5  
260 ±5  
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)  
10 ±1  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 11 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Wave soldering  
Temperature characteristic at component terminal with dual wave soldering  
Solder joint profiles for silver/nickel/tin terminations  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 12 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Reflow soldering  
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D  
Profile feature  
Sn-Pb eutectic assembly Pb-free assembly  
Preheat and soak  
- Temperature min  
- Temperature max  
- Time  
Average ramp-up rate  
Liquidous temperature  
Time at liquidous  
Peak package body temperature Tp  
Time (tP)3) within 5 °C of specified  
classification temperature (Tc)  
Tsmin  
Tsmax  
100 °C  
150 °C  
150 °C  
200 °C  
tsmin to tsmax 60 ... 120 s  
Tsmax to Tp 3 °C/ s max.  
60 ... 180 s  
3 °C/ s max.  
217 °C  
60 ... 150 s  
245 °C ... 260 °C2)  
TL  
tL  
183 °C  
60 ... 150 s  
220 °C ... 235 °C2)  
1)  
20 s3)  
30 s3)  
Average ramp-down rate  
Tp to Tsmax 6 °C/ s max.  
6 °C/ s max.  
Time 25 °C to peak temperature  
maximum 6 min  
maximum 8 min  
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.  
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.  
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.  
Note: All temperatures refer to topside of the package, measured on the package body surface.  
Number of reflow cycles: 3  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 13 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Solder joint profiles for silver/nickel/tin terminations  
1.1.3 Recommended geometry of solder pads  
Recommended maximum dimensions (mm)  
Case size  
inch/mm  
A
B
C
0402/1005 0.6  
0603/1608 1.0  
0805/2012 1.3  
1206/3216 1.8  
0.6  
1.0  
1.2  
1.2  
1.7  
3.0  
3.4  
4.5  
1.1.4 Notes  
Iron soldering should be avoided, hot air methods are recommended for repair purposes.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 14 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
2
Conductive adhesion  
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of  
this method is that it involves no thermal stress. The adhesives used must be chemically inert.  
3
Clamp contacting  
Pressure contacting by means of clamps is particularly suitable for applications involving frequent  
switching and high turn-on powers.  
4
Sealing and potting  
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused  
by thermal expansion during the production process (curing / overmolding process) and during  
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure  
that the materials used (sealing / potting compound and plastic material) are chemically neutral.  
5
Cleaning  
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are  
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are  
permissible.  
6
Storage  
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.  
Humidity, temperature and container materials are critical factors.  
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-  
terial may be deformed or SMDs may stick together, causing problems during mounting. After  
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.  
The components should be left in the original packing. Touching the metallization of unsoldered  
thermistors may change their soldering properties.  
Storage temperature:  
25 °C up to 45 °C  
Relative humidity (without condensation):  
75% annual mean  
<95%, maximum 30 days per annum  
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-  
fied:  
SMDs:  
12 months for Ni-barrier termination  
6 months for AgPd termination  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 15 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
7
Placement and orientation of SMD NTC thermistors on PCB  
a) Component placement  
It is recommended that the PC board  
should be held by means of some  
adequate supporting pins such as  
shown left to prevent the SMDs from  
being damaged or cracked.  
b) Cracks  
When placing a component near an  
area which is apt to bend or a grid  
groove on the PC board, it is advisable  
to have both electrodes subjected to  
uniform stress, or to position the  
component's electrodes at right angles  
to the grid groove or bending line (see  
c) Component orientation).  
c) Component orientation  
Choose a mounting position that  
minimizes the stress imposed on the  
chip during flexing or bending of the  
board.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 16 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Cautions and warnings  
General  
See "Important notes".  
Storage  
Store thermistors only in original packaging. Do not open the package prior to processing.  
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative  
humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is  
inadmissible.  
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the  
packing material may be deformed or components may stick together, causing problems during  
mounting.  
Avoid contamination of thermistor surface during storage, handling and processing.  
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).  
Use the components as soon as possible after opening the factory seals, i.e. the  
polyvinyl-sealed packages.  
Solder SMD NTC thermistors within the time specified after shipment from EPCOS. For SMD  
components with nickel barrier termination 12 months, for SMD components with AgPd  
termination 6 months.  
Handling  
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused  
during handling of NTCs.  
Do not touch components with bare hands. Gloves are recommended.  
Avoid contamination of thermistor surface during handling.  
Washing processes may damage the product due to the possible static or cyclic mechanical  
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,  
which might lead to reduced reliability or lifetime.  
Soldering  
Use resin-type flux or non-activated flux.  
Insufficient preheating may cause ceramic cracks.  
Rapid cooling by dipping in solvent is not recommended.  
Complete removal of flux is recommended.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 17 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Mounting  
Ensure that no thermo-mechanical stress occurs due to production processes (curing or  
overmolding processes) when thermistors are sealed, potted or overmolded or during their  
subsequent operation. The maximum temperature of the thermistor must not be exceeded.  
Ensure that the materials used (sealing/potting compound and plastic material) are chemically  
neutral.  
Electrodes/contacts must not be scratched or damaged before/during/after the mounting  
process.  
Contacts and housing used for assembly with the thermistor must be clean before mounting.  
Ensure that adjacent materials are designed for operation at temperatures comparable to the  
surface temperature of the thermistor. Be sure that surrounding parts and materials can  
withstand the temperature.  
Avoid contamination of the thermistor surface during processing.  
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to  
an environment with normal atmospheric conditions.  
Avoid using chemical substances as mounting aids. It must be ensured that no water or other  
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based  
substances (e.g. soap suds) must not be used as mounting aids for sensors.  
Operation  
Use thermistors only within the specified operating temperature range.  
Use thermistors only within the specified power range.  
Environmental conditions must not harm the thermistors. Only use the thermistors under  
normal atmospheric conditions or within the specified conditions.  
Contact of NTC thermistors with any liquids and solvents should be prevented. It must be  
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For  
measurement purposes (checking the specified resistance vs. temperature), the component  
must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).  
Avoid dewing and condensation unless thermistor is specified for these conditions.  
Be sure to provide an appropriate fail-safe function to prevent secondary product damage  
caused by malfunction.  
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 18 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Symbols and terms  
Symbol  
A
English  
Area  
German  
Fläche  
B-Wert  
B
B value  
B25/100  
B value determined by resistance  
measurement at 25 °C and 100 °C  
B-Wert, ermittelt durch Widerstands-  
messungen bei 25 °C und 100 °C  
Cth  
I
Heat capacitance  
Current  
Wärmekapazität  
Strom  
N
Number (integer)  
Anzahl (ganzzahliger Wert)  
P25  
Pdiss  
Pel  
Maximum power at 25 °C  
Power dissipation  
Electrical power  
Maximale Leistung bei 25 °C  
Verlustleistung  
Elektrische Leistung  
Pmax  
Maximum power within stated  
temperature range  
Maximale Leistung im  
angegebenenTemperaturbereich  
RB/RB  
Resistance tolerance caused by  
spread of B value  
Insulation resistance  
Parallel resistance  
Widerstandstoleranz, die durch die  
Streuung des B-Wertes verursacht wird  
Isolationswiderstand  
Rins  
RP  
Parallelwiderstand  
RR  
Rated resistance  
Nennwiderstand  
RR/RR  
RS  
Resistance tolerance  
Series resistance  
Widerstandstoleranz  
Serienwiderstand  
RT  
Resistance at temperature T  
(e.g. R25 = resistance at 25 °C)  
Widerstand bei Temperatur T  
(z.B. R25 = Widerstand bei 25 °C)  
T
Temperature  
Temperatur  
T  
t
Temperature tolerance  
Time  
Temperaturtoleranz  
Zeit  
TA  
Tmax  
Ambient temperature  
Upper category temperature  
Umgebungstemperatur  
Obere Grenztemperatur  
(Kategorietemperatur)  
Untere Grenztemperatur  
(Kategorietemperatur)  
Tmin  
Lower category temperature  
Top  
TR  
Tsurf  
Operating temperature  
Rated temperature  
Surface temperature  
Betriebstemperatur  
Nenntemperatur  
Oberflächentemperatur  
V
Voltage  
Spannung  
Vins  
Vop  
Vtest  
Insulation test voltage  
Operating voltage  
Test voltage  
Isolationsprüfspannung  
Betriebsspannung  
Prüfspannung  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 19 of 22  
Temperature measurement and compensation  
SMD NTC thermistors, case size 0603 (1608)  
B573**V2  
Standard series  
Symbol  
English  
German  
α
Temperature coefficient  
Tolerance, change  
Dissipation factor  
Temperaturkoeffizient  
Toleranz, Änderung  
Wärmeleitwert  
δth  
τc  
τa  
Thermal cooling time constant  
Thermal time constant  
Thermische Abkühlzeitkonstante  
Thermische Zeitkonstante  
Abbreviations / Notes  
Symbol  
English  
German  
Surface-mounted devices  
Oberflächenmontierbares Bauelement  
*
To be replaced by a number in ordering Platzhalter für Zahl im Bestellnummern-  
codes, type designations etc.  
code oder für die Typenbezeichnung.  
Platzhalter für einen Buchstaben.  
Alle Maße sind in mm angegeben.  
+
To be replaced by a letter.  
All dimensions are given in mm.  
The commas used in numerical values Verwendete Kommas in Zahlenwerten  
denote decimal points. bezeichnen Dezimalpunkte.  
Please read Cautions and warnings and  
Important notes at the end of this document.  
Page 20 of 22  
Important notes  
The following applies to all products named in this publication:  
1. Some parts of this publication contain statements about the suitability of our products for  
certain areas of application. These statements are based on our knowledge of typical re-  
quirements that are often placed on our products in the areas of application concerned. We  
nevertheless expressly point out that such statements cannot be regarded as binding  
statements about the suitability of our products for a particular customer application.  
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar  
with them than the customers themselves. For these reasons, it is always ultimately incum-  
bent on the customer to check and decide whether an EPCOS product with the properties de-  
scribed in the product specification is suitable for use in a particular customer application.  
2. We also point out that in individual cases, a malfunction of electronic components or  
failure before the end of their usual service life cannot be completely ruled out in the  
current state of the art, even if they are operated as specified. In customer applications  
requiring a very high level of operational safety and especially in customer applications in  
which the malfunction or failure of an electronic component could endanger human life or  
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by  
means of suitable design of the customer application or other action taken by the customer  
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by  
third parties in the event of malfunction or failure of an electronic component.  
3. The warnings, cautions and product-specific notes must be observed.  
4. In order to satisfy certain technical requirements, some of the products described in this  
publication may contain substances subject to restrictions in certain jurisdictions (e.g.  
because they are classed as hazardous). Useful information on this will be found in our Ma-  
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-  
tailed questions, please contact our sales offices.  
5. We constantly strive to improve our products. Consequently, the products described in this  
publication may change from time to time. The same is true of the corresponding product  
specifications. Please check therefore to what extent product descriptions and specifications  
contained in this publication are still applicable before or when you place an order. We also  
reserve the right to discontinue production and delivery of products. Consequently, we  
cannot guarantee that all products named in this publication will always be available. The  
aforementioned does not apply in the case of individual agreements deviating from the fore-  
going for customer-specific products.  
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-  
sion of the "General Terms of Delivery for Products and Services in the Electrical In-  
dustry" published by the German Electrical and Electronics Industry Association  
(ZVEI).  
Page 21 of 22  
Important notes  
7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP,  
CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,  
MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine,  
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D,  
SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and  
in other countries. Further information will be found on the Internet at  
www.epcos.com/trademarks.  
Page 22 of 22  
配单直通车
B57371V2103F060产品参数
型号:B57371V2103F060
生命周期:Active
IHS 制造商:EPCOS AG
包装说明:,
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8533.40.80.70
风险等级:5.83
JESD-609代码:e3
制造商序列号:B57371V2
安装特点:SURFACE MOUNT
端子数量:2
最高工作温度:125 °C
最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE
包装方法:TR, CARDBOARD, 7 INCH
额定功率耗散 (P):0.18 W
额定温度:25 °C
电阻:10000 Ω
电阻器类型:NTC THERMISTOR
表面贴装:YES
端子面层:TIN OVER NICKEL
端子位置:DUAL ENDED
端子形状:WRAPAROUND
热敏指数:4455 K
热敏电阻器应用:TEMPERATURE COMPENSATION
容差:1%
Base Number Matches:1
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