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产品型号BM2SC123FP2-LBZ的Datasheet PDF文件预览

Datasheet  
Quasi-resonant AC/DC Converter  
Built-in 1700 V SiC-MOSFET  
BM2SC12xFP2-LBZ Series  
General Description  
Key Specifications  
Operating Power Supply Voltage Range:  
This is the product guarantees long time support in  
industrial market.  
VCC:  
15.0 V to 27.5 V  
BM2SC12xFP2-LBZ series is a quasi-resonant AC/DC  
converter that provides an optimum system for all  
products which has an electrical outlet. Quasi-resonant  
operation enables soft switching and helps to keep the  
EMI low.  
DRAIN:  
1700 V (Max)  
800 µA (Typ)  
500 µA (Typ)  
Normal Operating Current:  
Burst Operating Current:  
Maximum Operating Frequency:  
Operating Temperature:  
120 kHz (Typ)  
-40 °C to +105 °C  
This IC can be designed easily because it includes the  
1700 V SiC (Silicon-Carbide) MOSFET.  
Package  
TO263-7L  
W (Typ) x D (Typ) x H (Max)  
10.18 mm x 15.5 mm x 4.43 mm  
Design with a high degree of flexibility is achieved with  
current detection resistors as external devices. The burst  
operation reduces an electric power at light load.  
BM2SC12xFP2-LBZ series includes various protection  
functions, such as soft start function, burst operation  
function, over current limiter per cycle, over voltage  
protection, overload protection.  
Features  
Long Time Support Product for Industrial Applications  
TO263-7L Package  
Built-in 1700 V SiC-MOSFET  
Quasi-resonant Type (Low EMI)  
Frequency Reduction Function  
Low Current Consumption (19 µA) during Standby  
Burst Operation at Light Load  
SOURCE Pin Leading Edge Blanking  
VCC UVLO (Under Voltage Lock Out)  
VCC OVP (Over Voltage Protection)  
Over Current Protection Circuit per Cycle  
Soft Start Function  
Lineup  
Product name  
FB OLP  
Auto Restart  
Latch  
Auto Restart  
Latch  
VCC OVP  
Latch  
Latch  
Auto Restart  
Auto Restart  
BM2SC121FP2-LBZ  
BM2SC122FP2-LBZ  
BM2SC123FP2-LBZ  
BM2SC124FP2-LBZ  
Applications  
Industrial Equipment, AC Adaptor, Household Appliances  
ZT Pin Trigger Mask Function  
ZT OVP (Over Voltage Protection)  
BR UVLO (Under Voltage Lock Out)  
Typical Application Circuit  
FUSE  
Diode  
Filter  
DRAIN  
Bridge  
ZT VCC GND FB  
SOURCE  
SOURCE  
BR  
ERROR  
/AMP  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 14 • 001  
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09.Apr.2021 Rev.001  
1/33  
BM2SC12xFP2-LBZ Series  
Pin Configuration  
(TOP VIEW)  
Pin Descriptions  
ESD Diode  
Pin No.  
Pin Name  
I/O  
Function  
VCC  
GND  
ZT  
VCC  
I
Zero current detection pin  
Power supply input pin  
GND pin  
1
-
-
I
2
GND  
I/O  
3
-
FB  
I
Feedback signal input pin  
AC voltage detect pin  
MOSFET SOURCE pin  
MOSFET SOURCE pin  
MOSFET DRAIN pin  
4
-
BR  
I
5
-
SOURCE  
SOURCE  
DRAIN  
I
I
6
7
I/O  
EXP-PAD  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
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09.Apr.2021 Rev.001  
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BM2SC12xFP2-LBZ Series  
Block Diagram  
VOUT  
VH  
Va  
FUSE  
Diode  
Filter  
Bridge  
EXP  
DRAIN  
2
5
VCC  
BR  
+
-
BR UVLO  
VCC UVLO  
+
-
Gate  
Clamper  
Regulator  
NOUT  
Internal  
Supply  
+
-
VCC OVP  
ZT ACSNS Comp.  
ZT OVP Comp.  
+
-
+
-
1700 V  
OSC  
OSC  
SiC-MOSFET  
ZT  
Comp.  
AND  
ZT  
1 shot  
+
-
1
ERROR  
AMP  
OR  
OR  
Time Out  
S
AND  
Q
ZT  
POUT  
Blanking  
NOUT  
PRE  
Driver  
AND  
FBOLP_OH  
OUT  
Maximum  
Blanking  
Frequency  
+
+
-
Internal  
Supply  
NOUT  
R
Burst  
Comp.  
FB  
+
-
4
OLP  
FBOLP_OH  
+
-
Timer  
Soft Start  
DCDC  
Comp.  
FB/2  
-
-
+
SOURCE  
Leading  
Edge  
Blanking  
CURRENT SENSE  
(V-V Change)  
6,7  
3
GND  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0F1F0A200770-1-2  
09.Apr.2021 Rev.001  
3/33  
BM2SC12xFP2-LBZ Series  
Description of Blocks  
1
Startup Sequences (FB OLP: Auto Restart Mode)  
The BM2SC12xFP2-LBZ’s startup sequence is shown in Figure 1.  
See the sections below for the detailed descriptions.  
Input  
Voltage  
VH  
VUVLO1  
VUVLO2  
VCC Pin  
Voltage  
tFOLP  
tFOLP  
tFOLP  
Internal REF  
Pull Up  
VFLOP1  
VFLOP2  
FB Pin  
Voltage  
Over  
Load  
VOUT  
Normal  
Load  
Light  
Load  
IOUT  
Burst Mode  
Switching  
Soft Start  
Time  
A
B C  
D
E
F
G H  
I J  
K
Figure 1. Startup Sequence Timing Chart  
A: The input voltage VH is applied. The VCC pin voltage rises due to start resistor RSTART  
.
B: This IC starts operating when the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V).  
C: When the protection functions are judged as normal status, the switching operation starts. At that time, since the  
VCC pin voltage value always drops due to the pin's consumption current, it is necessary to set the VCC pin voltage  
to more than VUVLO2 (Typ = 14.0 V). The IC has a soft start function which regulates the voltage level at the SOURCE  
pin to prevent an excessive rise in voltage and current. And when the switching operation starts, VOUT rises.  
D: At startup, the output voltage should be set to the regulated voltage within tFOLP period (Typ = 128 ms).  
E: At a light load, the IC starts burst operation in order to keep power consumption down.  
F: Overload operation.  
G: When the FB pin voltage keeps being more than VFOLP1 (Typ = 2.8 V) for tFOLP (Typ = 128 ms) or more, the switching  
operation is stopped by the overload protection circuit. If the FB pin voltage status becomes less than VFOLP2 (Typ =  
2.6 V) even once, tFOLP (Typ = 128 ms) timer is reset.  
H: When the VCC pin voltage becomes less than VUVLO2 (Typ = 14.0 V), IC is restarted.  
I: Same as B.  
J: Same as F.  
K: Same as G.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0F1F0A200770-1-2  
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BM2SC12xFP2-LBZ Series  
1
Startup Sequences (FB OLP: Auto Restart Mode) – continued  
Start resistance RSTART is the resistance required to start the IC. If the start resistance RSTART value is set to low, the  
standby power becomes high and the startup time becomes short. Conversely, if the start resistance RSTART value is set  
to high, standby power becomes low and the startup time becomes long. The standby current IOFF of BM2SC12xFP2-  
LBZ is 30 µA (Max). However, this is the minimum current required to start the IC. It is necessary to set the appropriate  
current value for the set target.  
e.g. Start Resistance RSTART Setting  
(
)
푆푇퐴ꢀ푇 < (푀퐼푁 푈ꢁ퐿푂 ꢂ푎푥 ) ÷ ꢃ푂퐹퐹  
[Ω]  
Where:  
푆푇퐴ꢀ푇 is the start resistance.  
푀퐼푁 is the minimum DC input voltage.  
푈ꢁ퐿푂 is the VCC UVLO voltage.  
푂퐹퐹 is the operation current at standby.  
When the AC input voltage is AC 80 V, VMIN = 113 V.  
At this time, it can be calculated as (113 - 20) / 30 μA = 3.1 MΩ because VUVLO1 (Max) = 20.0 V.  
Considering the optimal value for the resistor which is 3.1 MΩ or less and set RSTART to 3.0 MΩ.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
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BM2SC12xFP2-LBZ Series  
Description of Blocks – continued  
2
VCC Pin Protection Function  
BM2SC12xFP2-LBZ includes the VCC low voltage protection function VCC UVLO and the VCC over voltage protection  
function VCC OVP. These functions prevent the abnormal voltage-related break in MOSFETs used for switching. The  
VCC UVLO function is an auto restart type comparator with voltage hysteresis and the VCC OVP function is the  
comparator uses latch mode or auto restart mode. After latch function is detected by VCC OVP, latching is released  
(reset) when the condition the VCC pin voltage < VLATCH (Typ = VUVLO2 – 3.5 V) is met. Figure 2 is shown about VCC OVP  
Latch Mode and Figure 3 is shown about VCC OVP Auto Restart Mode. VCC OVP has a built-in mask time tLATCH (Typ =  
150 µs). This function masks such as the surges occur at the pin.  
Input  
Voltage  
VH  
VOVP1  
VUVLO1  
VCC Pin  
Voltage  
VUVLO2  
VLATCH  
0 V  
ON  
ON  
VCC UVLO  
OFF  
OFF  
ON  
ON  
VCC OVP  
Switching  
OFF  
ON  
OFF  
OFF  
OFF  
OFF  
L : Normal  
H : Latch  
Internal  
Latch Signal  
B C  
D E  
H
I
J
K
L
M
N
A
B
Time  
A
F
G
Figure 2. VCC UVLO/OVP (Latch Mode)  
A: VH is applied, the VCC pin voltage rises.  
B: When the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V), the VCC UVLO function is released and the  
switching operation starts.  
C: When the VCC pin voltage becomes lower than VUVLO2 (Typ = 14.0 V), the switching operation stops by the VCC  
UVLO function.  
D: When the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V), the VCC UVLO function is released the  
switching operation starts.  
E: The VCC pin voltage drops until the output voltage is stabilized.  
F: The VCC pin voltage rises.  
G: When the VCC pin voltage becomes higher than VOVP1 (Typ = 29.5 V), the switching is stopped by an internal latch  
signal. When the switching operation stops, power supply from the auxiliary coil stops and the VCC pin voltage  
drops.  
H: When the VCC pin voltage becomes lower than VUVLO2 (Typ = 14.0 V), the VCC pin voltage rises because the IC  
consumption current drops.  
I: When the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V), there are no switching operations because  
the IC is during latch operation. The VCC pin voltage drops because the switching stops.  
J: Same as H.  
K: Same as I.  
L: VH is OPEN (unplugged). The VCC pin voltage drops.  
M: When the VCC pin voltage lower than VLATCH (Typ = VUVLO2 - 3.5 V), it is latch-released.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0F1F0A200770-1-2  
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6/33  
BM2SC12xFP2-LBZ Series  
2
VCC Pin Protection Function – continued  
Input  
Voltage  
VH  
VOVP1  
VOVP2  
VUVLO1  
VCC Pin  
Voltage  
VUVLO2  
0 V  
ON  
ON  
VCC UVLO  
OFF  
OFF  
ON  
ON  
VCC OVP  
Switching  
OFF  
ON  
OFF  
ON  
OFF  
OFF  
OFF  
OFF  
B
L
A
B C  
D E  
I
J
K
Time  
A
H
G
F
Figure 3. VCC UVLO/OVP (Auto Restart Mode)  
A: VH is applied, the VCC pin voltage rises.  
B: When the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V), the VCC UVLO function is released and the  
switching operation starts.  
C: When the VCC pin voltage becomes lower than VUVLO2 (Typ = 14.0 V), the switching operation stops by the VCC  
UVLO function.  
D: When the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V), the VCC UVLO function is released and the  
switching operation starts.  
E: The VCC pin voltage drops until the output voltage is stabilized.  
F: The VCC pin voltage rises.  
G: When the VCC pin voltage becomes higher than VOVP1 (Typ = 29.5 V), the switching is stopped by the VCC OVP  
function. When the switching operation stops, power supply from the auxiliary coil stops and the VCC pin voltage  
drops.  
H: When the VCC pin voltage becomes lower than VOVP2 (Typ = 23.0 V), the switching operation starts by auto restart.  
I: VH is OPEN (unplugged). The VCC pin voltage drops.  
J: Same as C.  
K: When the VCC pin voltage becomes higher than VUVLO1 (Typ = 19.5 V), the VCC UVLO function is released and the  
VCC pin voltage drops. However, the switching operation doesn’t restart because VH is OPEN.  
L: When the VCC pin voltage becomes lower than VUVLO2 (Typ = 14.0 V), the VCC UVLO function operates. However,  
the VCC pin voltage continues to drop because VH is OPEN.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
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BM2SC12xFP2-LBZ Series  
Description of Blocks – continued  
3
DC/DC Converter Function  
BM2SC12xFP2-LBZ uses PFM (Pulse Frequency Modulation) mode control. The FB pin, the ZT pin, and the SOURCE  
pin are monitored to provide a system optimized as DC/DC. The switching MOSFET ON width (turn OFF) is controlled  
by the FB pin and the SOURCE pin, and the OFF width (turn ON) is controlled by the ZT pin. By setting maximum  
frequency, PFM mode will control it to meet noise regulation. A detailed description is below. (Refer to Figure 4)  
VOUT  
VH  
Va  
EXP  
DRAIN  
2
5
VCC  
BR  
Gate  
Clamper  
NOUT  
Internal  
Supply  
+
-
ZT ACSNS Comp.  
ZT OVP Comp.  
+
-
1700 V  
SiC-MOSFET  
ZT  
Comp.  
ZT  
1 shot  
+
1
ERROR  
AMP  
-
OR  
OR  
AND  
Time Out  
AND  
S
R
Q
ZT  
Blanking  
POUT  
NOUT  
PRE  
Driver  
AND  
FBOLP_OH  
OUT  
Maximum  
Blanking  
Frequency  
+
+
-
Internal  
Supply  
NOUT  
Burst  
Comp.  
FB  
+
4
-
OLP  
FBOLP_OH  
+
-
Timer  
Soft Start  
DCDC  
Comp.  
FB/2  
-
-
+
SOURCE  
Leading Edge  
Blanking  
CURRENT SENSE (V-V Change)  
6,7  
3
GND  
Figure 4. Block Diagram of DC/DC Operations  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
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BM2SC12xFP2-LBZ Series  
3
DC/DC Converter Function – continued  
3.1  
Determination of ON Width (Turn OFF)  
ON width is controlled by the FB pin and the SOURCE pin. The ON width is determined by comparing the FB pin  
voltage at 1/AV (Typ = 1/2) with the SOURCE pin voltage. In addition, the comparator level is changed by comparing  
with the IC's internally generated VLIM1A (Typ = 1.0 V), as is shown in Figure 5. The SOURCE pin is also used for the  
over current limiter circuit per pulse. Changes at the FB pin changes in the maximum blanking frequency and over  
current limiter level.  
mode 1: Burst operation  
mode 2: Frequency reduction operation (reduces maximum frequency)  
mode 3: Maximum frequency operation (operates at maximum frequency)  
mode 4: Overload operation (pulse operation is stopped when overload is detected)  
Maximum Operating  
Frequency [kHz]  
mode 2  
mode 1  
mode 3  
mode 4  
fSW1  
fSW2  
FB Pin  
Voltage  
[V]  
0.5  
0.0  
1.25  
2.0  
2.8  
CS  
Limiter [V]  
mode 1 mode 2  
mode 3  
mode 4  
VLIM1  
VLIM2  
FB Pin  
Voltage  
[V]  
0.0  
0.5  
1.25  
2.0  
2.8  
Figure 5. Relationship of FB Pin Voltage to Over Current Limiter and Maximum Frequency  
The switch of over current protection in the soft start function and input voltage is performed by adjusting the  
over current limiter level. In this case, the VLIM1 and VLIM2 values are as listed below.  
Table 1. Over Current Protection Voltage  
IZT ≥ -1.0 mA  
IZT < -1.0 mA  
Soft Start  
VLIM1A  
VLIM2A  
VLIM1B  
VLIM2B  
from startup to less than 1 ms  
from 1 ms to less than 4 ms  
4 ms or more  
0.250 V  
0.500 V  
1.000 V  
0.075 V  
0.150 V  
0.300 V  
0.175 V  
0.350 V  
0.700 V  
0.053 V  
0.105 V  
0.210 V  
3.2  
L.E.B. (Leading Edge Blanking) Function  
When the switching MOSFET is turned ON, surge current occur at each capacitor component and drive current.  
Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current limiter  
circuit. To prevent detection errors, BM2SC12xFP2-LBZ has the blanking function. This function masks the SOURCE  
pin voltage for tLEB (Typ = 250 ns) after the DRAIN pin changes from high to low. This blanking function reduces the  
SOURCE pin noise filter.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
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09.Apr.2021 Rev.001  
BM2SC12xFP2-LBZ Series  
3
DC/DC Converter Function – continued  
3.3  
SOURCE Over Current Protection Switching Function  
When the input voltage (VH) becomes high, the ON time is shortened and the operating frequency increases. As a  
result, the maximum allowable power is increased for a certain over current limiter. As a countermeasure, the IC will  
use its internal over current protection function to switch. In case of high voltage, the over current comparator value  
which determines the ON time is multiplied by 0.7 of normal operation.  
Detection and switch are performed by monitoring the ZT inflow current. When the MOSFET is turned ON, Va  
becomes a negative voltage dependent on the input voltage (VH). The ZT pin is clamped to nearly 0 V in the IC. The  
formula used to calculate this is shown below. A block diagram is shown in Figure 6. Also, graphs are shown in  
Figure 7, Figure 8 and Figure 9.  
푍푇 = (푉푎 − 푍푇) ÷ 푅푍푇1 = 푉푎 ÷ 푅푍푇1 = (푉퐻 × ꢄ푎) ÷ (ꢄ푝 × 푅푍푇1  
)
[A]  
푍푇1 = 푉푎 ÷ ꢃ푍푇  
[Ω]  
Where:  
푍푇 is the ZT inflow current.  
푉푎 is the auxiliary winding voltage.  
푍푇 is the ZT pin voltage.  
푍푇1 is the ZT pin resistance 1.  
푉퐻 is the input voltage.  
ꢄ푝 is the primary side winding.  
ꢄ푎 is the auxiliary winding.  
From the above, the VH voltage is set with a resistance value (RZT1). The ZT bottom detection voltage is determined  
at that time, therefore, set the timing with CZT.  
VOUT  
VH  
Va  
EXP  
DRAIN  
2
5
VCC  
BR  
Gate  
Clamper  
NOUT  
Internal  
Supply  
+
-
ZT ACSNS Comp.  
ZT OVP Comp.  
+
-
1700 V  
SiC-MOSFET  
RZT1  
RZT2  
ZT  
Comp.  
ZT  
1 shot  
+
1
ERROR  
AMP  
-
OR  
OR  
AND  
Time Out  
CZT  
AND  
S
R
Q
ZT  
Blanking  
POUT  
NOUT  
PRE  
Driver  
AND  
FBOLP_OH  
OUT  
Maximum  
Blanking  
Frequency  
+
+
-
Internal  
Supply  
NOUT  
Burst  
Comp.  
FB  
+
4
-
OLP  
FBOLP_OH  
+
-
Timer  
Soft Start  
DCDC  
Comp.  
FB/2  
-
-
+
SOURCE  
Leading Edge  
Blanking  
CURRENT SENSE (V-V Change)  
6,7  
3
GND  
Figure 6. Block Diagram of SOURCE Switching Current  
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BM2SC12xFP2-LBZ Series  
3.3  
SOURCE Over Current Protection Switching Function – continued  
SOURCE  
Limiter [V]  
mode 1 mode 2  
mode 3  
mode 4  
VLIM1A  
VLIM1B  
I
ZT -1.0 mA  
IZT < -1.0 mA  
VLIM2A  
VLIM2B  
0.0  
0.5  
1.0  
1.5  
2.0  
2.8  
FB pin voltage [V]  
Figure 7. SOURCE Switching: SOURCE Limiter vs FB Pin Voltage  
SOURCE  
Limiter [V]  
VLIM1  
VLIM1 x 0.7  
1.0  
Figure 8. SOURCE Switching: SOURCE Limiter vs ZT Pin Current  
ZT Pin Current [mA]  
e.g. Setup method (for switching between 100 V AC and 220 V AC.)  
100 V AC: 141 V ±42 V (±30 % margin)  
220 V AC: 308 V ±62 V (±20 % margin)  
In the above cases, the SOURCE current is switched in the range from 182 V to 246 V.  
→ This is done when VH = 214 V.  
Given: Np = 100, Na = 15.  
(
)
푉푎 = 푉 × ꢄ푎 ÷ ꢄ푝 = 2ꢅ4 푉 × ꢅ5 ÷ ꢅ00 × −ꢅ = −32.ꢅ  
[V]  
퐼푁  
푍푇1 = 푉푎 ÷ ꢃ푍푇 = −32.ꢅ 푉 ÷ −ꢅ 푚ꢆ = 32.ꢅ [kΩ]  
Where:  
푉푎 is the auxiliary winding voltage.  
퐼푁  
is the input voltage.  
ꢄ푝 is the primary side winding.  
ꢄ푎 is the auxiliary side winding.  
푍푇1 is the ZT pin resistance.  
푍푇 is the ZT pin inflow current.  
According to the above, RZT1 = 32 kΩ is set.  
SOURCE  
Limiter [V]  
VLIM1  
VLIM1 x 0.7  
214  
VH Pin Voltage [V]  
Figure 9. Example of SOURCE Switching: SOURCE Limiter vs VH Pin Voltage  
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BM2SC12xFP2-LBZ Series  
3
DC/DC Converter Function – continued  
3.4  
Determination of OFF Width (Turn ON)  
The OFF width is controlled at the ZT pin. While switching is OFF, the power stored in the coil is supplied to the  
secondary side output capacitor. When this power supply ends, there is no more current flowing to the secondary  
side, so the DRAIN pin voltage of switching MOS drops. Consequently, the voltage on the auxiliary coil side also  
drops. A voltage that was resistance-divided by RZT1 and RZT2 is applied to the ZT pin. When this voltage level drops  
to VZT1 (Typ = 100 mV) or less, switching is turned ON by the ZT comparator. To detect zero current status at the ZT  
pin, time constants are generated using CZT, RZT1, and RZT2. Additionally, the ZT pin trigger mask and the ZT pin  
trigger timeout function are built-in.  
3.5  
ZT Pin Trigger Mask Function  
When the switching is set OFF from ON, superposition of noise may occur at the ZT pin. At this time, the ZT  
comparator is masked for the tZTMASK (Typ = 0.60 µs) to prevent the ZT comparator operate errors. (Refer to Figure  
10)  
ON  
OFF  
ON  
OFF  
ON  
Switching  
OUT  
ZT Pin  
Voltage  
tZTMASK  
tZTMASK  
ZT Trigger  
Mask Pin  
Time  
A
B
C
D
E
F
G
Figure 10. ZT Pin Trigger Mask Function  
A: Switching is OFF→ON.  
B: Switching is ON→OFF.  
C: Because noise occurs at the ZT pin, the ZT comparator is not operated during tZTMASK (Typ = 0.60 µs).  
D: Same as A.  
E: Same as B.  
F: Same as C.  
G: Same as A.  
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BM2SC12xFP2-LBZ Series  
3
DC/DC Converter Function – continued  
3.6  
ZT Pin Trigger Timeout Function  
ZT Pin Trigger Timeout Function 1  
When the ZT pin voltage is not higher than VZT2 (Typ = 200 mV) during tZTOUT1 (Typ = 45 µs) because of the  
decrease of output voltage or the shorted ZT pin such as at startup, this function turns on the switching by force.  
ZT Pin Trigger Timeout Function 2  
After the ZT comparator detects the bottom, the IC turns on the switching by force when the IC does not operate  
next detection within tZTOUT2 (Typ = 5.0 µs). After the ZT comparator detected signal once, this function operates.  
For that, it does not operate at startup or at low output voltage. When the IC is not able to detect bottom by  
decreasing auxiliary winding voltage, the function operates.  
ZT pin GND  
short  
ZT Pin VZT2  
VZT1  
voltage  
Bottom  
Detection  
5 µs  
5 µs  
5 µs  
Timeout  
45 µs  
45 µs  
45 µs  
Timeout  
SOURCE  
Pin Voltage  
DRAIN  
Pin Voltage  
Time  
A
B C  
D
E
F
G
H
I
Figure 11. ZT Pin Trigger Timeout Function  
A: At startup, the IC starts to operate by ZT pin trigger timeout function1 because of the ZT pin voltage is 0 V.  
B: MOSFET turns ON.  
C: MOSFET turns OFF.  
D: The ZT pin voltage drops to lower than VZT2 (Typ = 200 mV) by the oscillation decreasing.  
E: MOSFET turns ON after tZTOUT2 (Typ = 5.0 µs) from D point by ZT pin trigger timeout function 2.  
F: The ZT pin voltage drops to lower than VZT2 (Typ = 200 mV) by the oscillation decreasing.  
G: MOSFET turns ON after tZTOUT2 (Typ = 5.0 µs) from F point by ZT pin trigger timeout function 2.  
H: The ZT pin is shorted to GND.  
I: MOSFET turns ON after tZTOUT1 (Typ = 45.0 µs) by ZT pin trigger timeout function 1.  
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BM2SC12xFP2-LBZ Series  
Description of Blocks – continued  
4
Soft Start Function  
Normally, a large current flows to the AC/DC power supply when the AC power supply is turned ON. BM2SC12xFP2-  
LBZ includes a soft start function to prevent large changes in the output voltage and current during startup. This function  
is performed when the VCC pin voltage drops to VUVLO2 (Typ = 14.0 V) or less.  
Soft start function performs the following operation after startup. (Refer to turn OFF described above in section 3.1).  
from startup to less than 1 ms → Set the SOURCE limiter value to 25 % of normal  
from 1 ms to less than 4 ms  
4 ms or more  
→ Set the SOURCE limiter value to 50 % of normal  
→ Normal operation  
5
FB Over Limited Protection  
The overload protection function operates in a latch mode or an auto restart mode. This function monitors the overload  
status of the secondary output current at the FB pin and fixes the OUT pin at low level when the overload status is  
detected. During overload status, current no longer flows to the photo-coupler, so the FB pin voltage rises. When this  
status continues for the tFOLP (Typ = 128 ms), it judges the status as an overload and the OUT pin is fixed at low level. If  
the FB pin voltage drops to lower than VFOLP2 (Typ = 2.6 V) within tFOLP (Typ = 128 ms) after once it exceeds VFOLP1 (Typ  
= 2.8 V), the overload protection timer is reset.  
At startup, the FB pin voltage is pulled up to the internal voltage by a pull-up resistor, so operation starts from VFOLP1 (Typ  
= 2.8 V) or above. Therefore, it is necessary for the design to set the FB pin voltage at VFOLP2 (Typ = 2.6 V) or less within  
tFOLP (Typ = 128 ms). In other words, the startup time of the secondary output voltage must be set to within tFOLP (Typ =  
128 ms) after the IC starts.  
To release latching at selecting latch mode is operated when the VCC pin voltage becomes lower than VLATCH (Typ =  
VUVLO2 – 3.5 V) by unplugging power supply.  
6
ZT OVP (Over Voltage Protection) Function  
ZT OVP (Over Voltage Protection) function is built-in the ZT pin. When the ZT pin voltage reaches VZTL (Typ = 3.5 V), this  
function operates detection. The ZT pin OVP function is performed in latch mode.  
ZT OVP function has a built-in mask time defined as tLATCH (Typ = 150 µs). This operates detection when ZT OVP status  
continues for tLATCH (Typ = 150 µs). This function masks such as surges those occur at the pin. Refer to Figure 12. (A  
similar tLATCH (Typ = 150 µs) is built-in VCC OVP.)  
ΔT2 = tLATCH (Typ = 150 µs)  
ΔT1 < tLATCH (Typ = 150 µs)  
ΔT1  
ΔT2  
VZTL  
ZTPin  
PULSE  
PULSE  
Voltage  
ON  
OFF  
Switching  
C
D
E
A
B
Figure 12. ZT OVP and Latch Mask Function  
A: Switching turns ON and the ZT pin starts pulse operation.  
B: The ZT pin voltage higher than VZTL (Typ = 3.5 V).  
C: The status of the ZT pin voltage higher than VZTL (Typ = 3.5 V) is within tLATCH (Typ = 150 µs), so the switching  
is reset to the normal operations.  
D: The ZT pin voltage higher than VZTL (Typ = 3.5 V).  
E: The status of ZT pin voltage higher than VZTL (Typ = 3.5 V) continues for tLATCH (Typ = 150 µs), so latching occurs  
and the switching turned OFF.  
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BM2SC12xFP2-LBZ Series  
Description of Blocks – continued  
7
Thermal Shutdown Function  
Thermal shutdown function is auto restart type. Thermal shutdown function is worked when the ambient temperature >  
T2 (Typ = 185 °C), switching is stopped. Switching restart when the ambient temperature < T1 (Typ = 135 °C).  
Switching  
State 2  
OFF  
State 1  
ON  
T1  
T2  
Temperature [°C]  
(Typ = 135 °C)  
(Typ = 185 °C)  
Figure 13. Thermal Shutdown Function  
BR UVLO (Under Voltage Lock Out) Function  
8
This IC has the BR UVLO function which monitoring the input voltage through the BR pin. If input voltage VH is lower,  
DC/DC function is stopped. Input is connected the BR pin dividing by registers. When the BR pin voltage is over VBR1  
(Typ = 1.0 V), the circuit detects the normal status and DC/DC function is operated.  
This comparator has the voltage hysteresis VBR3 (Typ = 0.2 V).  
VH  
FUSE  
RH  
Diode  
Filter  
Bridge  
RL  
BR  
BR  
Comp.  
+
-
Controller  
BM2SC12xFP2-LBZ  
Figure 14. BR UVLO Function  
Operation Modes of Protection Circuit  
Table 2 below lists the operation modes of the various protection functions.  
Table 2. Operation Modes of Protection Circuit  
Item  
Operation Mode  
VCC Under Voltage Locked Out  
VCC Over Voltage Protection  
Auto Restart  
BM2SC121FP2-LBZ/BM2SC122FP2-LBZ = Latch  
BM2SC123FP2-LBZ/BM2SC124FP2-LBZ = Auto Restart  
BM2SC121FP2-LBZ/BM2SC123FP2-LBZ = Auto Restart  
BM2SC122FP2-LBZ/BM2SC124FP2-LBZ = Latch  
FB Over Limited Protection  
ZT Over Voltage Protection  
Thermal Shutdown  
Latch  
Auto Restart  
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BM2SC12xFP2-LBZ Series  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
Conditions  
Maximum Applied Voltage 1  
Maximum Applied Voltage 2  
Maximum Applied Voltage 3  
Maximum Applied Voltage 4  
DRAIN Pin Current (Pulse)  
ZT Pin Maximum Current  
VMAX1  
VMAX2  
VMAX3  
VMAX4  
IDD  
-0.3 to +32.0  
-0.3 to +6.5  
-0.3 to +15.0  
-0.3 to +1700  
9.2  
V
V
VCC pin  
SOURCE pin, FB pin, ZT pin  
BR pin  
V
V
DRAIN pin  
A
PW = 10 µs, Duty cycle = 1 %  
ISZT  
±3.0  
mA  
°C  
°C  
Maximum Junction Temperature  
Tjmax  
150  
Storage Temperature Range  
Tstg  
-55 to +150  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing  
board size and copper area so as not to exceed the maximum junction temperature rating.  
Thermal Resistance (Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
TO263-7L  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
77.5  
18  
20.4  
5
°C/W  
°C/W  
ΨJT  
(Note 1) Based on JESD51-2A (Still-Air), using a BM2SC12xFP2-LBZ chip.  
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface  
of the component package.  
(Note 3) Using a PCB board based on JESD51-3.  
(Note 4) Using a PCB board based on JESD51-5, 7.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Thermal Via(Note 5)  
Material  
FR-4  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
Pitch  
Diameter  
4 Layers  
1.20 mm  
Φ0.30 mm  
Top  
Copper Pattern  
Bottom  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
74.2 mm x 74.2 mm  
(Note 5) This thermal via connects with the copper pattern of all layers.  
Recommended Operating Conditions  
Parameter  
Symbol  
Min  
Typ  
Max  
27.5  
Unit  
Conditions  
Operating Power Supply Voltage Range 1 VCC  
Operating Power Supply Voltage Range 2 VDRAIN  
15.0  
-0.3  
-40  
24.0  
V
V
VCC pin voltage  
-
+1700  
+105  
DRAIN pin voltage  
Operating Temperature  
Topr  
+25  
°C  
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BM2SC12xFP2-LBZ Series  
Electrical Characteristics (Unless otherwise specified VCC = 24 V, Ta = 25 °C)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Conditions  
[MOSFET]  
Voltage between DRAIN and SOURCE Pins V(BR)DDS  
1700  
-
-
-
V
ID = 1 mA  
DRAIN Leak Current  
On Resistance  
IDSS  
-
-
100  
2.00  
nA VDS = 1700 V  
RDS(ON)  
1.15  
Ω
ID = 1.1 A  
[Operating Current]  
VCC = 18.0 V  
(VCC UVLO = Disable)  
Standby Operating Current  
Normal Operating Current  
Burst Operating Current  
IOFF  
10  
19  
800  
500  
1600  
30  
µA  
µA  
µA  
µA  
FB Pin Voltage = 2.0 V  
(At Pulse Operation)  
ION1  
300  
150  
800  
1300  
1000  
2200  
FB Pin Voltage = 0.0 V  
(At Burst Operation)  
ION2  
FB OLP, VCC OVP,  
ZT OVP  
Protection Circuit Operating Current  
IPROTECT  
[VCC Pin Protection Function]  
VCC UVLO Voltage 1  
VUVLO1  
VUVLO2  
VUVLO3  
VOVP1  
VOVP2  
VOVP3  
19.00  
13.00  
-
19.50  
14.00  
5.50  
20.00  
15.00  
-
V
V
V
V
V
V
VCC pin voltage rising  
VCC pin voltage falling  
VUVLO3 = VUVLO1 - VUVLO2  
VCC pin voltage rising  
VCC pin voltage falling  
VOVP3 = VOVP1 - VOVP2  
VCC UVLO Voltage 2  
VCC UVLO Hysteresis Voltage  
VCC OVP Voltage 1  
27.50  
21.00  
-
29.50  
23.00  
6.50  
31.50  
25.00  
-
VCC OVP Voltage 2  
VCC OVP Hysteresis Voltage  
VUVLO2  
3.5  
Latch Released Voltage  
Latch Mask Time  
VLATCH  
tLATCH  
TSD1  
-
-
V
VCC pin Voltage  
50  
150  
250  
200  
µs  
C  
Control IC block’s Tj  
rising  
Over Temperature Protection 1(Note 6)  
160  
185  
Control IC block’s Tj  
falling  
Over Temperature Protection 2(Note 6)  
TSD2  
TSD3  
120  
-
135  
50  
150  
-
C  
C  
Over Temperature Protection  
Hysteresis  
[BR Pin Protection Function)]  
BR UVLO Voltage 1  
VBR1  
VBR2  
VBR3  
0.920  
-
1.000  
0.800  
0.200  
1.080  
-
V
V
V
BR UVLO Voltage 2  
BR UVLO Hysteresis Voltage  
[DC/DC Converter Block (Turn OFF)]  
FB Pin Pull-up Resistance  
0.140  
0.260  
VBR3= VBR1-VBR2  
RFB  
15  
20  
25  
kΩ  
SOURCE Pin  
Over Current Detection Voltage 1A  
FB pin voltage = 2.2 V  
(IZT -1.0 mA)  
VLIM1A  
0.950  
1.000  
1.050  
V
SOURCE Pin  
Over Current Detection Voltage 1B  
FB pin voltage = 2.2 V  
(IZT < -1.0 mA)  
VLIM1B  
VLIM2A  
VLIM2B  
IZT  
0.620  
0.200  
0.140  
0.900  
0.700  
0.300  
0.210  
1.000  
0.780  
0.400  
0.280  
1.100  
V
V
SOURCE Pin  
Over Current Detection Voltage 2A  
FB pin voltage = 0.6 V  
(IZT -1.0 mA)  
SOURCE Pin  
Over Current Detection Voltage 2B  
FB pin voltage = 0.6 V  
(IZT < -1.0 mA)  
V
SOURCE Pin Switching  
ZT Pin Current  
mA  
SOURCE Pin  
Leading Edge Blanking Time  
tLEB  
tMIN  
-
-
250  
-
-
ns  
µs  
Minimum ON Width  
0.500  
(Note 6) Over temperature protection operates over Maximum Junction Temperature. This IC cannot guarantee for the thermal destruction in case of the operation  
over Maximum Junction Temperature, always operate at Maximum Junction Temperature or less.  
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BM2SC12xFP2-LBZ Series  
Electrical Characteristics (Unless otherwise specified VCC = 24 V, Ta = 25 °C) – continued  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Conditions  
[DC/DC Converter Block (Turn ON)]  
Maximum Operating Frequency 1  
Maximum Operating Frequency 2  
FB Pin Frequency Reduction Start Voltage  
FB Pin Frequency Reduction End Voltage 1  
FB Pin Frequency Reduction End Voltage 2  
Voltage Gain  
fSW1  
fSW2  
106  
20  
120  
30  
134  
40  
kHz  
kHz  
V
FB pin voltage = 2.0 V  
FB pin voltage = 0.5 V  
VFBSW1  
VFBSW2  
VFBSW3  
AV  
1.100  
0.400  
-
1.250  
0.500  
0.550  
2.000  
100  
1.400  
0.600  
-
V
V
1.700  
60  
2.300  
140  
280  
V/V  
mV  
mV  
ΔVFB/ΔVSOURCE  
ZT Pin Comparator Voltage 1  
VZT1  
ZT pin voltage falling  
ZT pin voltage rising  
ZT Pin Comparator Voltage 2  
VZT2  
120  
200  
For noise prevention  
after OUT pin voltage  
HL  
ZT Pin Trigger Mask Time  
tZTMASK  
0.25  
30.0  
0.60  
45.0  
0.95  
90.0  
µs  
µs  
Count from final ZT pin  
trigger  
ZT Pin Trigger Timeout Period 1  
ZT Pin Trigger Timeout Period 2  
tZTOUT1  
Count from final ZT pin  
trigger (2 stages)  
tZTOUT2  
tZTON  
2.0  
5.0  
8.0  
µs  
µs  
Maximum ON Time  
[DC/DC Protection Functions]  
Soft Start Time 1  
27.0  
45.0  
62.0  
tSS1  
tSS2  
0.600  
2.400  
2.500  
2.300  
90  
1.000  
4.000  
2.800  
2.600  
128  
1.400  
5.600  
3.100  
2.900  
166  
ms  
ms  
V
Soft Start Time 2  
FB OLP Voltage 1  
FB OLP Voltage 2  
FB OLP Timer  
VFOLP1  
VFOLP2  
tFOLP  
VZTL  
FB pin voltage rising  
FB pin voltage falling  
V
ms  
V
ZT OVP Voltage  
3.250  
3.500  
3.750  
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BM2SC12xFP2-LBZ Series  
Typical Performance Curves  
30  
25  
20  
15  
10  
1300  
1100  
900  
700  
500  
300  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 16. Normal Operating Current vs Temperature  
Figure 15. Standby Operating Current vs Temperature  
900  
750  
600  
450  
300  
150  
2000  
1800  
1600  
1400  
1200  
1000  
-40 -20  
0
20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100120  
Temperature []  
Temperature []  
Figure 18. Protection Circuit Operating Current  
vs Temperature  
Figure 17. Burst Operating Current vs Temperature  
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Typical Performance Curves - continued  
20.0  
19.8  
19.6  
19.4  
19.2  
15.0  
14.5  
14.0  
13.5  
13.0  
19.0  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 20. VCC UVLO Voltage 2 vs Temperature  
Figure 19. VCC UVLO Voltage 1 vs Temperature  
6.5  
6.0  
5.5  
5.0  
31.5  
30.5  
29.5  
28.5  
4.5  
27.5  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 21. VCC UVLO Hysteresis Voltage vs Temperature  
Figure 22. VCC OVP Voltage 1 vs Temperature  
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Typical Performance Curves - continued  
25  
23  
21  
19  
17  
1.05  
1.03  
1.01  
0.99  
0.97  
0.95  
15  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 24. SOURCE Pin Over Current Detection Voltage 1A  
vs Temperature  
Figure 23. FB Pin Pull-up Resistance vs Temperature  
0.80  
0.75  
0.70  
0.65  
0.40  
0.35  
0.30  
0.25  
0.60  
0.20  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100120  
Temperature []  
Temperature []  
Figure 25. SOURCE Pin Over Current Detection Voltage 1B  
vs Temperature  
Figure 26. SOURCE Pin Over Current Detection Voltage 2A  
vs Temperature  
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Typical Performance Curves - continued  
0.30  
0.26  
0.22  
0.18  
1.10  
1.05  
1.00  
0.95  
0.90  
0.14  
-40 -20 0 20 40 60 80 100120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 27. SOURCE Pin Over Current Detection Voltage 2B  
vs Temperature  
Figure 28. SOURCE Pin Switching ZT Pin Current  
vs Temperature  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
130  
125  
120  
115  
0.1  
110  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 29. Minimum ON Width vs Temperature  
Figure 30. Maximum Operating Frequency 1  
vs Temperature  
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Typical Performance Curves - continued  
1.40  
40  
35  
30  
25  
1.35  
1.30  
1.25  
1.20  
1
.1
5
20  
1
.1
0
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature[]  
Figure 31. Maximum Operating Frequency 2 vs  
Temperature  
Figure 32. FB Pin Frequency Reduction Start Voltage vs  
Temperature  
0.60  
0.55  
0.50  
0.45  
0.65  
0.60  
0.55  
0.50  
0.40  
0.45  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 33. FB Pin Frequency Reduction End Voltage 1  
vs Temperature  
Figure 34. FB Pin Frequency Reduction End Voltage 2  
vs Temperature  
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Typical Performance Curves - continued  
140  
120  
100  
80  
2.3  
2.2  
2.1  
2.0  
1.9  
1.8  
1.7  
60  
-40 -20  
0
20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100120  
Temperature []  
Temperature []  
Figure 36. ZT Pin Comparator Voltage 1 vs Temperature  
Figure 35. Voltage Gain vs Temperature  
60  
55  
50  
45  
40  
35  
30  
1.4  
1.2  
1.0  
0.8  
0.6  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 38. Soft Start Time 1 vs Temperature  
Figure 37. Maximum ON Time vs Temperature  
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Typical Performance Curves - continued  
6.0  
5.0  
4.0  
3.0  
2.0  
3.1  
3.0  
2.9  
2.8  
2.7  
2.6  
2.5  
1.0  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 40. FB OLP Voltage 1 vs Temperature  
Figure 39. Soft Start Time 2 vs Temperature  
2.9  
2.8  
2.7  
2.6  
2.5  
2.4  
180  
160  
140  
120  
100  
2.3  
80  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 42. FB OLP Timer vs Temperature  
Figure 41. FB OLP Voltage 2 vs Temperature  
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Typical Performance Curves - continued  
3.8  
3.7  
3.6  
3.5  
3.4  
3.3  
1.10  
1.05  
1.00  
0.95  
0.90  
3.2  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 44. BR UVLO Voltage 1 vs Temperature  
Figure 43. ZT OVP Voltage vs Temperature  
0.90  
0.85  
0.80  
0.75  
0.28  
0.26  
0.24  
0.22  
0.20  
0.18  
0.16  
0.70  
0.14  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100120  
Temperature []  
Temperature []  
Figure 46. BR UVLO Hysteresis Voltage vs Temperature  
Figure 45. BR UVLO Voltage 2 vs Temperature  
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Typical Performance Curves - continued  
2.0  
1.6  
1.2  
0.8  
0.4  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.0  
-40 -20 0 20 40 60 80 100 120  
-40 -20 0 20 40 60 80 100 120  
Temperature []  
Temperature []  
Figure 48. DRAIN Leak Current vs Temperature  
Figure 47. On Resistance vs Temperature  
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BM2SC12xFP2-LBZ Series  
I/O Equivalence Circuits  
1
ZT  
2
VCC  
3
4
FB  
GND  
Internal Reg  
VCC  
GND  
ZT  
5
BR  
6
SOURCE  
7
EXP-PAD  
DRAIN  
SOURCE  
DRAIN  
VCC  
VCC  
BR  
Internal MOSFET  
SOURCE  
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Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
6.  
Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing  
of connections.  
7.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
8.  
9.  
Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge  
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power  
supply or ground line.  
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Operational Notes – continued  
10. Regarding the Input Pin of the IC  
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N  
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode  
or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 49. Example of IC Structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
12. Thermal Shutdown Circuit (TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the  
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj  
falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat  
damage.  
13. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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BM2SC12xFP2-LBZ Series  
Ordering Information  
1 2  
x
F
P 2  
B M 2 S C  
-
L B Z E 2  
(FB OLP)  
1: Auto Restart  
2: Latch  
(VCC OVP)  
Latch  
Latch  
Package  
FP2:  
TO263-7L  
Product Rank  
LB: Industrial applications  
3: Auto Restart  
4: Latch  
Auto Restart  
Auto Restart  
Packaging and forming specification  
E2: Embossed tape and reel  
Lineup  
Orderable Part Number  
BM2SC121FP2-LBZE2  
BM2SC122FP2-LBZE2  
BM2SC123FP2-LBZE2  
BM2SC124FP2-LBZE2  
FB OLP  
Auto Restart  
Latch  
Auto Restart  
Latch  
VCC OVP  
Latch  
Latch  
Auto Restart  
Auto Restart  
Package  
TO263-7L  
Part Number Marking  
M2SC121FP  
M2SC122FP  
M2SC123FP  
M2SC124FP  
Marking Diagram  
TO263-7L (TOP VIEW)  
Part Number Marking  
LOT Number  
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Physical Dimension and Packing Information  
Package Name  
TO263-7L  
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Revision History  
Date  
Revision  
001  
Changes  
09.Apr.2021  
New Release  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
配单直通车
BM2SCQ121T-LB产品参数
型号:BM2SCQ121T-LB
生命周期:Active
Reach Compliance Code:compliant
风险等级:5.71
模拟集成电路 - 其他类型:SWITCHING REGULATOR
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