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产品型号BM2P052F-GE2的概述

芯片BM2P052F-GE2的概述 BM2P052F-GE2是一款由日本半导体厂商生产的高性能电源管理芯片,主要用于各种电源应用,包括移动设备、便携式设备和工业设备等。该芯片内置了多种功能,能够有效地处理电源转换、调节和管理,提升设备的整体性能和效率。BM2P052F-GE2设计精巧,集成了多种保护措施,能够应对高电流和高电压的操作环境,确保设备的安全性和可靠性。 芯片BM2P052F-GE2的详细参数 BM2P052F-GE2的技术参数较为全面,主要包括以下几个方面: - 输入电压范围:该芯片支持的输入电压范围较广,一般在2.7V至5.5V之间,适合不同应用场景的需求。 - 输出电流:BM2P052F-GE2的最大输出电流可达2A,适用于需要高电流支持的负载设备。 - 输出电压精度:该芯片的输出电压误差小于±2%,确保输出电压的稳定性。 - 开关频率:芯片支持的开关频率通常在300k...

产品型号BM2P052F-GE2的Datasheet PDF文件预览

Datasheet  
AC/DC Drivers  
PWM type DC/DC converter IC  
Included 650V MOSFET  
BM2PXX2F Series  
General  
The PWM type DC/DC converter (BM2PXX2F) for  
Features  
PWM frequency : 65kHz  
PWM current mode method  
AC/DC provide an optimum system for all products  
that include an electrical outlet.  
BM2PXX2F supports both isolated and non-isolated  
devices, enabling simpler design of various types of  
low-power electrical converters.  
BM2PXX2F built in a HV starter circuit that tolerates  
650V, it contributes to low-power consumption.  
With current detection resistors as external devices, a  
higher degree of design freedom is achieved. Since  
current mode control is utilized, current is restricted in  
each cycle and excellent performance is demonstrated  
in bandwidth and transient response.  
Burst operation when load is light  
Frequency reduction function  
Built-in 650V start circuit  
Built-in 650V switching MOSFET  
VCC pin under voltage protection  
VCC pin overvoltage protection  
SOURCE pin Open protection  
SOURCE pin Short protection  
SOURCE pin Leading-Edge-Blanking function  
Per-cycle over current protection circuit  
Soft start  
The switching frequency is 65 kHz. At light load, the  
switching frequency is reduced and high efficiency is  
achieved.  
Secondary Over current protection circuit  
BR pin AC input low voltage protection  
BR pin AC input high voltage protection  
A frequency hopping function is also on chip, which  
contributes to low EMI.  
We can design easily, because BM2PXX2F includes  
the switching MOSFET.  
Package  
SOP8  
W (Typ.) x D (Typ.) x H (Max.)  
5.00mm x 6.20mm x 1.71mm  
Basic specifications  
Operating Power Supply Voltage Range:  
VCC 8.9V to 26.0V DRAIN:~650V  
Operating Current: Normal Mode  
BM2P052F: 0.60mA (Typ.)  
BM2P092F: 0.50mA (Typ.)  
Burst Mode: 0.40mA (Typ.)  
Applications  
AC adapters and household appliances (vacuum  
cleaners, humidifiers, air cleaners, air conditioners, IH  
cooking heaters, rice cookers, etc.)  
Oscillation Frequency:  
Operating Temperature:  
MOSFET ON Resistance:  
65kHz (Typ.)  
- 40 oC to +105 oC  
BM2P052F: 4.0(Typ.)  
BM2P092F: 8.5(Typ.)  
Line up  
Application circuit  
Product  
MOSFET ON resistor  
4.0Ω  
BM2P052F  
BM2P092F  
8.5Ω  
Figure 1Application circuit  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays  
.www.rohm.com  
TSZ02201-0F2F0A200040-1-2  
24. Sep.2015.Rev.006  
© 2012 ROHM Co., Ltd. All rights reserved.  
1/20  
TSZ2211114001  
Daattaasshheeeett  
BM2PXX2F  
Absolute Maximum RatingsTa=25C)  
Parameter  
Symbol  
Vmax1  
Rating  
-0.330  
-0.36.5  
650  
Unit  
V
Conditions  
Maximum applied voltage 1  
Maximum applied voltage 2  
Maximum applied voltage 3  
VCC  
Vmax2  
V max3  
V
V
SOURCE, FB, BR  
DRAIN  
PW=10us, Duty cycle=1%  
(BM2P052F)  
PW=10us, Duty cycle=1%  
(BM2P092F)  
Drain current pulse  
Drain current pulse  
IDP  
2.60  
A
IDP  
Pd  
1.30  
563  
A
Allowable dissipation  
Operating  
temperature range  
mW  
oC  
Topr  
-40 +105  
MAX junction temperature  
TJMAX  
Tsar  
150  
oC  
co  
Storage  
temperature range  
-55 +150  
(Note1) SOP8 : When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).  
Reduce to 4.563 mW/C when Ta = 25C or above.  
Operating ConditionsTa=25C)  
Parameter  
Power supply voltage range 1  
Power supply voltage range 2  
Symbol  
VCC  
VDRAIN  
Rating  
8.926.0  
650  
Unit  
V
V
Conditions  
VCC pin voltage  
DRAIN pin voltage  
Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V)  
Specifications  
Standard  
Parameter  
[MOSFET Block]  
Symbol  
Unit  
Conditions  
Minimum  
Maximum  
Between drain and  
source voltage  
Drain leak current  
V(BR)DDS  
IDSS  
650  
-
-
-
V
uA  
ID=1mA / VGS=0V  
-
-
100  
5.5  
VDS=650V / VGS=0V  
ID=0.25A / VGS=10V  
(BM2P052F)  
ID=0.25A / VGS=10V  
(BM2P092F)  
On resistance  
On resistance  
RDS(ON)  
4.0  
RDS(ON)  
-
8.5  
12.0  
www.rohm.com  
TSZ02201-0F2F0A200040-1-2  
24. Sep.2015.Rev.006  
© 2012 ROHM Co., Ltd. All rights reserved.  
2/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PXX2F  
Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)  
Specifications  
Parameter  
[Circuit current]  
Symbol  
Unit  
Conditions  
Minimum  
Standard Maximum  
BM2P052F, FB=2.0V  
(at pulse operation)  
BM2P092F, FB=2.0V  
(at pulse operation)  
Circuit current (ON) 1  
Circuit current (ON) 1  
ION1  
ION1  
ION2  
410  
350  
-
600  
500  
400  
790  
650  
500  
μA  
μA  
μA  
Circuit current (ON) 2  
FB=0.0V(at burst operation)  
[VCC protection function]  
VCC UVLO voltage 1  
VCC UVLO voltage 2  
VCC UVLO hysteresis  
VCC OVP voltage 1  
VCC OVP voltage 2  
Latch released VCC voltage  
VCC Recharge start voltage  
VCC Recharge stop voltage  
Latch mask time  
VUVLO1  
VUVLO2  
VUVLO3  
VOVP1  
VOVP2  
VLATCH  
VCHG1  
VCHG2  
TLATCH  
TSD  
12.50  
7.50  
-
13.50  
8.20  
5.30  
27.5  
23.5  
VUVLO2-0.5  
8.70  
13.00  
100  
145  
14.50  
8.90  
-
V
V
V
V
V
V
V
V
us  
C  
VCC rises  
VCC falls  
VUVLO3= VUVLO1- VUVLO2  
VCC rises  
VCC drop  
26.0  
29.0  
-
-
7.70  
12.00  
50  
9.70  
14.00  
150  
-
Thermal shut down temperature  
118  
[PWM type DCDC driver block]  
Oscillation frequency 1  
Oscillation frequency 2  
Frequency hopping width 1  
Hopping fluctuation frequency  
Soft start time 1  
Soft start time 2  
Soft start time 3  
Soft start time 4  
Maximum duty  
FSW1  
FSW2  
FDEL1  
FCH  
TSS1  
TSS2  
TSS3  
TSS4  
Dmax  
RFB  
60  
20  
-
65  
25  
4.0  
125  
0.50  
1.00  
2.00  
8.00  
75.0  
30  
70  
30  
-
175  
0.70  
1.40  
2.80  
11.20  
82.0  
37  
KHz FB=2.00V  
KHz FB=0.40V  
KHz FB=2.0V  
Hz  
ms  
ms  
ms  
ms  
%
75  
0.30  
0.60  
1.20  
4.80  
68.0  
23  
FB pin pull-up resistance  
ΔFB / ΔCS gain  
FB burst voltage  
kΩ  
V/V  
Gain  
VBST  
-
4.00  
0.400  
-
0.300  
0.500  
V
FB falls  
FB voltage of  
VDLT  
1.100  
1.250  
1.400  
V
starting Frequency reduction mode  
FB OLP voltage 1a  
FB OLP voltage 1b  
FB OLP ON timer  
FB OLP Start up timer  
FB OLP OFF timer  
VFOLP1A  
VFOLP1B  
TFOLP1  
TFOLP2  
TFOLP2  
2.60  
-
40  
26  
358  
2.80  
2.60  
64  
32  
512  
3.00  
-
88  
38  
666  
V
V
ms  
ms  
ms  
Overload is detected (FB rise)  
Overload is detected (FB drop)  
[Over current detection block]  
Overcurrent detection voltage  
VCS  
0.380  
0.400  
0.100  
0.150  
0.200  
0.300  
250  
0.420  
V
V
Ton=0us  
Overcurrent detection voltage SS1  
Overcurrent detection voltage SS2  
Overcurrent detection voltage SS3  
Overcurrent detection voltage SS4  
Leading Edge Blanking Time  
VCS_SS1  
VCS_SS2  
VCS_SS3  
VCS_SS4  
TLEB  
-
-
-
-
-
-
-
-
-
-
0[ms] ~ Tss1[ms]  
V
TSS1 [ms] ~ TSS2 [ms]  
TSS2 [ms] ~ TSS3[ms]  
TSS3 [ms] ~ TSS4 [ms]  
V
V
ns  
Over current detection AC Voltage  
compensation factor  
SOURCE pin  
KCS  
12  
20  
28  
mV/us  
V
VCSSHT  
0.020  
0.050  
0.080  
short protection voltage  
[Start circuit block]  
Start current 1  
Start current 2  
ISTART1  
ISTART2  
0.100  
1.000  
0.500  
3.000  
1.000  
6.000  
mA  
mA  
VCC= 0V  
VCC=10V  
Inflow current from Drain pin  
after UVLO released UVLO.  
When MOSFET is OFF  
OFF current  
ISTART3  
VSC  
-
10  
20  
uA  
V
Start current switching voltage  
0.800  
1.500  
2.100  
www.rohm.com  
TSZ02201-0F2F0A200040-1-2  
24. Sep.2015.Rev.006  
© 2012 ROHM Co., Ltd. All rights reserved.  
3/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PXX2F  
Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)  
[BR pin function]  
BR UVLO detection voltage1  
BR UVLO voltage 2  
BR UVLO hysteresis  
BR UVLO detection delay time1  
BR UVLO detection delay time2  
BR OVP detection voltage1  
BR OVP detection valtage2  
BR OVP hysteresis  
VBR1  
VBR2  
VBR3  
TBR1  
TBR2  
VBR4  
VBR5  
VBR6  
TBR3  
TBR4  
0.45  
0.29  
-
0.50  
0.35  
0.15  
100  
0.55  
0.41  
-
150  
350  
2.20  
2.10  
-
V
V
V
us  
ms  
V
V
V
us  
us  
BR rises  
BR falls  
VBR3=VBR1-VBR2  
BR rises  
BR falls  
BR rises  
BR falls  
VBR3=VBR1-VBR2  
BR rises  
BR falls  
50  
150  
2.00  
1.90  
-
50  
50  
256  
2.10  
2.00  
0.10  
100  
BR OVP detection delay time1  
BR OVP detection delay time2  
150  
150  
100  
PIN DESCRIPTIONS  
Table 1 Pin Description  
Function  
ESD Diode  
NO.  
Pin Name  
I/O  
VCC  
1
2
3
4
5
6
7
8
VCC  
N.C.  
I
-
Power supply input pin  
-
-
-
-
-
N.C.  
-
-
-
DRAIN  
SOURCE  
BR.  
I/O  
I/O  
I
MOSFET DRAIN pin  
MOSFET SOURCE pin  
Input AV Voltage monitor pin  
GND pin  
-
-
-
-
GND  
I/O  
I
-
-
FB  
Feedback signal input pin  
I/O Equivalent Circuit Diagram  
Figure 2. I/O Equivalent Circuit Diagram  
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Block Diagram  
+
FUSE  
Diode  
Bridge  
AC  
Filter  
-
1
4
VCC UVLO  
+
-
13.5V  
/ 8.2V  
Starter  
4.0V  
Line Reg  
VCC OVP  
+
-
10uA  
12V Clamp  
Circuit  
27.5V/23.5V  
Internal Block  
+
-
256ms  
Timer  
0.50V/0.35V  
+
S
R
6
100us  
Filter  
-
Q
DRIVER  
2.0V/2.1V  
PWM Control  
4.0V  
30k  
OLP  
1M  
-
+
64ms  
Timer  
8
Current  
Limiter  
Leading Edge  
Blanking  
Burst  
Comparator  
+
-
5
(typ=250ns)  
-
+
AC Input  
Compensation  
Soft Start  
PWM  
Comparator  
MAX  
DUTY  
-
+
7
Frequency  
Hopping  
OSC  
(65kHz)  
+
Slope  
Compensation  
FeedBack  
With  
Isolation  
Figure 3. Block Diagram  
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Description of Blocks  
(1) Start circuit (DRIAN: 4pin)  
This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.  
After starting, consumption power is idling current ISTART3typ=10uAonly.  
Reference values of Starting time are shown in figure-6. When Cvcc=10uF it can start less than 0.1 sec.  
+
FUSE  
AC  
Diode  
Bridge  
85-265 Vac  
-
DRAIN  
SW1  
VCC  
Cvcc  
+
-
VCCUVLO  
Figure 4. Block diagram of start circuit  
ISTART2  
ISTART1  
ISTART3  
0
Vsc  
VUVLO1  
10V  
VCC Voltage[V]  
Figure 5. Start current vs VCC voltage  
Figure 6. Start time (reference value)  
* Start current flows from the DRAIN pin  
Ex) Consumption power of start circuit only when the Vac=100V  
PVH100V*2*10uA=1.41mW  
Ex) Consumption power of start circuit only when the Vac=240V  
PVH240V*2*10uA=3.38mW  
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(2) Start sequences  
(Soft start operation, light load operation, and auto recovery operation during overload protection)  
Start sequences are shown in Figure 7. See the sections below for detailed descriptions.  
VH  
VCC=13.5V  
VCC(1pin)  
VCC=8.2V  
Within  
32ms  
FB OLP ON  
64ms  
Internal REF  
Pull Up  
FB(8pin)  
Vout  
Iout  
Over Load  
Normal Load  
Light LOAD  
Burst mode  
Switching  
stop  
Switing  
Soft  
Start  
G H  
I
C
E
F
A
B
D
Figure 7. Start sequences Timing Chart  
A: Input voltage VH is applied  
B: This IC starts operation when VCC pin voltage rises and VCC > VUVLO1 (13.5 V typ).  
Becomes constant level, VCC voltage drops because of the VCC consumption current.  
VCC recharge function start if VCC voltage < VCHG1 8.7V typC : With the soft start function, over current limit value  
is restricted to prevent any excessive rise in voltage or current.  
D: When the switching operation starts, VOUT rises.  
The output voltage become to stable state, VCC voltage also become to stable state through auxiliary winding.  
Please set the rated voltage within the TFOLP1b period (32ms typ) from VCC voltage > VUVLO1.  
E: During a light load, if it reaches FB voltage < VBST (= 0.4Vtyp), the IC starts burst operation to keep power consumption  
low.  
During burst operation, it becomes low-power consumption mode.  
F : When the FB VoltageVFOLP1A=2.8V typ, it becomes a overload operation.  
G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above T FOLP (64ms typ), the overload protection function is  
triggered and switching stops 64mS later. If the FB pin voltage becomes FB<VFOLP1B even once, the IC’s FB OLP  
timer is reset.  
H : If the VCC voltage drops to VCC < VUVLO2 (7.7Vtyp) or below, restart is executed.  
I: The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)  
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(3) VCC pin protection function  
BM2PXX2F built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection  
function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC voltage.  
VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at abnormal  
voltage.  
VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at  
dropping the VCC voltage.  
(3-1) VCC UVLO VCC OVP function  
VCCUVLO is auto recovery protection. VCCOVP is auto recovery protection. And they have voltage hysteresis. Refer to  
the operation figure-8.  
Switching is stopped by the VCCOVP function when VCC pin voltage > Vovp1 (typ=27.5V), and Switching is restart when  
VCC pin voltage < Vovp2 (typ=23.5V)  
Figure 8. VCC UVLO / OVP Timing Chart  
A: DRAIN voltage input, VCC pin voltage starts rising.  
B: VCC>Vuvlo1, DC/DC operation starts  
C: VCC< VCHG1, VCC charge function operates and the VCC voltage rises.  
D: VCC > VCHG2, VCC charge function is stopped.  
E: VCC > VOVP1, continues TLATCH (typ =100us), switching is stopped by the VCCOVP function.  
F: VCC < VOVP2, Switching operation restarts  
G: VH is OPEN.VCC Voltage is fall.  
H: Same as C.  
I: Same as D.  
J: VCC<Vuvlo2, Switching is stopped by the VCC UVLO function  
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(3-2) VCC Charge function  
After VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin  
voltage drops to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit.  
By this operation, BM2PXX2 doesn’t occur to start failure.  
When VCC pin voltage rises to VCC >VCHG2, charge is stopped. The operations are shown in figure 9.  
VH  
VUVLO1  
VCHG2  
VCC  
VCHG1  
VUVLO2  
Switching  
VH charge  
charge  
charge  
charge  
charge  
OUTPUT  
voltage  
A
B C D E  
F G H  
Figure 9. Charge operation VCC pin charge operation  
A: DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.  
B: VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.  
C: When DC/DC operation starts, the VCC voltage drops.  
D: VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises.  
E: VCC > VCHG2, VCC recharge function stops.  
F: VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises...  
G: VCC > VCHG1, VCC recharge function stops.  
H: After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.  
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(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)  
BM2PXX2F is current mode PWM control.  
An internal oscillator sets a fixed switching frequency (65 kHz typ).  
BM2PXX2F is integrated switching frequency hopping function which changes the switching frequency to fluctuate as  
shown in figure-10 below.  
The fluctuation cycle is 125 Hz typ.  
Switching Frequency  
[kHz]  
500us  
69  
68  
67  
66  
65  
64  
63  
62  
61  
125 Hz(8ms)  
Time  
Figure 10. Frequency hopping function  
Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).  
With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.  
As a countermeasure to this, BM2PXX2F is built in slope compensation circuits.  
BM2PXX2F is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the load  
is light.  
FB pin is pull up by RFB (30 ktyp).  
FB pin voltage is changed by secondary output voltage (secondary load power).  
FB pin is monitored, burst mode operation and frequency detection start.  
Figure 11 shows the FB voltage, and switching frequency, DCDC operation  
mode1 : Burst operation  
mode2: Frequency reduction operation.  
mode3 : Fixed frequency operation.(operate at the max frequency)  
mode4 : Over load operation.(detect the over load state and stop the pulse operation)  
Figure 11. Switching operation state changes by FB pin voltage  
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(5) Over Current limiter  
BM2PXX2F is built in Over Current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is stopped. It is  
also built in AC voltage compensation function. This is the function which compensates the maximum power as the AC voltage’  
s change by increasing over current limiter with time.  
Shown in figure-12, 13, and 14.  
Figure 12. No AC voltage compensation function  
Figure13. built-in AC compensation voltage  
Primary peak current is decided as the formula below.  
Primary peak current:  
Ipeak = Vcs/Rs + Vdc/Lp*Tdelay  
VcsOver current limiter voltage internal IC, RsCurrent detection resistance, Vdc input DC voltage, LpPrimary inductance,  
Tdelaydelay time after detection of over current limiter  
Figure 14. Over current limiter voltage  
(6) L.E.B period  
When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.  
Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter circuit.  
To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the  
on-chip LEB (Leading Edge Blanking) function.  
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(7) SOURCE pin short protection function  
When the SOURCE pin is shorted, BM2PXX2F is over heat.  
BM2PXX2F built in short protection function to prevent destroying.  
(8) SOURCE pin open protection  
If the SOURCE pin becomes OPEN, BM2PXX2F may be damaged.  
To prevent to be damaged, BM2PXX2F built in OPEN protection circuitauto recovery protection.  
(9) Output over load protection function FB OLP Comparator)  
The output overload protection function monitors the secondary output load status at the FB pin, and stops switching when  
an overload occurs. In case of an overload, the output voltage is reduced and current no longer flows to the photo coupler,  
so the FB pin voltage rises.  
When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period TFOLP1 (64ms typ), it is judged as an overload and  
stops switching.  
When the FB pin > VFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period TFOLP1 (64ms typ),  
the overload protection timer is reset. The switching operation is performed during this period TFOLP1 (64ms typ).  
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V typ) or  
above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (2.6 V typ) or below during the period TFOLP1 (64ms  
typ), and the secondary output voltage’s start time must be set within the period TFOLP1 (64ms typ) following startup of the IC.  
Recovery from the once detection of FBOLP, after the period TFOLP2 (512 ms typ)  
Figure 15. Over load protection (Auto recovery)  
A: The FBOLP comparator detects over load for FB>VFOLP1A  
B: If the State of A continues for the period TFOLP1 (64ms typ), it is judged as an overload and stops switching after 64ms.  
C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage reaches  
< VCHG1, the VCC charge function operates so the VCC pin voltage rises.  
D: VCC charge function stops when VCC pin voltage > VCHG2  
E: If TFOLP2 typ =512msgo on from B point, Switching function starts on soft start.  
F: If TFOLP1 (64ms typ) go on from E point to continues an overload condition (FB>VFOLP1A), Switching function stops at F point.  
G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.  
H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops.  
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(10) Input voltage protection function  
This IC has BR-UVLO function and BR-OVP function to monitor input voltage. By monitoring input voltage, it can be  
prevented from breaking of IC. AC voltage and DC voltage can be monitored by BR pin.  
Figure 16(a). AC voltage monitor setting  
Figure 16(b). DC voltage monitor setting  
BRUVLO function can protect the breaking of IC when input voltage is low.  
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Operation mode of protection circuit  
Operation mode of protection functions are shown in Table 2.  
Table 2. Operation mode of protection circuit  
Function  
Operation mode  
VCC Under Voltage Locked Out  
VCC Over Voltage Protection  
TSD  
Auto recovery  
Auto recovery  
Latchwith 100us timer)  
FB Over Limited Protection  
SOURCE Open Protection  
Auto recoverywith 64ms timer)  
Auto recovery  
Sequence  
The sequence diagram is show in figure-17.  
All condition transits OFF Mode VCC<8.2V  
Figure 17. The sequence diagram  
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Thermal loss  
The thermal design should set operation for the following conditions.  
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)  
1. The ambient temperature Ta must be 105or less.  
2. The IC’s loss must be within the allowable dissipation Pd.  
The thermal abatement characteristics are as follows.  
(PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy substrate)  
Figure 18. SOP8 Thermal Abatement Characteristics  
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Ordering Information  
2 F  
B M 2 P X X  
-
GE2  
Package  
F : SOP8  
Product  
name  
Packaging and  
forming specification  
E2: Embossed tape and reel  
Marking Diagram  
SOP8 (TOP VIEW)  
Part Number Marking  
LOT Number  
1PIN MARK  
Series  
BM2P052F  
BM2P092F  
Part Number  
2P052  
2P092  
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Physical Dimension, Tape and Reel Information  
Package Name  
SOP8  
(Max 5.35 (include. BURR))  
(UNIT: mm)  
PKG: SOP8  
Drawing No. : EX112-5001-1  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2500pcs  
Quantity  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
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Operational Notes  
1.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum  
rating, increase the board size and copper area to prevent exceeding the Pd rating.  
6. Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
7. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush  
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC  
has more than one power supply. Therefore, give special consideration to power coupling capacitance,  
power wiring, width of ground wiring, and routing of connections.  
8.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
9. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
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Operational Notes – continued  
11. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should  
be avoided.  
Figure 19. Example of hic IC scture  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
15. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation  
should always be within the IC’s power dissipation rating. If however the rating is exceeded for a  
continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn  
OFF all output pins. The IC should be powered down and turned ON again to resume normal  
operation because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the  
TSD threshold.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat  
damage.  
16. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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date  
Rev. No.  
001  
Revision Point  
New Release  
2012.07.19  
P7 An explanation for Figure7  
P8 An explanation for VCC_UVLO/VCC_OVP function  
An explanation for Figure8  
P11 An explanation for Over Current limiter  
P12 An explanation for Output over load protection function  
An explanation for Figure15  
003  
2013.11.18  
P1 Package size  
P17 Physical Dimension  
004  
005  
2015.02.23  
2015.05.15  
P14 Operation mode of protection circuit  
P14 Sequence  
P3 A value of BR UVLO detection voltage 1  
P7 An explanation of Start sequence  
P8 An explanation of VCC pin protection function  
P8 An explanation of VCC UVLO / VCC OVP function  
P9 An explanation of VCC Charge function  
P11 An explanation of Over Current Limiter  
P12 An explanation of Output over load protection function  
006  
2015.09.24  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Datasheet  
Buy  
BM2P052F - Web Page  
Distribution Inventory  
Part Number  
Package  
BM2P052F  
SOP8  
Unit Quantity  
2500  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
2500  
Taping  
inquiry  
Yes  
配单直通车
BM2P091产品参数
型号:BM2P091
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:ROHM CO LTD
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:1.72
模拟集成电路 - 其他类型:SWITCHING REGULATOR
峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIED
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