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产品型号BM2P01A的Datasheet PDF文件预览

Datasheet  
AC/DC Convertor IC  
PWM Type DC/DC converter IC  
Integrated Switching MOSFET  
BM2PXXA/BM2PXXB Series  
General Description  
Basic specifications  
The PWM Type DC/DC converter for AC/DC provides an  
optimal system for all products that include an electrical  
outlet. BM2PXXA/BM2PXXB supports both isolated and  
non-isolated devices, enabling simpler design of various  
Types of high-efficiency electrical converters.  
Operating Power Supply Voltage Range  
VCC  
DRAIN  
VH  
Normal Operating Current  
Burst Operating Current  
Oscillation Frequency  
Operating Temperature  
MOSFET ON Resistance  
:10.9V to 26.0V  
:to 650V  
:to 650V  
:1.40mA (Typ.)  
:0.25mA (Typ.)  
:100kHz (Typ.)  
:- 40 oC to +105 oC  
:2.0(Typ.)  
The built-in starter circuit which withstand 650V pressure  
contributes to low-power consumption. Design can be  
easily implemented because includes a sensing resistor.  
Current is restricted in each cycle and excellent  
performance is demonstrated in bandwidth and transient  
response since current mode control is utilized. The  
switching frequency is 100 kHz. At light load, the  
switching frequency is reduced and high efficiency is  
achieved. A frequency hopping function that contributes  
to low EMI is also included on chip. Design can be easily  
implemented because includes a 650V switching Super  
Junction MOSFET.  
Package  
DIP8  
9.27mm×6.35mm×5.33mm pitch 2.54mm  
(Typ.) (Typ.)  
(Max.)  
Key Features  
PWM frequency : 100kHz  
PWM current mode control  
Frequency hopping function  
Burst operation when load is light  
Frequency reduction function  
Built-in 650V starter circuit  
Built-in 650V switching MOSFET  
VCC pin Under-Voltage protection  
VCC pin Over-Voltage protection  
Per-cycle Over-Current Protection Circuit  
AC Correction function of Over current limiter  
Soft start  
Line-up  
Current Limitter  
0.43A  
VCCOVP  
FBOLP  
Latch  
BM2P01A  
Latch  
Latch  
BM2P11A  
BM2P21A  
BM2P31A  
BM2P01B  
BM2P11B  
BM2P21B  
BM2P31B  
0.43A  
Auto Restart  
Latch  
0.43A  
Auto Restart  
Auto Restart  
Latch  
0.43A  
Auto Restart  
Latch  
0.54A  
0.54A  
Latch  
Auto Restart  
Latch  
Secondary Over-Current Protection Circuit  
External LATCH function  
X-Capacitor discharge function  
0.54A  
Auto Restart  
Auto Restart  
0.54A  
Auto Restart  
Applications  
For AC adapters and household appliances  
Application Circuit  
FUSE  
Diode  
Bridge  
AC  
Input  
Filter  
7
6
8
5
DRAIN DRAIN  
VH  
DRAIN  
LATCH  
4
GND  
1
VCC  
2
FB  
3
ERROR  
AMP  
Product structureSilicon monolithic integrated circuit This product has no designed protection against radioactive rays.  
.www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
1/20  
TSZ2211114001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
Pin Descriptions  
ESD Diode  
VCC GND  
NO.  
Pin Name  
I/O  
Function  
1
2
3
4
5
6
7
8
GND  
VCC  
I/O  
GND pin  
-
I
I
Power Supply pin  
Feedback pin  
External Latch  
Start up pin  
-
-
-
FB  
LATCH  
VH  
I
I
DRAIN  
DRAIN  
DRAIN  
I/O  
I/O  
I/O  
MOSFET DRAIN pin  
MOSFET DRAIN pin  
MOSFET DRAIN pin  
-
-
-
-
-
Block Diagram  
2
5
6,7,8  
Starter  
VCC UVLO  
+
-
15.5V  
/10.2V  
4.0V  
Line Reg  
Discharge  
6.3V  
100μs  
Filter  
+
-
Clamp  
Circuit  
VCC OVP  
27.5V/23.5V  
320μA  
Internal Block  
SW1=ON @ACON  
SW1=OFF@ACOFF  
S
R
100μs  
Filter  
-
+
4
Q
DRIVER  
8.5V  
Super  
Junction  
MOSFET  
SW2=OFF @ACON  
SW2=ON@ACOFF  
PWM Control  
4.0V  
Current  
Limmiter  
30k  
Leading Edge  
Blanking  
OLP  
64ms  
Timer  
+
-
3
-
+
(typ=250ns)  
1k  
2.8V/2.6V  
Burst  
Comparator  
AC Input  
Compensation  
-
+
1/4  
Soft Start  
PWM  
Comparator  
0.18V/0.15V  
(FB=0.23V/0.18V)  
MAX  
DUTY  
-
+
1
Frequency  
Hopping  
OSC  
(100kHz)  
Slope  
Compensation  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
2/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
Absolute Maximum Ratings Ta=25C)  
Parameter  
Symbol  
Vmax1  
Vmax2  
Vmax3  
Vmax4  
IDD  
Rating  
-0.3 to 650  
-0.3 to 650  
-0.3 to 6.5  
-0.3 to 32.0  
10.4  
Unit  
V
V
V
V
Conditions  
Maximum applied voltage 1  
Maximum applied voltage 2  
Maximum applied voltage 3  
Maximum applied voltage 4  
Drain current pulse  
Power dissipation  
Ambient  
temperature range  
Maximum junction  
temperature  
VH  
DRAIN  
FB, LATCH  
VCC  
A
W
PW=10μs, Duty cycle=1%  
PD  
1.06  
TOPR  
TJMAX  
TSTR  
-40 to +105  
+125  
oC  
oC  
oC  
Storage  
-55 to +150  
temperature range  
(Note) When mounted (on 114.5 mm × 101.5 mm × 1.6 mm thick, glass epoxy on single-layer substrate). De-rated by 8.52mW/°C when  
operating above Ta=25°C.  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins  
or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a  
fuse, in case the IC is operated over the absolute maximum ratings  
Operating Conditions Ta=25C)  
Parameter  
Symbol  
VH  
Rating  
to 650  
Unit  
V
Conditions  
Power supply voltage range 1  
Power supply voltage range 2  
Power supply voltage range 3  
VH  
VDRAIN  
VCC  
to 650  
V
DRAIN  
VCC  
10.9 to 26.0  
V
Electrical Characteristics of MOSFET (unless otherwise noted, Ta = 25C, VCC = 15V)  
Specifications  
Unit  
Conditions  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
[MOSFET part]  
Between DRAIN and SORCE  
current  
V(BR)DDS  
650  
-
-
V
ID=1mA / VGS=0V  
DRAIN leak current  
On resistance  
IDSS  
-
-
-
100  
2.6  
μA  
VDS=650V / VGS=0V  
ID=0.25A / VGS=10V  
RDS(ON)  
2.0  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
3/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
Electrical Characteristics of Control IC(unless otherwise noted, Ta = 25C, VCC = 15 V)  
Specifications  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
Typ.  
Max.  
[Circuit Current]  
FB=2.0V(PULSE operation)  
DRAIN : OPEN  
Circuit current (ON) 1  
Circuit current (ON) 2  
ION1  
ION2  
IOFF  
0.90  
0.15  
10  
1.40  
0.25  
20  
1.90  
0.35  
30  
mA  
mA  
μA  
FB=0.0V(Burst operation)  
Circuit current (OFF)  
During Starting and VCC=14.5V  
[VCC Protection Function]  
VCC UVLO voltage 1  
VCC UVLO voltage 2  
VCC UVLO hysteresis  
VCC OVP voltage 1  
VUVLO1  
VUVLO2  
VUVLO3  
VOVP1  
14.50  
9.50  
-
15.50  
10.20  
5.30  
16.50  
10.90  
-
V
V
V
V
VCC rises  
VCC falls  
VUVLO3= VUVLO1- VUVLO2  
VCC rises  
26.0  
27.5  
29.0  
In the case of  
Auto Restart Typed  
In the case of  
Auto Restart Typed  
VCC OVP voltage 2  
VOVP2  
VOVP3  
-
-
23.5  
4.0  
-
-
V
V
VCC OVP hysteresis  
Latch released VCC voltage  
VCC recharge start voltage  
VCC recharge stop voltage  
Latch mask time  
VRESET  
VCHG1  
VCHG2  
TLATCH  
TSD1  
-
VUVLO2-0.5  
10.70  
15.00  
100  
-
V
V
9.70  
14.00  
50  
11.70  
16.00  
150  
V
μs  
C  
C  
Thermal shut down temperature1  
Thermal shut down temperature2  
[PWM Type DCDC Driver Block]  
120  
90  
145  
170  
Control IC, temp rises  
Control IC, temp falls  
TSD2  
115  
140  
Oscillation frequency 1  
Oscillation frequency 2  
Frequency hopping width  
Hopping fluctuation frequency  
Starting frequency reduction mode  
Maximum duty  
FB pin pull-up resistance  
FB burst voltage1  
FB burst voltage2  
FSW1  
FSW2  
FDEL  
FCH  
VDLT  
94  
20  
-
100  
25  
6.0  
106  
30  
-
kHz FB=2.00V  
kHz FB=0.18V  
kHz FB=2.00V  
Hz  
V
75  
125  
175  
1.260  
82.0  
37  
0.230  
0.280  
3.100  
-
1.060  
68.0  
23  
0.130  
0.180  
2.500  
-
1.160  
75.0  
30  
0.180  
0.230  
2.800  
2.600  
64  
Dmax  
RFB  
%
kΩ  
VBST1  
VBST2  
VFOLP1A  
VFOLP1B  
TFOLP1  
TFOLP2  
V
V
V
FB rises  
FB falls  
FB rises  
FB falls  
FB OLP voltage 1a  
FB OLP voltage 1b  
V
FB OLP LATCH ON TIMER  
FB OLP LATCH OFF TIMER  
[Over Current Detection Block]  
Over-current Limiter 1a  
Over-current Limiter 2a  
Over-current Limiter 1b  
Over-current Limiter 2b  
Leading edge blanking time  
40  
332  
88  
692  
ms  
ms  
512  
ISOURCE1a  
ISOURCE2a  
ISOURCE1b  
ISOURCE2b  
TLEB  
0.330  
-
0.430  
0.780  
0.540  
1.020  
(250)  
0.530  
A
A
Ton=0μs (BM2PXXA)  
Ton=10μs (BM2PXXA)  
Ton=0μs (BM2PXXB)  
Ton=10μs (BM2PXXB)  
-
0.440  
0.640  
A
-
-
A
-
ns  
[ External LATCH function  
]
LATCH detect voltage  
LATCH pull up current  
LATCH pull down resistance  
[VH Start Circuit Block]  
Start current  
VLATCH  
ILATCH-up  
RLATCH-down  
7.80  
250  
100  
8.50  
320  
250  
9.20  
390  
400  
V
μA  
AC=ON  
AC=OFF, LATCH=3.0V  
ISTART  
1.90  
5
5.50  
10  
10.20  
20  
mA  
VH=100V/ VCC=10V  
VH=100V  
ISTART_OF  
Start OFF current  
μA  
F
Discharge ON voltage  
VHDIS1  
TDISON  
90.2  
88  
101.5  
128  
112.8  
168  
V
Discharge ON delay time  
ms  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
4/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
Block Description  
(1) Start circuit / AC Voltage UVLO / Discharge function (VH: Pin 5)  
This IC has a built-in start circuit. The IC also has the AC voltage UVLO (Under Voltage Lock Out) function which  
stops to operate the pulse operation when the AC voltage lowers at the VH pin, and the discharge function which  
discharges X-cap if the AC voltage outlet is pulling out.  
The Application circuit and Block Diagram are shown in Figure 1 and Timing chart is shown in Figure 2.  
Figure 1. Application circuit and Block Diagram  
Figure 2. X-Capacitance Discharge / AC voltage UVLO Timing chart  
A: The AC voltage input is turned OFF.  
B: After TDISON (Typ.=128ms), so DC/DC is turned OFF and VCC is higher than VCHG1(Typ.=10.7V) that VCC  
capacitor is discharged.  
C: VCC becomes higher than VCHG1(Typ.=10.7V), and the IC starts the recharge from VH pin to VCC pin. At this  
moment, VCC capacitor discharge is stopped.  
D: It stops charging to VCC pin when VCC becomes higher than VCHG2(Typ.=15.0V). And it starts discharging of VCC  
capacitor.  
E: Same as C  
F: Same as D  
G: Same as C  
H: Same as D  
I: VCC< VUVLO2(Typ.=10.2V)  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
5/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
(2) Start sequences  
(Soft start operation, light load operation, and auto recovery operation by overload protection)  
Start sequences are shown in Figure 3. See the sections below for detailed descriptions.  
Figure 3. Start Sequences Timing Chart  
A: The input voltage VH is applied.  
B: This IC starts operating when the VCC pin voltage is higher than VUVLO1 (Typ.=15.5V).The Switching operation  
starts when the other protection functions are judged as normal. While the secondary output voltage becomes  
constant, the VCC pin current causes the VCC voltage to drop. As a result, the IC should be set the VCC voltage  
to be higher than VUVLO2 (Typ.=10.2V) until the IC starts to switch.  
C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.  
D: When the switching operation starts, Vout rises. After the output voltage starts, set the rated voltage within the  
TFOLP1 (Typ.=64ms) period.  
E: In case of a light load, the IC operates burst mode to reduce power consumption if the FB voltage lowers than  
VBST1 (Typ.=0.18V). During this time, it operates at low-power consumption mode.  
F: When the FB pin Voltage is higher than VFOLP1A (Typ.=2.8V), it overloads.  
G: When the status that the FB voltage is higher than VFOLP1A (Typ.=2.8V) continues for T FOLP1 (Typ.=64ms)(NOTE1)  
,
the overload protection function is triggered and the switching stops during T FOLP2 (Typ.=512ms) (NOTE2)  
H: If the VCC voltage drops to lower than VUVLO2 (Typ.=10.7V), restart is executed.  
I: After T FOLP2 (Typ.=512ms), it repeats F,G and H if the condition keeps on overload.  
.
(NOTE 1): IC internal timer is reset if the overload is released within 64ms.  
(NOTE 2): IC internal timer is reset if the overload is released within 512ms.  
www.rohm.com  
© 2015 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
6/20  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
(3) VCC pin protection function  
The IC has a built-in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), an over voltage  
protection function VCCOVP (Over Voltage Protection), and a VCC recharge function that operates in case of a drop  
in VCC voltage.  
The VCC charge function stabilizes the secondary output voltage charging from high voltage lines by the start circuit  
when the VCC voltage drops.  
VCC UVLO / VCC OVP function  
VCCUVLO is an auto recovery comparator with a voltage hysteresis. And VCCOVP is a latch Type or auto restart  
Type comparator. (The type of a latch or auto restart is different by products series.)  
VCCOVP has a built-in mask time. This detects when the condition that VCC pin voltage is higher than VOVP1  
(Typ.=27.5V) continues for TLATCH (Typ.=100us). This function masks such as a surge generated at pin. Figure 4 is  
showed about the time chart of VCC OVP latch Type  
VCC charge function  
This IC has the recharge function.  
VCC charge function operates when the VCC voltage drops lower than VCHG1(Typ.=10.7V) after once VCC becomes  
higher than VUVLO1(Typ.=15.5V) and the IC starts. At that time the VCC pin is charged from the VH pin through the  
start circuit. Through this operation, BM2PXXA/BM2PXXB prevents failure.  
When the VCC pin voltage rises higher than VCHG2(Typ.=15.0V) by charging, the IC stops it  
Figure 4. VCC UVLO / OVP Timing Chart  
A: The VH voltage input, VCC pin voltage starts rising.  
B: When the VCC voltage is higher than VUVLO1(Typ.=15.5V), VCC UVLO is released and DC/DC operation starts.  
C: When the VCC voltage is lower than VCHG1 (Typ.=10.7V), VCC charge function operates and the VCC voltage  
rises.  
D: When the VCC voltage is higher than VCHG2 (Typ.=15.0V), VCC charge function stops.  
E: When the condition that VCC voltage is higher than VOVP1 (Typ.=27.5V), continues for TLATCH (Typ.=100us), the  
switching is stopped by the VCCOVP function.  
F: When the VCC voltage is lower than VOVP2(Typ.=23.5V), DC/DC operation doesn’t restarts because of latch  
function.  
G: The high voltage line VH is drops.  
H: Same as C  
I: Same as D  
J: When the VCC voltage is lower than VUVLO2(Typ.=10.2V), VCC UVLO function operates.  
K: When the VCC voltage is lower than VRESET(Typ.= VUVLO2-0.5), LATCH function is released.  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
7/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)  
This IC has a current mode PWM control.  
An internal oscillator sets a fixed switching frequency FSW1(Typ.=100kHz)  
It also has an integrated switching frequency hopping function, which causes the switching frequency to fluctuate. The  
fluctuation of cycle is FCH (Typ.=125Hz ).  
Maximum duty cycle is fixed at Dmax (Typ.=75%).  
In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50%.  
As a countermeasure, this IC has built-in slope compensation circuits.  
This IC has built-in burst mode and frequency reduction circuits to achieve lower power consumption  
when the load is light.  
FB pin is pulled up by RFB (Typ.=30k).  
FB pin voltage is changed by secondary output voltage (secondary load power).  
By monitoring the FB pin, burst mode operation and frequency detection start.  
Figure 5 shows the FB voltage, and the DC/DC switching frequency operation.  
mode1 : Burst operation  
mode2 : Frequency reduction operation  
(frequency is reduced)  
mode3 : Fixed frequency operation (operates at max frequency)  
mode4 : Overload operation  
(stops the pulse operation and starts burst mode)  
Y
Switching  
Frequency  
[kHz]  
mode  
mode 1  
mode2  
3
mode4  
100kHz  
25kHz  
Pulse OFF  
X
2.00V  
2.80V  
0.18V 0.23V  
1.16V  
FB[V]  
Figure 5. Switching Operation State Changes by FB Pin Voltage  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
© 2015 ROHM Co., Ltd. All rights reserved.  
8/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
(5) Over Current limiter  
The IC has a built-in over current limiter per cycle. If the primary coil current exceeds a certain current, switching stops.  
It also has a built-in AC voltage compensation function. This is the correction function of AC voltage which increases  
the over current limiter level with time.  
It is shown in figure 6, 7, and 8.  
Figure 6. No AC Voltage Compensation Function  
Figure 7. Built-in AC Compensation Voltage  
Primary peak current is calculated using the formula below.  
Primary peak current: Ipeak = ISOURCE + Vdc / Lp×Tdelay  
I
SOURCEOver-current Limiter, Vdc: Input DC voltage, LpPrimary inductance value,  
Tdelay: Delay time after detection of over current limiter  
Figure 8a. Over Current Limiter (BM2PXXA)  
Figure 8b. Over Current Limiter (BM2PXXB)  
(6) Soft start operation  
In order to prevent excessive voltage rise and current rise during startup, The IC limits the over current limiter value.  
The detail is shown in Figure 9. Over current limiter achieves the soft start operation by changing its value with time.  
Figure 9a. Soft start (BM2PXXA/Ton=0μs)  
Figure 9b. Soft start (BM2PXXB/Ton=0μs)  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
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9/20  
TSZ2211115001  
Daattaasshheeeett  
BM2PX1A/BM2PX1B Series  
(7) Output over load protection function FB OLP Comparator)  
The output overload protection is the function which monitors the secondary output load status by FB pin and  
stops the switching at over status.  
In case of overload, current no longer flows to the photo coupler because of the fall of output voltage, so FB  
voltage rises. If the status that FB voltage is higher than VFOLP1A (Typ.=2.8V) continues for TFOLP1 (Typ.=64ms),  
IC stops the switching operation judging it is overload. If FB pin drops to lower than VFOLP1B (Typ.=2.6V) from  
the status that FB pin is higher than VFOLP1A (Typ.=2.8V) within TFOLP1 (Typ.=64ms), the timer of the overload  
protection is reset. The IC operate switching for TFOLP1 (Typ.=64ms). At starting, FB pin operates from more  
than VFOLP1A (Typ.=2.8V) because it is pulled up at IC internal voltage. For that, it is necessary for the  
secondary output voltage to be set the startup time so that FB voltage becomes lower than VFOLP1B (Typ.=2.6V)  
within TFOLP1 (Typ.=64ms).  
The returning from once detecting FBOLP is after TFOLP2 (Typ.=512ms).  
www.rohm.com  
TSZ02201-0F1F0A200100-1-2  
22. Mar.2017.Rev.002  
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(8) External latch functionLATCH Pin)  
LATCH pin has external LATCH function and LED indication.  
Block Diagram and Timing chart is shown in Figure10 and Figure11.  
<AC Voltage indication>  
AC voltage is monitored by VH pin.  
AC ON : Hi (320μA current pull up)  
AC OFF : Low ( 250 ohm pull down )  
Figure 10a. AC=ON, LED connected  
Figure 10b. AC=OFF, LED connected  
Internal  
Internal  
Reg=6.3V  
Reg=6.3V  
320μA typ  
250μA min  
320μA typ  
250μA min  
VCC  
VCC  
OFF  
ON  
SW1  
SW1  
VCC Voltage  
(9.50V~32.0V)  
+
-
+
-
Internal  
Reg=6.5V  
100μs  
Single pulse stop  
100μs  
Single pulse stop  
LATCH  
LATCH  
Normal  
Function  
8.5V±0.70V  
8.5V±0.70V  
LATCH  
Function  
SW2  
SW2  
Figure 10c. LATCH=OFF, LED not connected  
LATCH Function>  
Figure 10d. LATCH=ON, LED not connected  
If the LATCH pin voltage becomes over 8.5V for more than 100μs, the IC latch-stops.  
<100μs  
100μs  
8.5V  
LATCH  
DC/DC  
LATCH STOP  
A
B
C
D E  
Figure 11.  
LATCH Function Timing chart  
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© 2015 ROHM Co., Ltd. All rights reserved.  
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Operation mode of protection circuit  
Operation mode of protection functions are shown in Table 1.  
Table 1.  
Operation Mode of Protection Circuit  
Operation mode  
Function  
VCC Under Voltage Locked Out  
VCC Over Voltage Protection  
Thermal Shut Down  
Auto recovery  
Auto recovery/Latchwith 100μs timer)  
Auto recoverywith 100μs timer)  
FB Over Limited Protection  
Auto recovery/Latchwith 64ms timer)  
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TSZ02201-0F1F0A200100-1-2  
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Thermal loss  
The thermal design should set the operation for the following conditions.  
(Since the temperature shown below is the guaranteed temperature, be sure to take into account a sufficient margin.)  
1. The ambient temperature Ta must be 105or less.  
2. The IC’s loss must be within the allowable dissipation Pd.  
The thermal dissipation characteristics are as follows.  
(PCB: 114.5 mm × 101.5mm × 1.6 mm, mounted on glass epoxy single-layer substrate)  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
25  
50  
75  
100  
125  
150  
Ta[]  
Figure 12. Thermal Dissipation Characteristics  
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TSZ02201-0F1F0A200100-1-2  
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I/O Equivalent Circuit Diagram  
8
DRAIN  
DRAIN  
5
VH  
7
DRAIN  
6
VH  
DRAIN  
DRAIN  
DRAIN  
Internal  
Circuit  
Internal MOSFET  
Internal MOSFET  
Internal MOSFET  
GND  
GND  
GND  
GND  
GND  
VCC  
3
4
LATCH  
1
2
FB  
VCC  
VCC  
VCC  
VCC  
LATCH  
FB  
GND  
GND
GND  
GND  
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TSZ02201-0F1F0A200100-1-2  
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Characteristic data (These are reference data. They can’t guarantee their value.)  
30.0  
0.31  
0.29  
0.27  
0.25  
0.23  
0.21  
0.19  
0.17  
0.15  
1.9  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
27.5  
25.0  
22.5  
20.0  
17.5  
15.0  
12.5  
10.0  
-40 -20  
0
20  
40  
60  
80 100 120  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20  
40  
60  
80 100 120  
Tempature []  
Tempature []  
Tempature []  
Circuit current(OFF)  
VCCUVLO voltage1  
VCCOVP voltage1  
Circuit current (ON)1  
Circuit current (ON)2  
10.5  
10.4  
10.3  
10.2  
10.1  
10.0  
9.9  
9.8  
9.7  
9.6  
9.5  
-40 -20  
0
20  
40  
60  
80 100 120  
Tempature []  
VCCUVLO voltage2  
VCCUVLO hysteresis  
VCC recharge start voltage1  
VCC recharge start voltage 2  
150  
140  
130  
120  
110  
100  
90  
106  
105  
104  
103  
102  
101  
100  
99  
98  
97  
96  
95  
30  
28  
26  
24  
22  
20  
80  
70  
60  
94  
50  
-40 -20  
0
20  
40  
60  
80 100 120  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20  
40  
60  
80 100 120  
Tempature []  
Tempature []  
Tempature []  
Latch mask time  
Oscillation frequency1  
Oscillation frequency 2  
Hopping fluctuation frequency  
Starting frequency reduction mode  
Maximum DUTY  
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Characteristic data (These are reference data. They can’t guarantee their value.)  
FB pin pull-up resistance  
FB burst voltage1  
FB burst voltage 2  
FBOLP voltage 1a  
FBOLP voltaege1b  
FBOLP ON detection timer  
0.64  
0.62  
0.60  
0.58  
0.56  
0.54  
0.52  
0.50  
0.48  
0.46  
0.44  
0.64  
0.62  
0.60  
0.58  
0.56  
0.54  
0.52  
0.50  
0.48  
0.46  
0.44  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20  
40  
60  
80 100 120  
Tempature []  
Tempature []  
FBOLP OFF detection timer  
Over current limiter 1a  
Over current limiter 1b  
13  
12  
11  
10  
9
8
7
6
-40 -20  
0
20  
40  
60  
80 100 120  
Tempature []  
LATCH detection voltage  
LATCH pull-up current  
LATCH pull-down current  
Start current  
Discharge ON voltage  
Discharge ON delay time  
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TSZ02201-0F1F0A200100-1-2  
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Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
terminals.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the GND and supply lines of the digital  
and analog blocks to prevent noise in the GND and supply lines of the digital block from affecting the analog block.  
Furthermore, connect a capacitor to GND at all power supply pins. Consider the effect of temperature and aging on the  
capacitance value when using electrolytic capacitors.  
3. GND Voltage  
Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition.  
4. GND Wiring Pattern  
When using both small-signal and large-current GND traces, the two GND traces should be routed separately but  
connected to a single GND at the reference point of the application board to avoid fluctuations in the small-signal GND  
caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND  
voltage. The GND lines must be as short and thick as possible to reduce line impedance.  
5. Thermal Consideration  
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,  
increase the board size and copper area to prevent exceeding the Pd rating.  
6. Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
7. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of  
connections.  
8. Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
9. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned OFF completely before connecting or removing it from the test setup during the inspection process.  
To prevent damage from static discharge, GND the IC during assembly and use similar precautions during transport  
and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
11. Unused Input Terminals  
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance  
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to  
the power supply or GND line.  
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Operational Notes – continued  
12. Regarding Input Pins of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Figure 17. Example of Monolithic IC Structure  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
15. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be  
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The IC should be powered  
down and turned ON again to resume normal operation because the TSD circuit keeps the outputs at the OFF state  
even if the Tj falls below the TSD threshold. Note that the TSD circuit operates in a situation that exceeds the absolute  
maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any  
purpose other than protecting the IC from heat damage.  
16. Over-Current Protection Circuit (OCP)  
This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is  
strongly advised not to subject the IC to prolonged shorting of the output.  
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Ordering Information  
X
B M 2 P X X  
-
Package  
Blank: DIP8  
Product  
name  
Packaging and forming specification  
Blank: Tube  
Physical Dimension Tape and Reel Information  
<Tape and Reel information>  
Container  
Quantity  
Tube  
2000pcs  
Direction of feed Direction of products is fixed in a container tube  
Order quantity needs to be multiple of the minimum quantity.  
Marking Diagram  
Line - UP  
Product name  
BM2P01A  
BM2P11A  
BM2P21A  
BM2P31A  
BM2P01B  
BM2P11B  
BM2P21B  
BM2P31B  
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Revision History  
Date  
Revision  
001  
Changes  
16.Nov.2015  
New Release  
P1 a value of basic specifications  
P3 a value of operating conditions  
P8 a value of Figure5  
22.Mar.2017  
002  
P11 a value of external latch function  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Datasheet  
BM2P01A - Web Page  
Part Number  
Package  
BM2P01A  
DIP8  
Unit Quantity  
2000  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
2000  
Tube  
inquiry  
Yes  
配单直通车
BM2P01A产品参数
型号:BM2P01A
是否Rohs认证: 符合
生命周期:Active
包装说明:,
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.74
模拟集成电路 - 其他类型:SWITCHING REGULATOR
峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIED
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