BA2902YFV-MGE2全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

Operational Amplifier Series

AutomotiveGround Sense

Operational Amplifiers

BA2904Yxxx-M, BA2902Yxx-M

●General Description

●Key Specifications

Automotive series BA2904Yxxx-M/BA2902Yxx-M

integrate two or four independent Op-Amps and

ground sense input Amplifier on a single chip and

have some features of high-gain, low power

consumption, and operating voltage range of 3V to

32V (single power supply ). BA2904Yxxx-M,

BA2902Yxx-M are manufactured for automotive

requirements of car navigation system, car audio, and

so on.

 Wide operating supply voltage

single supply :

+3.0V to +32V

±1.5V to ±16V

dual supply :

 low supply current

BA2904Yxxx-M BA2902Yxx-M

0.7mA(Typ.)

 input bias current :

 input offset current :

20nA(Typ.)

2nA(Typ.)

 Operating temperature range :

-40℃ to +125℃

●Features

 Operable with a single power supply

 Wide operating supply voltage

 Standard Op-Amp Pin-assignments

 Input and output are operable GND sense

 Low supply current

 High open loop voltage gain

 Internal ESD protection circuit

 Wide temperature range

●Packages

SOP8

W(Typ.) x D(Typ.) x H(Max.)

5.00mm x 6.20mm x 1.71mm

8.70mm x 6.20mm x 1.71mm

3.00mm x 6.40mm x 1.35mm

5.00mm x 6.40mm x 1.35mm

2.90mm x 4.00mm x 0.90mm

SOP14

SSOP-B8

SSOP-B14

MSOP8

●Selection Guide

Maximum operating temperature

+125°C

Output current

Source/Sink

supply current

BA2904YF-M

BA2904YFV-M

BA2904YFVM-M

Dual

30mA / 20mA

0.7mA

Automotive(-Ｍ)

BA2902YF-M

BA2902YFV-M

Quad

0.7mA

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･14･001

1/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Block Diagram

VCC

IN

－

＋

VOUT

VEE

Fig.1 Simplified schematic (one channel only)

●Pin Configuration

OUT1

1

2

3

14 OUT4

OUT1

-IN1

+IN1

VCC

+IN2

-IN2

OUT2

VCC

OUT2

-IN2

+IN2

1

2

3

4

8

7

6

5

13

12

-IN4

+IN4

VEE

CH1

+

CH4

+ -

-

CH1

- +

-IN1

+IN1

VEE

4

5

11

10

+IN3

-IN3

OUT3

CH2

+ -

CH3

- +

CH2

6

7

9

8

SSOP-B14

SOP14

SOP8

SSOP-B8

MSOP8

Package

MSOP8

SOP8

SSOP-B8

BA2904YFV-M

SOP14

SSOP-B14

BA2902YFV-M

BA2904YF-M

BA2904YFVM-M

BA2902YF-M

●Ordering Information

B A 2 9 0 x Y x x x

-

M x x

Parts Number.

BA2904Yxxx

BA2902Yxx

Package

: SOP8

SOP14

FV : SSOP-B8

SSOP-B14

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/SOP14/SSOP-B8/SSOP-B14)

TR: Embossed tape and reel

(MSOP8)

F

M: Automotive

FVM: MSOP8

●Line-up

2channel

/4channel

Ordarable Parts

Topr

Supply voltage

+3 to +32V

Package

Number

SOP8

Reel of 2500

Reel of 3000

Reel of 2500

BA2904YF-ME2

BA2904YFV-ME2

BA2904YFVM-MTR

BA2902YF-ME2

BA2902YFV-ME2

Dual

SSOP-B8

MSOP8

-40°C to +125°C

SOP14

Quad

SSOP-B14

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

2/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Absolute Maximum Ratings(Ta=25℃)

Parameter

Symbol

Ratings

Unit

V

Supply Voltage

VCC-VEE

+36

780^*1*6

Power Dissipation

SOP8

SSOP-B8

MSOP8

690^*2*6

590^*3*6

610^*4*6

Pd

mW

SOP14

SSOP-B14

870^*5*6

Differential Input Voltage ^*7

Vid

+36

V

Input Common-mode Voltage Range

Vicm

Vopr

(VEE-0.3) to (VEE+36)

+3.0 to +32

(±1.5 to ±16)

Operating Supply Voltage

V

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Topr

Tstg

-40 to +125

-55 to +150

+150

℃

Tjmax

Note: Absolute maximum rating item indicates the condition which must not be exceeded.

Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature

environment may cause deterioration of characteristics.

*1

*2

*3

*4

*5

*6

*7

To use at temperature above Ta＝25℃ reduce 6.2mW/℃.

To use at temperature above Ta＝25℃ reduce 5.5mW/℃.

To use at temperature above Ta＝25℃ reduce 4.8mW/℃.

To use at temperature above Ta＝25℃ reduce 7.0mW/℃.

To use at temperature above Ta＝25℃ reduce 4.9mW/℃.

Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).

The voltage difference between inverting input and non-inverting input is the differential input voltage.

Then input terminal voltage is set to more than VEE.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

3/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Electrical Characteristics

○BA2904Yxxx-M (Unless otherwise specified VCC=+5V, VEE=0V)

Limits

Typ.

2

Temperature

Range

Parameter

Symbol

Unit

mV

Conditions

VOUT=1.4V

VCC=5 to 30V, VOUT=1.4V

Min.

-

Max.

7

25℃

Input Offset Voltage^*8

Input Offset Voltage drift

Input Offset Current^*8

Input Offset Current drift

Input Bias Current^*8

Vio

△Vio/△T

Iio

Full range

-

±7

2

10

-

μV/℃ VOUT=1.4V

nA VOUT=1.4V

pA/℃ VOUT=1.4V

nA VOUT=1.4V

25℃

-

50

200

-

Full range

-

ΔIio/ΔT

Ib

-

±10

20

-

25℃

250

1.2

2

Full range

25℃

-

0.7

-

Supply Current

ICC

mA RL=∞, All Op-Amps

Full range

25℃

-

3.5

27

-

RL=2kΩ

-

High Level Output Voltage

VOH

V

Full range

28

5

VCC=30V, RL=10kΩ

-

Low Level Output Voltage

Large Signal Voltage Gain

VOL

AV

20

mV RL=∞, All Op-Amps

RL≧2kΩ, VCC=15V

VOUT=1.4 to 11.4V

(VCC-VEE)=5V

VOUT=VEE+1.4V

25℃

25

0

100

-

V/mV

-

Input Common-mode

Voltage range

Vicm

VCC-1.5

V

Common-mode Rejection Ratio CMRR

25℃

50

65

20

10

2

80

100

30

-

dB VOUT=1.4V

-

Power Supply Rejection Ratio

Output Source Current^*9

PSRR

dB VCC=5 to 30V

25℃

VIN+=1V, VIN-=0V

mA

IOH

VOUT=0V, 1CH is short circuit

Full range

25℃

20

-

VIN+=0V,VIN-=1V

VOUT=5V, 1CH is short circuit

IOL

mA

Output Sink Current^*9

Full range

VIN+=0V, VIN-=1V

VOUT=200mV

Isink

CS

25℃

12

-

40

120

0.2

μA

-

Channel Separation

Slew Rate

dB f=1kHz, input referred

VCC=15V, AV=0dB

V/μs

SR

-

RL=2kΩ, CL=100pF

VCC=30V, RL=2kΩ

CL=100pF

VCC=15V, VEE=-15V

RS=100Ω, Vi=0V, f=1kHz

Gain bandwidth product

GBW

Vn

0.5

40

MHz

25℃

-

Input Referred Noise Voltage

nV/ Hz

*8 Absolute value

*9 Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

TSZ22111･15･001

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

4/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Electrical Characteristics

○BA2902Yxx-M (Unless otherwise specified VCC=+5V, VEE=0V)

Limits

Typ.

2

Temperature

Range

25℃

Parameter

Symbol

Unit

mV

Conditions

VOUT=1.4V

VCC=5 to 30V, VOUT=1.4V

Min.

-

Max.

7

Input Offset Voltage^*10

Input Offset Voltage drift

Input Offset Current^*10

Input Offset Current drift

Input Bias Current^*10

Vio

△Vio/△T

Iio

Full range

-

±7

2

10

-

μV/℃ VOUT=1.4V

nA VOUT=1.4V

pA/℃ VOUT=1.4V

nA VOUT=1.4V

25℃

-

50

200

-

Full range

-

ΔIio/ΔT

Ib

-

±10

20

-

25℃

250

2

Full range

25℃

-

0.7

-

Supply Current

ICC

mA RL=∞, All Op-Amps

Full range

25℃

-

3

3.5

27

-

RL=2kΩ

-

High Level Output Voltage

VOH

V

Full range

28

5

VCC=30V, RL=10kΩ

-

Low Level Output Voltage

Large Signal Voltage Gain

VOL

AV

20

mV RL=∞, All Op-Amps

RL≧2kΩ, VCC=15V

VOUT=1.4 to 11.4V

(VCC-VEE)=5V

VOUT=VEE+1.4V

25℃

25

0

100

-

V/mV

-

Input Common-mode

Voltage range

Vicm

VCC-1.5

V

Common-mode Rejection Ratio CMRR

25℃

50

65

20

10

2

80

100

30

-

dB VOUT=1.4V

-

Power Supply Rejection Ratio

Output Source Current^*11

PSRR

dB VCC=5 to 30V

25℃

VIN+=1V, VIN-=0V

mA

IOH

VOUT=0V, 1CH is short circuit

Full range

25℃

20

-

VIN+=0V,VIN-=1V

VOUT=5V, 1CH is short circuit

IOL

mA

Output Sink Current^*11

Full range

VIN+=0V, VIN-=1V

VOUT=200mV

Isink

CS

25℃

12

-

40

120

0.2

μA

-

Channel Separation

Slew Rate

dB f=1kHz, input referred

VCC=15V, AV=0dB

V/μs

SR

-

RL=2kΩ, CL=100pF

VCC=30V, RL=2kΩ

CL=100pF

VCC=15V, VEE=-15V

RS=100Ω, Vi=0V, f=1kHz

Gain bandwidth product

GBW

Vn

0.5

40

MHz

25℃

-

Input Referred Noise Voltage

nV/ Hz

*10 Absolute value

*11 Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

TSZ22111･15･001

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

5/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms

Please note that item names, symbols and their meanings may differ from those on another manufacturer’s documents.

1. Absolute maximum ratings

The absolute maximum ratings are values that should never be exceeded, since doing so may result in deterioration of

electrical characteristics or damage to the part itself as well as peripheral components.

1.1 Power supply voltage (VCC-VEE)

Expresses the maximum voltage that can be supplied between the positive and negative supply terminals without

causing deterioration of the electrical characteristics or destruction of the internal circuitry.

1.2 Differential input voltage (Vid)

Indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without

damaging the IC.

1.3 Input common-mode voltage range (Vicm)

Signifies the maximum voltage that can be supplied to non-inverting and inverting terminals without causing

deterioration of the characteristics or damage to the IC itself. Normal operation is not guaranteed within the

common-mode voltage range of the maximum ratings - use within the input common-mode voltage range of the

electric characteristics instead.

1.4 Operating and storage temperature ranges (Topr,Tstg)

The operating temperature range indicates the temperature range within which the IC can operate. The higher the

ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range

of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.

1.5 Power dissipation (Pd)

Indicates the power that can be consumed by a particular mounted board at ambient temperature (25℃). For

packaged products, Pd is determined by the maximum junction temperature and the thermal resistance.

2. Electrical characteristics

2.1 Input offset voltage (Vio)

Indicates the voltage difference between the non-inverting and inverting terminals. It can be thought of as the input

voltage difference required for setting the output voltage to 0 V.

2.2 Input offset voltage drift (△Vio/△T)

Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.

2.3 Input offset current (Iio)

Indicates the difference of input bias current between the non-inverting and inverting terminals.

2.4 Input offset current drift (△Iio/△T)

Signifies the ratio of the input offset current fluctuation to the ambient temperature fluctuation.

2.5 Input bias current (Ib)

Indicates the current that flows into or out of the input terminal, it is defined by the average of the input bias current

at the non-inverting terminal and the input bias current at the inverting terminal.

2.6 Circuit current (ICC)

Indicates the current of the IC itself that flows under specified conditions and during no-load steady state.

2.7 High level output voltage/low level output voltage (VOH/VOL)

Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into

high-level output voltage and low-level output voltage. High-level output voltage indicates the upper limit of output

voltage. Low-level output voltage indicates the lower limit.

2.8 Large signal voltage gain (AV)

Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal

and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.

Av = (Output voltage fluctuation) / (Input offset fluctuation)

2.9 Input common-mode voltage range (Vicm)

Indicates the input voltage range under which the IC operates normally.

TSZ02201-0RAR1G200510-1-2

TSZ22111･15･001

6/26

26.SEP.2012 Rev.002

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

2.10 Common-mode rejection ratio (CMRR)

Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the

fluctuation of DC.

CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)

2.11 Power supply rejection ratio (PSRR)

Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of

DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation)

2.12 Output source current/ output sink current (IOH/IOL)

The maximum current that can be output under specific output conditions, it is divided into output source current and

output sink current. The output source current indicates the current flowing out of the IC, and the output sink current

the current flowing into the IC.

2.13 Channel separation (CS)

Indicates the fluctuation of output voltage with reference to the change of output voltage of driven channel.

2.14 Slew rate (SR)

SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage

as unit time.

2.15 Gain Band Width (GBW)

Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave.

2.16 Input referred noise voltage (Vn)

Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in

series with input terminal.

TSZ02201-0RAR1G200510-1-2

TSZ22111･15･001

7/26

26.SEP.2012 Rev.002

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Typical Performance Curves

○BA2904Yxxx-M

1. 0

0. 8

0. 6

0. 4

0. 2

0. 0

1000

800

BA2904YF-M

BA2904YFV-M

600

25℃

BA2904YFVM-M

－40℃

400

200

0

125℃

0

10

20

30

40

0

25

50

75

100

125

150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.2

Fig.3

Derating Curve

Supply Current – Supply Voltage

40

30

20

10

0

1.0

0.8

0.6

0.4

0.2

0.0

32V

-40℃

125℃

25℃

5V

3V

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

SUPPLY VOLTAGE [V]

Fig.4

Fig.5

Supply Current – Ambient Temperature

Maximum Output Voltage – Supply Voltage

(RL=10kΩ)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

8/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2904Yxxx-M

5

4

3

2

1

0

50

40

30

20

10

0

-40℃

25℃

125℃

-50 -25

0

25 50 75 100 125 150

0

1

2

3

4

5

AMBIENT TEMPERATURE [℃]

OUTPUT VOLTAGE [V]

Fig.6

Fig.7

Maximum Output Voltage – Ambient Temperature

(VCC=5V, RL=2kΩ)

Output Source Current – Output Voltage

(VCC=5V)

50

40

30

20

10

0

100

10

3V

125℃

5V

1

-40℃

25℃

15V

0.1

0.01

0. 001

0

0.4

0.8

1.2

1.6

2

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

OUTPUT VOLTAGE [V]

Fig.9

Output Sink Current – Output Voltage

(VCC=5V)

Fig.8

Output Source Current – Ambient Temperature

(VOUT=0V)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

9/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2904Yxxx-M

80

70

60

50

40

30

20

10

0

30

15V

-40℃

25℃

20

5V

3V

125℃

10

0

-50 -25

0

25 50 75 100 125 150

0

5

10

15

20

25

30

35

AMBIENT TEMPERATURE [℃]

SUPPLY VOLTAGE [V]

Fig.11

Fig.10

Low Level Sink Current – Supply Voltage

(VOUT=0.2V)

Output Sink Current – Ambient Temperature

(VOUT=VCC)

8

6

80

70

60

50

40

30

20

10

0

32V

4

-40℃

25℃

5V

2

0

3V

125℃

-2

-4

-6

-8

0

5

10

15

20

25

30

35

-50 -25

0

25 50 75 100 125 150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.12

Low Level Sink Current – Ambient Temperature

(VOUT=0.2V)

Fig.13

Input Offset Voltage – Supply Voltage

(Vicm=0V, VOUT=1.4V)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

10/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2904Yxxx-M

8

6

4

50

40

30

20

10

0

2

3V

25℃

-40℃

0

5V

32V

-2

-4

-6

-8

125℃

0

5

10

15

20

25

30

35

-50 -25

0

25 50 75 100 125 150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.15

Fig.14

Input Bias Current – Supply Voltage

(Vicm=0V, VOUT=1.4V)

Input Offset Voltage – Ambient Temperature

(Vicm=0V, VOUT=1.4V)

50

40

30

20

10

0

50

40

30

20

10

0

32V

3V

5V

-10

-50 -25

0

25 50 75 100 125 150

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

Fig.17

Fig.16

Input Bias Current – Ambient Temperature

(VCC=30V, Vicm=28V, VOUT=1.4V)

Input Bias Current – Ambient Temperature

(Vicm=0V, VOUT=1.4V)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

11/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2904Yxxx-M

10

5

8

6

-40℃

4

125℃

25℃

-40℃

25℃

2

0

125℃

-2

-4

-6

-8

-5

-10

-1

0

1

2

3

4

5

0

5

10

15

20

25

30

35

INPUT VOLTAGE [V]

SUPPLY VOLTAGE [V]

Fig.19

Fig.18

Input Offset Current – Supply Voltage

(Vicm=0V, VOUT=1.4V)

Input Offset Voltage – Input Voltage

(VCC=5V)

10

5

140

130

120

110

100

90

-40℃

25℃

3V

0

5V

32V

125℃

80

-5

-10

70

60

4

6

8

10

12

14

16

-50 -25

0

25 50 75 100 125 150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.21

Fig.20

Large Signal Voltage Gain – Supply Voltage

Input Offset Current – Ambient Temperature

(Vicm=0V, VOUT=1.4V)

(RL=2kΩ)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

12/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2904Yxxx-M

140

120

100

80

140

130

15V

120

-40℃

25℃

110

5V

100

125℃

90

80

70

60

40

-50 -25

0

25 50 75 100 125 150

0

10

20

30

40

AMBIENT TEMPERATURE [℃]

SUPPLY VOLTAGE [V]

Fig.22

Large Signal Voltage Gain – Ambient Temperature

(RL=2kΩ)

Fig.23

Common Mode Rejection Ratio

– Supply Voltage

140

120

100

80

140

130

120

110

100

90

32V

5V

3V

80

60

70

40

60

-50 -25

0

25 50 75 100 125 150

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

Fig.24

Fig.25

Common Mode Rejection Ratio

– Ambient Temperature

Power Supply Rejection Ratio

– Ambient Temperature

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

13/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2902Yxxx-M

1000

2. 0

1. 6

1. 2

0. 8

0. 4

0. 0

800

BA2902YF-M

BA2902YFV-M

600

400

200

0

25℃

－40℃

125℃

0

25

50

75

100

125

150

0

10

20

30

40

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.26

Fig.27

Derating Curve

Supply Current – Supply Voltage

40

2.0

1.6

1.2

0.8

0.4

0.0

30

20

10

0

-40℃

32V

125℃

25℃

5V

3V

0

10

20

30

40

-50

0

50

100

150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.28

Fig.29

Supply Current – Ambient Temperature

Maximum Output Voltage – Supply Voltage

(RL=10kΩ)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

14/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2902Yxxx-M

5

4

3

2

1

0

50

40

30

20

10

0

-40℃

25℃

125℃

-50 -25

0

25 50 75 100 125 150

0

1

2

3

4

5

AMBIENT TEMPERATURE [℃]

OUTPUT VOLTAGE [V]

Fig.30

Fig.31

Maximum Output Voltage – Ambient Temperature

(VCC=5V, RL=2kΩ)

Output Source Current – Output Voltage

(VCC=5V)

50

40

30

20

10

0

100

10

3V

125℃

5V

1

-40℃

25℃

15V

0.1

0.01

0. 001

0

0.4

0.8

1.2

1.6

2

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

OUTPUT VOLTAGE [V]

Fig.33

Output Sink Current – Output Voltage

(VCC=5V)

Fig.32

Output Source Current – Ambient Temperature

(VOUT=0V)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

15/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2902Yxxx-M

80

70

60

50

40

30

20

10

0

30

15V

-40℃

25℃

20

5V

3V

125℃

10

0

-50 -25

0

25 50 75 100 125 150

0

5

10

15

20

25

30

35

AMBIENT TEMPERATURE [℃]

SUPPLY VOLTAGE [V]

Fig.35

Fig.34

Low Level Sink Current – Supply Voltage

(VOUT=0.2V)

Output Sink Current – Ambient Temperature

(VOUT=VCC)

8

6

80

70

60

50

40

30

20

10

0

32V

4

-40℃

25℃

5V

2

0

3V

125℃

-2

-4

-6

-8

0

5

10

15

20

25

30

35

-50 -25

0

25 50 75 100 125 150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.36

Low Level Sink Current – Ambient Temperature

(VOUT=0.2V)

Fig.37

Input Offset Voltage – Supply Voltage

(Vicm=0V, VOUT=1.4V)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

16/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2902Yxxx-M

8

6

4

50

40

30

20

10

0

2

3V

25℃

-40℃

0

5V

32V

-2

-4

-6

-8

125℃

0

5

10

15

20

25

30

35

-50 -25

0

25 50 75 100 125 150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.39

Fig.38

Input Bias Current – Supply Voltage

(Vicm=0V, VOUT=1.4V)

Input Offset Voltage – Ambient Temperature

(Vicm=0V, VOUT=1.4V)

50

40

30

20

10

0

50

40

30

20

10

0

32V

3V

5V

-10

-50 -25

0

25 50 75 100 125 150

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

Fig.41

Fig.40

Input Bias Current – Ambient Temperature

(VCC=30V, Vicm=28V, VOUT=1.4V)

Input Bias Current – Ambient Temperature

(Vicm=0V, VOUT=1.4V)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

17/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2902Yxxx-M

10

5

8

6

-40℃

4

125℃

25℃

-40℃

25℃

2

0

125℃

-2

-4

-6

-8

-5

-10

-1

0

1

2

3

4

5

0

5

10

15

20

25

30

35

INPUT VOLTAGE [V]

SUPPLY VOLTAGE [V]

Fig.43

Fig.42

Input Offset Current – Supply Voltage

(Vicm=0V, VOUT=1.4V)

Input Offset Voltage – Input Voltage

(VCC=5V)

10

5

140

130

120

110

100

90

-40℃

25℃

3V

0

5V

32V

125℃

80

-5

-10

70

60

4

6

8

10

12

14

16

-50 -25

0

25 50 75 100 125 150

SUPPLY VOLTAGE [V]

AMBIENT TEMPERATURE [℃]

Fig.45

Fig.44

Large Signal Voltage Gain – Supply Voltage

Input Offset Current – Ambient Temperature

(Vicm=0V, VOUT=1.4V)

(RL=2kΩ)

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

18/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

○BA2902Yxxx-M

140

120

100

80

140

130

15V

120

-40℃

25℃

110

5V

100

125℃

90

80

70

60

40

-50 -25

0

25 50 75 100 125 150

0

10

20

30

40

AMBIENT TEMPERATURE [℃]

SUPPLY VOLTAGE [V]

Fig.46

Large Signal Voltage Gain – Ambient Temperature

(RL=2kΩ)

Fig.47

Common Mode Rejection Ratio

– Supply Voltage

140

120

100

80

140

130

120

110

100

90

32V

5V

3V

80

60

70

40

60

-50 -25

0

25 50 75 100 125 150

-50 -25

0

25 50 75 100 125 150

AMBIENT TEMPERATURE [℃]

Fig.48

Fig.49

Common Mode Rejection Ratio

– Ambient Temperature

Power Supply Rejection Ratio

– Ambient Temperature

(*)The above data is measurement value of typical sample, it is not guaranteed.

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

19/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Power Dissipation

Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25℃(normal temperature). IC is heated

when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that

can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.

Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal

resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum

value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead

frame of the package. The parameter which indicatesthis heat dissipation capability(hardness of heat release)is called

thermal resistance, represented by the symbol θja℃/W.The temperature of IC inside the package can be estimated by this

thermal resistance. Fig.50(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient

temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below:

θja = (Tjmax -Ta) / Pd

℃/W

・・・・・ (Ⅰ)

Derating curve in Fig.50(b) indicates power that can be consumed by IC with reference to ambient temperature.Power that

can be consumed by IC begins to attenuate at certain ambient temperature. This gradient iis determined by thermal

resistance θja. Thermal resistance θja depends on chip size, power consumption, package,ambient temperature, package

condition, wind velocity, etc even when the same of package is used.

Thermal reduction curve indicates a reference value measured at a specified condition. Fig.50(c) show a derating curve for

an example of BA2904Yxxx-M and BA2902xxY-M.

LSI

[W]

n of LSI

の消費電力

Power dissipa

tio

Pd (max)

Ta) / Pd

[

/W]

℃

P2

θja = ( Tjmax

θja2 < θja1

θ' ja2

-

Ta [

]

℃

Ambient temperature

P1

θ ja2

Tj ' (max) Tj (max)

θ' ja1

θ ja1

Tj [

Chip surface temperature

℃

]

0

25

50

75

ture

100

Ta [

125

150

]

℃

Ambient tempe

周

ra

囲

温

度

Power dissipation Pd[W]

(b) Derating curve

(a) Thermal resistance

Fig. 50 Thermal resistance and derating

1000

BA2902YFV-M(15)

BA2904YF-M(12)

800

600

400

200

0

800

600

400

200

0

BA2904YFV-M(13)

BA2904YFVM-M(14)

BA2902YF-M(16)

0

25

50

75

100

125

150

0

25

50

75

100

125

150

AMBIENT TEMPERATURE [

]

℃

AMBIENT TEMPERATURE [

]

℃

(d) BA2902Yxx-M

(c) BA2904Yxxx-M

(12)

6.2

(13)

5.5

(14)

4.8

(15)

7.0

(16)

4.9

単位

mW/℃

When using the unit above Ta=25℃, subtract the value above per Celsius degree .

Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%) is mounted.

Fig. 51 Derating curve

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

20/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Application Information

Test Circuit1 NULL method

VCC, VEE, EK, Vicm Unit V

Parameter

VF

S1

S2

S3

Vcc

VEE

EK

Vicm calculation

Input Offset Voltage

Input Offset Current

Input Bias Current

VF1

VF2

ON

OFF 5 to 30

0

-1.4

0

1

2

3

4

5

6

OFF OFF

OFF

ON

5

VF3

VF4

VF5

VF6

VF7

VF8

VF9

VF10

OFF

ON

OFF

15

5

0

-1.4

-11.4

-1.4

0

Large Signal Voltage Gain

ON

0

Common-mode Rejection Ratio

(Input common-mode Voltage Range)

OFF

5

3.5

0

5

Power Supply Rejection Ratio

30

0

- Calculation -

1. Input Offset Voltage (Vio)

| VF1 |

[V]

Vio =

1 + Rf / Rs

0.1μF

2. Input Offset Current (Iio)

| VF2 VF1 |

－

Rf=50kΩ

[A]

Iio =

Ri ×(1 + Rf / Rs)

0.1μF

500kΩ

3. Input Bias Current (Ib)

VCC

EK

SW1

| VF4 VF3 |

－

+15V

[A]

Ib =

Rs=50Ω

2×Ri× (1 + Rf / Rs)

500kΩ

1000pF

Ri=10kΩ

4. Large Signal Voltage Gain (Av)

DUT

VEE

NULL

EK×(1+Rf /Rs)

Δ

SW3

Av = 20×Log

[dB]

V

VF

Vicm

|VF5-VF6|

RL

SW2

50kΩ

5. Common-mode Rejection Ration (CMRR)

-15V

Vicm×(1+Rf/Rs)

|VF8-VF7|

Δ

CMRR = 20×Log

[dB]

6. Power supply rejection ratio (PSRR)

Fig. 52 Test circuit1 (one channel only)

Vcc×(1+Rf /Rs)

|VF10-VF9|

Δ

PSRR = 20×Log

[dB]

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

21/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

Test Circuit 2 Switch Condition

SW SW SW SW SW SW SW SW SW SW SW SW SW SW

10 11 12 13 14

SW No.

1

2

3

4

5

6

7

8

9

Supply Current

OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF OFF

OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF

OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF OFF ON

OFF OFF OFF ON OFF OFF OFF ON ON ON ON OFF OFF OFF

OFF ON OFF OFF ON ON OFF OFF ON ON ON OFF OFF OFF

ON OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF OFF

High Level Output Voltage

Low Level Output Voltage

Output Source Current

Output Sink Current

Slew Rate

Gain Bandwidth Product

Equivalent Input Noise Voltage

Input voltage

VH

VL

t

Input wave

Output voltage

SR＝ΔV/Δt

90%

VH

ΔV

C

10%

VL

t

Δ

t

Output wave

Fig. 54 Slew Rate Input Waveform

Fig. 53 Test Circuit 2 (each Op-Amp)

Measurement Circuit 3 Amplifier To Amplifier Coupling

VCC

OTHER

CH

R1//R2

VEE

R1

VIN

R2

R1

R2

VOUT1

=0.5[Vrms]

V

VOUT2

40dB amplifier

100 VOUT1

×

CS 20 log

＝

×

VOUT2

(R1=1kΩ, R=100kΩ)

Fig. 55 Test Circuit 3

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

22/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

VCC

●Operational Notes

1) Unused circuits

When there are unused circuits, it is recommended that they are

connected as in Fig.56, setting the non-inverting input terminal to a

potential within the in-phase input voltage range (Vicm).

+

-

Connect

to Vicm

Vicm

2) Input voltage

VEE

Applying VEE+36V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, irrespective of

the supply voltage. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input voltage

is within the common mode input voltage range of the electric

characteristics.

Fig. 56 The example of

application circuit for unused op-amp

3) Power supply (single / dual)

The op-amp operates when the voltage supplied is between VCC and VEE. Therefore, the single supply op-amp can be

used as a dual supply op-amp as well.

4) Power dissipation (Pd)

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise

in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation

(Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating

curves for more information.

5) Short-circuit between pins and erroneous mounting

Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output

and the power supply, or the output and GND may result in IC destruction.

6) Operation in a strong electromagnetic field

Operation in a strong electromagnetic field may cause malfunctions.

7) Radiation

This IC is not designed to withstand radiation.

8) IC handling

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical

characteristics due to piezo resistance effects.

9) IC operation

The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected

to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and

charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias

current for Class A operation will suppress crossover distortion.

10) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the

power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly

process as well as during transportation and storage.

11) Output capacitor

Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE,

causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation

due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance

less than 0.1μF.

12) Oscillation by output capacitor

Please pay attention to oscillation by output capacitor, designing application of negative feed back loop circuit with these

ICs.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

TSZ02201-0RAR1G200510-1-2

TSZ22111･15･001

23/26

26.SEP.2012 Rev.002

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Physical Dimensions Tape and Reel Information

SOP8

5.0 0.2

(MAX 5.35 include BURR)

Tape

Embossed carrier tape

2500pcs

+

−

6

°

4°

4

°

Quantity

8

7

6

5

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2

3

4

0.595

+0.1

0.17

-

0.05

S

0.1

S

1.27

Direction of feed

1pin

0.42 0.1

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

SOP14

8.7 0.2

(MAX 9.05 include BURR)

Tape

Embossed carrier tape

Quantity

2500pcs

14

8

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

7

0.15 0.1

1.27

0.4 0.1

0.1

Direction of feed

1pin

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

SSOP-B8

3.0 0.2

(MAX 3.35 include BURR)

Tape

Embossed carrier tape

Quantity

2500pcs

8

7 6

5

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2 3

4

0.15 0.1

S

0.1

0.22 0.10

M

0.08

Direction of feed

1pin

(0.52)

0.65

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

24/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

SSOP-B14

5.0 0.2

Tape

Embossed carrier tape

2500pcs

14

8

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

7

0.15 0.1

0.1

0.65

Direction of feed

1pin

0.22 0.1

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

MSOP8

2.9 0.1

(MAX 3.25 include BURR)

Tape

Embossed carrier tape

+

6°

4°

Quantity

3000pcs

−4°

8

7

6

5

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2

3

4

1PIN MARK

+0.05

1pin

+0.05

−0.03

0.145

0.475

S

0.22

−0.04

0.08

S

Direction of feed

0.65

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

25/26

Datasheet

BA2904Yxxx-M, BA2902Yxx-M

●Marking Diagram

SOP8(TOP VIEW)

SOP14(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

SSOP-B8(TOP VIEW)

SSOP-B14(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

MSOP8(TOP VIEW)

Product Name

F-M

Package Type

Marking

Part Number Marking

SOP8

04YM

LOT Number

BA2904Y

FV-M

SSOP-B8

FVM-M MSOP8

04YM

F-M

SOP14

BA2902YFM

02YM

BA2902Y

FV-M

SSOP-B14

1PIN MARK

TSZ02201-0RAR1G200510-1-2

26.SEP.2012 Rev.002

TSZ22111･15･001

26/26

Daattaasshheeeett

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - SS

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - SS

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

电子百科

产品导航

产品型号BA2902YFV-MGE2的Datasheet PDF文件预览

BA2902YFV-MGE2相关产品

BA2902YFV-MGE2相关文章

IC37:专业IC行业平台