BAT30SWFILM应用文章市场行情现货热卖使用介绍供应商报价-中国IC网-芯三七

当前位置：IC37首页_>B字母起始型号索引_>B字母起始型号索引第401页更新时间：2024-11-20 17:21:07

产品型号BAT30SWFILM的概述

芯片BAT30SWFILM的详细分析与应用一、概述 BAT30SWFILM是一款低功耗的半导体器件，以其小型化、高效率和良好的热管理特性，广泛应用于现代电子产品中。该芯片的设计主要用于高频、低功耗的开关电路，实现电子信号的快速转换，提高设备的工作效率。随着消费电子、通信、汽车电子等领域对高性能器件的需求不断增加，BAT30SWFILM作为一种理想的选择，正逐渐受到关注。 1.1 发展背景随着科技的飞速发展，电子设备逐渐向小型化、轻量化、高性能化方向发展。特别是移动设备的普及，要求芯片不仅要具备优秀的性能，还需要在尺寸和功耗上具有优势。BAT30SWFILM的推出，正是为了满足这一市场需求，其设计理念围绕着高效能和节能特性展开。二、详细参数 BAT30SWFILM的技术规格包括以下几个方面： - 电流容量：该芯片能承受高达 3A 的电流，适应多种应用场景。 - 最大反向电压：可...

产品型号BAT30SWFILM的Datasheet PDF文件预览

BAT30 Series

Small signal Schotky diodes

Main product characteristics

BAT30JFILM

(Single)

I_F

300 mA

30 V

V_RRM

SOD-323

C (typ)

T_j(max)

14 pF

150° C

BAT30KFILM

(Single)

Features and benefits

SOD-523

■ Very low conduction losses

■ Negligible switching losses

BAT30FILM

(Single)

■ Low forward and reverse recovery times

■ Extremely fast switching

BAT30AFILM

SOT-23

(Common anode)

■ Surface mount device

BAT30SFILM

(Series)

■ Low capacitance diode

Description

BAT30CFILM

The BAT30 series uses 30 V Schotky barrier

diodes encapsulated in a wide range of packages

such as SOD-323, SOD-523, SOT-23, SOT-323,

or SOT-666. This device is specially suited for

switching mode applications needing low forward

voltage drop diodes.

(Common cathode)

BAT30WFILM

(Single)

Order codes

BAT30CWFILM

(Common cathode)

SOT-323

Part Number

Marking

BAT30AWFILM

(Common anode)

BAT30FILM

BAT30SFILM

B30

S30

C30

A30

B30

S30

C30

A30

BAT30CFILM

BAT30AFILM

BAT30SWFILM

(Series)

BAT30WFILM

BAT30SWFILM

BAT30CWFILM

BAT30AWFILM

BAT30JFILM

BAT30-07P6FILM

(2 parallel diodes)

BAT30-09P6FILM

(2 opposite diodes)

SOT-666

BAT30KFILM

BAT30-07P6FILM

BAT30-09P6FILM

Configurations in top view

July 2006

Rev 1

1/12

www.st.com

Characteristics

BAT30 Series

Characteristics

Table 1.

Symbol

Absolute ratings (limiting values at T_j= 25° C, unless otherwise specified)

Parameter

Value

Unit

V_RRM

I_F

Repetitive peak reverse voltage

Continuous forward current

300

I_FSM

T_stg

T_j

Surge non repetitive forward current

t_p= 10 ms Sinusoidal

Storage temperature range

-65 to +150

150

° C

Maximum operating junction temperature⁽¹⁾

Maximum soldering temperature

T_L

260

1. Pulse test: t = 5 ms, δ < 2 %

Table 2.

Symbol

Thermal parameters

Parameter

Value

Unit

SOT-23

SOT-323, SOD-323,

SOD-523, SOT-666

500

550

600

R_th(j-a)

Junction to ambient⁽¹⁾

° C/W

1. On epoxy printed circuit board with recommended pad layout

Table 3.

Symbol

Static electrical characteristics

Parameter

Test conditions

Min.

Typ

Max.

Unit

V_R= 5 V

0.5

V_R= 10 V

V_R= 25 V

V_R= 30 V

T_j= 25° C

0.65

(1)

I_R

Reverse leakage current

µA

T_j= 70° C

T_j= 85° C

V_R= 10 V

I_F= 0.1 mA

I_F= 1 mA

240

300

375

430

500

580

I_F= 10 mA

I_F= 30 mA

I_F= 100 mA

I_F= 200 mA

I_F= 300 mA

(2)

V_F

Forward voltage drop

T_j= 25° C

530

1. Pulse test: t = 5 ms, δ < 2 %

2. Pulse test: t = 380 µs, δ < 2 %

2/12

BAT30 Series

Characteristics

Table 4.

Symbol

Dynamic characteristics

Parameter

Test conditions

V_R= 0 V, F = 1 MHz

Min. Typ Max. Unit

Diode capacitance

V_R= 1 V, F = 1 MHz

V_R= 10 V, F = 1 MHz

Figure 1.

Power dissipation versus average Figure 2.

forward current

Average forward current versus

ambient temperature (δ = 1)

I_F(AV)(A)

P (W)

0.175

0.150

0.125

0.100

0.075

0.050

0.025

0.000

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

δ=1

δ=0.2

δ=0.5

δ=0.1

δ=0.05

=tp/T

I_F(AV)(A)

0.20

T_amb(° C)

0.00

0.05

0.10

0.15

0.25

0.30

0.35

100

125

150

Figure 3.

Relative variation of thermal

Figure 4.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOT-23)

impedance junction to ambient

versus pulse duration

(SOT-323 / SOD-323)

Z_th(j-a)/R_th(j-a)

1.E+00

1.E-01

1.E-02

1.E-03

Single pulse

SOT-23

Single pulse

SOT-323/SOD-323

1.E-01

Alumine substrate

10 x 8 x 0.5 mm

Epoxy FR4

S_CU=2.25 mm²

e_CU=35 µm

t_P(s)

1.E-02

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

3/12

Characteristics

BAT30 Series

Figure 5.

Relative variation of thermal

Figure 6.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOT-666)

impedance junction to ambient

versus pulse duration (SOD-523)

Z_th(j-a)/R_th(j-a)

1.E+00

Single pulse

SOT-666

Single pulse

SOD-523

1.E-01

1.E-02

1.E-01

Epoxy FR4

e_CU=35 µm

Epoxy FR4

e_CU=35 µm

t_P(s)

1.E-02

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E-02

1.E-01

1.E+00

1.E+01

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOD-323)

Figure 8.

Leakage current versus reverse

applied voltage (typical values)

I_R(A)

R_th(j-a)(°C/W)

1.E-02

1.E-03

1.E-04

1.E-05

1.E-06

1.E-07

600

500

400

300

200

Epoxy FR4

e_CU=35 µm

T_j=150°C

T_j=125°C

T_j=85°C

T_j=25°C

S_CU(mm²)

V_R(V)

Figure 9.

Relative variation of reverse

Figure 10. Junction capacitance versus

leakage current versus junction

temperature (typical values)

reverse applied voltage (typical

values)

I_R[T_j] / I_R[T_j=25°C]

C(pF)

100

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

F=1 MHz

V_OSC=30 mV_RMS

T_j=25 °C

V_R=30 V

V_R(V)

T_j(°C)

100

-40

-20

100

120

140

160

4/12

BAT30 Series

Ordering information scheme

Figure 11. Forward voltage drop versus

forward current (typical values)

Figure 12. Forward voltage drop versus

forward current (typical values)

I_FM(A)

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

1.E-04

1.E+00

T_j=150 °C

1.E-01

T_j=125 °C

T_j=85 °C

1.E-02

T_j=25 °C

T_j=-40 °C

1.E-03

V_FM(V)

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3

V_FM(V)

1.E-04

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3

Ordering information scheme

BAT30 xx xx FILM

Signal Schotky diodes

V_RRM= 30 V

Configuration

Blank = Single diode

A = Common anode

C = Common cathode

S = Series diodes

07 = Parallel diodes

09 = Opposite diodes

Package

Blank = SOT-23

J = SOD-323

W = SOT-323

K = SOD-523

P6 = SOT-666

Packing

FILM = Tape and reel

5/12

Package information

BAT30 Series

Package information

Epoxy meets UL94, V0

Table 5.

SOD-323 dimensions

Dimensions

Millimeters Inches

Ref.

Min.

Max.

Min.

Max.

1.17

0.1

0.046

0.004

0.017

0.01

0.25

0.1

0.44

0.25

1.8

0.01

0.004

0.06

1.52

1.11

2.3

0.071

0.057

0.106

0.02

1.45

2.7

0.044

0.09

0.1

0.46

0.41

0.004

0.1

0.016

Figure 13. SOD-323 footprint (dimensions in mm)

3.20

0.30

1.06

1.08

1.06

6/12

BAT30 Series

Package information

Table 6.

SOD-523 dimensions

Dimensions

Millimeters

Typ. Max. Min.

Ref.

Inches

0.15

C A B

Min.

Typ. Max.

2xb

0.50

1.50

1.10

0.70

0.25

0.07

0.15

0.10

0.60

1.60

1.20

0.80

0.70 0.020 0.024 0.028

1.70 0.059 0.063 0.067

1.30 0.043 0.047 0.051

0.90 0.028 0.031 0.035

0.20

C A B

8°

R0.1

SEATING PLANE

7°

0.35 0.010

0.20 0.003

0.014

0.008

0.20

0.25 0.006 0.008 0.010

0.20 0.004 0.008

Figure 14. SOD-523 footprint (dimensions in mm)

0.7

0.3

7/12

Package information

Table 7.

BAT30 Series

SOT-23 dimensions

Dimensions

Millimeters

Min. Max.

Ref.

Inches

Min.

Max.

0.89

1.4

0.1

0.035

0.055

0.004

0.02

0.3

0.51

0.18

3.04

1.05

2.1

0.012

0.003

0.108

0.033

0.067

0.047

0.083

0.085

2.75

0.85

1.7

0.007

0.12

0.041

0.083

0.063

0.108

1.2

1.6

2.1

2.75

0.6 typ.

0.35

0.024 typ.

0.65

0.014

0.026

Figure 15. SOT-23 footprint (dimensions in mm)

0.95

0.61

1.26

0.73

3.25

8/12

BAT30 Series

Package information

Table 8.

SOT-323 dimensions

Dimensions

Ref.

Millimeters

Inches

Min.

Typ. Max. Min.

Typ. Max.

0.8

0.0

1.1

0.1

0.4

0.031

0.0

0.043

0.004

0.016

0.010

0.25

0.1

0.010

0.26 0.004

2.2

1.8

2.0

1.25

0.65

2.1

0.071 0.079 0.086

1.15

1.35 0.045 0.049 0.053

0.026

1.8

0.1

2.4

0.3

30°

0.071 0.083 0.094

0.004 0.008 0.012

0.2

30°

Figure 16. SOT-323 footprint (dimensions in mm)

0.95

1.0 2.9

0.8

0.50

9/12

Package information

Table 9.

BAT30 Series

SOT-666 dimensions

Dimensions

Millimeters

Min. Typ. Max. Min. Typ. Max.

Ref.

Inches

0.45

0.60 0.018

0.18 0.003

0.34 0.007

0.024

0.007

0.013

A3 0.08

0.17

b1 0.19 0.27 0.34 0.007 0.011 0.013

1.50

1.70 0.059

1.30 0.043

0.067

0.051

E1 1.10

0.50

0.19

0.020

0.007

L2 0.10

0.30 0.004

0.012

0.10

0.004

Figure 17. SOT-666 footprint (dimensions in mm)

0.50

0.62

2.60

0.99

0.30

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

10/12

BAT30 Series

Ordering information

Base qty Delivery mode

Ordering information

Part Number

Marking

Package

Weight

BAT30FILM

B30

S30

SOT-23 Single

SOT-23 Serial

10 mg

3000

Tape and reel

BAT30SFILM

SOT-23

Common cathode

BAT30CFILM

BAT30AFILM

C30

A30

10 mg

3000

Tape and reel

SOT-23

Common anode

BAT30WFILM

B30

S30

SOT-323 Single

SOT-323 Serial

6 mg

3000

Tape and reel

BAT30SWFILM

SOT-323

Common cathode

BAT30CWFILM

BAT30AWFILM

C30

A30

6 mg

3000

Tape and reel

SOT-323

Common anode

BAT30JFILM

BAT30KFILM

SOD-323

SOD-523

5 mg

3000

5000

Tape and reel

1.4 mg

2.9 mg

BAT30-07P6FILM

BAT30-09P6FILM

SOT-666 Parallel

SOT-666 Opposite

Revision history

Date

Revision

Description of Changes

24-Jul-2006

First issue

11/12

BAT30 Series

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the

right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any

time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no

liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this

document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products

or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such

third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED

WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS

OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT

RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,

DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE

GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void

any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any

liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

12/12

BAT30SWFILM相关文章

配单直通车

北京元坤伟业科技有限公司服务专线: 010-62104931621064316210489162104791 在线联系:

QQ：857273081 复制

QQ：1594462451 复制

深圳市芯福林电子有限公司服务专线: 13418564337 在线联系:

QQ：2881495808 复制

QQ：308365177 复制

首天国际（深圳）科技有限公司服务专线: 0755-82807802/82807803 在线联系:

QQ：528164397 复制

QQ：1318502189 复制

深圳市中利达电子科技有限公司服务专线: 0755-13686833545 在线联系:

QQ：1902134819 复制

QQ：2881689472 复制

柒号芯城电子商务（深圳）有限公司服务专线: 18922803401 在线联系:

QQ：2881677436 复制

QQ：2881620402 复制

BAT30SWFILM产品参数

型号:	BAT30SWFILM
Brand Name：	STMicroelectronics
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	STMICROELECTRONICS
包装说明：	ROHS COMPLIANT, PLASTIC PACKAGE-3
针数：	3
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8541.10.00.70
Factory Lead Time：	15 weeks
风险等级：	1.61
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	1477496
Samacsys Pin Count：	3
Samacsys Part Category：	Schottky Diode
Samacsys Package Category：	SOT23 (3-Pin)
Samacsys Footprint Name：	SOT-323 Serial
Samacsys Released Date：	2020-02-06 16:26:56
Is Samacsys：	N
配置：	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
二极管元件材料：	SILICON
二极管类型：	RECTIFIER DIODE
最大正向电压 (VF)：	0.24 V
JESD-30 代码：	R-PDSO-G3
JESD-609代码：	e3
湿度敏感等级：	1
最大非重复峰值正向电流：	1 A
元件数量：	2
端子数量：	3
最高工作温度：	150 °C
最大输出电流：	0.3 A
封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified
最大重复峰值反向电压：	30 V
子类别：	Rectifier Diodes
表面贴装：	YES
技术：	SCHOTTKY
端子面层：	Matte Tin (Sn)
端子形式：	GULL WING
端子位置：	DUAL
处于峰值回流温度下的最长时间：	30
Base Number Matches：	1

电子百科

产品导航

产品型号BAT30SWFILM的概述

产品型号BAT30SWFILM的Datasheet PDF文件预览

BAT30SWFILM相关产品

BAT30SWFILM相关文章

IC37:专业IC行业平台