36
sB/pB/up/nB/gB/Ba seRIes RelIaBIlITY TesT
1-1 MeChanICal peRFORManCe
NO.
ITEM
SPECIFICATION
TEST CONDITIONS
1-1-1 Flexure Strength
Appearance : No Damage
Z Change : within ±20%
RDC : within Specification
Test device shall be soldered on the substrate.
Substrate Dimension : 100 x 40 x 1.6mm
Deflection : 2.0mm
KeepingTime : 30Sec.
* For 100505, substrate dimension is 100 x 40 x 0.8mm.
Test device shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1Min.
Amplitude : 1.5mm
1-1-2 Vibration
Time : 2Hrs. for each Axis (X,Y & Z), Total 6Hrs.
Pre-heating : 150ºC, 1Min.
1-1-3 Resistance to
Soldering Heat
Appearance : No Damage
Solder Composition : Sn/Pb = 63/37
SolderTemperature : 260 ± 5ºC
ImmersionTime : 10 ± 1Sec.
1-1-4 Solderability
The electrodes shall be at least 90% covered
with new solder coating.
Pre-heating : 150°C, 1Min.
Solder Composition : Sn/Pb = 63/37
SolderTemperature : 230 ± 5°C
ImmersionTime : 4 ± 1Sec.
1-1-5 Terminal StrengthTest
100505 Series : ≥ 0.2kg
160808 Series : ≥ 0.5kg
201209 Series : ≥ 1.0kg
Other Series : ≥ 2.0kg
Test device shall be soldered on the substrate.
W
1-2 enVIROnMenTal peRFORManCe
NO.
ITEM
SPECIFICATION
TEST CONDITIONS
One Cycle
1-2-1 Temperature Cycle
Appearance : No Damage
Z Change : within ±20%
RDC : within Specification
Step
Temperature (°C)
-55 ± 3
Time (Min.)
1
30
3
2
25 ± 2
3
125 ± 3
30
3
4
25 ± 2
Total : 100 Cycles
Measured after Exposure in the Room Condition for 24Hrs.
Temperature : 40 ±2°C
1-2-2 Humidity Resistance
Relative Humidity : 90 ~ 95%
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
Temperature : 125 ± 3°C
1-2-3 HighTemperature
Resistance
Relative Humidity : 0%
Applied Current : Rated Current
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
Temperature : -55 ± 3°C
1-2-4 LowTemperature
Resistance
Relative Humidity : 0%
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.