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    产品型号BCT574的Datasheet PDF文件预览

    SN54BCT574, SN74BCT574  
    OCTAL TRANSPARENT D-TYPE FLIP-FLOPS  
    WITH 3-STATE OUTPUTS  
    SCBS074C – SEPTEMBER 1991 – REVISED MARCH 2003  
    Operating Voltage Range of 4.5 V to 5.5 V  
    State-of-the-Art BiCMOS Design  
    ESD Protection Exceeds JESD 22  
    – 2000-V Human-Body Model (A114-A)  
    – 200-V Machine Model (A115-A)  
    Significantly Reduces I  
    CCZ  
    – 1000-V Charged-Device Model (C101)  
    Full Parallel Access for Loading  
    SN54BCT574 . . . J OR W PACKAGE  
    SN74BCT574 . . . DB, DW, N, OR NS PACKAGE  
    (TOP VIEW)  
    SN54BCT574 . . . FK PACKAGE  
    (TOP VIEW)  
    1
    2
    3
    4
    5
    6
    7
    8
    9
    10  
    20  
    19  
    18  
    17  
    16  
    15  
    14  
    13  
    12  
    11  
    OE  
    1D  
    2D  
    3D  
    4D  
    5D  
    6D  
    7D  
    8D  
    V
    CC  
    1Q  
    2Q  
    3Q  
    4Q  
    5Q  
    6Q  
    7Q  
    8Q  
    CLK  
    3
    2
    1
    20 19  
    18  
    4
    5
    6
    7
    8
    3D  
    4D  
    5D  
    6D  
    7D  
    2Q  
    3Q  
    4Q  
    5Q  
    6Q  
    17  
    16  
    15  
    14  
    9 10 11 12 13  
    GND  
    description/ordering information  
    These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively  
    low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional  
    bus drivers, and working registers.  
    The eight flip-flops of the ’BCT574 devices are edge-triggered D-type flip-flops. On the positive transition of the  
    clock (CLK) input, the Q outputs are set to the logic levels that were set up at the data (D) inputs.  
    A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high  
    or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive  
    the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus  
    lines without interface or pullup components.  
    To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
    CC  
    resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
    ORDERING INFORMATION  
    ORDERABLE  
    PART NUMBER  
    TOP-SIDE  
    MARKING  
    †
    PACKAGE  
    T
    A
    PDIP – N  
    Tube  
    SN74BCT574N  
    SN74BCT574N  
    Tube  
    SN74BCT574DW  
    SN74BCT574DWR  
    SN74BCT574NSR  
    SN74BCT574DBR  
    SNJ54BCT574J  
    SNJ54BCT574W  
    SNJ54BCT574FK  
    SOIC – DW  
    BCT574  
    0°C to 70°C  
    Tape and reel  
    Tape and reel  
    Tape and reel  
    Tube  
    SOP – NS  
    SSOP – DB  
    CDIP – J  
    BCT574  
    BT574  
    SNJ54BCT574J  
    SNJ54BCT574W  
    SNJ54BCT574FK  
    –55°C to 125°C  
    CFP – W  
    Tube  
    LCCC – FK  
    Tube  
    †
    Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
    available at www.ti.com/sc/package.  
    Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
    Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
    Copyright 2003, Texas Instruments Incorporated  
    On products compliant to MIL-PRF-38535, all parameters are tested  
    unless otherwise noted. On all other products, production  
    processing does not necessarily include testing of all parameters.  
    PRODUCTION DATA information is current as of publication date.  
    Products conform to specifications per the terms of Texas Instruments  
    standard warranty. Production processing does not necessarily include  
    testing of all parameters.  
    1
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    SN54BCT574, SN74BCT574  
    OCTAL TRANSPARENT D-TYPE FLIP-FLOPS  
    WITH 3-STATE OUTPUTS  
    SCBS074C – SEPTEMBER 1991 – REVISED MARCH 2003  
    description/ordering information (continued)  
    OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered  
    while the outputs are in the high-impedance state.  
    FUNCTION TABLE  
    (each flip-flop)  
    INPUTS  
    OUTPUT  
    Q
    OE  
    L
    CLK  
    D
    H
    L
    ↑
    ↑
    H
    L
    L
    L
    H or L  
    X
    X
    X
    Q
    0
    H
    Z
    logic diagram (positive logic)  
    1
    OE  
    11  
    CLK  
    C1  
    1D  
    19  
    1Q  
    2
    1D  
    To Seven Other Channels  
    †
    absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
    Supply voltage range, V  
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
    CC  
    Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
    I
    Voltage range applied to any output in the disabled or power-off state, V . . . . . . . . . . . . . . . . –0.5 V to 5.5 V  
    O
    Voltage range applied to any output in the high state, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V  
    O
    CC  
    Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –30 mA  
    IK  
    I
    Current into any output in the low state: SN54BCT574 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA  
    SN74BCT574 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
    Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
    JA  
    DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
    N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W  
    NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W  
    Storage temperature range, T  
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
    stg  
    †
    Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
    functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
    implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
    NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
    2. The package thermal impedance is calculated in accordance with JESD 51-7.  
    2
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    SN54BCT574, SN74BCT574  
    OCTAL TRANSPARENT D-TYPE FLIP-FLOPS  
    WITH 3-STATE OUTPUTS  
    SCBS074C – SEPTEMBER 1991 – REVISED MARCH 2003  
    recommended operating conditions (see Note 3)  
    SN54BCT574  
    MIN NOM MAX  
    SN74BCT574  
    MIN NOM MAX  
    UNIT  
    V
    V
    V
    Supply voltage  
    4.5  
    2
    5
    5.5  
    4.5  
    2
    5
    5.5  
    V
    V
    CC  
    IH  
    IL  
    High-level input voltage  
    Low-level input voltage  
    Input clamp current  
    0.8  
    –18  
    –12  
    48  
    0.8  
    –18  
    –15  
    64  
    V
    I
    I
    I
    mA  
    mA  
    mA  
    °C  
    IK  
    High-level output current  
    Low-level output current  
    Operating free-air temperature  
    OH  
    OL  
    T
    A
    –55  
    125  
    0
    70  
    NOTE 3: All unused inputs of the device must be held at V  
    or GND to ensure proper device operation. Refer to the TI application report,  
    CC  
    Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
    electrical characteristics over recommended operating free-air temperature range (unless  
    otherwise noted)  
    SN54BCT574  
    SN74BCT574  
    PARAMETER  
    TEST CONDITIONS  
    UNIT  
    †
    †
    MIN TYP  
    MAX  
    MIN TYP  
    MAX  
    V
    V
    V
    = 4.5 V,  
    = 4.5 V  
    I = –18 mA  
    –1.2  
    –1.2  
    V
    IK  
    CC  
    I
    I
    I
    I
    I
    I
    = –3 mA  
    = –12 mA  
    = –15 mA  
    = 48 mA  
    = 64 mA  
    2.4  
    2
    3.3  
    3.2  
    2.4  
    2
    3.3  
    3.1  
    OH  
    OH  
    OH  
    OL  
    OL  
    V
    OH  
    V
    CC  
    0.38  
    0.55  
    V
    OL  
    V
    CC  
    = 4.5 V  
    V
    0.42  
    0.55  
    0.4  
    20  
    I
    I
    I
    I
    I
    I
    I
    I
    I
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    V
    CC  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5.5 V,  
    = 5 V,  
    V = 5.5 V  
    I
    0.4  
    20  
    mA  
    µA  
    I
    V = 2.7 V  
    I
    IH  
    IL  
    V = 0.5 V  
    I
    –0.6  
    –225  
    50  
    –0.6  
    –225  
    50  
    mA  
    mA  
    µA  
    ‡
    V
    O
    V
    O
    V
    O
    = 0  
    –100  
    –100  
    OS  
    = 2.7 V  
    = 0.5 V  
    OZH  
    OZL  
    CCL  
    CCH  
    CCZ  
    –50  
    62  
    –50  
    62  
    µA  
    Outputs open  
    Outputs open  
    Outputs open  
    38.1  
    4.9  
    38.1  
    4.9  
    4.9  
    5.5  
    7.5  
    mA  
    mA  
    mA  
    pF  
    8
    8
    4.5  
    8
    8
    C
    C
    V = 2.5 V or 0.5 V  
    I
    i
    = 5 V,  
    V
    O
    = 2.5 V or 0.5 V  
    pF  
    o
    †
    ‡
    All typical values are at V  
    = 5 V, T = 25°C.  
    A
    CC  
    Not more than one output should be tested at a time, and the duration of the test should not exceed one second.  
    timing requirements over recommended ranges of supply voltage and operating free-air  
    temperature (unless otherwise noted)  
    V
    T
    = 5 V,  
    = 25°C  
    CC  
    A
    SN54BCT574 SN74BCT574  
    UNIT  
    MIN  
    MAX  
    MIN  
    MAX  
    MIN  
    MAX  
    f
    t
    Clock frequency  
    77  
    77  
    77  
    MHz  
    ns  
    clock  
    Pulse duration, CLK high or low  
    6.5  
    4.5  
    6
    6.5  
    4.5  
    6
    6.5  
    4.5  
    6
    w
    High  
    t
    ns  
    ns  
    Setup time, data before CLK↑  
    Hold time, data after CLK↑  
    su  
    h
    Low  
    t
    High or low  
    0
    1
    0
    3
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    SN54BCT574, SN74BCT574  
    OCTAL TRANSPARENT D-TYPE FLIP-FLOPS  
    WITH 3-STATE OUTPUTS  
    SCBS074C – SEPTEMBER 1991 – REVISED MARCH 2003  
    switching characteristics over recommended ranges of supply voltage and operating free-air  
    temperature, C = 50 pF (unless otherwise noted) (see Figure 1)  
    L
    V
    T
    = 5 V,  
    = 25°C  
    CC  
    A
    SN54BCT574 SN74BCT574  
    FROM  
    (INPUT)  
    TO  
    (OUTPUT)  
    PARAMETER  
    UNIT  
    MIN  
    77  
    TYP  
    MAX  
    MIN  
    77  
    MAX  
    MIN  
    77  
    MAX  
    f
    t
    t
    t
    t
    t
    t
    MHz  
    ns  
    max  
    PLH  
    PHL  
    PZH  
    PZL  
    PHZ  
    PLZ  
    2.2  
    2.8  
    2.5  
    3.7  
    1
    6.5  
    6.1  
    6.4  
    7.3  
    4.4  
    4.2  
    8.6  
    8
    2.2  
    2.8  
    2.5  
    3.7  
    1
    11.2  
    9.7  
    10.9  
    11.3  
    8
    2.2  
    2.8  
    2.5  
    3.7  
    1
    10  
    8.9  
    CLK  
    Q
    Q
    Q
    8.1  
    9.2  
    7.4  
    5.8  
    10.4  
    10.9  
    7.5  
    ns  
    ns  
    OE  
    OE  
    1.3  
    1.3  
    7.1  
    1.3  
    6.4  
    4
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    SN54BCT574, SN74BCT574  
    OCTAL TRANSPARENT D-TYPE FLIP-FLOPS  
    WITH 3-STATE OUTPUTS  
    SCBS074C – SEPTEMBER 1991 – REVISED MARCH 2003  
    PARAMETER MEASUREMENT INFORMATION  
    7 V (t  
    , t  
    , O.C.)  
    PZL PLZ  
    Open  
    (all others)  
    S1  
    From Output  
    Under Test  
    Test  
    Point  
    C
    L
    R1  
    R1  
    (see Note A)  
    From Output  
    Under Test  
    Test  
    Point  
    C
    L
    R2  
    (see Note A)  
    LOAD CIRCUIT FOR  
    TOTEM-POLE OUTPUTS  
    R
    = R1 = R2  
    L
    LOAD CIRCUIT FOR  
    3-STATE AND OPEN-COLLECTOR OUTPUTS  
    High-Level  
    Pulse  
    (see Note B)  
    3 V  
    0 V  
    1.5 V  
    1.5 V  
    3 V  
    Timing Input  
    (see Note B)  
    1.5 V  
    t
    w
    0 V  
    3 V  
    0 V  
    3 V  
    0 V  
    t
    h
    Low-Level  
    Pulse  
    t
    1.5 V  
    su  
    1.5 V  
    Data Input  
    (see Note B)  
    1.5 V  
    1.5 V  
    VOLTAGE WAVEFORMS  
    PULSE DURATION  
    VOLTAGE WAVEFORMS  
    SETUP AND HOLD TIMES  
    3 V  
    0 V  
    Output  
    Control  
    (low-level enable)  
    3 V  
    1.5 V  
    1.5 V  
    Input  
    (see Note B)  
    1.5 V  
    1.5 V  
    0 V  
    PHL  
    t
    t
    PZL  
    t
    t
    PLZ  
    t
    PLH  
    3.5 V  
    In-Phase  
    Output  
    (see Note D)  
    V
    OH  
    1.5 V  
    Waveform 1  
    (see Notes C and D)  
    1.5 V  
    1.5 V  
    1.5 V  
    t
    V
    OL  
    V
    OL  
    0.3 V  
    t
    PHZ  
    PLH  
    t
    PHL  
    PZH  
    V
    OH  
    V
    OH  
    Out-of-Phase  
    Output  
    (see Note D)  
    Waveform 2  
    (see Notes C and D)  
    1.5 V  
    1.5 V  
    0.3 V  
    0 V  
    V
    OL  
    VOLTAGE WAVEFORMS  
    PROPAGATION DELAY TIMES (see Note D)  
    VOLTAGE WAVEFORMS  
    ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS  
    NOTES: A.  
    C includes probe and jig capacitance.  
    L
    B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, t = t ≤ 2.5 ns, duty cycle = 50%.  
    r
    f
    C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
    Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
    D. The outputs are measured one at a time with one transition per measurement.  
    E. When measuring propagation delay times of 3-state outputs, switch S1 is open.  
    F. All parameters and waveforms are not applicable to all devices.  
    Figure 1. Load Circuit and Voltage Waveforms  
    5
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    4-Jun-2007  
    PACKAGING INFORMATION  
    Orderable Device  
    Status (1)  
    Package Package  
    Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
    Qty  
    Type  
    LCCC  
    CDIP  
    CFP  
    Drawing  
    5962-9583601Q2A  
    5962-9583601QRA  
    5962-9583601QSA  
    SN74BCT574DBR  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    FK  
    J
    20  
    20  
    20  
    20  
    1
    1
    1
    TBD  
    TBD  
    TBD  
    POST-PLATE N / A for Pkg Type  
    A42 SNPB  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    W
    SSOP  
    DB  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SN74BCT574DBRE4  
    SN74BCT574DBRG4  
    SN74BCT574DW  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    SSOP  
    SSOP  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    SOIC  
    PDIP  
    PDIP  
    SO  
    DB  
    DB  
    DW  
    DW  
    DW  
    DW  
    DW  
    DW  
    N
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    20  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SN74BCT574DWE4  
    SN74BCT574DWG4  
    SN74BCT574DWR  
    SN74BCT574DWRE4  
    SN74BCT574DWRG4  
    SN74BCT574N  
    25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    20  
    Pb-Free  
    (RoHS)  
    CU NIPDAU N / A for Pkg Type  
    SN74BCT574NE4  
    SN74BCT574NSR  
    SN74BCT574NSRE4  
    SN74BCT574NSRG4  
    N
    20  
    Pb-Free  
    (RoHS)  
    CU NIPDAU N / A for Pkg Type  
    NS  
    NS  
    NS  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SO  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SO  
    2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SNJ54BCT574FK  
    SNJ54BCT574J  
    SNJ54BCT574W  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    LCCC  
    CDIP  
    CFP  
    FK  
    J
    20  
    20  
    20  
    1
    1
    1
    TBD  
    TBD  
    TBD  
    POST-PLATE N / A for Pkg Type  
    A42 SNPB  
    A42  
    N / A for Pkg Type  
    N / A for Pkg Type  
    W
    (1) The marketing status values are defined as follows:  
    ACTIVE: Product device recommended for new designs.  
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
    a new design.  
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
    OBSOLETE: TI has discontinued the production of the device.  
    (2)  
    Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
    http://www.ti.com/productcontent for the latest availability information and additional product content details.  
    TBD: The Pb-Free/Green conversion plan has not been defined.  
    Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
    for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
    at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
    Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
    package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
    Addendum-Page 1  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    4-Jun-2007  
    compatible) as defined above.  
    Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
    retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
    (3)  
    MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
    temperature.  
    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
    provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
    accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
    reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
    incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
    information may not be available for release.  
    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
    to Customer on an annual basis.  
    Addendum-Page 2  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    19-May-2007  
    TAPE AND REEL INFORMATION  
    Pack Materials-Page 1  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    19-May-2007  
    Device  
    Package Pins  
    Site  
    Reel  
    Reel  
    A0 (mm)  
    B0 (mm)  
    K0 (mm)  
    P1  
    W
    Pin1  
    Diameter Width  
    (mm) (mm) Quadrant  
    (mm)  
    330  
    (mm)  
    16  
    SN74BCT574DBR  
    SN74BCT574DWR  
    SN74BCT574NSR  
    DB  
    DW  
    NS  
    20  
    20  
    20  
    MLA  
    MLA  
    MLA  
    8.2  
    10.8  
    8.2  
    7.5  
    2.5  
    2.7  
    2.5  
    12  
    12  
    12  
    16  
    24  
    24  
    Q1  
    Q1  
    Q1  
    330  
    24  
    13.0  
    13.0  
    330  
    24  
    TAPE AND REEL BOX INFORMATION  
    Device  
    Package  
    Pins  
    Site  
    Length (mm) Width (mm) Height (mm)  
    SN74BCT574DBR  
    SN74BCT574DWR  
    SN74BCT574NSR  
    DB  
    DW  
    NS  
    20  
    20  
    20  
    MLA  
    MLA  
    MLA  
    342.9  
    333.2  
    333.2  
    336.6  
    333.2  
    333.2  
    28.58  
    31.75  
    31.75  
    Pack Materials-Page 2  
    PACKAGE MATERIALS INFORMATION  
    www.ti.com  
    19-May-2007  
    Pack Materials-Page 3  
    MECHANICAL DATA  
    MLCC006B – OCTOBER 1996  
    FK (S-CQCC-N**)  
    LEADLESS CERAMIC CHIP CARRIER  
    28 TERMINAL SHOWN  
    A
    B
    NO. OF  
    TERMINALS  
    **  
    18 17 16 15 14 13 12  
    MIN  
    MAX  
    MIN  
    MAX  
    0.342  
    (8,69)  
    0.358  
    (9,09)  
    0.307  
    (7,80)  
    0.358  
    (9,09)  
    19  
    20  
    11  
    10  
    9
    20  
    28  
    44  
    52  
    68  
    84  
    0.442  
    (11,23)  
    0.458  
    (11,63)  
    0.406  
    (10,31)  
    0.458  
    (11,63)  
    21  
    B SQ  
    22  
    0.640  
    (16,26)  
    0.660  
    (16,76)  
    0.495  
    (12,58)  
    0.560  
    (14,22)  
    8
    A SQ  
    23  
    0.739  
    (18,78)  
    0.761  
    (19,32)  
    0.495  
    (12,58)  
    0.560  
    (14,22)  
    7
    24  
    25  
    6
    0.938  
    (23,83)  
    0.962  
    (24,43)  
    0.850  
    (21,6)  
    0.858  
    (21,8)  
    5
    1.141  
    (28,99)  
    1.165  
    (29,59)  
    1.047  
    (26,6)  
    1.063  
    (27,0)  
    26 27 28  
    1
    2
    3
    4
    0.080 (2,03)  
    0.064 (1,63)  
    0.020 (0,51)  
    0.010 (0,25)  
    0.020 (0,51)  
    0.010 (0,25)  
    0.055 (1,40)  
    0.045 (1,14)  
    0.045 (1,14)  
    0.035 (0,89)  
    0.045 (1,14)  
    0.035 (0,89)  
    0.028 (0,71)  
    0.022 (0,54)  
    0.050 (1,27)  
    4040140/D 10/96  
    NOTES: A. All linear dimensions are in inches (millimeters).  
    B. This drawing is subject to change without notice.  
    C. This package can be hermetically sealed with a metal lid.  
    D. The terminals are gold plated.  
    E. Falls within JEDEC MS-004  
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    MECHANICAL DATA  
    MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
    DB (R-PDSO-G**)  
    PLASTIC SMALL-OUTLINE  
    28 PINS SHOWN  
    0,38  
    0,22  
    0,65  
    28  
    M
    0,15  
    15  
    0,25  
    0,09  
    5,60  
    5,00  
    8,20  
    7,40  
    Gage Plane  
    1
    14  
    0,25  
    A
    0°–ā8°  
    0,95  
    0,55  
    Seating Plane  
    0,10  
    2,00 MAX  
    0,05 MIN  
    PINS **  
    14  
    16  
    20  
    24  
    28  
    30  
    38  
    DIM  
    6,50  
    5,90  
    6,50  
    5,90  
    7,50  
    8,50  
    7,90  
    10,50  
    9,90  
    10,50 12,90  
    A MAX  
    A MIN  
    6,90  
    9,90  
    12,30  
    4040065 /E 12/01  
    NOTES: A. All linear dimensions are in millimeters.  
    B. This drawing is subject to change without notice.  
    C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
    D. Falls within JEDEC MO-150  
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    IMPORTANT NOTICE  
    Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
    improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
    Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
    complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
    TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
    standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
    warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
    performed.  
    TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
    applications using TI components. To minimize the risks associated with customer products and applications, customers should  
    provide adequate design and operating safeguards.  
    TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
    work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
    are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
    products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
    the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
    Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
    accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
    unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties  
    may be subject to additional restrictions.  
    Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
    voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
    practice. TI is not responsible or liable for any such statements.  
    TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
    reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
    specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
    of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
    requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
    applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
    representatives against any damages arising out of the use of TI products in such safety-critical applications.  
    TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
    specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
    specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
    solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
    connection with such use.  
    TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
    are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
    non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
    Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
    Products  
    Amplifiers  
    Data Converters  
    DSP  
    Applications  
    Audio  
    amplifier.ti.com  
    dataconverter.ti.com  
    dsp.ti.com  
    www.ti.com/audio  
    Automotive  
    Broadband  
    Digital Control  
    Military  
    www.ti.com/automotive  
    www.ti.com/broadband  
    www.ti.com/digitalcontrol  
    www.ti.com/military  
    Interface  
    interface.ti.com  
    logic.ti.com  
    Logic  
    Power Mgmt  
    Microcontrollers  
    RFID  
    power.ti.com  
    Optical Networking  
    Security  
    www.ti.com/opticalnetwork  
    www.ti.com/security  
    www.ti.com/telephony  
    www.ti.com/video  
    microcontroller.ti.com  
    www.ti-rfid.com  
    www.ti.com/lpw  
    Telephony  
    Low Power  
    Wireless  
    Video & Imaging  
    Wireless  
    www.ti.com/wireless  
    Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
    Copyright © 2007, Texas Instruments Incorporated  
    配单直通车
    BCT8-08产品参数
    型号:BCT8-08
    是否Rohs认证： 符合
    生命周期：Contact Manufacturer
    包装说明：R-MXFM-D3
    Reach Compliance Code：unknown
    风险等级：5.7
    其他特性：LOW POWER LOSS
    应用：EFFICIENCY
    配置：COMMON CATHODE, 2 ELEMENTS
    二极管元件材料：SILICON
    二极管类型：RECTIFIER DIODE
    最大正向电压 (VF)：1 V
    JESD-30 代码：R-MXFM-D3
    最大非重复峰值正向电流：300 A
    元件数量：2
    相数：1
    端子数量：3
    最高工作温度：150 °C
    最低工作温度：-55 °C
    最大输出电流：4 A
    封装主体材料：METAL
    封装形状：RECTANGULAR
    封装形式：FLANGE MOUNT
    峰值回流温度（摄氏度）：NOT SPECIFIED
    最大重复峰值反向电压：800 V
    最大反向电流：10 µA
    端子形式：SOLDER LUG
    端子位置：UNSPECIFIED
    处于峰值回流温度下的最长时间：NOT SPECIFIED
    Base Number Matches：1
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