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BCW68H
Features
l Ideally Suited for Automatic Insertion
l 150oC Junction Temperature
PNP Small
Signal Transistor
330mW
l Low Current, Low Frequency
l Epitaxial Planar Die Construction
Mechanical Data
SOT-23
l Case: SOT-23, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Marking: DH
A
D
B
C
l Weight: 0.008 grams ( approx.)
Maximum Ratings @ 25oC Unless Otherwise Specified
F
E
Charateristic
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current(DC)
Peak Collector Current
Base Current(DC)
Symbol Value Unit
VCEO
VCBO
VEBO
IC
-45
-60
V
V
H
G
J
K
-5
V
DIMENSIONS
MM
-800
-1000
-100
-200
330
mA
mA
mA
mA
mW
INCHES
MIN
DIM
A
B
C
D
E
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
ICM
IB
Peak Base Current
IBM
F
G
H
J
Power Dissipation@Ts=79oC
Thermal Resistance, Junction to
Ambient Air
Thermal Resistance, Junction to
Soldering Point
Pd
.085
.37
K
(1)
RθJA
285
oC/W
Suggested Solder
Pad Layout
oC/W
RθJS
215
.031
.800
Operating & Storage Temperature Tj, TSTG -55~150 oC
.035
.900
Notes:
.079
2.000
inches
mm
(1) Valid provided that leads are kept at
ambient temperature.
.037
.950
.037
.950
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