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产品型号BD46241G-TR的概述

芯片BD46241G-TR的概述 BD46241G-TR是一款高性能的线性电压稳压器,广泛应用于消费电子、工业设备和通信系统中。该芯片的设计目标是提供稳定的输出电压,同时具备较低的功耗和较好的瞬态响应性能。随着电子产品对稳定电源的需求不断增加,BD46241G-TR凭借其优异的性能和灵活的应用范围,逐渐成为设计师和工程师们的热点选择。 BD46241G-TR通常用作电源管理模块中的一部分,通过将输入电压稳定在特定的输出电压值,为后续电路提供可靠的电源。此芯片不仅提高了系统的整体可靠性,而且通过减少电源波动引起的噪声,使得系统在各种应用场合下都能正常运作。 芯片的详细参数 BD46241G-TR的主要特点包括: 1. 输入电压范围:该芯片可以处理的输入电压范围从1.8V到6.5V,满足多种电源需求。 2. 输出电压:提供多种固定输出电压选项,如1.2V、1.5V、1.8V等,也可以进行外...

产品型号BD46241G-TR的Datasheet PDF文件预览

Datasheet  
Voltage Detector IC Series  
Counter Timer Built-in  
CMOS Voltage Detector IC  
BD45xxx series BD46xxx series  
Key Specifications  
„ Detection voltage:  
General Description  
2.3V to 4.8V (Typ.)  
0.1V steps  
±1.0%  
ROHM’s BD45xxx and BD46xxx series are highly  
accurate, low current consumption Voltage Detector ICs.  
Because the counter timer delay circuit is built into  
these series, an external capacitor for the delay time  
setting is unnecessary. The lineup was established with  
low output types (Nch open drain and CMOS output)  
and detection voltages range from 2.3V to 4.8V in  
increments of 0.1V, so that the series may be selected  
according the application at hand.  
„ High accuracy detection voltage:  
„ Ultra-low current consumption:  
„ Operating temperature range:  
„ Three internal, fixed delay time:  
0.85µA (Typ.)  
-40°C to +105°C  
50ms  
100ms  
200ms  
Package  
SSOP5  
2.90mm x 2.80mm x 1.25mm  
Features  
„ Counter Timer Built-in  
Applications  
„ No delay time setting external capacitor required  
„ Ultra-low current consumption  
Circuits using microcontrollers or logic circuits that  
require a reset.  
„ Two output types (Nch open drain and CMOS output)  
„ Package SSOP5 is similar to SOT-23-5 (JEDEC)  
Typical Application Circuit  
VDD1  
VDD2  
VDD1  
RL  
Micro  
controller  
Micro  
controller  
BD46xxx  
RST  
BD45xxx  
RST  
CL  
CL  
Noise-filtering  
Capacitor)  
Noise-filtering  
Capacitor)  
GND  
GND  
Open Drain Output Type)  
CMOS Output Type)  
BD45xxx series  
BD46xxx series  
Connection Diagram  
Pin Descriptions  
SSOP5  
VDD  
VOUT  
PIN No.  
Symbol  
ER  
Function  
1
2
3
4
5
Manual Reset  
Substrate *  
SUB  
GND  
VOUT  
VDD  
GND  
Reset Output  
Power Supply Voltage  
Lot. No  
Marking  
ER SUB GND  
*Connect the substrate to GND.  
Product structureSilicon monolithic integrated circuit This product is not designed for protection against radioactive rays  
.www.rohm.com  
TSZ02201-0R7R0G300010-1-2  
18.Dec.2012 Rev.005  
© 2012 ROHM Co., Ltd. All rights reserved.  
1/13  
TSZ2211114001  
Daattaasshheeeett  
BD45xxx series BD46xxx series  
Ordering Information  
B
D
x
x
x
x
x
x
-
T
R
Part  
Number  
Output Type  
45 : Open Drain  
46 : CMOS  
Reset Voltage Value Counter Timer  
23 : 2.3V  
Package  
Delay Time Settings G : SSOP5  
0.1V step 5 : 50ms  
Packaging and  
forming specification  
TR : Embossed tape  
and reel  
48 : 4.8V  
1 : 100ms  
2 : 200ms  
SSOP5  
<Tape and Reel information>  
°
°
+
4  
2.9 0.2  
6
°
4
Tape  
Embossed carrier tape  
3000pcs  
5
4
Quantity  
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
2
3
1pin  
+0.05  
0.13  
0.03  
S
+0.05  
0.04  
0.42  
0.1  
0.95  
S
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
Reel  
(Unit : mm)  
Lineup  
Table 1. Open Drain Output Type  
Counter Timer Delay Time Settings  
50ms  
100ms  
Part  
200ms  
Detection  
Voltage  
Part  
Part  
Marking  
Marking  
Marking  
Number  
Number  
Number  
T0  
T1  
T2  
T3  
T4  
T5  
T6  
T7  
T8  
T9  
TA  
TB  
TC  
TD  
TE  
TF  
TG  
TH  
TJ  
BD45485  
BD45475  
BD45465  
BD45455  
BD45445  
BD45435  
BD45425  
BD45415  
BD45405  
BD45395  
BD45385  
BD45375  
BD45365  
BD45355  
BD45345  
BD45335  
BD45325  
BD45315  
BD45305  
BD45295  
BD45285  
BD45275  
BD45265  
BD45255  
BD45245  
BD45235  
TS  
TT  
TU  
TV  
TW  
TX  
TY  
TZ  
U0  
U1  
U2  
U3  
U4  
U5  
U6  
U7  
U8  
U9  
UA  
UB  
UC  
UD  
UE  
UF  
UG  
UH  
BD45481  
BD45471  
BD45461  
BD45451  
BD45441  
BD45431  
BD45421  
BD45411  
BD45401  
BD45391  
BD45381  
BD45371  
BD45361  
BD45351  
BD45341  
BD45331  
BD45321  
BD45311  
BD45301  
BD45291  
BD45281  
BD45271  
BD45261  
BD45251  
BD45241  
BD45231  
UJ  
UK  
UL  
UM  
UN  
UP  
UQ  
UR  
US  
UT  
UU  
UV  
UW  
UX  
UY  
UZ  
V0  
V1  
V2  
V3  
V4  
V5  
V6  
V7  
V8  
BD45482  
BD45472  
BD45462  
BD45452  
BD45442  
BD45432  
BD45422  
BD45412  
BD45402  
BD45392  
BD45382  
BD45372  
BD45362  
BD45352  
BD45342  
BD45332  
BD45322  
BD45312  
BD45302  
BD45292  
BD45282  
BD45272  
BD45262  
BD45252  
BD45242  
BD45232  
4.8V  
4.7V  
4.6V  
4.5V  
4.4V  
4.3V  
4.2V  
4.1V  
4.0V  
3.9V  
3.8V  
3.7V  
3.6V  
3.5V  
3.4V  
3.3V  
3.2V  
3.1V  
3.0V  
2.9V  
2.8V  
2.7V  
2.6V  
2.5V  
2.4V  
2.3V  
TK  
TL  
TM  
TN  
TP  
TQ  
TR  
V9  
www.rohm.com  
TSZ02201-0R7R0G300010-1-2  
18.Dec.2012 Rev.005  
© 2012 ROHM Co., Ltd. All rights reserved.  
2/13  
TSZ2211115001  
Daattaasshheeeett  
BD45xxx series BD46xxx series  
Lineup - continued  
Table 2. CMOS Output Type  
Counter Timer Delay Time Settings  
50ms  
100ms  
Part  
200ms  
Detection  
Marking  
Part  
Part  
Marking  
Marking  
Voltage  
Number  
Number  
Number  
VA  
VB  
VC  
VD  
VE  
VF  
VG  
VH  
VJ  
BD46485  
BD46475  
BD46465  
BD46455  
BD46445  
BD46435  
BD46425  
BD46415  
BD46405  
BD46395  
BD46385  
BD46375  
BD46365  
BD46355  
BD46345  
BD46335  
BD46325  
BD46315  
BD46305  
BD46295  
BD46285  
BD46275  
BD46265  
BD46255  
BD46245  
BD46235  
W2  
W3  
W4  
W5  
W6  
W7  
W8  
W9  
WA  
WB  
WC  
WD  
WE  
WF  
WG  
WH  
WJ  
WK  
WL  
WM  
WN  
WP  
WQ  
WR  
WS  
WT  
BD46481  
BD46471  
BD46461  
BD46451  
BD46441  
BD46431  
BD46421  
BD46411  
BD46401  
BD46391  
BD46381  
BD46371  
BD46361  
BD46351  
BD46341  
BD46331  
BD46321  
BD46311  
BD46301  
BD46291  
BD46281  
BD46271  
BD46261  
BD46251  
BD46241  
BD46231  
WU  
WV  
WW  
WX  
WY  
WZ  
X0  
X1  
X2  
X3  
X4  
BD46482  
BD46472  
BD46462  
BD46452  
BD46442  
BD46432  
BD46422  
BD46412  
BD46402  
BD46392  
BD46382  
BD46372  
BD46362  
BD46352  
BD46342  
BD46332  
BD46322  
BD46312  
BD46302  
BD46292  
BD46282  
BD46272  
BD46262  
BD46252  
BD46242  
BD46232  
4.8V  
4.7V  
4.6V  
4.5V  
4.4V  
4.3V  
4.2V  
4.1V  
4.0V  
3.9V  
3.8V  
3.7V  
3.6V  
3.5V  
3.4V  
3.3V  
3.2V  
3.1V  
3.0V  
2.9V  
2.8V  
2.7V  
4.8V  
4.7V  
4.6V  
4.5V  
VK  
VL  
VM  
VN  
VP  
VQ  
VR  
VS  
VT  
VU  
VV  
VW  
VX  
VY  
VZ  
W0  
W1  
X5  
X6  
X7  
X8  
X9  
XA  
XB  
XC  
XD  
XE  
XF  
XG  
XH  
XJ  
XK  
www.rohm.com  
TSZ02201-0R7R0G300010-1-2  
18.Dec.2012 Rev.005  
© 2012 ROHM Co., Ltd. All rights reserved.  
3/13  
TSZ2211115001  
Daattaasshheeeett  
BD45xxx series BD46xxx series  
z Absolute maximum ratings  
Parameter  
Symbol  
Limits  
-0.3 to +10  
Unit  
Power Supply Voltage  
VDD-GND  
V
Nch Open Drain Output  
CMOS Output  
GND-0.3 to +10  
GND-0.3 to VDD+0.3  
60  
Output Voltage  
VOUT  
V
Output Current  
ER pin Voltage  
Power Dissipation  
IO  
mA  
V
VCT  
Pd  
GND-0.3 to VDD+0.3  
540  
*1 *2  
mW  
°C  
Operating Temperature  
Topr  
Tstg  
-40 to +105  
-55 to +125  
Ambient Storage Temperature  
°C  
*1 Reduced by 5.4mW/°C when used over 25°C.  
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).  
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)  
Limit  
Typ.  
Parameter  
Symbol  
Condition  
Unit  
Min.  
VDET(T)  
×0.99  
2.475  
2.417  
2.422  
2.970  
2.901  
2.906  
3.267  
3.191  
3.196  
4.158  
4.061  
4.068  
4.752  
4.641  
4.649  
Max.  
VDET(T)  
×1.01  
2.525  
2.580  
2.598  
3.030  
3.095  
3.117  
3.333  
3.405  
3.429  
4.242  
4.334  
4.364  
4.848  
4.953  
4.988  
*1  
VDD=HÆL, RL=470k  
VDET(T)  
2.5  
Ta=+25°C  
-
VDET=2.5V  
VDET=3.0V  
VDET=3.3V  
VDET=4.2V  
VDET=4.8V  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
3.0  
-
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
3.3  
Detection Voltage  
VDET  
V
-
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
4.2  
-
-
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
4.8  
-
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
-
Detection Voltage  
Temperature coefficient  
VDET/  
T  
-
±100  
±360 ppm/°C  
-40°C to +105°C  
VDET(T) VDET(T) VDET(T)  
VDDLÆHÆL, RL=470kΩ  
Hysteresis Voltage  
VDET  
V
×0.03  
45  
×0.05  
50  
×0.08  
55  
BD45XX5, BD46XX5  
BD45XX1, BD46XX1  
BD45XX2, BD46XX2  
CL=100pF,  
‘High’ Output  
Delay time  
tPLH  
90  
100  
110  
ms  
RL=100kΩ  
*1, *2, *3  
180  
200  
220  
*1  
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V  
VDD=VDET-0.2V, VER=0V VDET=2.3V to 3.1V  
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V  
VDD=VDET-0.2V, VER=0V VDET=3.2V to 4.2V  
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V  
VDD=VDET-0.2V, VER=0V VDET=4.3V to 4.8V  
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V  
VDD=VDET+0.2V, VER=0V VDET=2.3V to 3.1V  
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V  
VDD=VDET+0.2V, VER=0V VDET=3.2V to 4.2V  
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V  
VDD=VDET+0.2V, VER=0V VDET=4.3V to 4.8V  
-
-
-
-
-
-
-
-
-
-
-
-
0.70  
0.70  
0.75  
0.75  
0.80  
0.80  
0.75  
0.75  
0.80  
0.80  
0.85  
0.85  
2.10  
2.85  
2.25  
3.00  
2.40  
3.15  
2.25  
4.28  
2.40  
4.50  
2.55  
4.73  
*1  
*1  
Circuit Current  
when ON  
IDD1  
IDD2  
µA  
µA  
*1  
*1  
*1  
Circuit Current  
when OFF  
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)  
RL :Pull-up resistor to be connected between VOUT and power supply.  
CL :Capacitor to be connected between VOUT and GND.  
*1 Guarantee is Ta=25°C.  
*2 tPLH:VDD=(VDET(T)-0.5V)Æ(VDET(T)+0.5V)  
*3 tPLH:VDD=Please set the rise up time between VDD=0ÆVDET to more than 100µs.  
Attention: Please connect the GND when you don’t use ‘ER’  
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Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued  
Limit  
Condition  
Parameter  
Symbol  
VOPL  
Unit  
Min.  
0.95  
1.20  
Typ.  
-
-
-
Max.  
-
-
-
VOL0.4V, RL=470k, Ta=25 to 105°C  
Operating Voltage Range  
‘High’ Output Voltage (Pch)  
V
V
VOL0.4V, RL=470k, Ta=-40 to 25°C  
VDD-0.5  
VDD=4.8V, ISOURCE= 1.0 mA, VDET(2.3V to 4.2V)  
VDD=6.0V, ISOURCE= 1.2 mA, VDET(4.3V to 4.8V)  
VOH  
VDD-0.5  
-
-
-
-
-
-
-
-
-
1
0.3  
0.3  
0.1  
-
0.8  
10  
VDD=1.2V, ISINK = 0.45 mA  
‘Low’Output Voltage (Nch)  
VOL  
V
VDD=2.4V, ISINK = 1.3 mA, VDET(2.7V to 4.8V)  
*1  
*1  
Leak Current when OFF  
ER Pin ‘H’ Voltage  
ER Pin ‘L’ Voltage  
Ileak  
VEH  
VEL  
IEL  
VDD=VDS=10V  
-
2.0  
-
µA  
V
V
*1  
ER Pin Input Current  
-
µA  
VDET(T):Standard Detection Voltage (2.3V to 4.8V, 0.1V step)  
RL :Pull-up resistor to be connected between VOUT and power supply.  
CL :Capacitor to be connected between VOUT and GND.  
*1 Guarantee is Ta=25°C.  
Attention: Please connect the GND when you don’t use ‘ER’  
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BD45xxx series BD46xxx series  
Block Diagrams  
VDD  
VOUT  
Oscillation  
Circuit Counter  
Timer  
Vref  
GND  
ER  
Fig.1 BD45xxx Series  
VDD  
Oscillation  
Circuit Counter  
Timer  
VOUT  
Vref  
GND  
ER  
Fig.2 BD46xxx Series  
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BD45xxx series BD46xxx series  
Typical Performance Curves  
2.0  
20  
15  
10  
5
BD45281
BD45281
BD46281】  
BD46281】  
1.5  
1.0  
0.5  
0.0  
VDD=2.4V  
VDD=1.2V  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
DS[V]  
0
1
2
3
4
5
6
7
8
9 10  
DRAIN-SOURCE VOLTAGE  
V
V
DD SUPPLY VOLTAGE VDD[V]  
Fig.4 “Low” Output Current  
Fig.3 Circuit Current  
7
6
5
4
3
2
1
0
20  
15  
10  
5
BD46281】  
BD45281】  
BD46281】  
VDD=6.0V  
VDD=4.8V  
Ta=25  
Ta=25  
0
0
1
2
3
4
5
6
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5  
DRAIN-SOURCE VOLTAGE  
VDS[V]  
VDD SUPPLY VOLTAGE VDD[V]  
Fig.5 “High” Output Current  
Fig.6 I/O Characteristics  
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Typical Performance Curves – continued  
20  
20  
15  
10  
5
BD45281】  
BD45421】  
BD46281】  
BD46421】  
15  
10  
5
0
0
0
1
2
3
4
5
6
7
8
9
10  
0
1
2
3
4
5
6
7
8
9 10  
ER VOLTAGE  
V
ER[V]  
ER VOLTAGE VER[V]  
Fig.7 ER Terminal Threshold Voltage  
Fig.8 ER Terminal Input Current  
5.8  
5.4  
5.0  
4.6  
4.2  
3.8  
3.4  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
BD45421BD46421】  
BD45421】  
BD46421】  
Low to high(VD ET+ΔVD ET  
)
High to low(VD ET  
)
-40 -20  
0
20  
40  
60  
80  
100  
-0  
0
40  
80  
TEM PERATURE Ta[  
]
TEM PERATURE Ta[  
]
Fig.9 Detection Voltage  
Release Voltage  
Fig.10 Circuit Current when ON  
(VDET-0.2V)  
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BD45xxx series BD46xxx series  
Typical Performance Curves – continued  
1.5  
1.0  
3.0  
2.8  
BD45421】  
BD45421】  
BD46421】  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
BD46421】  
0.5  
0.0  
-40 -20  
0
20  
40  
60  
80  
100  
-40 -20  
0
20 40 60 80 100  
TEM PERATURE Ta[  
]
TEMPERATURE Ta[  
]
Fig.11 Circuit Current when OFF  
Fig.12 Operating Limit Voltage  
50  
40  
30  
20  
10  
0
250  
BD45282BD46282】  
BD45281】  
200  
150  
100  
50  
BD46281】  
BD45281BD46281】  
BD45285BD46285】  
0
-60 -40 -20  
0
20 40 60 80 100 120  
-60 -40 -20  
0
20 40 60 80 100 120  
TEMPERATURE Ta[ ]  
TEMPERATURE Ta[  
]
Fig.13 Output Delay Time  
Fig.14 Output Delay Time  
“Low”Æ”High”  
“High”Æ”Low”  
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Application Information  
Explanation of Operation  
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as  
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal  
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD45xxx series uses an open drain output  
type, it is necessary to connect either a pull-up resistor to VDD or another power supply if needed [The output “High” voltage  
(VOUT) in this case becomes VDD or the voltage of the other power supply].  
VDD  
VDD  
VDD  
R1  
R2  
R1  
R2  
Q2  
Q1  
Vref  
Vref  
Reset  
VOUT  
Oscillation  
Circuit Counter  
Timer  
Oscillation  
Circuit Counter  
Timer  
Reset  
VOUT  
Q1  
R3  
R3  
GND  
GND  
ER  
ER  
Fig.15 (BD45xxx Type Internal Block Diagram)  
Fig.16 (BD46xxx Type Internal Block Diagram)  
Reference Data  
Examples of Leading (tPLH) and Falling (tPHL) Output  
Part Number  
tPLH[ms]  
50  
tPHL[µs]  
BD45275G  
BD46275G  
18  
18  
50  
VDD=2.2VÆ3.2V  
VDD=3.2VÆ2.2V  
*This data is for reference only.  
The figures will vary with the application, so please confirm actual operating conditions before use.  
Timing Waveform  
Example: The following shows the relationship between the input voltages VDD, the output voltage VOUT and ER terminal when  
the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig. 12 and 13).  
1
When the power supply is turned on, the output is unstable from  
VDD  
VDET+ΔVDET  
after over the operating limit voltage (VOPL) until tPHL. Therefore it is  
possible that the reset signal is not outputted when the rise time of  
VDET  
VDD  
VDD is faster than tPHL  
2
.
VOPL  
0V  
When VDD is greater than VOPL but less than the reset release  
voltage (VDET + VDET), the output voltages will switch to Low.  
VOH  
3
If VDD exceeds the reset release voltage (VDET + VDET), the  
tPLH  
tPLH  
tPLH  
VOUT  
counter timer start and VOUT switches from L to H.  
tPHL  
VOL  
VEH  
4
When more than the high level voltage is supplied to the ER  
tPHL  
terminal, VOUT comes to “L” after tPLH delay time. Therefore, a time  
when ER terminal is “H” is necessary for 100µsec or more.  
ER  
5
tPHL  
When the ER terminal switches to Low, the counter timer starts  
to operate, a delay of tPLH occurs, and VOUT switches from “L” to “H”.  
6
If VDD drops below the detection voltage (VDET) when the power  
④ ⑤  
supply is powered down or when there is a power supply fluctuation,  
VOUT switches to L (with a delay of tPHL).  
Fig.17 Timing Waveform  
7
The potential difference between the detection voltage and the  
release voltage is known as the hysteresis width (VDET). The  
system is designed such that the output does not toggle with power  
supply fluctuations within this hysteresis width, preventing  
malfunctions due to noise.  
These time changes by the application and use it, please verify and confirm using practical applications.  
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BD45xxx series BD46xxx series  
Circuit Applications  
1) Examples of common power supply detection reset circuits.  
Application examples of BD45xxx series (Open Drain  
output type) and BD46xxx series (CMOS output type)  
are shown below.  
VDD1  
VDD2  
RL  
Micro  
controller  
BD45xxx  
RST  
CASE1: Power supply of the microcontroller (VDD2)  
differs from the power supply of the reset detection  
(VDD1).  
CL  
Noise-filtering  
Capacitor)  
Use an open drain output type (BD45xxx) with a load  
resistance RL as shown Fig.18.  
GND  
Fig.18 Open Drain Output Type  
CASE2: Power supply of the microcontroller (VDD1) is  
same as the power supply of the reset detection (VDD1).  
Use a CMOS output type (BD46xxx) device or an open  
drain output type (BD45xxx) device with a pull up  
VDD1  
resistor between the output and VDD1  
.
Micro  
controller  
BD46xxx  
RST  
When a capacitance CL for noise filtering is connected to  
the VOUT pin (the reset signal input terminal of the  
microcontroller), please take into account the waveform  
of the rise and fall of the output voltage (VOUT).  
CL  
Noise-filtering  
Capacitor)  
GND  
Fig.19 CMOS Output Type  
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage  
resets the microcontroller.  
VDD1  
VDD2  
VDD3  
RL  
Micro  
controller  
BD45xxx  
BD45xxx  
RST  
GND  
Fig. 20  
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain  
output type (BD45xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller  
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.  
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3) Examples of the power supply with resistor dividers.  
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow  
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current  
that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause  
malfunction in the systems operation such as output oscillations, etc.  
V1  
R2  
I1  
VDD  
BD45xxx  
BD46xxx  
R1  
VOUT  
CIN  
CL  
GND  
Fig. 21  
When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,  
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD  
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”  
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches  
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to  
oscillation.  
IDD  
In-rush Current  
VDD  
0
VDET  
Fig. 22 Current Consumption vs. Power Supply Voltage  
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Operational Notes  
1) Absolute maximum ratings  
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit  
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such  
as adding a fuse, in case the IC is operated over the absolute maximum ratings.  
2) Ground Voltage  
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no  
pins are at a voltage below the ground pin at any time, even during transient condition.  
3) Recommended operating conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately  
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.  
4) Bypass Capacitor for Noise Rejection  
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.  
Be careful when using extremely big capacitor as transient response will be affected.  
5) Short between pins and mounting errors  
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong  
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.  
6) Operation under strong electromagnetic field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
7) The VDD line impedance might cause oscillation because of the detection current.  
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.  
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)  
condition.  
10) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might  
cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage of  
about 1Mis assumed between the ER terminal and the GND terminal, 100kconnection between the ER terminal  
and the VDD terminal would be recommended. If the leakage is assumed between the VOUT terminal and the GND  
terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance.  
11) External parameters  
The recommended parameter range for RL is 50kto 1M. There are many factors (board layout, etc) that can affect  
characteristics. Please verify and confirm using practical applications.  
12) Power on reset operation  
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual  
operation.  
13) Testing on application boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
14) Rush current  
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to  
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special  
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.  
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Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
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