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产品型号BD52E47的Datasheet PDF文件预览

Datasheet  
Voltage Detector IC Series  
Free Delay Time Setting  
CMOS Voltage Detector IC Series  
BD52Exxx-M series BD53Exxx-M series (for Automotive Accessories)  
General Description  
Key Specifications  
¢ Detection voltage:  
Rohm's BD52Exxx and BD53Exxx series are highly  
accurate, low current consumption Voltage Detector  
ICs with a capacitor controlled time delay. The line up  
includes BD52Exxx devices with N-channel open drain  
output and BD53Exxx devices with CMOS output. The  
devices are available for specific detection voltages  
ranging from 2.3V to 6.0V in increments of 0.1V.  
Features  
2.3V to 6.0V (Typ.)  
0.1V steps  
¢ High accuracy detection voltage:  
¢ Ultra-low current consumption:  
Package  
±1.0%  
0.95µA (Typ.)  
SSOP5:  
2.90mm x 2.80mm x 1.25mm  
Applications  
Circuits using microcontrollers or logic circuits that  
require a reset.  
¢ Delay Time Controlled by external Capacitor  
¢ Two output types (N-channel open drain and CMOS  
output)  
¢ Ultra-low current consumption  
¢ Very small, lightweight and thin package  
¢ Package SSOP5 is similar to SOT-23-5(JEDEC)  
Typical Application Circuit  
VDD1  
VDD1  
VDD2  
R
L
Micro  
controller  
RST  
BD53Exxx-M  
Micro  
controller  
R
ST  
BD52Exxx-M  
CT  
C
T
CL  
C
L
(Capacitor for  
noise filtering)  
(Capacitor for  
noise filtering)  
GND  
GND  
Open Drain Output type  
BD52Exxx-M Series  
CMOS Output type  
BD53Exxx-M Series  
Connection Diagram  
SSOP5  
CT  
N.C.  
TOP VIEW  
Lot. No  
Marking  
VOUT VDD GND  
Pin Descriptions  
SSOP5  
PIN No. Symbol  
Function  
1
2
3
4
VOUT  
VDD  
Reset Output  
Power Supply Voltage  
GND  
GND  
N.C.  
Unconnected Terminal  
Capacitor connection terminal for  
output delay time  
5
CT  
Product structureSilicon monolithic integrated circuit This product is not designed for protection against radioactive rays  
.www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
1/12  
TSZ2211114001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Ordering Information  
B
D
x
x
E
x
x
x
-
M
T
R
Part  
Number  
Output Type  
52 : Open Drain  
53 : CMOS  
Reset Voltage Value Package  
G : SSOP5  
0.1V step  
Automotive Accessories Packaging and  
23 : 2.3V  
forming specification  
TR : Embossed tape  
and reel  
60 : 6.0V  
SSOP5  
<Tape and Reel information>  
°
°
+
2.9±0.2  
6
°
4
Tape  
Embossed carrier tape  
3000pcs  
4  
5
4
Quantity  
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
2
3
1pin  
+0.05  
0.03  
0.13  
+0.05  
0.04  
0.42  
0.1  
0.95  
Direction of feed  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
Lineup  
Output Type  
Detection Voltage  
Open Drain  
CMOS  
Part Number  
Part Number  
Marking  
Marking  
6.0V  
5.9V  
5.8V  
5.7V  
5.6V  
5.5V  
5.4V  
5.3V  
5.2V  
5.1V  
5.0V  
4.9V  
4.8V  
4.7V  
4.6V  
4.5V  
4.4V  
4.3V  
4.2V  
4.1V  
4.0V  
3.9V  
3.8V  
3.7V  
3.6V  
3.5V  
3.4V  
3.3V  
3.2V  
3.1V  
3.0V  
2.9V  
2.8V  
2.7V  
2.6V  
2.5V  
2.4V  
2.3V  
Ph  
Pg  
Pf  
Pe  
Pd  
Pc  
Pb  
Pa  
Ny  
Nr  
Np  
Nn  
Nm  
Nk  
Nh  
Ng  
Nf  
Ne  
Nd  
Nc  
Nb  
Na  
My  
Mr  
Mp  
Mn  
Mm  
Mk  
Mh  
Mg  
Mf  
BD52E60  
BD52E59  
BD52E58  
BD52E57  
BD52E56  
BD52E55  
BD52E54  
BD52E53  
BD52E52  
BD52E51  
BD52E50  
BD52E49  
BD52E48  
BD52E47  
BD52E46  
BD52E45  
BD52E44  
BD52E43  
BD52E42  
BD52E41  
BD52E40  
BD52E39  
BD52E38  
BD52E37  
BD52E36  
BD52E35  
BD52E34  
BD52E33  
BD52E32  
BD52E31  
BD52E30  
BD52E29  
BD52E28  
BD52E27  
BD52E26  
BD52E25  
BD52E24  
BD52E23  
Ud  
Uc  
Ub  
Ua  
Ry  
Rr  
Rp  
Rn  
Rm  
Rk  
Rh  
Rg  
Rf  
Re  
Rd  
Rc  
Rb  
Ra  
Qy  
Qr  
Qp  
Qn  
Qm  
Qk  
Qh  
Qg  
Qf  
Qe  
Qd  
Qc  
Qb  
Qa  
Py  
Pr  
Pp  
Pn  
Pm  
Pk  
BD53E60  
BD53E59  
BD53E58  
BD53E57  
BD53E56  
BD53E55  
BD53E54  
BD53E53  
BD53E52  
BD53E51  
BD53E50  
BD53E49  
BD53E48  
BD53E47  
BD53E46  
BD53E45  
BD53E44  
BD53E43  
BD53E42  
BD53E41  
BD53E40  
BD53E39  
BD53E38  
BD53E37  
BD53E36  
BD53E35  
BD53E34  
BD53E33  
BD53E32  
BD53E31  
BD53E30  
BD53E29  
BD53E28  
BD53E27  
BD53E26  
BD53E25  
BD53E24  
BD53E23  
Me  
Md  
Mc  
Mb  
Ma  
Ly  
Lr  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
2/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Absolute maximum ratings  
Parameter  
Symbol  
Limits  
-0.3 to +10  
Unit  
Power Supply Voltage  
VDD-GND  
V
Nch Open Drain Output  
Output Voltage  
GND-0.3 to +10  
GND-0.3 to VDD+0.3  
80  
VOUT  
Io  
V
CMOS Output  
Output Current  
V
Power  
*1*2  
SSOP5  
Pd  
540  
mW  
Dissipation  
Operating Temperature  
Topr  
Tstg  
-40 to +105  
-55 to +125  
°C  
°C  
Ambient Storage Temperature  
*1 Reduced by 5.4mW/°C when used over 25°C.  
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).  
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)  
Limit  
Typ.  
Parameter  
Symbol  
Condition  
Unit  
Min.  
VDET(T)  
×0.99  
Max.  
VDET(T)  
×1.01  
*1  
VDET(T)  
VDD=HL, RL=470k  
Ta=+25°C  
2.475  
2.418  
2.404  
2.970  
2.901  
2.885  
3.267  
3.191  
3.173  
4.158  
4.061  
4.039  
4.752  
4.641  
4.616  
-
2.5  
2.525  
2.584  
2.597  
3.030  
3.100  
3.117  
3.333  
3.410  
3.428  
4.242  
4.341  
4.364  
4.848  
4.961  
4.987  
2.40  
2.55  
2.70  
2.85  
2.25  
2.40  
2.55  
2.70  
-
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
VDET=2.5V  
-
3.0  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
VDET=3.0V  
VDET=3.3V  
VDET=4.2V  
VDET=4.8V  
-
3.3  
Detection Voltage  
VDET  
V
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
-
4.2  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
Ta=+25°C  
-
-
4.8  
Ta=-40°C to 85°C  
Ta=85°C to 105°C  
VDET =2.3-3.1V  
VDET =3.2-4.2V  
VDET =4.3-5.2V  
VDET =5.3-6.0V  
VDET =2.3-3.1V  
VDET =3.2-4.2V  
VDET =4.3-5.2V  
VDET =5.3-6.0V  
-
-
0.80  
-
0.85  
Circuit Current when ON  
Circuit Current when OFF  
IDD1  
IDD2  
VDD=VDET-0.2V  
VDD=VDET+2.0V  
µA  
µA  
-
0.90  
-
0.95  
-
0.75  
-
0.80  
-
0.85  
-
0.90  
VOL0.4V, Ta=25 to 105°C, RL=470kΩ  
VOL0.4V, Ta=-40 to 25°C, RL=470kΩ  
VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V  
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V  
0.95  
1.20  
-
-
-
-
-
-
-
-
Operating Voltage Range  
‘Low’ Output Voltage (Nch)  
VOPL  
VOL  
V
V
-
0.5  
-
0.5  
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5  
VDD=6.0V, ISOURCE=0.9 mA, VDET(4.3V to 5.2V) VDD-0.5  
VDD=8.0V, ISOURCE=1.1 mA, VDET(5.3V to 6.0V) VDD-0.5  
-
‘High’ Output Voltage (Pch)  
VOH  
-
V
-
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)  
RL: Pull-up resistor to be connected between VOUT and power supply.  
Design Guarantee. (Outgoing inspection is not done on all products.)  
*1 Guarantee is at Ta=25°C.  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
3/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued  
Limit  
Typ.  
Parameter  
Symbol  
Ileak  
Condition  
Unit  
Min.  
Max.  
*1  
Leak Current when OFF  
VDD=VDS=10V  
-
-
0.1  
VDD  
×0.60  
µA  
VDD  
×0.30  
VDD  
×0.40  
VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ  
VDD  
×0.30  
VDD  
×0.35  
VDD  
×0.40  
5.5  
VDD  
×0.45  
VDD  
×0.50  
VDD  
×0.50  
9
VDD  
×0.60  
VDD  
×0.60  
VDD  
×0.60  
12.5  
-
VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ  
CT pin Threshold Voltage  
VCTH  
V
VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ  
VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ  
*1  
*1  
Output Delay Resistance  
CT pin Output Current  
RCT  
ICT  
VDD=VDET×1.1 VCT=0.5V  
VCT=0.1V VDD=0.95V  
VCT=0.5V VDD=1.5V  
MΩ  
15  
40  
µA  
150  
240  
-
Detection Voltage  
VDET/T Ta=-40°C to 105°C  
-
±100  
±360 ppm/°C  
Temperature coefficient  
VDET  
VDET  
VDET  
V
Hysteresis Voltage  
VDET VDD=LHL, RL=470kΩ  
×0.03  
×0.05  
×0.08  
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)  
RL: Pull-up resistor to be connected between VOUT and power supply.  
Design Guarantee. (Outgoing inspection is not done on all products.)  
*1 Guarantee is at Ta=25°C.  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
4/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Block Diagrams  
VDD  
V
OUT  
Vref  
GND  
CT  
Figure.1 BD52Exxx-M Series  
DD  
V
V
OUT  
Vref  
CT  
Figure.2 BD53Exxx-M Series  
GND  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
5/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Typical Performance Curves  
2.0  
18  
15  
12  
9
BD242GFVE  
BD52E42G-M】  
BD52E42G-M】  
BD53E42G-M】  
BD53E42G-M】  
1.5  
1.0  
0.5  
0.0  
VDD=2.4V  
6
3
VDD=1.2V  
2.0  
0
0.0  
0.5  
1.0  
1.5  
2.5  
0
1
2
3
4
5
6
7
8
9 10  
DRAIN-SOURCE VOLTAGE VDS[V]  
VDD SUPPLY VOLTAGE VDD[V]  
Figure.4 “Low” Output Current  
Figure.3 Circuit Current  
9
8
7
6
5
4
3
2
1
0
45  
40  
35  
30  
25  
20  
15  
10  
5
BD52E42G-M】  
BD53E42G-M】  
BD53E42G-M】  
VDD=8.0V  
VDD=6.0V  
Ta=25  
Ta=25  
VDD=4.8V  
0
0
1
2
3
4
5
6
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5  
DRAIN-SOURCE VOLTAGE VDS[V]  
VDD SUPPLY VOLTAGE VDD[V]  
Figure.5 “High” Output Current  
Figure.6 I/O Characteristics  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
6/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Typical Performance Curves – continued  
450  
400  
350  
300  
250  
200  
150  
100  
50  
1.0  
BD52E42G-M】  
BD52E42G-M】  
0.8  
0.6  
0.4  
0.2  
0.0  
BD53E42G-M】  
BD53E42G-M】  
0
0
1
2
3
4
5
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
VDD SUPPLY VOLTAGE VDD[V]  
VDD SUPPLY VOLTAGE VDD[V]  
Figure.8 CT Terminal Current  
Figure.7 Operating Limit Voltage  
5.6  
5.2  
4.8  
4.4  
4.0  
3.6  
3.2  
1.5  
1.0  
0.5  
0.0  
BD52E42G-M】  
BD52E42G-M
BD53E42G-M】  
BD53E42G-M】  
Lowto high(VDET  
+
VDET)  
Δ
High to low(VDET  
)
-40 -20  
0
20 40 60 80 100  
-40  
0
40  
80  
TEMPERATURE Ta[  
]
TEMPERATURE Ta[  
]
Figure.10 Circuit Current when ON  
Figure.9 Detection Voltage  
Release Voltage  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
7/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Typical Performance Curves – continued  
1.5  
1.0  
0.5  
0.0  
1.5  
BD52E42G-M
BD52E42G-M】  
BD53E42G-M】  
BD53E42G-M】  
1.0  
0.5  
0.0  
-40 -20  
0
20 40 60 80 100  
-40 -20  
0
20 40 60 80 100  
TEMPERATURE Ta[  
]
TEMPERATURE Ta[  
]
Figure.11 Circuit Current when OFF  
Figure.12 Operating Limit Voltage  
13  
12  
11  
10  
9
10000  
BD52E42G 】  
-M
BD52E42G-M】  
BD53E42G-M】  
1000  
100  
10  
BD53E42G-M】  
8
7
1
6
5
0.1  
4
0.0001  
0.001  
0.01  
0.1  
-40 -20  
0
20 40 60 80 100  
CAPACITANCE OF CT CCT[µF]  
TEMPERATURE Ta[  
]
Figure.14 Delay Time (tPLH) and  
CT Terminal External Capacitance  
Figure.13 CT Terminal Circuit Resistance  
www.rohm.com  
TSZ02201-0R7R0G300090-1-2  
22.May.2013 Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
8/12  
TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Application Information  
Explanation of Operation  
For both the open drain type (Figure.15) and the CMOS output type (Figure.16), the detection and release voltages are  
used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT  
terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and  
Electrical Characteristics for information on hysteresis. Because the BD52Exxx-M series uses an open drain output type, it  
is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this  
case becomes VDD or the voltage of the other power supply].  
DD  
V
DD  
V
DD  
V
L
R
Q2  
R1  
R2  
R1  
R2  
DD  
V
RESET  
Vref  
Vref  
RESET  
OUT  
V
OUT  
V
Q1  
Q1  
Q3  
Q3  
R3  
R3  
GND  
GND  
CT  
CT  
Figure.15 (BD52Exxx-MType Internal Block Diagram)  
Setting of Detector Delay Time  
It is possible to set the delay time at the rise of VDD using a capacitor connected to the Ct terminal.  
Figure.16 (BD53Exxx-MType Internal Block Diagram)  
Delay time at the rise of VDD  
voltage(VDET+VDET  
t
PLHTime until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release  
)
VDD-VCTH  
t
PLH = -CCT×RCT×ln  
VDD  
CCT  
RCT  
VCTH  
:
CT pin Externally Attached Capacitance  
:
CT pin Internal ImpedancePlease refer to Electrical Characteristics.)  
CT pin Threshold VoltagePlease refer to Electrical Characteristics.)  
:
ln : Natural Logarithm  
Reference Data of Falling Time (tPHL) Output  
Examples of Falling Time (tPHL) Output  
Part Number  
BD52E27G-M  
tPHL[µs] -40°C  
tPHL[µs] ,+25°C  
tPHL[µs],+105°C  
28.8  
30.8  
26.8  
30  
26  
BD53E27G-M  
24.8  
*This data is for reference only.  
The figures will vary with the application, so confirm actual operating conditions before use.  
Timing Waveforms  
Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output  
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in  
Figure.15 and 16).  
1
When the power supply is turned on, the output is unstable  
V
DD  
from after over the operating limit voltage (VOPL) until tPHL.  
Therefore it is possible that the reset signal is not outputted when  
the rise time of VDD is faster than tPHL.  
V
DET+ΔVDET  
DET  
V
2
When VDD is greater than VOPL but less than the reset release  
VOPL  
0V  
voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT)  
voltages will switch to L.  
V
CT  
3
1/2 VDD  
If VDD exceeds the reset release voltage (VDET+VDET), then  
VOUT switches from L to H (with a delay due to the CT terminal).  
4
If VDD drops below the detection voltage (VDET) when the  
power supply is powered down or when there is a power supply  
fluctuation, VOUT switches to L (with a delay of tPHL).  
V
OUT  
t
PLH  
t
PHL  
t
PLH  
5
The potential difference between the detection voltage and the  
t
PHL  
release voltage is known as the hysteresis width (VDET). The  
system is designed such that the output does not toggle with  
power supply fluctuations within this hysteresis width, preventing  
malfunctions due to noise.  
Figure.17 Timing Waveform  
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TSZ2211115001  
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Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Circuit Applications  
1) Examples of a common power supply detection reset circuit  
V
DD1  
VDD2  
Application examples of BD52Exxx series (Open Drain  
output type) and BD53Exxx series (CMOS output type)  
are shown below.  
R
L
Micro  
controller  
R
ST  
BD52Exxx-M  
CASE1: Power supply of the microcontroller (VDD2  
)
C
T
differs from the power supply of the reset detection  
(VDD1).  
C
L
Noise-filtering  
Capacitor)  
Use an open drain output type (BD52Exxx) with a load  
resistance RL attached as shown Figure.18.  
GND  
Figure.18 Open Drain Output Type  
CASE2: Power supply of the microcontroller (VDD1) is the  
same as the power supply of the reset detection (VDD1).  
Use a CMOS output type (BD53Exxx) device or open  
drain output type (BD52Exxx) device with a pull up  
V
DD1  
resistor attached between the output and VDD1  
.
Micro  
controller  
RST  
BD53Exxx-M  
When a capacitance CL for noise filtering is connected to  
the VOUT pin (the reset signal input terminal of the  
microcontroller), please take into account the waveform  
of the rise and fall of the output voltage (VOUT).  
C
T
C
L
Noise-filtering  
Capacitor)  
Please refer to Operational Notes for recommendations  
on resistor and capacitor values.  
GND  
Figure.19 CMOS Output Type  
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage  
resets the microcontroller.  
VDD1  
VDD2  
VDD3  
RL  
BD52Exxx-M  
NO.1  
BD52Exxx-M  
NO.2  
RST  
microcontroller  
CT  
CT  
GND  
Fig.20  
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain  
output type (BD52Exxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the  
microcontroller (VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is  
possible.  
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Datasheet  
BD52Exxx-M series BD53Exxx-M series  
3) Examples of the power supply with resistor dividers  
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow  
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of  
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow  
may cause malfunction in the systems operation such as output oscillations, etc.  
Figure.21  
V1  
IDD  
R2  
I1  
Through  
Current  
VDD  
BD52Exxx-M  
BD53Exxx-M  
R1  
VOUT  
CIN  
CL  
GND  
VDD  
VDET  
0
When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,  
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD  
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”  
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches  
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to  
oscillation.  
Figure.22  
IDD Peak Current vs. Power Supply Voltage  
* This data is for reference only.  
The figures will vary with the application, so please confirm actual operating conditions before use.  
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TSZ2211115001  
Datasheet  
BD52Exxx-M series BD53Exxx-M series  
Operational Notes  
1) Absolute maximum ratings  
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit  
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such  
as adding a fuse, in case the IC is operated over the absolute maximum ratings.  
2) Ground Voltage  
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no  
pins are at a voltage below the ground pin at any time, even during transient condition.  
3) Recommended operating conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
4) Bypass Capacitor for Noise Rejection  
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.  
Be careful when using extremely big capacitor as transient response will be affected.  
5) Short between pins and mounting errors  
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong  
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.  
6) Operation under strong electromagnetic field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
7) The VDD line impedance might cause oscillation because of the detection current.  
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.  
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)  
condition.  
10) External parameters  
The recommended value of RL Resistor is 50kto 1M. The recommended value of CT Capacitor is over 100pF to  
0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using  
practical applications.  
11) Power on reset operation  
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual  
operation.  
12) Testing on application boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
13) Rush current  
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to  
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special  
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.  
14) CT pin discharge  
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input  
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.  
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Daattaasshheeeett  
Notice  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
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aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales  
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responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHM’s Products for Specific Applications.  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
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H2S, NH3, SO2, and NO2  
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[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.004  
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Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
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isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
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please consult with ROHM representative in case of export.  
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concerning such information.  
2. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.004  
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配单直通车
BD530产品参数
型号:BD530
是否Rohs认证: 不符合
生命周期:Obsolete
包装说明:,
Reach Compliance Code:unknown
风险等级:5.9
最大集电极电流 (IC):2 A
配置:Single
最小直流电流增益 (hFE):60
JESD-609代码:e0
最高工作温度:140 °C
最低工作温度:-55 °C
极性/信道类型:PNP
最大功率耗散 (Abs):1 W
子类别:Other Transistors
表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)
标称过渡频率 (fT):100 MHz
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