BD6210F-E2原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

Datasheet

DC Brush Motor Drivers (7V max.)

BD621xxx Series

●General Description

●Key Specifications

These H-bridge drivers are full bridge drivers for brush

motor applications. Each IC can operate at a power

supply voltage range of 3.0V to 5.5V, with output

currents of up to 2A. MOS transistors in the output stage

allow PWM speed control. The integrated VREF voltage

control function allows direct replacement of deprecated

motor driver ICs. These highly efficient H-bridge driver

ICs facilitate low-power consumption design.

■

Supply Voltage Range:

Maximum Output Current:

Output ON resistance:

PWM Input frequency range:

Standby current:

Operating temperature range:

7V(Max.)

0.5A / 1.0A / 2.0A

1.0Ω / 1.0Ω / 0.5Ω

20 to 100kHz

0μA (Typ.)

-40 to 85℃

●Packages

SOP8

(Typ.)

(Max.)

5.00mm x 6.20mm x 1.71mm

13.60mm x 7.80mm x 2.11mm

9.395mm x 10.540mm x 2.005mm

●Features

HSOP25

HRP7

Built-in, selectable one channel or two channels

configuration

VREF voltage setting pin enables PWM duty control

Cross-conduction prevention circuit

Four protection circuits provided: OCP, OVP, TSD

and UVLO

●Applications

VTR; CD/DVD players; audio-visual equipment; optical

SOP8 (Pd=0.69W)

HRP7 (Pd=1.60W)

disc drives; PC peripherals; OA equipments

HSOP25 (Pd=1.45W)

*Pd : Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board.

●Ordering Information

B D

6

2

1

x

x -

x x

Package

Part Number

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/HSOP25)

TR: Embossed tape and reel

(HRP7)

F

: SOP8

FP

HFP

: HSOP25

: HRP7

●Lineup

Voltage rating

(Max.)

Output current

(Max.)

Ordering

Part Number

Channels

Package

HRP7

Reel of 2000 BD6210HFP-TR

Reel of 2500 BD6210F-E2

Reel of 2000 BD6211HFP-TR

Reel of 2500 BD6211F-E2

Reel of 2000 BD6212HFP-TR

Reel of 2000 BD6212FP-E2

0.5A

1.0A

2.0A

SOP8

HRP7

SOP8

HRP7

HSOP25

7V

1ch

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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BD621xxx Series

●Block Diagrams / Pin Configurations / Pin Descriptions

Table 1 BD6210F/BD6211F

BD6210F / BD6211F

1

Name

OUT1

VCC

FIN

Function

VREF

6

DUTY

PROTECT

Driver output

Power supply

3

2

VCC

2

FIN

RIN

4

5

3

CTRL

4

Control input (forward)

Control input (reverse)

Duty setting pin

Driver output

8

GND

5

RIN

1

7

6

VREF

OUT2

GND

OUT1

OUT2

Fig.1 BD6210F / BD6211F

7

8

Ground

OUT1

VCC

FIN

GND

OUT2

VREF

RIN

Note: Use all VCC pin by the same voltage.

Fig.2 SOP8 (TOP VIEW)

BD6210HFP / BD6211HFP / BD6212HFP

Table 2 BD6210HFP/BD6211HFP/BD6212HFP

1

Name

VREF

OUT1

FIN

Function

Duty setting pin

Driver output

VREF

DUTY

PROTECT

1

VCC

GND

7

4

2

FIN

RIN

3

5

3

Control input (forward)

Ground

CTRL

4

GND

RIN

5

Control input (reverse)

Driver output

FIN

2

6

OUT2

VCC

GND

OUT1

OUT2

Fig.3 BD6210HFP / BD6211HFP / BD6212HFP

7

Power supply

Ground

FIN

Fig.4 HRP7 (TOP VIEW)

BD6212FP

Table 3 BD6212FP

1,2

6

Name

OUT1

GND

RNF

OUT2

VREF

RIN

Function

Driver output

VREF

DUTY

PROTECT

17

VCC

21

22

23

Small signal ground

Power stage ground

Driver output

FIN

RIN

20

19

7,8

12,13

17

CTRL

7

8

RNF

Duty setting pin

Control input (reverse)

Control input (forward)

Power supply

6

FIN

1

2

12 13

OUT2

GND

OUT1

19

Fig.5 BD6212FP

20

FIN

21

VCC

GND

OUT1

NC

VCC

FIN

OUT1

NC

22,23

FIN

Power supply

NC

Ground

GND

Note: All pins not described above are NC pins.

Note: Use all VCC pin by the same voltage.

GND

RNF

NC

RIN

NC

VREF

NC

OUT2

NC

Fig.6 HSOP25 (TOP VIEW)

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●Absolute Maximum Ratings (Ta=25℃, All voltages are with respect to ground)

Parameter

Supply voltage

Symbol

VCC

I_OMAX

V_IN

Ratings

7

Unit

V

Output current

0.5 *¹/ 1.0 *²/ 2.0 *³

-0.3 to VCC

-40 to +85

A

All other input pins

Operating temperature

Storage temperature

Power dissipation

Junction temperature

V

T_OPR

T_STG

Pd

℃

W

℃

-55 to +150

0.687 *⁴/ 1.6 *⁵/ 1.45 *⁶

150

T_jmax

*1

*2

*3

*4

*5

*6

BD6210. Do not exceed Pd or ASO.

BD6211. Do not exceed Pd or ASO.

BD6212. Do not exceed Pd or ASO.

SOP8 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 5.5mW/℃ above 25℃.

HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/℃ above 25℃.

HSOP25 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 11.6mW/℃ above 25℃.

●Recommended Operating Ratings (Ta=25℃)

Parameter

Supply voltage

VREF voltage

Symbol

VCC

Ratings

3.0 to 5.5

1.5 to 5.5

Unit

V

VREF

V

●Electrical Characteristics (Unless otherwise specified, Ta=25℃ and VCC=VREF=5V)

Limits

Parameter

Symbol

Limits

Conditions

Min.

0.4

Min.

0.7

Min.

1.5

Supply current (1ch)

Stand-by current

I_CC

I_STBY

V_IH

mA

µA

V

Forward / Reverse / Brake

Stand-by

-

0

-

10

-

Input high voltage

2.0

-

Input low voltage

V_IL

-

0.8

100

1.5

1.0

10

V

Input bias current

I_IH

30

0.5

0.2

-10

20

50

1.0

0.5

0

µA

ꢀ

VIN=5.0V

Output ON resistance *¹

Output ON resistance *²

Output ON resistance *³

VREF bias current

Carrier frequency

R_ON

I_VREF

F_PWM

F_MAX

IO=0.25A, vertically total

IO=0.5A, vertically total

IO=1.0A, vertically total

VREF=VCC

ꢀ

µA

kHz

25

-

35

VREF=3.75V

Input frequency range

100

FIN / RIN

*1

*2

*3

BD6210

BD6211

BD6212

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●Typical Performance Curves (Reference data)

1.5

1.0

0.5

0.0

-0.5

1.0

0.8

0.6

0.4

0.2

0.0

85°C

25°C

-40°C

25°C

85°C

-40°C

25°C

85°C

1

1.2

1.4

1.6

1.8

2

3

4

5

6

Input Voltage: VIN [V]

Supply Voltage: Vcc [V]

Fig.7 Supply current (1ch)

Fig.8 Input threshold voltage

10

5

100

80

60

40

20

0

-40°C

25°C

85°C

25°C

-40°C

0

-5

-10

0

1

2

3

4

5

0

1

2

3

4

5

6

Input Voltage: VREF [V]

Input Voltage: VIN [V]

Fig.9 Input bias current

Fig.10 VREF input bias current

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●Typical Performance Curves (Reference data) - Continued

35

30

25

20

1.0

0.8

0.6

0.4

85°C

25°C

-40°C

25°C

85°C

0.2

0.0

3

4

5

6

0

0.2

0.4

0.6

0.8

1

Supply Voltage: VCC [V]

Input Voltage: VREF / VCC [V]

Fig.12 VCC - Carrier frequency

Fig.11 VREF - DUTY

(VCC=5V)

6.0

4.0

2.0

0.0

9.0

6.0

3.0

0.0

85°C

25°C

-40°C

25°C

85°C

6

6.5

7

7.5

8

1.5

2

2.5

Supply Voltage: VCC [V]

Fig.13 Under voltage lock out

3

3.5

SupplyVoltage: VCC [V]

Fig.14 Over voltage protection

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●Typical Performance Curves (Reference data) - Continued

1.5

1.0

0.5

0.0

-0.5

1.5

1.0

0.5

0.0

-0.5

85°C

25°C

-40°C

1.5

2

2.5

3

125

150

175

200

Load Current / Iomax: Normalized

Junction Temperature: Tj [°C]

Fig.15 Thermal shutdown

Fig.16 Over current protection (H side)

1.5

1.0

0.5

0.0

-0.5

0.4

0.3

0.2

0.1

0

85°C

25°C

85°C

25°C

-40°C

1

1.5

2

2.5

0

0.1

Output Current: IOUT [A]

Fig.18 Output high voltage (BD6210)

0.2

0.3

0.4

0.5

Load Current / Iomax: Normalized

Fig.17 Over current protection (L side)

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●Typical Performance Curves (Reference data) - Continued

0.8

0.6

0.4

0.2

0

0.8

85°C

25°C

-40°C

85°C

25°C

-40°C

0.6

0.4

0.2

0

0.4

0.8

Output Current: IOUT [A]

Fig.20 Output high voltage(BD6212)

1.2

1.6

2

0

0.2

Output Current: IOUT [A]

Fig.19 Output high voltage (BD6211)

0.4

0.6

0.8

1

2

1.5

1

2

1.5

1

-40°C

25°C

85°C

-40°C

25°C

85°C

0.5

0

0.5

0

0.1

0.2

0.3

0.4

0.5

0

0.2

0.4

0.6

0.8

1

Output Current: IOUT [A]

Fig.21 High side body diode (BD6210)

Fig.22 High side body diode (BD6211)

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●Typical Performance Curves (Reference data) - Continued

2

0.4

0.3

0.2

0.1

0

85°C

25°C

-40°C

25°C

85°C

1.5

1

0.5

0

0.4

0.8

1.2

1.6

2

0

0.1

0.2

0.3

0.4

0.5

Output Current: IOUT [A]

Fig.23 High side body diode (BD6212)

Fig.24 Output low voltage (BD6210)

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

85°C

25°C

-40°C

85°C

25°C

-40°C

0

0.2

0.4

Output Current: IOUT [A]

Fig.25 Output low voltage (BD6211)

0.6

0.8

1

0

0.4

0.8

Output Current: IOUT [A]

Fig.26 Output low voltage (BD6212)

1.2

1.6

2

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●Typical Performance Curves (Reference data) - Continued

2

1.5

1

2

-40°C

25°C

85°C

-40°C

25°C

85°C

1.5

1

0.5

0

0.5

0

0.2

0.4

Output Current: IOUT [A]

Fig.28 Low side body diode (BD6211)

0.6

0.8

1

0

0.1

0.2

0.3

0.4

0.5

Output Current: IOUT [A]

Fig.27 Low side body diode (BD6210)

2

1.5

1

-40°C

25°C

85°C

0.5

0

0.4

0.8

Output Current: IOUT [A]

Fig.29 Low side body diode (BD6212)

1.2

1.6

2

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●Functional Descriptions

1) Operation modes

Table 4 Logic table

FIN

RIN

VREF

X

OUT1

OUT2

Hi-Z*

L

Operation

a

b

c

d

e

f

L

Hi-Z*

Stand-by (idling)

H

L

H

VCC

X

H

L

Forward (OUT1 > OUT2)

Reverse (OUT1 < OUT2)

Brake (stop)

L

H

L

__________

PWM

L

VCC

Option

H

Forward (PWM control mode A)

Reverse (PWM control mode A)

Forward (PWM control mode B)

Reverse (PWM control mode B)

Forward (VREF control)

PWM

__________

PWM

__________

PWM

H

L

__________

PWM

__________

PWM

g

h

i

H

PWM

H

L

H

__________

j

L

H

Reverse (VREF control)

PWM

* Hi-Z i: all output transistors are off. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay.

X : Don’t care

a) Stand-by mode

Stand-by operates independently with the VREF pin voltage. In stand-by mode, all internal circuits are turned off,

including the output power transistors. Motor output goes to high impedance. When the system is switched to

stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However,

when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in

the high state for at least 50µs before shutting down all circuits.

b) Forward mode

This operating mode is defined as the forward rotation of the motor when the OUT1 pin is high and OUT2 pin is low.

When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. To operate

in this mode, connect the VREF pin to the VCC pin.

c) Reverse mode

This operating mode is defined as the reverse rotation of the motor when the OUT1 pin is low and OUT2 pin is high.

When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. To operate

in this mode, connect the VREF pin to the VCC pin.

d) Brake mode

This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode

because the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the

brake mode) to save power and reduce consumption.

OFF

OFF ON

OFF OFF

ON OFF

OFF ON

OFF

ON

M

ON

a) Stand-by mode

b) Forward mode

c) Reverse mode

d) Brake mode

Fig.30 Four basic operations (output stage)

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e) f) PWM control mode A

The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the

RIN pin. In this mode, the high side output is fixed and the low side output is switching, corresponding to the input

signal. The state of the output toggles between "L" and "Hi-Z".

The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for

PWM frequencies below 20kHz and above 100kHz. Note that control may not be attained by switching on duty at

frequencies lower than 20kHz, since the operation functions via the stand-by mode. To operate in this mode,

connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor,

by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground.

ON

OFF

ON

OFF

M

OFF

Control input : H

Control input : L

Fig.31 PWM control mode A operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.32 PWM control mode A operation (timing chart)

g) h) PWM control mode B

The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the

RIN pin. In this mode, the low side output is fixed and the high side output is switching, corresponding to the input

signal. The state of the output toggles between "L" and "H".

The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for

PWM frequencies below 20kHz and above 100kHz. To operate in this mode, connect the VREF pin to the VCC pin.

In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF

or higher is recommended) between VCC and ground.

ON

OFF

ON

OFF

M

OFF

Control input : H

Control input : L

Fig.33 PWM control mode B operation (output stage)

FIN

RIN

OUT1

OUT2

Fig.34 PWM control mode B operation (timing chart)

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i) j) VREF control mode

The built-in VREF duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the VREF pin

and the VCC voltage. The function offers the same level of control as the high voltage output setting function in

previous models. The duty cycle is calculated by the following equation.

DUTY ≈ VREF [V] / VCC [V]

For example, if VCC voltage is 5V and VREF pin voltage is 3.75V, the duty cycle is about 75 percent. However,

please note that the duty cycle might be limited by the range of the VREF pin voltage (Refer to the operating

conditions, shown on page 2). The PWM carrier frequency in this mode is 25kHz (nominal), and the switching

operation is the same as the PWM control modes. When operating in this mode, do not input a PWM signal to the

FIN and RIN pins. In addition, establish a current path for the recovery current from the motor, by connecting a

bypass capacitor (10µF or more is recommended) between VCC and ground.

VCC

VREF

0

FIN

RIN

OUT1

OUT2

Fig.35 VREF control operation (timing chart)

2) Cross-conduction protection circuit

In the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low

or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. This circuit

eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition.

3) Output protection circuits

a) Under voltage lock out (UVLO) circuit

To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage

malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 2.3V (nominal) or

below, the controller forces all driver outputs to high impedance. When the voltage rises to 2.5V (nominal) or above,

the UVLO circuit ends the lockout operation and returns the chip to normal operation.

b) Over voltage protection (OVP) circuit

When the power supply voltage exceeds 7.3V (nominal), the controller forces all driver outputs to high impedance.

The OVP circuit is released and its operation ends when the voltage drops back to 6.8V (nominal) or below. This

protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is

asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this

circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed.

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c) Thermal shutdown (TSD) circuit

The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175°C

nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided

in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset

temperature (150°C nominal). Thus, it is a self-resetting circuit.

The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or

guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is

activated, and do not operate the IC in an environment where activation of the circuit is assumed.

d) Over current protection (OCP) circuit

To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors

the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over

current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC

returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this

circuit works independently for each channel.

Threshold

Iout

0

CTRL Input

Internal status

Monitor / Timer

ON

mon.

OFF

ON

off timer

Fig.36 Over current protection (timing chart)

●I/O equivalent circuit

VCC

VREF

100k

10k

FIN

RIN

OUT1

OUT2

OUT1

OUT2

GND

RNF

GND

Fig.37 FIN / RIN

Fig.38 VREF

Fig.39 OUT1 / OUT2

Fig.40 OUT1 / OUT2

(HSOP25)

(SOP8/HRP7)

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●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Reverse connection of power supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply terminals.

3) Power supply lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply

lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting

the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of

temperature and aging on the capacitance value when using electrolytic capacitors.

4) GND Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that

no pins are at a voltage below the ground pin at any time, even during transient condition.

5) Thermal consideration

Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd)

in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd).

Package Power dissipation

Power dissipation

: Pd (W)=(Tjmax－Ta)/θja

: Pc (W)=(Vcc－Vo)×Io+Vcc×Ib

Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] ,

θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],

Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current

6) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the

pins.

7) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8) Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

9) Capacitor between output and GND

If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor can flow

into the output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a

capacitor smaller than 10uF between output and GND.

10) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

11) Switching noise

When the operation mode is in PWM control or VREF control, PWM switching noise may affect the control input pins

and cause IC malfunctions. In this case, insert a pull down resistor (10kꢀ is recommended) between each control

input pin and ground.

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12) Regarding the input pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

C

E

Pin A

B

C

E

N

P⁺

N

P⁺

P

Parasitic

element

P

N

P substrate

Parasitic

element

GND

Parasitic element

Other adjacent elements

Fig.41 Example of monolithic IC structure

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●Physical Dimensions Tape and Reel Information

SOP8

5.0 0.2

(MAX 5.35 include BURR)

Tape

Embossed carrier tape

2500pcs

+

−

6

°

4°

4

°

Quantity

8

1

7

6

5

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

2

3

4

0.595

+0.1

0.17

-

0.05

S

0.1

S

1.27

Direction of feed

1pin

0.42 0.1

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

HSOP25

13.6 0.2

(MAX 13.95 include BURR)

Tape

Embossed carrier tape

Quantity

2000pcs

2.75 0.1

25

14

13

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

0.25 0.1

1.95 0.1

S

0.1

S

0.8

0.36 0.1

12.0 0.2

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

HRP7

9.395 0.125

(MAX 9.745 include BURR)

Tape

Embossed carrier tape

1.905 0.1

8.82 0.1

(6.5)

Quantity

2000pcs

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

1

2

3

4

5 6 7

0.8875

+

−

5.5°

4.5°

+0.1

0.27

-

0.05

0.73 0.1

S

1.27

Direction of feed

0.08 S

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

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●Marking Diagrams

SOP8(TOP VIEW)

HSOP25 (TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

HRP7 (TOP VIEW)

Part Number Marking

LOT Number

Part Number

Package

HRP7

Part Number Marking

BD6210HFP

6210

BD6210HFP

BD6210F

SOP8

BD6211HFP

BD6211F

HRP7

BD6211HFP

6211

SOP8

BD6212HFP

BD6212FP

HRP7

BD6212HFP

BD6212FP

HSOP25

1PIN MARK

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●Revision History

Date

Revision

Changes

14.Mar.2012

001

002

New Release

Improved the statement in all pages.

Deleted “Status of this document” in page 15.

25.Dec.2012

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Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Notice - Rev.004

Daattaasshheeeett

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Notice - Rev.004

Daattaasshheeeett

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.004

型号:	BD6210F-E2
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	ROHM CO LTD
零件包装代码：	SOIC
包装说明：	SOP, SOP8,.25
针数：	8
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	9 weeks
风险等级：	0.98
Samacsys Description：	ROHM BD6210F-E2, Full Bridge Motor Driver Half-Bridge,, 8-Pin SOP
模拟集成电路 - 其他类型：	BRUSH DC MOTOR CONTROLLER
JESD-30 代码：	R-PDSO-G8
长度：	5 mm
功能数量：	1
端子数量：	8
最高工作温度：	85 °C
最低工作温度：	-40 °C
最大输出电流：	0.5 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5 V
认证状态：	Not Qualified
子类别：	Motion Control Electronics
最大供电电流 (Isup)：	1.5 mA
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	3 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	4.4 mm

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