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产品型号BD7861KN-E2的Datasheet PDF文件预览

Audio Accessory ICs for Mobile Devices  
Mixer & Selector IC  
with PCM CODEC and 16bit D/A Converter  
No.10087EAT04  
BU7861KN  
Description  
The “In/Output Selector with Built-in PCM Codec 16bit D/A Converter” LSI is ideal for improving the sound quality of and  
miniaturizing cellular phone handsets with music playback function, accumulating analog circuits for sound which application  
CPUs and bass band LSIs are not ideally able to handle.  
Features  
1) Loaded with stereo 16bit audio D/A converter  
2) Compatible with stereo and analog interfaces  
3) Built-in stereo headphone amp (16Ω)  
4) Lowpass correction circuit built into the headphone amp  
5) Gain-adjustable volume built in  
6) Flexible mixing function built in  
Applications  
Portable information communication devices such as cellular phone handsets and PDA (Personal Digital Assistants)  
Cellular phone handsets with music playback function  
Absolute maximum ratings  
Parameter  
Supply Voltage  
Symbol  
Ratings  
-0.3 4.5  
500 *1  
Unit  
V
DVDD  
AVDD, PVDD  
Power Dissipation  
Pd  
mW  
Operational Temperature Range  
Storage Temperature Range  
TOPR  
TSTG  
-25 +80  
-55 +125  
*1 When used at over Ta=25, lessen by 5.0mW per 1increase.  
Operating conditions  
Ratings  
Typ.  
Parameter  
Symbol  
Unit  
Min.  
2.7  
Max.  
3.3  
Digital Supply Voltage  
DVDD  
AVDD  
3.0  
3.0  
3.0  
8
V
V
Analog Supply Voltage  
2.7  
2.7  
3.3  
3.3  
Power Supply Voltage  
PVDD  
FSYNC  
V
PLL Synchronous Signal Frequency  
kHz  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
1/13  
Technical Note  
BU7861KN  
Electrical characteristics (Unless specified, Ta=25, DVDD=AVDD=3.0V, PVDD=3.0V, FSYNC=8kHz)  
Complete Block  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
Typ.  
0.1  
Max.  
10  
Consumed Current 1  
IDD1  
IDD2  
IDD3  
IDD4  
IDD5  
IDD6  
IDD7  
IDD8  
IDD9  
IDD10  
IDD11  
IDD12  
VIH  
µA When all power down, FSYNC L fixed  
mA REFON, FSYNC L fixed  
Consumed Current 2  
0.8  
1.7  
1.6  
1.0  
5.9  
6.4  
2.2  
2.9  
2.2  
10.0  
18.0  
1.2  
2.6  
2.4  
1.5  
9.0  
9.6  
3.3  
4.5  
3.3  
15.0  
27.0  
Consumed Current 3  
mA REFON+PLLON, FSYNC=8kHz  
mA REFON+MICBON, FSYNC L fixed  
mA REFON+EXTOUT, FSYNC L fixed  
Consumed Current 4  
Consumed Current 5  
REFON+PLLON+VICON,  
FSYNC=8kHz  
Consumed Current 6  
mA  
REFON+PLLON+VICON+TONEON,  
FSYNC=8kHz  
Consumed Current 7  
mA  
Consumed Current 8  
mA REFON+RECON, FSYNC L fixed  
mA REFON+HPON, FSYNC L fixed  
Consumed Current 9  
REFON+ HPVOLON, FSYNC  
Consumed Current 10  
Consumed Current 11  
Consumed Current 12  
Digital High Level Input Voltage  
Digital Low Level Input Voltage  
Digital High Level Input Current  
Digital Low Level Input Current  
mA  
L fixed  
mA DACON, SYSCLK=256fs  
All power on  
mA  
FSYNC=8kHz SYSCLK=256fs  
0.8×  
DVDD  
V
0.2×  
DVDD  
VIL  
V
IIH  
10  
µA VIH=DVDD  
µA VIL=0V  
IIL  
-10  
Digital High Level Output  
Voltage  
DVDD  
-0.5  
VOH  
VOL  
Vhys  
V
V
V
IOH=-1mA  
IOL=1mA  
Digital Low Level Output  
Voltage  
0.5  
0.7  
SYSCLK, BCLK, LRCLK, FSYNC,  
DSPCLK  
Schmidt Input Hysteresis Width  
0.3  
0.5  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
2/13  
Technical Note  
BU7861KN  
Sound Block  
Parameter  
Limits  
Typ.  
Unit  
dB  
Conditions  
Min.  
-3  
Max.  
+3  
Reference level (-20dB due to full scale)  
f=20Hz20kHz -3dB band width  
Frequency Characteristics  
DAC Full Scale  
1.8  
-
1.4  
-
2.2  
±1.5  
1
VP-P 0.6×VDD  
Difference between Lch and Rch levels during  
Gain Error between Channels  
Distortion (No Bass Boost)  
Distortion (With Bass Boost)  
S/N  
dB  
%
DAC full scale  
DAC input=-0.5dBFS, HP_VOL=-2dB,  
HP2_VOL=0dB  
75  
70  
70  
83  
80  
80  
DAC input=-0.5dBFS, HP_VOL=-2dB,  
HP2_VOL=0dB  
10  
%
During full scale  
dB HP_VOL, HP2_VOL=0dB, f=1kHz, A-weighted  
Stereo headphone amp included  
Measures the leak from Lch to Rch during  
full-scale output. 1kHz BPF  
Crosstalk  
dB  
Output Level during Mute  
dB 1kHz BPF  
Driver Amp Block  
Limits  
Typ.  
Parameter  
Unit  
Conditions  
Min.  
Max.  
Gain Configurable Range  
(THD1%)  
40  
60  
1.0  
66  
dB f=100Hz3.4kHz  
Vrms MICO terminal, f=1kHz  
dB C-Message  
Maximum Output Voltage  
(THD1%)  
Microphone Amp  
S/N  
100Hz  
12  
25  
20  
35  
0.2VP-P superimposed to supply  
dB  
PSRR  
1kHz  
COMIN 1.0µF, MICIN no input  
Load  
26  
31.25  
80  
32  
45  
90  
5
Ω
Maximum Output Power  
(THD1%)  
mW RL=32Ω, f=1kHz  
dB RL=32Ω, C-Message  
mV  
Receiver Amp  
S/N  
Offset Voltage  
100  
100Hz  
65  
60  
77  
70  
0.2VP-P superimposed to supply  
COMIN 1.0µF  
PSRR  
1kHz  
dB  
Load  
12  
15  
16  
25  
Ω
Stereo  
Headphone Amp  
Maximum Output Power  
(THD1%)  
mW RL=16Ω, f=1kHz  
100Hz  
15  
40  
26  
48  
0.2VP-P superimposed to supply  
dB  
PSRR  
1kHz  
COMIN 1.0µF, HP_Vol=0dB  
Maximum Output Voltage  
(THD1%)  
SPOUT Terminal  
0.707  
0.707  
Vrms RL=10kΩ, f=1kHz  
Vrms RL=3kΩ, f=1kHz  
EXTOUT  
Terminal  
Maximum Output Voltage  
(THD1%)  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
3/13  
Technical Note  
BU7861KN  
Codec Block  
Limits  
Parameter  
Unit  
Conditions  
Min. Typ. Max.  
MICIN→  
DSPOUT  
When 1020Hz, sine wave, 0dBm0 transmitting  
MIC amp gain 0dB, Tx_Vol 0dB  
0.44 0.50 0.56 Vrms  
0.119 0.135 0.151 Vrms  
0.44 0.50 0.56 Vrms  
0.44 0.50 0.56 Vrms  
0.44 0.50 0.56 Vrms  
Transmitting Side  
Reference Input Level  
EXTIN→  
DSPOUT  
When 1020Hz, sine wave, 0dBm0 transmitting  
Amp gain 11.37dB, Tx_Vol 0dB  
DSPIN→  
RECP  
At 1020Hz, sine wave, 0dBm0 input  
Rx_Vol 0dB  
Receiving Side  
Reference Input Level  
DSPIN→  
SPOUT  
At 1020Hz, sine wave, 0dBm0 input  
Rx_Vol 0dB  
DSPIN→  
EXTOUT  
At 1020Hz, sine wave, 0dBm0 input  
Rx_Vol 0dB  
EXTIN→  
RECN  
EXTIN input, Rx_testline path  
Rx_Vol 0dB  
2.4  
2.4  
3.2  
3.2  
4.0  
4.0  
dB  
dB  
Pass Gain  
EXTIN→  
SPOUT  
EXTIN input, Rx_testline path  
SPRX_Vol 0dB  
Transmitter Signal vs.  
General  
Power Distortion  
-45dBm0  
-40dBm0  
0, -30dBm0  
-45dBm0  
-40dBm0  
0, -30dBm0  
-55dBm0  
-50dBm0  
0, -40dBm0  
-55dBm0  
-50dBm0  
0, -40dBm0  
0.06kHz  
24  
29  
1020Hz, sine wave,  
dB MIC amp gain 0dB  
Tx_Vol 0dB, C-MESSAGE  
35  
MICINDSPOUT  
Receiver Signal vs.  
General  
Power Distortion  
24  
1020Hz, sine wave  
dB  
29  
Rx_Vol 0dB, C-MESSAGE  
35  
DSPINRECP  
-0.9  
-0.6  
-0.3  
-0.9  
-0.6  
-0.3  
24  
0.9  
0.6  
0.3  
0.9  
0.6  
0.3  
Transmitter  
Transmission Level  
MICINDSPOUT  
1020Hz, -10dBm0 typical  
dB MIC amp gain 0dB  
Tx_Vol 0dB, C-MESSAGE  
Receiver  
Transmission Level  
DSPINRECP  
1020Hz, -10dBm0 typical  
dB  
Rx_Vol 0dB, C-MESSAGE  
0.2kHz  
0
2.5  
0.3  
0.9  
Transmitter  
Transmission Loss  
F Special  
1020Hz, 0dBm0 at transmission  
dB MIC amp gain 0dB  
Tx_Vol 0dB  
0.33.0kHz  
3.4kHz  
-0.3  
-0.3  
0
MICINDSPOUT  
3.6kHz  
3.78kHz  
6.5  
-0.3  
-0.3  
0.0  
6.5  
0.33.0kHz  
3.4kHz  
0.5  
0.9  
Receiver  
Transmission Loss  
F Special  
1020Hz, 0dBm0 at input  
Rx_Vol 0dB  
dB  
3.6kHz  
DSPINRECP  
3.78kHz  
Noise during idle  
transmission  
MICIN→  
DSPOUT  
MIC amp gain 0dB  
Tx_Vol 0dB, C-MESSAGE  
-65 dBm0  
-75 dBV  
Noise during idle  
reception  
DSPIN→  
REC[P-N]  
DSPIN ALL0  
Rx_Vol 0dB, C-MESSAGE  
1020Hz, 0dBm0 at transmission  
MIC amp gain 0dB  
DSPIN ALL0 Tx_Vol 0dB  
Crosstalk  
(Transmitter→  
Receiver)  
MICIN→  
REC[P-N]  
60  
70  
dB  
Rx_Vol 0dB  
ST_MT OFF  
1020Hz, 0dBm0 at input, 2040Hz component  
MIC amp gain 30dB  
Crosstalk  
(Receiver→  
Transmitter)  
DSPIN→  
DSPOUT  
63  
40  
68  
50  
dB  
dB  
Tx_Vol 0dB  
ST_MT ON  
Rx_Vol 0dB  
RX Higher Harmonic  
Component  
Distortion  
1020Hz, sine wave, 0dBm0 at input  
Rx_Vol 0dB  
2nd to 5th time  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
4/13  
Technical Note  
BU7861KN  
Pass Switch Block  
Parameter  
Limits  
Typ.  
Unit  
dB  
Conditions  
Min.  
70  
Max.  
Configured at each mute SW  
Measured at 1kHz BPF  
1  
2  
80  
80  
Mute Level  
Configured at each mute SW  
Leakage amount to each test line during  
normal usage  
70  
dB  
Measured at 1kHz BPF  
Receiving side is muted digitally by VIC_MT and SPVIC_MT.  
1 MIC_SEL, MIC_MT, EXTIN_MT, MEL_MT, VIC_MT, REC_MT, ST_MT, HSJL_MT, HSJR_MT, SPVIC_MT, SPMEL_VOL,  
EXTOUT_SEL, TONE_MT, SOUND_MT, DIG_MT, AIN_MT, HP_SMT, SPOUT_SMT, EXTOUT_SMT, REC_SMT, HPR_MT, HPL_MT  
2 Tx_test1, Tx_test2, Rx_test1, Rx_test2, REC_TST, HPR_TST, HPL_TST  
DTMF/TONE Generator Block  
Limits  
Typ.  
Parameter  
Symbol  
VDTMF_L  
VDTMF_H  
VTONE_L  
VTONE_H  
SDTN  
Unit  
Conditions  
Min.  
Max.  
f:DTMF_L  
MEL_Vol 0dB  
TONERECP  
Rx_Vol 0dB  
-15.3  
-14.3  
-13.3 dBV  
-10.8 dBV  
-13.3 dBV  
-10.8 dBV  
f:DTMF_H  
MEL_Vol 0dB  
TONERECP  
Rx_Vol 0dB  
-12.8  
-15.3  
-12.8  
-11.8  
-14.3  
-11.8  
Output Level  
f: designated TONE, low band TONERECP  
MEL_Vol 0dB Rx_Vol 0dB  
f: designated TONE, high band TONERECP  
MEL_Vol 0dB Rx_Vol 0dB  
f=1kHz ( designated TONE) TONEREC[P-N]  
Tone Distortion  
-38  
dB  
MEL_Vol 0dB  
Rx_Vol 0dB C-Message  
Microphone Bias Block  
Limits  
Typ.  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
1.8  
Max.  
2.2  
Output Voltage  
VO  
IO  
2.0  
V
Io=500µA  
Maximum  
Output Current  
2
30  
mA  
Load Stability  
ΔVO1  
N
14.0  
-109  
mV Io=100µA2mA  
dBV C-Message Io=500µA  
Output Noise Voltage  
-90  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
5/13  
Technical Note  
BU7861KN  
Reference data  
19  
2.0  
1.5  
1.0  
0.5  
0.0  
1.0  
0.8  
Vdd=3.4V  
18  
0.6  
0.4  
Vdd=3.4V  
Vdd=3.0V  
Lch  
0.2  
17  
Vdd=3.0V  
0.0  
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
16  
Rch  
Vdd=2.6V  
15  
Vdd=2.6V  
14  
-50  
0
50  
100  
0
5000  
10000  
15000  
20000  
-50  
0
50  
Temperature[  
100  
Frequency [Hz]  
Temperature [  
]
]
Fig.3 16bit D/A Converter  
Frequency characteristics@ 0dBFS  
Fig.1 Operational Current  
(All On)  
Fig.2 Static Consumed Current  
-40  
-50  
-60  
-70  
-80  
-90  
0
0
-20  
-20  
Lch  
-40  
-60  
-40  
-60  
Rch  
-80  
-80  
-100  
-120  
-140  
-100  
-120  
-140  
-60  
-40  
-20  
0
0
5000  
10000  
15000  
20000  
0
5000  
10000  
15000  
20000  
Frequency [Hz]  
Frequency [Hz]  
DAC Output Lev el [dBFS]  
Fig.5 16bit D/A Converter  
FFT @ 0dBFS, 1kHz  
Fig.4 16bit D/A Converter  
Distortion @ 1kHz  
Fig.6 16bit D/A Converter  
FFT @ 0FS  
2
0
2
0
10  
6dB  
0
-10  
-20  
-30  
-40  
-50  
-60  
2dB  
4dB  
4dB  
8dB  
-2  
-2  
2dB  
10dB  
12dB  
-4  
-4  
6dB  
8dB  
-6  
-6  
14dB  
-8  
-8  
10dB  
12dB  
-10  
-12  
-14  
-16  
-10  
-12  
-14  
-16  
14dB  
10  
100  
1000  
10000  
100000  
10  
100  
1000  
10000  
100000  
0
1000  
2000  
Frequency [Hz]  
3000  
4000  
Frequency [Hz]  
Frequency [Hz]  
Fig.9 Voice CODEC  
TX Frequency Characteristics  
Fig.8 Bus Boost + High Pass Emphasis  
Frequency Characteristics  
Fig.7 Bus Boost Frequency  
Characteristics  
2
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
0
-2  
-4  
-6  
-8  
-10  
-12  
0
10  
20  
30  
40  
50  
0
1000  
2000  
3000  
4000  
0
20  
40  
60  
80  
100  
Output Power [mW]  
Frequency [Hz]  
Output Power [mW]  
Fig.10 Voice CODEC  
RX Frequency Characteristics  
Fig.11 Headphone Amp  
Output Characteristics @ vdd=3.0V, 1kHz  
Fig.12 Receiver Amp  
Output Characteristics @ vdd=3.0V, 1kHz  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
6/13  
Technical Note  
BU7861KN  
Block diagrams  
MICB_1  
MICB_2  
MIC_BIAS  
MIC BIAS  
CPU I/F  
VREF/COMMON  
16step  
VDD/VSS  
SMUTE  
POP  
MICO  
MICIN_C  
MICIN_1  
MICIN_2  
100kΩ  
MIC_MT  
100kΩ  
TX_TEST1  
-
+
-
+
A/D  
BPF  
TX_VOL  
MIC_SEL  
27kΩ  
+6-8dB  
DSPCLK  
DSPIN  
RX_TEST1  
EXTIN  
EXTIN_MT  
Tx_testline  
Rx_testline  
EXTGND  
DSPOUT  
330kΩ  
DSP  
I/F  
EXTOUT  
8step  
TX_TEST2  
EXTOUT  
RECN  
ST_VOL  
-18-42dB  
ST_MT  
60kΩ  
EXTOUT_SMT  
60kΩ  
100kΩ  
Gain=3.2dB  
VIC_MT  
32step  
REC_MT  
100kΩ  
-
+
D/A  
LPF  
-
+
RX_VOL  
41.7kΩ  
RX_TEST2  
0-30dB  
32step  
PLLLPF  
FSYNC  
100kΩREC_TST  
+6-54dB  
PLL  
100kΩ  
MEL_VOL  
40kΩ  
TONE_MT  
60kΩ MEL_MT  
40kΩ  
DTMF/  
TONE  
-
+
RECP  
100kΩ  
-
+
Gain=3.2dB  
REC_SMT  
SPVIC_MT  
41.7kΩ  
60kΩ  
16step  
+6-8dB  
32step  
SPMEL_VOL  
-
+
SPRX_VOL  
SPOUT  
60k  
Ω
SPMEL_MT  
SOUND_MT  
16step  
0-30dB  
0-28dB  
SPOUT_SMT  
AIN_R  
AIN_L  
50kΩ  
AIN_MT  
AIN_VOL  
HPR_TST  
80kΩ  
80kΩ  
50kΩ  
50kΩ  
HPL_TST  
Gain=+3dB  
70.8kΩ  
HSJL_MT  
SYSCLK  
SDI  
100kΩ  
200kΩ 100kΩ  
200kΩ  
32step  
0-45dB  
HP_LI  
-
+
-
+
HP2_VOL  
25kΩ  
25kΩ  
HPL_MT  
HSJR_MT  
8step  
+140dB  
100kΩ  
-
HP_L  
HP_R  
+
DIG_MT  
LRCLK  
BCLK  
HP_SMT  
Gain=+3dB  
70.8kΩ  
HP_VOL  
100kΩ  
100kΩ  
+
-
50k  
Ω
+
-
-
+
HP2_VOL  
25kΩ  
25k  
Ω
200kΩ  
200kΩ  
HPR_MT  
8step  
+140dB  
HP_RI  
100kΩ  
TEST  
Fig.13 BU7861KN Block Diagram  
27  
36  
35  
33  
32  
31  
30  
29 28  
26  
34  
25  
DSPIN  
24  
23  
RECN  
37  
38  
RECP  
DSPOUT  
39  
40  
CSTEP  
CPOP  
22 DSPCLK  
DVSS  
21  
SMUTE  
41  
42  
20 DVDD  
19  
18  
SYSCLK  
BCLK  
SDI  
RXCOM  
TXCOM  
PVCOM  
BU7861KN  
43  
17  
16  
15  
14  
44  
45  
LRCLK  
COMIN  
RSTB  
TEST  
EXTOUT  
46  
MICB_1 47  
13 DACRO  
48  
MICB_2  
1
3
7
8
12  
4
6
9
11  
2
5
10  
Fig.14 BU7861KN Pin Placement Diagram  
www.rohm.com  
2010.09 - Rev.A  
7/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU7861KN  
Lowpass correction circuit  
The headphone output terminal (either HP_X or HPX_OUT) has a built-in “lowpass correction circuit” to correct lowpass  
decay, comprised of output coupling capacity and headphone impedance.  
CCHPx  
200kΩ  
200kΩ  
HP_XI  
or  
HPX_FB  
100kΩ  
CL  
+
-
+
OUTPUT  
HP_X  
or  
HPX_OUT  
RL  
Fig.15 Headphone Output Section Equivalent Circuit  
Lowpass Cut-off Frequency  
fC= 1/(2・π・CLRL)  
Lowpass Boost Frequency  
Boost Gain  
fBOOST = 1/(2・π・CCHPx200kΩ)  
ABOOST = 20log((200 kΩ+1/(2・π・fCCHPx))/100 kΩ)  
(Maximum lowpass boost is 6dB.)  
The constant configuration calculates the lowpass cut-off frequency fC after confirming the output coupling capacity CL and  
headphone impedance RL used. CCHPx is determined in order for the lowpass cut-off frequency fC and lowpass boost  
frequency fBOOST to roughly correspond. The recommended constants are CL = 100µF, when RL = 16Ω and CCHPx =  
6800pF.  
The chart below shows the frequency characteristics (calculated values) during recommended constant use.  
10  
5
Amp Output  
0
-5  
After correction  
-10  
Before correction  
-15  
-20  
-25  
-30  
-35  
-40  
1
10  
100  
1000  
10000  
100000  
Frequency [Hz]  
Fig.16 Low pass Correction Circuit Frequency Characteristics  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
8/13  
Technical Note  
BU7861KN  
Recommended circuits  
CPU  
+
+
+
+
MICB_1  
MICB_2  
MIC_BIAS  
MIC BIAS  
CPU I/F  
VREF/COMMON  
VDD/VSS  
SMUTE  
POP  
MICO  
MICIN_C  
MICIN_1  
MIC_MT  
16step  
TX_VOL  
TX_TEST1  
-
-
BPF  
A/D  
+
+
MICIN_2  
EXTIN  
MIC_SEL  
+6-8dB  
DSPCLK  
DSPIN  
RX_TEST1  
CPU  
EXTIN_MT  
Tx_testline  
Rx_testline  
DSPOUT  
DSP  
I/F  
EXTOUT  
8step  
TX_TEST2  
EXTOUT  
ST_VOL  
ST_MT  
-18-42dB  
Gain=3.2dB  
32step  
RX_VOL  
REC_MT  
D/A  
LPF  
RECN  
-
-
+
VIC_MT  
PLLLPF  
0.01µ  
+
RX_TEST2  
0-30dB  
32step  
+6-54dB  
REC_TST  
PLL  
32Ω  
MEL_VOL  
FSYNC  
MEL_MT  
DTMF/  
TONE  
-
+
RECP  
TONE_MT  
Gain=3.2dB  
SPVIC_MT  
-
+
16step  
+6-8dB  
32step  
SPOUT  
SPMEL_VOL  
-
SPRX_VOL  
SP amp  
8
Ω
+
SPMEL_MT  
SOUND_MT  
16step  
0-28dB  
0-30dB  
AIN_R  
HPR_TST  
Sound  
Source  
IC  
AIN_MT  
AIN_VOL  
AIN_L  
SYSCLK  
HPL_TST  
HSJL_MT  
HPL_MT  
HP_LI  
32step  
SDI  
0-45dB  
-
HP2_VOL  
-
+
+
8step  
+140dB  
DSP  
16Ω  
16Ω  
+
100µ  
+
-
LRCLK  
+
DIG_MT  
HP_L  
HP_R  
HP_VOL  
HSJR_MT  
+
-
BCLK  
TEST  
100µ  
+
-
-
HP2_VOL  
+
8step  
+140dB  
HPR_MT  
HP_RI  
CSTEP  
Fig.17 Recommended Circuit  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
9/13  
Technical Note  
BU7861KN  
Input/output equivalent circuit figure  
Terminal  
name  
Analog/  
Power  
source  
Circuit  
figure  
No  
I/O  
Terminal function  
Digital  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Digital  
Analog  
Digital  
Digital  
Digital  
Digital  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
Analog  
1
MICO  
MICIN_C  
MICIN_1  
MICIN_2  
EXTGND  
EXTIN  
O
O
I
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
-
E
E
E
E
E
H
I
MIC output  
2
MIC Selection output  
MIC1 input  
3
4
I
MIC2 input  
5
O
I
External ground  
External input  
6
7
AVDD  
-
-
Power source for analog  
8
AVSS  
-
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
-
I
GND for analog  
9
SPOUT  
AIN_L  
O
I
E
D
D
F
F
A
A
B
A
B
B
I
Speaker output  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
Melody input terminal Lch  
Melody input terminal Rch  
DAC Lch LPF Condenser connected terminal  
DAC Rch LPF Condenser connected terminal  
Please connect to DVSS  
AIN_R  
I
DACLO  
DACRO  
TEST  
I
I
I
RSTB  
I
L:Reset input  
LRCLK  
SDI  
I
LRCLK terminal 44.1kHz(fs) for DAC  
SDI terminal for DAC  
I
BCLK  
I
BCLK terminal 2.8224MHz(64fs) for DAC  
SYSCLK terminal 11.2896MHz(256fs) for DAC  
The power source for digital  
GND for digital  
SYSCLK  
DVDD  
I
-
DVSS  
-
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
DVDD  
PVDD  
PVDD  
PVDD  
PVDD  
PVDD  
-
I
DSPCLK  
DSPOUT  
DSPIN  
FSYNC  
PLLLPF  
AUDCLK  
AUDCS  
AUDTXD  
AUDRXD  
PVSS  
I
B
C
A
B
F
A
A
A
C
I
PCMClock input for PCM signal  
PCMsignal input  
O
I
PCM signal input  
I
8kHz The reference clock for PLL  
Condenser connected terminal for PLL  
O
I
CPU I/F clock input terminal  
I
The chip selection terminal for CPU I/F (H active)  
I
CPU I/FData input terminal  
O
-
CPU I/FData output terminal  
GND for Headphone and receiver  
Lch head phone amplifier revision terminal in low limits  
Lch Head phone amplifier output terminal  
Rch Head phone amplifier output terminal  
Rch head phone amplifier revision terminal in low limits  
Power source for Headphone and receiver  
Receiver output  
HP_LI  
I
F
E
E
F
I
HP_L  
O
O
I
HP_R  
HP_RI  
PVDD  
-
RECN  
O
O
O
O
O
O
O
O
I
PVDD  
PVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
AVDD  
-
E
E
F
F
F
E
E
E
G
H
E
E
RECP  
Receiver output  
CSTEP  
CPOP  
Step noise decrease terminal when volume is variable  
Pop sound decrease terminal  
SMUTE  
RXCOM  
TXCOM  
PVCOM  
COMIN  
EXTOUT  
MICB_1  
MICB_2  
Constant terminal when soft mute  
Receiving standard voltage output  
Transmit standard voltage output  
PATH standard voltage output  
Standard voltage input terminal  
External output  
O
O
O
AVDD  
AVDD  
MIC BIAS output1  
MIC BIAS output2  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.09 - Rev.A  
10/13  
Technical Note  
BU7861KN  
PAD  
PAD  
PAD  
C
F
I
A
D
G
B
PAD  
PAD  
PAD  
E
PAD  
PAD  
PAD  
H
Fig.18 Terminal equivalent circuit figure  
www.rohm.com  
2010.09 - Rev.A  
11/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU7861KN  
Notes for use  
1) Absolute maximum ratings  
When applied voltage (VDD and VIN), and the operating temperature range (Topr) and the like it exceeds absolute  
maximum rating, there is a possibility of destroying, Because it cannot specify destructive mode such as short circuit or  
opening, when special mode which exceeds absolute maximum rating is supposed, that physical safety measure such as  
a fuse should be implemented.  
2) Recommendation operating range  
If it is this range, it is the range which almost can obtain the quality of according to expectation. Concerning electric  
quality being something which is guaranteed under condition of each item. Even inside the recommendation operating  
range, voltage, temperature characteristic is shown.  
3) About the opposite connection of the power source connector  
There is a possibility of destroying LSI with the opposite connection to the power source connector. Please administer the  
measure such as the diode is inserted between power source and the power source terminal of LSI outside as the  
protection for opposite connection destruction.  
4) About the power source line  
At the time of designing the baseplate pattern, as for wiring of the power source/GND line, please make sure to become  
low impedance. At that time, even digital type power source and analog type power source being the same electric  
potential, please separate digital type power source pattern and analog type power source pattern, control the turning of  
digital noise to the analog power source due to the common impedance of wiring pattern. Concerning the GND line, please  
consider the similar pattern design. In addition, concerning all power source terminals of LSI, the condenser is inserted  
between power source and the GND terminal, in the case of electrolysis condenser use, please decide constant with  
sufficient verification in regard to the fact of without being problem in qualities of the condenser which is used, such as the  
capacity pulling out happens in low temperature.  
5) About GND voltage  
As for electric potential of the GND terminal regarding what ever working condition, please make sure to become lowest  
electric potential. In addition, please really verify that does not have the terminal which becomes electric potential below  
GND include transient phenomenon  
6) About the short circuit between the terminal and error installing  
The occasion where you install in the set baseplate, please pay attention to the direction and the position gap of LSI  
sufficiently. when you install with mistake, there is a possibility of LSI destroying. In addition, there is a possibility of  
destruction concerning when it short-circuits e.g. due to the foreign material enters between the terminal and between  
terminal and power source and GND.  
7) About the operation in the strong electromagnetic field  
As for the use in the strong electromagnetic field, being to be a possibility of doing the malfunction, please note.  
8) About the testing with the set baseplate  
When inspecting with the set baseplate, the condenser is connected to the LSI terminal whose impedance is low, because  
there is a possibility of stress depending on LSI, please be sure to do discharge in every process. In addition, when  
installing and removing the tool in inspection process, by all means with power source as off to connect, to inspect, to  
remove. Furthermore, As a static electricity measure, please note to administer the earth and the conveyance and  
preservation in the case of assemble process sufficiently.  
9) About each input terminal  
With respect to the structure of LSI, the parasitic element is formed inevitably by the relationship of electric potential. It  
causes the interference of circuit operation due to the fact that the parasitic element operates, the malfunction, even can  
become cause of destruction. Therefore, e.g., the voltage which is lower than GND in the input terminal is impressed,  
please note sufficiently not to do the method where the parasitic element operates. In addition, When not impress power  
supply voltage in LSI, please do not impress voltage in the input terminal. Furthermore, when power supply voltage is  
impressed even, as for each input terminal, please make voltage below power supply voltage or within guaranteed  
performance of electric quality.  
10) About GND wiring pattern  
When there are both small signal GND and a heavy-current GND, it separates small signal GND pattern from  
heavy-current GND pattern, in order that the pattern wiring and the voltage change caused by large current do not change  
the voltage of small-signal GND, it is recommended to carry out the one-point grounding at the reference point of set..  
Please be careful of not to fluctuate the GND wiring pattern of external parts  
11) When in the external condenser, the ceramic condenser is used, please decide the constant on the consideration of the  
nominal capacity decrease caused by direct current bias and the change of the capacity due to temperature etc.  
www.rohm.com  
2010.09 - Rev.A  
12/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU7861KN  
Ordering part number  
B
D
7
8
6
1
K
N
-
E
2
Part No.  
Part No.  
Package  
KN: UQFN48  
Packaging and forming specification  
E2: Embossed tape and reel  
UQFN48  
7.2 0.1  
7.0 0.1  
<Tape and Reel information>  
(1.4)  
37  
Tape  
Embossed carrier tape (with dry pack)  
36  
25  
24  
13  
Quantity  
2500pcs  
E2  
48  
Direction  
of feed  
1
12  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
0.2 0.05  
M
0.05  
(
)
+0.1  
0.05  
0.6  
-
0.3  
(0.55)  
3-(0.45)  
(0.2)  
Notice :  
Do not use the dotted line area  
for soldering  
Direction of feed  
1pin  
0.4  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
www.rohm.com  
2010.09 - Rev.A  
13/13  
© 2010 ROHM Co., Ltd. All rights reserved.  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-  
controller or other safety device). ROHM shall bear no responsibility in any way for use of any  
of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
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