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产品型号BD81A44EFV-ME2的概述

芯片BD81A44EFV-ME2概述 BD81A44EFV-ME2是一款由日本半导体制造公司ROHM(罗姆公司)开发的高性能电源管理集成电路(PMIC),主要用于支持各类消费电子产品的应用,包括便携式设备、智能手机及其周边设备。随着现代电子产品对电源管理的需求日益增长,BD81A44EFV-ME2将高效的电源转换与智能控制功能集成在一个封装中,为设计工程师提供了较大的灵活性和便捷性。 此芯片具备较低的静态功耗和高效率的电源转换能力,其工作电压范围以及支持的多种输出电流选项,使其适合用于多种应用环境。BD81A44EFV-ME2不仅能够满足各种负载条件下的稳定性需求,同时也兼顾了系统的整体性能优化。 BD81A44EFV-ME2的详细参数 BD81A44EFV-ME2的关键参数如下: - 输入电压范围:2.3V至5.5V - 输出电压调节范围:0.8V至3.8V - 输出电流:最大可以达...

产品型号BD81A44EFV-ME2的Datasheet PDF文件预览

Datasheet  
4ch White LED Driver with Buck-Boost  
(40 LED Maximum)  
BD81A44MUV-M / BD81A44EFV-M  
General Description  
Key Specifications  
BD81A44MUV-M/EFV-M is a white LED driver with the capability of  
withstanding high input voltage (35V Max). This driver has 4ch  
constant-current drivers integrated in 1-chip, where each channel  
can draw up to 120mA (Max), which is also suitable for high  
illumination LED drive. Furthermore, a buck-boost current mode  
DC/DC controller is also integrated to achieve stable operation  
during power voltage fluctuation. Light modulation (5000:1 dimming  
function) is possible by PWM input.  
Operating Input Voltage Range  
Output LED Current Accuracy  
DC/DC Oscillation Frequency 200 to 2200kHz  
Operating Temperature Range  
LED Maximum Output Current  
PWM min pulse width  
4.5 to 35 V  
±3.0%@50mA  
-40 to +125℃  
120mA/ch  
1.0us  
Package(s) W(Typ) x D(Typ) x H(Max)  
Features  
Integrated Buck-Boost current mode DC/DC controller  
Integrated 4ch current driver for LED drive  
5000:1 PWM dimming @200Hz  
VQFN28SV5050  
(BD81A44MUV-M)  
HTSSOP-B28  
(BD81A44EFV-M)  
External switching frequency synchronization  
Built-In protection function (UVLO, OVP, OCP, SCP)  
LED abnormality detection function (Open/Short)  
Integrated VOUT discharge function (Buck-Boost or Buck  
structure limitation)  
W(Typ) × D(Typ) × H(Max) W(Typ) × D(Typ) × H(Max)  
5.0mm × 5.0mm ×1.0mm  
9.7mm × 6.4mm × 1.0mm  
AEC-Q100 Qualified (Note 1)  
(Note 1) Grade1  
Application  
For Display audio, CID, Cluster, HUD  
Small and Medium type LCD Panels for Automotive use.  
Typical Application Circuit  
VCC CIN  
CREG  
COUT  
VREG  
VDISC  
OVP  
VCC  
EN  
CS  
BOOT  
OUTH  
SW  
SYNC  
RT  
OUTL  
RRT  
DGND  
COMP  
SS  
RPC  
CPC  
BD81A44MUV-M /  
BD81A44EFV-M  
LED1  
LED2  
LED3  
LED4  
CSS  
PWM  
ISET  
PGND  
RISET  
VREG  
FAIL1  
GND  
FAIL2  
SHDETEN  
LEDEN1  
LEDEN2  
Figure 1. Buck-Boost Application Circuit  
Product structureSilicon monolithic integrated circuit  
This product has no designed protection against radioactive rays  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0T3T0C600060-1-2  
2016.10.19 Rev.003  
1/35  
Daattaasshheeeett  
BD81A44MUV-M/EFV-M  
Pin Description  
VQFN28SV5050 (Top view)  
Pin Configuration  
VQFN28  
SV5050  
HTSSOP  
Terminal  
Name  
LEDEN1  
LEDEN2  
LED1  
LED2  
LED3  
LED4  
OVP  
Function  
-B28  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
1
1
2
3
4
5
6
7
8
LED output pin enable terminal 1  
LED output pin enable terminal 2  
LED output terminal 1  
LED output terminal 2  
LED output terminal 3  
LED output terminal 4  
Over-voltage detection terminal  
LED output current setting terminal  
LED output GND terminal  
Low side FET gate terminal  
DC/DC output GND terminal  
Output voltage discharge terminal  
High side FET source terminal  
High side FET gate terminal  
High side FET driver power supply terminal  
Internal constant voltage  
ISET  
9
PGND  
OUTL  
DGND  
VDISC  
SW  
OUTH  
BOOT  
VREG  
EN  
CS  
VCC  
SS  
COMP  
RT  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
HTSSOP-B28 (Top view)  
Enable terminal  
DC/DC current sense terminal  
Input power supply terminal  
“Soft Start” Capacitor connection  
ERR AMP output  
Oscillation Frequency-setting resistor input  
External synchronization input terminal  
2
3
4
5
6
7
8
9
SYNC  
SHDETEN Short detection enable signal  
GND  
PWM  
FAIL1  
FAIL2  
Small signal GND terminal  
PWM light modulation input terminal  
“Failure” signal output terminal  
LED open/short detection output signal  
Figure 2. Pin Configuration  
10  
Thermal  
PAD  
Back side thermal PAD  
(Please connect to GND)  
-
-
Block Diagram  
Figure 3. Internal Block Diagram  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0T3T0C600060-1-2  
2016.10.19 Rev.003  
2/35  
Daattaasshheeeett  
BD81A44MUV-M/EFV-M  
Description of Blocks  
1. Voltage Reference (VREG  
)
5V (Typ) is generated from the VCC Input Voltage (when at EN=High). This voltage (VREG) is used as power supply of internal  
circuit and when fixing the pins outside of the IC at a high voltage, as well. The UVLO protection is integrated in VREG. The  
circuit starts to operate at VCC4.0V (Typ) and VREG=3.5V (Typ) and stops when at VCC3.5V (Typ) or VREG2.0V (Typ). For  
release/cancellation condition and detection condition, please refer to Table 2 on page 11. Connect a ceramic capacitor  
(CREG) to VREG terminal for phase compensation. Creg range is 1.0uF to 4.7uF and recommend value is 2.2uF. If the CREG  
is not connected, the operation of circuit will be notably unstable.  
2. Constant Current Driver  
Table1. LED Control Logic  
LEDEN1  
LEDEN2  
LED1  
ON  
LED2  
ON  
LED3  
ON  
LED4  
ON  
L
H
L
L
L
ON  
ON  
ON  
OFF  
OFF  
OFF  
H
H
ON  
ON  
OFF  
OFF  
H
ON  
OFF  
If less than four constant-current drivers are used, please make the LED1~4 terminal ‘open’ while the output ‘OFF’ by  
LEDEN1 and LEDEN2 terminal. The truth table for these pins is shown above. If the unused constant-current driver output  
will be set open without the process of LEDEN1,2 terminals, the ‘open detection’ will be activated. The LEDEN1, 2 terminals  
is pulled down internally in the IC and it is low at ‘open’ condition. They should be connected to VREG terminal or fixed to  
logic HIGH when in use.  
(1) Output Current Setting (RISET)  
Figure 4. ILED vs RISET  
The Output Current ILED can be obtained by the following equation:  
[
]
[
]
ꢀꢁꢂꢃ ꢄꢅ = (1.0ꢆ ꢇꢀꢈꢂꢉ ꢊΩ ) × 5000  
RISET operating range is 41kohm to 250kohm. It can not change the RISET value in the operation.  
This IC has ISET-GND short protection that protect LED element from over current when ISET and GND is short. If the RISET  
value is under 4.7kohm, the IC detects ISET-GND short and LED current becomes off.  
www.rohm.com  
TSZ02201-0T3T0C600060-1-2  
2016.10.19 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
3/35  
TSZ2211115001  
Daattaasshheeeett  
BD81A44MUV-M/EFV-M  
<Caution of LED current setting>  
If the output current ILED is set to >100mA/ch, the stability of LED current within specified operating temperature range will  
decrease. LED current supply value will depends on the amount of ripple in output voltage (VOUT). The figure below shows the  
temperature and the possible LED current maximum value settings, please adjust the ripple voltage in such a way that the LED  
current value setting will fall within the range as shown on the graph below. (VOUTOutput Ripple Voltage) Please refer P.22,  
there is the detail information of VOUT ripple voltage.  
Figure 5. Temperature (Ta) vs Output LED Current (ILED)  
(2) PWM Intensity Control  
1ms/div  
500ns/div  
PWM  
(2V/div)  
PWM  
(2V/div)  
ILED  
(50mA/div)  
ILED  
(50mA/div)  
Figure 6. PWM=150Hz, Duty=0.02%, ILED Waveform  
Figure 7. PWM=150Hz, Duty=50.0%, ILED Waveform  
The current driver ON/OFF is controlled by PWM terminal. The duty ratio of PWM terminal becomes duty ratio of ILED. If don’t  
use PWM dimming, please set the PWM terminal to HIGH. Output light intensity is greatest at 100% input  
3. Buck-Boost DC/DC Controller  
(1) Number of LED in Series Connection  
In this IC, the output voltage of the DC/DC converter (VOUT) is controlled by LED cathode voltage (LED1–4 terminal  
voltage) becomes 1.0V (Typ). When two or more LED are operating at the same time, the LED terminal voltage that  
connects the highest LED Vf row is held at 1.0V (Typ). Then the voltages of other LED terminal will increased only LED VF  
tolerance. Please decide LED VF tolerance by using the description as shown below:  
LED series number x LED VF tolerance voltage < Short Detection Voltage 4.2V (Min) LED Control Voltage 1.1V (Max)  
(2) Over Voltage Protection (OVP)  
The output of the DC/DC converter (VOUT) should be connected to the OVP pin via voltage divider. If OVP terminal voltage  
is over 2.0V (Typ), Over Voltage Protection (OVP) is active and stop the DCDC switching. In determining an appropriate  
trigger voltage for OVP function, consider the total number of LEDs in series and the Maximum variation in VF. When OVP  
terminal voltage drops to 1.94V (Typ) after OVP operation, the OVP will be released. If ROVP1 is GND side resistance,  
ROVP2 is output voltage side resistance and output voltage is VOUT, OVP will occur at below equation.  
[ ]  
(
[
]
[
])  
[
]
ꢆꢋꢌꢉ ꢆ ꢍ { ꢇꢋꢆꢎ1 ꢊꢏ + ꢇꢋꢆꢎ2 ꢊꢏ /ꢇꢋꢆꢎ1 ꢊꢏ } × 2.0[ꢆ]  
OVP will engage when VOUT >32V if ROVP1=22kand ROVP2=330k.  
www.rohm.com  
TSZ02201-0T3T0C600060-1-2  
2016.10.19 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
4/35  
TSZ2211115001  
Daattaasshheeeett  
BD81A44MUV-M/EFV-M  
(3) Buck-Boost DC/DC Converter Oscillation Frequency (FOSC)  
Figure 8. RRT vs FOSC  
DCDC oscillation frequency can be set via a resistor connected to the RT pin. This resistor determines the charge/discharge  
current to the internal capacitor, thereby changing the oscillation frequency. Please set the resistance of RRTusing the above  
data and below equation.  
[
]
[
]
ꢐꢑꢒꢓ ꢊꢔꢕ = (81 × 10 ꢇꢇꢉ ꢊΩ ) × ꢗ  
Where:  
2
81×10 is the constant value in IC (+/-10%)  
α is the adjustment factor  
(RRT : α = 41k: 1.01, 27k: 1.00, 18k: 0.99, 10 k: 0.98, 4.7k: 0.97, 3.9k: 0.96)  
A resistor in the range of 3.6 kto 41 kis recommended. Settings that deviate from the frequency range shown above may  
cause switching to stop, and proper operation cannot be guaranteed.  
(4) External Synchronization Oscillation Frequency (FSYNC)  
If the clock signal input to SYNC terminal, the internal oscillation frequency can be synchronized externally.  
Do not switch from external to internal oscillation if the DC/DC converter is active.  
The clock input to SYNC terminal is valid only in rising edge.  
As for the external input frequency, the input of the internal oscillation frequency ± 20% decided in RT terminal resistance  
is recommended.  
(5) Soft Start Function (SS)  
The soft-start (SS) function can limits the start up current and output rise-time slowly if the capacitor connected to SS  
Terminal. It is available for prevention of output voltage overshoot and inrush current. If you don’t use soft-start function,  
please set SS terminal open. For the calculation of SS time, please refer to the formula on page 19.  
(6) Max Duty  
If this IC operates by DCDC switching Max Duty, it would not output expect voltage and LED current decrease or LED  
current OFF by SCP. Please set load condition and external parts for DCDC switching Duty does not reach Max Duty.  
www.rohm.com  
TSZ02201-0T3T0C600060-1-2  
2016.10.19 Rev.003  
© 2016 ROHM Co., Ltd. All rights reserved.  
5/35  
TSZ2211115001  
Daattaasshheeeett  
BD81A44MUV-M/EFV-M  
4. Protect Function  
Table 2. The detect condition of each protect function and the operation during detection  
Detect Condition  
Protect Function  
Operation During Detection  
[Detection]  
[Release/ Cancellation]  
All Blocks Shuts down  
(Except for VREG)  
All Blocks Shuts down  
(Except for VREG)  
UVLO  
TSD  
VCC<3.5V or VREG<2.0V  
Tj>175°C  
VCC >4.0V and VREG>3.5V  
Tj<150°C  
OVP  
OCP  
VOVPP>2.0V  
VOVP<1.94V  
DCDC switching OFF  
DCDC switching OFF  
VCSVCC-0.2V  
VCS>VCC-0.2V  
One of the LED1-4  
is under 0.3V  
EN Reset  
or  
After SCP delay time,  
all block Latch Off  
(Except for VREG)  
SCP  
or  
VOVP<0.57V  
UVLO Reset  
(100ms delay @300kHz)  
EN Reset  
or  
VLED<0.3V  
Only the detected channel latches  
OFF  
LED Open Protection  
LED Short Protection  
and VOVP>2.0V  
UVLO Reset  
EN Reset  
or  
VLED>4.5V  
After LED Short delay time,  
(100ms delay @300kHz)  
only the detected channel latch OFF  
UVLO Reset  
Figure 9. Protection Flag Output Block Diagram  
The operating status of the protection is propagated to FAIL1 and FAIL2 terminals (open-drain outputs). FAIL1 becomes low  
when OVP or OCP protection is detected, whereas FAIL2 becomes low when SCP, LED open or LED short is detected. If  
the FAIL terminal will not be used as flag output, please make the FAIL terminal open or connect it to GND. But if the FAIL  
terminal will be used as a flag output, it is recommended to pull-up the FAIL1, 2 terminals to VREG terminal. The  
recommended value of pull-up resistance is 100kΩ.  
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(1) Under-Voltage Lock Out (UVLO)  
The UVLO shuts down all the circuits except VREG when VCC<3.5V (Typ) or VREG <2.0V (Typ). And UVLO is  
released by Vcc>4.0V(Typ) and VREG>3.5V(Typ).  
(2) Thermal Shut Down (TSD)  
The TSD shuts down all the circuits except VREG when the Tj reaches 175°C (Typ), and releases when the Tj  
becomes below 150°C (Typ).  
(3) Over-Voltage Protection (OVP)  
The output voltage of DC/DC is detected from the OVP terminal voltage, and the over-voltage protection will activate if  
the OVP terminal voltage becomes greater than 2.0V (Typ). When OVP is activated, the switching operation of the  
DC/DC turns off. And OVP terminal becomes less than 1.94V (Typ), OVP is released and the switching operation of the  
DC/DC turns on.  
(4) Over-Current Protection (OCP)  
The OCP detects the coil current by monitoring the voltage of the high-side resistor, and activates when the CS voltage  
becomes less than VCC-0.2V (Typ).  
When the OCP is activated, the switching operation of the DC/DC turns off. And CS voltage becomes over than  
Vcc-0.2V (typ), OCP is released and the switching operation of the DC/DC turns on.  
(5) Short Circuit Protection (SCP)  
When the LED terminal voltage becomes less than 0.3V (Typ) or OVP terminal becomes less than 0.57V (typ), the  
built-in counter operation will start and the latch will activate at oscillation frequency in 32770 count. In case of  
fosc=300kHz, the count time is approximately 100ms. If the LED terminal voltage becomes over 0.3V or OVP terminal  
becomes over 1.0V (typ) before 32770 count, the counter resets and SCP is not detected.  
(6) LED Open Detection  
When the LED terminal voltage is below 0.3V (Typ) and OVP terminal voltage more than 2.0V (Typ) simultaneously,  
LED open is detected and latches off the open channel.  
(7) LED Short Detection Circuit  
If the LED terminal voltage becomes more than 4.5V (Typ), the built-in counter operation will start and the latch will  
activate at oscillation frequency in 32770 count. In case of fosc=300kHz, the count time is approximately 100ms. During  
PWM dimming, the LED Short Detect operation is carried out only when PWM=High. If the LED terminal voltage  
becomes less than 4.5V (Typ) before 32770 count, the counter resets and LED Short is not detected.  
When LED Short Detect function will not be used, SHDETEN terminal should be connected to VREG before starting.  
When LED Short Detect function is used, the SHDETEN terminal should be connected to GND. In addition, It cannot  
change SHDETEN voltage (High or Low) during normal operation.  
(8) PWM Low Latch Off Circuit  
After the EN is ON, the low interval of PWM input is counted by built-in counter. The clock frequency of counter is the  
fosc Frequency, which is determined by RRT, and stops the operation of circuits except VREG at 32768 counts.  
In case of fosc=300kHz, the count time is approximately 100ms.  
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(9) Output Voltage Discharge Circuit (VDISC function)  
When EN restart with Vout charge remaining, there is the possibility of LED flicker. Therefore restarting DC/DC must be  
operated after discharging Vout. If using only pull-down resistance as setting OVP for discharge, it takes a lot time for  
discharging Vout. Therefore this product has functionality of circuit for Vout discharge. Vout discharge function is  
available for BuckBoost or Buck application. It is need to connect Vout and VDISC terminal and use VDISC function.  
When VDISC terminal is connected to Vout, the output can be discharged when DCDC circuit becomes OFF (with EN  
changing high to low or detection of protect).  
The discharge time Tdisc is expressed in the following equations.  
[ ]  
[ ]  
ꢚ×ꢛꢜꢝꢞ ꢛ ×ꢟꢜꢝꢞ ꢠ  
[ ]  
ꢉꢘꢙꢒꢓ ꢒ =  
[ ]  
ꢡ×ꢢꢣꢢꢤꢟ ꢥ  
Where:  
Tdisc : DC/DC Output Discharge Time  
COUT : DC/DC Output Capacity  
Vout : DC/DC Output Voltage  
IDISC : Discharge current  
Please confirm IDISC value that 25% of Vout voltage from following graph and input above equation. For example,  
when using Vout=20V, please use IDISC value of Vout=5V (approximately 76mA). It will take Tdisc time for Vout  
discharge. Please set EN=Low time over than Tdisc for prevent LED flicker.  
This Tdisc value is reference data. Please verifying by actual measurements.  
Vout vs IDISC  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
0
5
10  
15  
20  
25  
30  
35  
40  
Vout [V]  
Figure.10 Vout vs IDISC  
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Absolute Maximum Ratings (Ta=25°C)  
Parameter  
Symbol  
VCC  
Rating  
40  
Unit  
V
Power Supply Voltage  
BOOT, OUTH Pin Voltage  
SW, CS Pin Voltage  
VBOOT, VOUTH  
45  
40  
V
V
VSW, VCS  
BOOT-SW Pin Voltage  
VBOOT-SW  
7
V
LED1 to 4, VDISC Pin Voltage  
PWM, SYNC, EN pin Voltage  
VLED1,2,3,4, VVDISC  
VPWM, VSYNC, VEN  
40  
V
-0.3 to +7  
-0.3 to +7 < VCC  
-0.3 to +7 < VREG  
-40 to +150  
-55+150  
120 (Note 1)  
V
VREG, OVP, FAIL1, FAIL2,  
SS, RT pin Voltage  
VVREG, VOVP, VFAIL1, VFAIL2,  
VSS, VRT  
V
LEDEN1, LEDEN2, ISET,  
VLEDEN1, VLEDEN2, VISET  
VOUTL, VCOMP, VSHDETEN  
V
OUTL, COMP, SHDETEN pin Voltage  
Junction Temperature Range  
Storage Temperature Range  
LED Maximum Output Current  
Tj  
mA  
Tstg  
ILED  
(Note 1) Current level per channel. Please set LED current that does not over Junction Temperature Range (Tj) maximum.  
Recommended Operating Ratings  
Rating  
Parameter  
Symbol  
Unit  
Min  
4.5  
-40  
200  
200  
40  
Max  
35  
(Note 2)  
Power Supply Voltage  
Operating Temp Range  
VCC  
Topr  
V
+125  
2200  
2200  
60  
DC/DC Oscillation Frequency Range  
FOSC  
FSYNC  
FSDUTY  
kHz  
kHz  
%
(Note 3) (Note 4)  
External Synchronization Frequency Range  
External Synchronization Pulse Duty Range  
(Note2) It is near Vcc terminal voltage. Please be careful the voltage drop by Vcc line impedance.  
(Note3) If don’t use an external synchronization frequency, please make the SYNC open or connect to GND.  
(Note4) If using an external synchronization frequency, don’t change to internal oscillation in the middle of process.  
Recommended Parts Ratings  
Rating  
Parameter  
Symbol  
Unit  
Min  
1.0  
Max  
4.7  
VREG Capacitor  
CREG  
RISET  
RRT  
μF  
kΩ  
kΩ  
μF  
LED Current setting Resistance  
41  
250  
41  
DC/DC Oscillation Frequency setting Resistance  
Soft Start setting Capacitor  
3.6  
CSS  
0.047  
0.47  
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Thermal Resistance(Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
VQFN28SV5050  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
128.5  
12  
31.5  
9
°C/W  
°C/W  
ΨJT  
HTSSOP-B28  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
107.0  
6
25.1  
3
°C/W  
°C/W  
ΨJT  
(Note 1)Based on JESD51-2A(Still-Air)  
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside  
surface of the component package.  
(Note 3)Using a PCB board based on JESD51-3.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3mm x 76.2mm x 1.57mmt  
Top  
Copper Pattern  
Thickness  
Footprints and Traces  
70μm  
(Note 4)Using a PCB board based on JESD51-5, 7.  
Thermal Via(NOTE 5)  
Layer Number of  
Material  
Board Size  
114.3mm x 76.2mm x 1.6mmt  
2 Internal Layers  
Measurement Board  
Pitch  
Diameter  
4 Layers  
FR-4  
1.20mm  
Φ0.30mm  
Top  
Bottom  
Copper Pattern  
Thickness  
Copper Pattern  
Thickness  
Copper Pattern  
Thickness  
70μm  
Footprints and Traces  
70μm  
74.2mm x 74.2mm  
35μm  
74.2mm x 74.2mm  
(Note 5) This thermal via connects with the copper pattern of all layers..  
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Electrical Characteristics (VCC=12V, Ta = -40°C to +125°C *Unless otherwise specified)  
Limit  
Normal  
Parameter  
Symbol  
Unit  
mA  
μA  
Conditions  
Min  
-
Max  
10  
EN=High, SYNC=High, RT=OPEN  
PWM=Low, ISET=OPEN,CIN=10μF  
Circuit Current  
ICC  
-
Standby Current  
[VREG]  
IST  
-
-
10  
EN=Low, VDISC=OPEN  
Reference Voltage  
[OUTH]  
VREG  
4.5  
5.0  
5.5  
V
IREG=-5mA, CREG=2.2μF  
OUTH High Side ON-Resistor  
RONHH  
RONHL  
VOLIMIT  
1.5  
0.8  
3.5  
2.5  
7.0  
5.5  
V
IOUTH=-10mA  
IOUTH=10mA  
OUTH Low Side ON-Resistor  
OCP Detection Voltage  
[OUTL]  
VCC-0.22 VCC-0.2 VCC-0.18  
OUTL High Side ON-Resistor  
RONLH  
RONLL  
1.5  
0.8  
3.5  
2.5  
10.0  
5.5  
IOUTL=-10mA  
IOUTL=10mA  
OUTL Low Side ON-Resistor  
[SW]  
SW Low Side  
ON-Resistor  
RON_SW  
4.0  
10.0  
25.0  
ISW=10mA  
[Error AMP]  
LED Control Voltage  
COMP Sink Current  
VLED  
0.9  
35  
1.0  
80  
1.1  
145  
-35  
V
ICOMPSINK  
ICOMPSOURCE  
μA  
μA  
VLED=2V, VCOMP=1V  
VLED=0.5V, VCOMP=1V  
COMP Source Current  
-145  
-80  
[Oscillator]  
Oscillation Frequency 1  
fosc1  
fosc2  
285  
300  
315  
kHz RT=27kΩ  
kHz RT=3.9kΩ  
Oscillation Frequency 2  
[OVP]  
1800  
2000  
2200  
OVP Detection Voltage  
VOVP1  
1.9  
2.0  
2.1  
V
V
VOVP=Sweep up  
OVP Hysteresis Width  
VOVPHYS1  
0.02  
0.06  
0.10  
VOVP=Sweep down  
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Electrical Characteristics (VCC=12V, Ta = -40°C to +125°C *Unless otherwise specified)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Normal  
Max  
[UVLO]  
UVLO Detection Voltage  
UVLO Hysteresis Width  
[LED Output]  
VUVLO  
VUHYS  
3.2  
3.5  
0.5  
3.8  
V
V
VCC : Sweep down  
0.25  
0.75  
VCC : Sweep up,VREG>3.5V  
ILED=50mA, Ta=25℃  
ILED1=(ILED/ILED_AVG-1)×100  
-3  
-5  
-
-
+3  
+5  
+3  
+5  
1.1  
%
%
%
%
V
LED Current Relative  
Dispersion  
ILED1  
ILED=50mA, Ta=-40℃~125℃  
ILED1=(ILED/ILED_AVG-1)×100  
ILED=50mA, Ta=25℃  
ILED2=(ILED/50mA-1)×100  
-3  
-
LED Current Absolute  
Dispersion  
ILED2  
ILED=50mA, Ta=-40℃~125℃  
ILED2=(ILED/50mA-1)×100  
-5  
-
ISET Voltage  
VISET  
TMIN  
fPWM  
0.9  
1.0  
RISET=100kΩ  
FPWM=150Hz15kHz,  
ILED=20mA100mA  
PWM Minimum Pulse Width  
1
-
-
-
μs  
PWM Frequency  
0.15  
20  
kHz  
[Protection Circuit]  
LED Open Detection Voltage  
LED Short Detection Voltage  
VOPEN  
0.2  
4.2  
0.3  
4.5  
0.4  
4.8  
V
V
VLED1,2,3,4= Sweep down  
VLED1,2,3,4= Sweep up  
VSHORT  
LED Short Detection Latch  
OFF Delay Time  
tSHORT  
70  
100  
130  
ms  
RRT=27kΩ  
SCP Latch OFF Delay Time  
PWM Latch OFF Delay Time  
tSCP  
70  
70  
100  
100  
130  
130  
ms  
ms  
RRT=27kΩ  
RRT=27kΩ  
tPWM  
ISET-GND Short Protection  
impedance  
RISETPROT  
-
-
4.7  
kΩ  
[Logic Input]  
EN, SYNC, SHDETEN,  
PWM, LEDEN1, LEDEN2  
EN, SYNC, SHDETEN,  
PWM, LEDEN1, LEDEN2  
Input High Voltage  
Input Low Voltage  
Input Current  
VINH  
VINL  
IIN  
2.1  
GND  
15  
-
-
VREG  
0.8  
V
V
VIN=5V(EN,SYNC, SHDETEN  
PWM, LEDEN1, LEDEN2,)  
50  
100  
μA  
[FAIL Output (Open Drain)]  
FAIL Low Voltage  
VOL  
-
0.1  
0.2  
V
IOL=0.1A  
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Typical Performance Curves  
10  
5.5  
5.0  
4.5  
4.0  
3.5  
VCC=4.5~35V  
EN=3.3V  
PWM=0V  
VCC=12V~35V  
EN=3.3V  
PWM=5V  
8
Ta=25°C  
6
4
2
0
5
15  
25  
35  
-40  
0
40  
80  
120  
Supply Voltage:VCC[V]  
Temperature:Ta [℃]  
Figure 11. Circuit Current vs Supply Voltage  
Figure 12. VREG vs Temperature  
3000  
2500  
2000  
1500  
1000  
400  
350  
300  
250  
200  
VCC=12V  
EN=3.3V  
RT=3.9kΩ  
VCC=12V  
EN=3.3V  
RT=27kΩ  
-40  
0
40  
80  
120  
-40  
0
40  
80  
120  
Temperature:Ta [℃]  
Temperature:Ta [℃]  
Figure 13. Switching Frequency vs  
Temperature (@ 300 kHz)  
Figure 14. Switching Frequency vs Temperature  
(@ 2000 kHz)  
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Typical Performance Curves – continued  
60  
50  
40  
30  
20  
60  
50  
40  
30  
20  
10  
0
VCC=12V  
EN=3.3V  
VLED=2V  
PWM=VREG  
VCC=12V  
EN=3.3V  
VLED=SWEEP  
10  
Ta=25°C  
0
0
1
2
3
4
5
-40  
0
40  
80  
120  
LED Voltage:VLED [V]  
Temperature:Ta [℃]  
Figure 16. LED Current vs Temperature  
Figure 15. LED Current vs LED Voltage  
100  
95  
90  
85  
80  
100  
95  
90  
VCC=12V  
EN=3.3V  
PWM=VREG  
Ta=25°C  
LED8series 4ch  
VCC=12V  
EN=3.3V  
PWM=VREG  
Ta=25°C  
LED4series 4ch  
85  
80  
20  
40  
60  
80  
100  
120  
20  
40  
60  
80  
100  
120  
Output currentILED1-4 [mA]  
Output current:ILED1-4 [mA]  
Figure 17. Efficiency vs Output Current  
(Buck-Boost Application)  
Figure 18. Efficiency vs Output Current  
(Boost Application)  
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Timing Chart (Start up and Protection)  
4.5V  
VCC  
EN *1  
3.5V  
VREG  
UVLO  
SYNC *1  
PWM *1  
SS  
Vf  
SW/OUTL/  
OUTH  
VOUT  
OVP  
1.94V  
2.0V  
2.0V  
1.94V  
VOVP  
1.0V  
LED2=OPEN  
LED3=SHORT LED4=GND  
ILED1  
ILED2  
ILED3  
ILED4  
VLED1  
VLED2  
VLED3  
VLED4  
1.0V  
Hi-z  
Hi-z  
Hi-z  
Hi-z  
100ms *2  
100ms *2  
Under 0.3V  
Over 4.5V  
Under 0.3V  
FAIL1 *3  
FAIL2 *3  
Figure 19. Startup and Protect function timing chart  
*1 Vcc, EN, PWM, SYNC are input sequence free.  
*2 The count time of 32770clk × 1/FOSC. In case of fosc=300kHz, the count time is approximately 100ms.  
*3 Above timing chart is the case of pulling up FAIL1 and FAIL2 terminal to VREG.  
1. When VOVP less than 1.0V, regardless of PWM input, the DC/DC switching operation will be active (Pre-Boost function).  
And if VOVP reaches 1.0V, the Pre-Boost is finished.  
2. When VLED2 less than 0.3V and VOVP more than 2.0V, LED Open Protect is active and LED2 is turned OFF. Then  
FAIL2 becomes Low.  
3. If The condition of VLED3 more than 4.5V passes 100ms (@fosc=300kHz), LED3 is turned OFF. Then FAIL2 becomes  
Low.  
4. When VLED4 short to GND, increase the Vout voltage. Then VOVP rises over 2.0V, FAIL1 becomes Low. If OVP occur,  
DCDC switching is OFF and decrease Vout voltage, then OVP repeats ON/OFF. And DCDC switching and LED current  
of each CH is OFF after approximately 100ms. (In case of fosc=300kHz).  
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Timing Chart (Start up and Restart)  
4.5V  
VCC  
2.0ms *1  
EN  
3.5V  
3.5V  
2.0V  
VREG  
UVLO  
SYNC  
PWM  
SS  
SW/OUTL/  
OUTH  
VOUT  
VOVP  
1.0V  
1.0V  
ILED1  
ILED2  
ILED3  
ILED4  
1.0V  
Hi-z  
1.0V  
VLED1  
Hi-z  
VLED2  
Hi-z  
Hi-z  
Hi-z  
Hi-z  
VLED3  
Hi-z  
VLED4  
Hi-z  
FAIL1 *3  
FAIL2 *3  
Figure 20. Start up and EN restart timing chart  
*1 EN Low term when EN restart needs more 2.0ms  
*2 Please restart after Vout voltage discharged. Vout discharge function (P.8) or external discharge switch is available. If EN  
restart with Vout voltage remaining, there is possibility of LED flash.  
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Application Examples  
When using as Boost DC/DC converter  
VCC CIN  
CREG  
COUT  
VREG  
VDISC  
OVP  
CS  
VCC  
EN  
BOOT  
OUTH  
SW  
SYNC  
RT  
OUTL  
RRT  
DGND  
COMP  
SS  
RPC  
CPC  
BD81A44MUV-M /  
BD81A44EFV-M  
LED1  
LED2  
LED3  
LED4  
CSS  
PWM  
ISET  
PGND  
RISET  
FAIL1  
FAIL2  
GND  
SHDETEN  
LEDEN1  
LEDEN2  
Figure 21. Boost application circuit  
Note: When using as boost DC/DC converter, if the VOUT and LED terminal are shorted, the over-current from VIN cannot be  
prevented. To prevent overcurrent, carry out measure such as inserting fuse in between VCC and RCS.  
When using as Buck DC/DC Converter  
VCC CIN  
CREG  
COUT  
VREG  
VDISC  
OVP  
CS  
VCC  
EN  
BOOT  
OUTH  
SW  
SYNC  
RT  
OUTL  
RRT  
DGND  
COMP  
SS  
RPC  
CPC  
BD81A44MUV-M /  
BD81A44EFV-M  
LED1  
LED2  
LED3  
LED4  
CSS  
PWM  
ISET  
PGND  
RISET  
FAIL1  
FAIL2  
GND  
SHDETEN  
LEDEN1  
LEDEN2  
Figure 22. Buck application circuit  
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PCB Application Circuit  
Figure 23. PCB Application Circuit  
Please arrange RRT resistor closest to RT pin and do not attach capacitor.  
Please arrange RISET resistor closest to ISET pin and do not attach capacitor.  
Please attach the decoupling capacitor of CIN and CREG to IC pin as close as possible.  
Because there is possibility that big current may flow into DGND and PGND, please make the impedance low.  
In pins of ISET, RT and COMP, please pay attention so that noise will not get in.  
Since PWM, OUTH, OUTL, SW, SYNC and LED 1-4 are switching, please pay attention so that it will not affect  
the surrounding pattern.  
There is a heat dissipation PAD at the back of package. Please solder the board for the heat dissipation PAD.  
Please set the gate resistor of step-down FET (M1) to 0. If resistor is connected, M1 OFF timing is delayed in M1 parasitic  
capacity and gate resistor, and the penetrating current flows to the internal transistor of M1 and SW. OCP may be detected  
by penetrating current.  
To reduce noise, please consider the board layout in the shortest MIN impedance for Boost loop  
(D2COUTDGNDM2D2) and Buck loop (VCCRCSM1D1DGNDGNDCINVCC).  
The ringing of Low side FET is decreased by RG1, but if RG1 value is increased, there is concern about a decrease of  
efficiency. Please evaluate to determine the proper value of RG1 to be used.  
.
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PCB Board External Components ListBuck Boost application)  
serial No.  
1
component name  
CIN1  
component value  
10μF  
product name  
GCM32EC71H106KA01  
Manufacturer  
murata  
2
CIN2  
3
CIN3  
4
RCS1  
RCS2  
RCS3  
CCS  
100mΩ  
100mΩ  
Short  
MCR100 Sieries  
MCR100 Sieries  
Rohm  
Rohm  
5
6
7
8
CSS  
0.1μF  
0.01μF  
5.1kΩ  
27kΩ  
100kΩ  
100kΩ  
2.2μF  
0.1μF  
Short  
22μH  
GCM15R71H104KE37  
GCM15R71H104KE37  
MCR03 Series  
MCR03 Series  
MCR03 Series  
MCR03 Series  
GCM188C71A225KE01  
GCM155R71H104KE37  
murata  
murata  
Rohm  
Rohm  
Rohm  
Rohm  
murata  
murata  
9
CPC1  
RPC1  
RRT1  
RFL1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
RFL2  
CREG  
CBOOT  
RBOOT  
L1  
SLF12565T-220M3R5-PF  
RSS070N05  
TDK  
M1  
Rohm  
Rohm  
Rohm  
Rohm  
murata  
murata  
murata  
murata  
Rohm  
Rohm  
Rohm  
M2  
RSS070N05  
D1  
RB050L-40  
D2  
RB050L-40  
COUT1  
COUT2  
COUT3  
COUT4  
ROVP1  
ROVP2  
RISET1  
RG1  
10μF  
10μF  
10μF  
10μF  
30kΩ  
360kΩ  
100kΩ  
0Ω  
GCM32EC71H106KA01  
GCM32EC71H106KA01  
GCM32EC71H106KA01  
GCM32EC71H106KA01  
MCR03 Series  
MCR03 Series  
MCR03 Series  
* Above components should be changed by load or conditions.  
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Selection of Components Externally Connected  
Follow the steps as shown below for selecting the external components.  
1. Computation of Input Peak Current IL_MAX from application condition  
L value is  
feed back  
2. Set the RCS value so that it becomes IOCP>IL_MAX  
VOUT  
3. Select the value of L so that it becomes 0.05V/μs<  
RCS<0.63xFosc [MHz]  
L
Please judge the L value. If it’s OK, go to 4. And if it’s NG, go back to 1.  
4. Select the coil, schottky diode, MOSFET and RCS which meets the current  
and voltage ratings.  
5. Select the output capacitor which meets with the ripple voltage requirements.  
6. Select the input capacitor.  
7. Select the BOOT SW capacitor.  
8. Phase Characteristics adjustment (CPC, RPC)  
9. Over-Voltage Protection setting (ROVP1, ROVP2).  
10. Soft Start Time Selection (CSS).  
11. Check the Startup Time  
Cpc, CSS adjustment  
(When use Boost  
application)  
12. EN restart check  
13. Actual Operation Confirmation  
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1. Input Peak Current IL_Max Computation  
Internal IC  
VIN  
Rcs  
IL  
CS  
M1  
OUTH  
L
D2  
Vout  
SW  
D1  
Cout  
M2  
OUTL  
Figure 24. Output Application Circuit Diagram (In case of Buck-Boost application)  
(1) Max Output Voltage (Vout_Max) Computation  
Consider the VF variation and number of LED connection in series for Vout_Max derivation  
ꢆꢑꢦꢧ_ꢨꢗꢩ = (ꢆ + ∆ꢆ ) × ꢪ + 1.1ꢆ  
Vout_Max [V] : Max Output Voltage  
VF[V] : LED VF Voltage  
VF[V] : LED VF Voltage Variation  
N : LED series number  
(P) Max Output Current IOUT_MAX Computation  
ꢀꢑꢦꢧ_ꢨꢗꢩ = ꢀꢁꢂꢃ × 1.05 × ꢨ  
Iout_Max[A] : Max Input Peak Current  
ILED[A] : Output Current per Channel  
M : LED parallel number  
(P) Max Input Peak Current IL_MAX Computation  
ꢀꢁ_ꢨꢗꢩ = ꢀꢁ_ꢅꢆꢫ + 1 ∕ 2∆ꢀꢁ  
IL_Max[A] : Max Input Peak Current  
IL_AVG[A] : Max Input Average Current  
ΔIL[A] : Input Current Amplification  
(In case of Boost application)  
ꢀꢁ_ꢅꢆꢫ = ꢆꢑꢦꢧ_ꢨꢗꢩ × ꢀꢑꢦꢧ_ꢨꢗꢩ ∕ (ꢬ × ꢆꢭꢭ)  
ꢛꢜꢝꢞ_ꢲꢳꢴꢵꢛꢟꢟ  
ꢛꢜꢝꢞ_ꢲꢳꢴ  
∆ꢀ= ꢛꢟꢟ  
×
×
ꢠꢜꢰꢱ  
(In case of Buck-Boost application)  
ꢀꢁ_ꢅꢆꢫ = (ꢆꢭꢭ + ꢆꢑꢦꢧ_ꢨꢗꢩ) × ꢀꢑꢦꢧ_ꢨꢗꢩ ∕ (ꢬ × ꢆꢭꢭ)  
ꢛꢜꢝꢞ_ꢲꢳꢴ  
∆ꢀ= ꢛꢟꢟ  
×
×
ꢠꢜꢰꢱ  
ꢛꢟꢟꢶꢛꢜꢝꢞ_ꢲꢳꢴ  
(In case of Buck application)  
ꢀꢁ_ꢅꢆꢫ = ꢀꢑꢦꢧ_ꢨꢗꢩ ∕ ꢬ  
ꢛꢟꢟꢵꢷꢛꢜꢝꢞ_ꢲꢳꢴ  
∆ꢀ= ꢛꢜꢝꢞ  
×
×
ꢠꢜꢰꢱ  
ꢛꢟꢟ  
VCC[V]Input Voltage  
Fosc[Hz]Switching Frequency  
η:Efficiency  
L[H]Coil Value  
The worst case for VIN is Minimum, so the Minimum value should be applied in the equation.  
The current-mode Type of DC/DC convertor is adopted for BD81A34MUV-M/EFV-M, which is optimized with the use of the  
recommended L value in the design stage. This recommendation is based upon the efficiency as well as the stability. The L  
values outside this recommended range may cause irregular switching waveform and hence deteriorate stable operation.  
N (efficiency) becomes almost 80%.  
2. Setting of Over-Current Protection (IOCP) Value  
[ ]  
ꢀꢋꢭꢎ ꢅ = ꢆꢑꢓꢸ_ꢨꢙꢹ[ꢆ](= 0.18ꢆ) ÷ ꢇꢓꢒ[ꢏ] > ꢀꢁ_ꢨꢗꢩ[ꢅ]  
RCS should be selected by above equation.  
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3. Selection of the inductor  
In order to achieve stable operation of the current mode DC/DC converter, we recommend selecting the L value in the range  
indicated below.  
[ ]  
[ ]  
ꢆꢑꢦꢧ ꢆ × ꢇꢓꢒ ꢏ  
0.05[ꢆ ꢺꢒ] <  
< 0.63 × ꢐꢑꢒꢓ[ꢨꢔꢕ]  
[
]
ꢁ ꢺꢔ  
Since there is almost ±30% variation in the value of coil L, keep enough margin and set.  
[ ]  
[
]
ꢛꢜꢝꢞ ꢛ ×ꢻꢱꢰ ꢼ  
The smaller  
allows stability improvement but slows down the response time.  
[
]
ꢮ ꢽꢾ  
If the condition of VCC is under 5V, please satisfy below equation when selecting the coil.  
[ ]  
[ ]  
12 × ꢆꢭꢭ ꢆ × ꢆꢭꢭ ꢆ × ꢬ  
ꢁ[ꢺꢔ] <  
[ ]  
ꢆꢑꢦꢧ ꢆ × ꢀꢁꢂꢃ[ꢅ] × ꢐꢑꢒꢓ[ꢨꢔꢕ]  
The coil outside of above equations may cause Low LED brightness.  
4. Selection of Coil L, Diode D1, D2, MOSFET M1, RCS and COUT  
Current Rating  
Voltage Rating  
Heat Loss  
Coil L  
Diode D1  
Diode D2  
MOSFET M1  
MOSFET M2  
RCS  
> IL_Max  
> IOCP  
> IOCP  
> IOCP  
> IOCP  
> VCC_Max  
> Vovp_Max  
> VCC_Max  
> Vovp_Max  
> Iocp2 × Rcs  
COUT  
>Vovp_Max  
Please consider external parts deviation and make the setting with enough margin.  
In order to achieve fast switching, choose the MOSFET’s with the smaller gate-capacitance.  
5. Selection of Output Capacitor  
Select the output capacitor COUT based on the requirement of the ripple voltage Voutpp.  
[ ]  
20 × ꢀꢁꢂꢃ ꢅ  
ꢆꢑꢦꢧꢸꢸ[ꢆ] =  
+ ∆ꢀ[ꢅ] × ꢇꢿꢤꢻ[ꢏ]  
[
]
[ ]  
ꢐꢑꢒꢓ ꢔꢕ × ꢭꢑꢦꢧ ꢐ × ꢬ  
Actually, VOUT ripple voltage is sensitive to PCB layout and external components characteristics. Therefore, when designing  
for mass-production, stability should be thoroughly investigated and confirmed in the actual physical design. Available Cout  
max value is 500uF.  
6. Selection of Input Capacitor  
We recommend an input capacitor greater than 10μF with the small ESR ceramic capacitor. The input capacitor outside of  
our recommendation may cause large ripple voltage at the input and hence lead to malfunction.  
7. Selection of BOOT – SW capacitor  
When using the BuckBoost application or Buck application, please input BOOT – SW capacitor 0.1uF.  
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8. Phase Characteristics adjustment  
Vout  
LED1~4  
Internal IC  
COMP  
A
RPC  
CPC  
Figure 25. COMP terminal Application Circuit Diagram  
About Application Stability Condition  
The stability in LED voltage feedback system is achieved when the following conditions are met.  
(1) The phase delay when gain is 1(0dB) is below 150°C (or simply, phase margin >30°C).  
(2) The frequency (Unity Gain Frequency) when gain is 1(0dB) is <1/10 of switching frequency.  
One way to assure stability based on phase margin adjustment is setting the Phase-lead fz close to switching frequency. In  
addition, the Phase-lag fp1 shall be decided based on COUT and Output impedance RL.  
Respective formula shall be as follows.  
Phase-lead ꣀꢕ[ꢔꢕ] = ꢖꣁꢻꣂꢱ[ꣃ]ꢟꣂꢱ ꢠ  
[ ]  
Phase-lag ꣀꢸ1[ꢔꢕ] = ꢖꣁꢻ  
(Note) The output impedance calculated from = ꢛꣅ꣆꣇  
ꢢꣅ꣆꣇  
[
]
ꣃ ꢟꢜꢝꢞ[ꢠ]  
Good stability would be obtained when the fz is set between 1kHz10kHz.  
It is important to keep in Mind that these are very loose guidelines, and adjustments may have to be made to ensure stability  
in the actual circuitry. It is also important to note that stability characteristics can change greatly depending on factors such  
as substrate layout and load conditions. Therefore, when designing for mass-production, stability should be thoroughly  
investigated and confirmed in the actual physical design.  
9. Setting of Over Voltage Protection(OVP)  
Over voltage protection (OVP) is set from the external resistance ROVP1 and ROVP2.  
The setting described below will be important in the either boost, buck, buck-boost applications.  
Internal IC  
Vout  
ROVP2  
2.0V/1.94V  
OVP  
ROVP1  
1.0V/0.57V  
Figure 26. OVP Application Circuit  
The OVP terminal detects the over voltage when at >2.0V (Typ) and stops the DC/DC switching. In addition, it detects the  
open condition when OVP terminal is at >2.0V (Typ) and LED1 to 4 pin voltage is at <0.3V (Typ), and the circuit is latched to  
OFF (Please refer to page 11, Protect Function). In preventing error in detection of OPEN, it is necessary that the resistor  
divide voltage of the maximum value of output voltage shall be less than the MIN value of OPEN detection voltage. Please  
set the ROVP1 and ROVP2 is such a way the formula shown below can be met.  
(
)
[ ]⁄(  
[ ]  
[ ])  
ꢆꢑꢦꢧ ꢨꢗꢩ [ꢆ] × {ꢇꢋꢆꢎ1 ꢏ ꢇꢋꢆꢎ1 ꢏ + ꢇꢋꢆꢎ2 ꢏ } < ꢆꢋꢆꢎꢑꢸ꣈ꢹ(ꢨꢙꢹ)[ꢆ] (1)  
Vout : DC/DC Output Voltage  
VOVPopen : OVP Pin Open Detection Voltage  
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Sample 1: When VF=3.2V±0.3V LED is used in 8series  
(
)
(
)
(
)
ꢆꢑꢦꢧ ꢨꢗꢩ [ꢆ] = 1.1ꢆ ꢁꢂꢃꢷꢓꢑꢹꢧ꣉ꢑ꣊ꢷ꣋ꢑ꣊ꢧꢗ꣌꣈ꢷꢨꢗꢩ + 3.2ꢆ + 0.3ꢆ × 8 = 29.1ꢆ  
(
)
Open Detection OVP Pin Voltage ꢆꢋꢆꢎꢑꢸ꣈ꢹꢷ ꢨꢙꢹ = 1.9ꢆ  
If ROVP1=20k, please set by ROVP2 > 286.3kfrom (1)  
Sample 2: VF=3.2V±0.3V LED is used in 3series  
(
)
(
)
(
)
ꢆꢑꢦꢧ ꢨꢗꢩ [ꢆ] = 1.1ꢆ ꢁꢂꢃꢷꢓꢑꢹꢧ꣉ꢑ꣊ꢷ꣋ꢑ꣊ꢧꢗ꣌꣈ꢷꢨꢗꢩ + 3.2ꢆ + 0.3ꢆ × 3 = 11.6ꢆ  
(
)
Open Detection OVP Pin Voltage ꢆꢋꢆꢎꢑꢸ꣈ꢹꢷ ꢨꢙꢹ = 1.9ꢆ  
If ROVP1=20k, please set by ROVP2 > 102.21kfrom (1).  
10. Setting of Soft Start time  
The soft start circuit minimizes the coil current at the input and overshoot at the output voltage during the start-up condition.  
A capacitance in the range of 0.047 to 0.47µF is recommended. A capacitance of less than 0.047µF may cause overshoot at  
the output voltage. However, a capacitance greater than 0.47µF may cause massive reverse current through the parasitic  
elements when power supply is OFF and may damage the IC.  
Soft start time TSS (Typ) is below.  
[ ]  
ꢉꢈꢈ ꢒ = ꢭꢈꢈ[ꢺꢐ] × 3.3[ꢆ] ∕ 5[ꢺꢅ]  
CSS: The capacitance at SS terminal  
11. Check the Start up time  
If the PWM duty at start up is small, the start up time is longer. If you want to setup the Startup Time shorter, small CPC value  
is available, but it needs phase margin check. Below data is PWM duty vs Startup Time of representative two conditions.  
Condition 1 (Boost, below figure left side)  
Vcc = 12V, Vout = 30V (assumed LED 8 series), RRT = 27k(Fosc = 300kHz), CPC=0.01μF, RPC=5.1k, CSS = 0.1μF,  
ROVP1 = 20k, ROVP2 = 360kΩ  
PWM duty vs Startup Time  
(Boost)  
PWM duty vs Startup Time  
(Boost, Zoom up)  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
0
20  
40  
60  
80  
100  
0
0.2  
0.4  
0.6  
0.8  
1
PWM duty [%]  
PWM duty [%]  
Figure 27. PWM Duty vs Startup Time (Boost)  
Condition 2 (BuckBoost, below figure right side)  
Vcc = 12V, Vout = 20V (assumed LED 5 series), RRT = 27k(Fosc = 300kHz), CPC=0.01μF, RPC=5.1k, CSS = 0.1μF,  
ROVP1 = 30k, ROVP2 = 360kΩ  
PWM duty vs Startup Time  
(BuckBoost)  
PWM duty vs Startup Time  
(BuckBoost, Zoom up)  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
0
20  
40  
60  
80  
100  
0
0.2  
0.4  
0.6  
0.8  
1
PWM duty [%]  
PWM duty [%]  
Figure 28. PWM Duty vs Startup Time (BuckBoost)  
Above data is only reference data. Actual Startup Time depends on layout pattern, parts value and part characteristics,  
Please verify your design by the actual measurements.  
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12. EN restart check  
EN restart when Vout voltage is remain, it possible to detect SCP. Please set the condition according to applications.  
When use the BuckBoost or Buck application.  
Please connect Vout and VDISC terminal and set EN=Low time refer to the below equation.  
[ ]  
[ ] < ꢂꢪꢷꢁꢑ꣍ꢷꢉꢙꢄ꣈ꢷ[ꢒ]  
ꢚ×ꢛꢜꢝꢞ ꢛ ×ꢟꢜꢝꢞ ꢠ  
[ ]  
ꢉꢘꢙꢒꢓ ꢒ =  
[ ]  
ꢡ×ꢢꢣꢢꢤꢟ ꢥ  
Regarding Tdisc details, please refer P.8.  
When use the Boost application.  
Please adjust CSS and Cpc value according to below. If Cpc value is changed, phase margin will changed, and if CSS value  
is changed, start up time is changed. Please verifying by actual measurements.  
[ ]  
0.4 + 2.7 × ꢹ − ꢆꢭꢭ ꢆ  
1
[ ]  
(
)
ꢉ1 ꢒ = (  
×
+ 1.56) × ꢭꢸꢓ[ꢺꢐ]/ 0.46 × ꢃꢦꢧ꣎[%]  
[ ] [ ]  
ꢐꢑꢒꢓ ꢊꢔꢕ × ꢇꢇꢉ ꢊꢔꢕ × 138ꢺ  
0.4 + 2.7 × ꢹ  
[ ]  
[
]
ꢉ2 ꢒ = ꢭꢈꢈ ꢺꢐ × 0.61 + 29.8/ꢐꢑꢒꢓ[ꢊꢔꢕ]  
[ ]  
Please adjust CSS and Cpc value with ꢉ1 ꢒ < ꢉ2[ꢒ]  
n : LEDseries number  
RRT[kΩ] : RT resistence  
CSS[μF] : SS capacitor  
VCC[V] : Power supply  
Cpc[μF] : COMP capacitor  
Fosc[kHz] : DCDC Frequency  
Duty[%] : PWM Duty  
Ex.) n=7, Vcc=7V, Fosc=300kHz, RRT=27kΩ, Cpc=0.01μF, CSS=0.1μF, PWM Duty = 1%  
0.4 + 2.7 × 7 − 7  
1
[ ]  
ꢉ1 ꢒ = (  
( )  
+ 1.56) × 0.01/ 0.46 × 1 = 46.3ꢄꢒ  
×
0.4 + 2.7 × 7  
29.8  
300 × 27 × 138ꢺ  
[ ]  
ꢉ2 ꢒ = 0.1 × 0.61 +  
= 160.3ꢄꢒ  
300  
[ ]  
ꢉ1 ꢒ < ꢉ2[ꢒ] This condition is OK.  
13. Verification of the operation by taking measurements  
The overall characteristics may change based on load current, input voltage, output voltage, inductance, load capacitance,  
switching frequency, and PCB layout. We strongly recommend verifying your design by the actual measurements.  
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BD81A44MUV-M/EFV-M  
Additional parts for EMC  
1. This part adjusts “Slew Rate” of high side FET.  
2. This part decreases noise of current loop of high side FET.  
3. This part decreases spectrum of high frequency on power line.  
4. This low Pass Filter decreases noise of power line.  
5. This common mode filter decreases noise of power line.  
6. This snubber circuit decreases spectrum of high frequency of low side FET.  
7. This snubber circuit decreases ringing of switching for low side FET.  
5
4
3
VCC  
CIN  
CREG  
COUT  
VREG  
VDISC  
OVP  
CS  
VCC  
EN  
BOOT  
OUTH  
SW  
1
7
SYNC  
RT  
6
OUTL  
RRT  
DGND  
COMP  
SS  
RPC  
CPC  
BD81A44MUV-M /  
BD81A44EFV-M  
LED1  
LED2  
LED3  
LED4  
CSS  
PWM  
ISET  
PGND  
RISET  
FAIL1  
FAIL2  
GND  
SHDETEN  
LEDEN1  
LEDEN2  
Figure 29. Application parts for EMC  
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TSZ02201-0T3T0C600060-1-2  
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Attention Point for PCB Layout  
The layout pattern influences characteristic, such as  
efficiency and a ripple greatly. So, it is necessary to  
examine carefully about it.  
VCC  
Boost DC/DC has “Loop1” (in the right side figure).  
Placement of these parts should be compact. And wiring  
should be low-impedance (e.g. Cout’s GND and DGND  
should be very near). Also, Back-Boost DC/DC has “Loop2”.  
Placement of these parts and wiring should be compact  
and low-impedance (e.g. Cin’s GND and D1’s GND should  
be very near).  
BD81A44MUV/EFV-M  
Rcs  
M1  
Cin  
CS  
OUTH  
D1  
SW  
<Loop2>  
L
Vout  
OUTL  
D2  
M2  
Cout  
<Loop1>  
Figure 30. Circuit of DC/DC block  
Cout  
D2  
Cin  
D1  
<Loop1>  
M1  
RCS  
<Loop2>  
Figure 31. BD81A44EFV-M PCB TOP-layer  
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TSZ02201-0T3T0C600060-1-2  
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Calculation of Power Consumption  
ꢎꢓ = ꢀꢓꢓ × ꢆꢭꢭ  
・・・①Circuit Power  
+ꢭꢙꢒꢒ1 × ꢆꢇꢂꢫ × ꢐꢒ꣍ × ꢆꢇꢂꢫ  
+ꢭꢙꢒꢒ2 × ꢆꢇꢂꢫ × ꢐꢒ꣍ × ꢆꢇꢂꢫ  
・・・②Boost FET Power  
・・・③Buck FET Power  
・・・④Current Driver Power  
(
)
+{ꢆꢁꢂꢃ × ꢨ + ∆ꢆꣀ × ꢨ − 1 } × ꢀꢁꢂꢃ  
Pc[W]  
Ciss1[F]  
Fsw[Hz]  
M
:
:
:
:
IC Power Consumption  
Boost FET Gate Capacitance  
Switching Frequency  
Icc[A]  
:
Max Circuit Current  
Buck FET Gate Capacity  
LED Control Voltage  
LED Vf torelance  
VCC [V]  
VREG[V]  
ILED [A]  
:
:
:
Power Supply Voltage  
VREG Voltage  
Ciss2[F]  
VLED[V]  
Vf[V]  
:
:
LED Output Current  
Number of LED Parallel  
:
<Sample Calculation>  
Icc=10mA, VCC=12V, Ciss1=2000pF, Ciss2=2000pF, VREG=5V, Fsw=2200kHz, VLED=1V, ILED=50mA, N=7, M=4  
Vf=3.5V, Vf=0.5V, n=80%  
(
)
ꢆꢑꢦꢧ = 3.5ꢆ + 0.5ꢆ × 7ꢷꢒ꣈꣉ꢙ꣈ꢒ + 1ꢆ = 29ꢆ  
ꢀꢑꢦꢧ = 50ꢄꢅ × 1.05 × 4ꢷꢸꢗ꣉ꢗ꣊꣊꣈꣊ = 0.21ꢅ  
(
)⁄  
ꢀꢁ_ꢅꢆꢫ = 12 + 29ꢆ 12ꢆ × 0.21ꢅ 0.8 = 0.897ꢅ  
( )  
ꢎꢓ 4 = 10ꢄꢅ × 12ꢆ + 2000ꢸꢐ × 5ꢆ × 2200ꢊꢔꢕ × 5ꢆ + 2000ꢸꢐ × 5ꢆ ×  
{
(
)}  
2200ꢊꢔꢕ × 5ꢆ + 1.0ꢆ × 4 + 0.5ꢆ × 4 − 1 × 50ꢄꢅ = 0.615[꣏]  
The above mentioned is a simple calculation and sometimes the value may differ from the actual value.  
www.rohm.com  
TSZ02201-0T3T0C600060-1-2  
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I/O Equivalence Circuit  
SS  
COMP  
RT  
VREG  
VCC  
VREG  
VREG  
VREG  
5k  
12.5  
1k  
10k  
SS  
COMP  
RT  
1k  
1k  
SYNC,PWM  
SHDETEN,LEDEN1,LEDEN2  
FAIL1,FAIL2  
VREG  
VREG  
VREG  
SHDETEN  
10k  
10k  
1k  
PWM  
SYNC  
FAIL1  
FAIL2  
LEDEN1  
LEDEN2  
100k  
100k  
LED1~4  
OVP  
ISET  
VREG  
VREG  
LED1  
LED2  
LED3  
LED4  
100k  
10k  
1k  
10k  
10k  
10k  
OVP  
ISET  
1k  
90k  
10k  
10k  
2Ω  
OUTL  
VDISC  
SW  
VREG  
VREG  
VCC  
OUTL  
VDISC  
SW  
OUTH  
BOOT  
VREG  
BOOT  
BOOT  
BOOT  
VCC  
VREG  
1k  
OUTH  
BOOT  
VREG  
SW  
SW  
SW  
SW  
EN  
CS  
VCC  
VCC  
5k  
EN  
CS  
62.5k  
125k  
166Ω  
1.1k  
2p  
All values are Typ value.  
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Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size  
and copper area to prevent exceeding the Pd rating.  
6. Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
7. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
8. Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
9. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
11. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
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Operational Notes – continued  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Figure 32. Example of hic IC structure  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
15. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below  
the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
16. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
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Ordering Information  
B D 8 1 A 4 4 M U V  
-
-
ME2  
Package  
MUV:VQFN28SV5050  
Packing & foaming specification  
M: High reliability design  
E2: reel shape embossed taping  
(VQFN28SV5050)  
B
D
8
1
A
4
4
E
F
V
ME2  
Package  
EFV:HTSSOP-B28  
Packing & foaming specification  
M: High reliability design  
E2: reel shape embossed taping  
(HTSSOP-B28)  
Marking Diagram  
VQFN28SV5050 (TOP VIEW)  
HTSSOP-B28 (TOP VIEW)  
Part Number Marking  
Part Number Marking  
LOT Number  
BD81A  
44MUV  
BD81A44EFV  
LOT Number  
1PIN MARK  
1PIN MARK  
Part Number Marking  
BD81A44MUV  
Package  
VQFN28SV5050  
HTSSOP-B28  
Orderable Part Number  
BD81A44MUV-ME2  
BD81A44EFV  
BD81A44EFV-ME2  
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TSZ02201-0T3T0C600060-1-2  
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Physical Dimension Tape and Reel Information (BD81A44MUV-M)  
Package Name  
VQFN28SV5050  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
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Physical Dimension, Tape and Reel Information (BD81A44EFV-M)  
Package Name  
HTSSOP-B28  
<Tape and Reel information>  
Tape  
Embossed carrier tape (with dry pack)  
Quantity  
2500pcs  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
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Revision History  
Date  
Revision  
001  
Changes  
2016/1/13  
New  
P.9 Absolute Maximum Ratings PWM, SYNC and EN terminal.  
Before : -0.3 to +7 < VCC  
After : -0.3 to +7  
P.10 Thermal Resistance  
2016/4/26  
002  
003  
2 internal layers / Copper Pattern, Bottom / Copper Pattern  
Before : 74.2mm2(Square)  
After : 74.2mm x 74.2mm  
P.29 I/O Equivalence Circuit  
Change RT, OUTL, OUTH and EN terminal.  
2016/10/19  
P.12 Change the PWM Frequency Limit Max value 15kHz to 20kHz.  
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TSZ02201-0T3T0C600060-1-2  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
Datasheet  
Buy  
BD81A44EFV-M - Web Page  
Distribution Inventory  
Part Number  
Package  
Unit Quantity  
BD81A44EFV-M  
HTSSOP-B28  
2500  
Minimum Package Quantity  
Packing Type  
Constitution Materials List  
RoHS  
2500  
Taping  
inquiry  
Yes  
配单直通车
BD82000FVJ产品参数
型号:BD82000FVJ
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:ROHM CO LTD
零件包装代码:SOIC
包装说明:TSSOP,
针数:8
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.64
Is Samacsys:N
内置保护:OVER CURRENT; THERMAL; UNDER VOLTAGE
接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:S-PDSO-G8
JESD-609代码:e2
长度:3 mm
功能数量:1
端子数量:8
最高工作温度:85 °C
最低工作温度:-40 °C
输出电流流向:SINK
标称输出峰值电流:1 A
封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP
封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260
认证状态:Not Qualified
座面最大高度:1.1 mm
最大供电电压:5.5 V
最小供电电压:2.7 V
标称供电电压:5 V
表面贴装:YES
温度等级:INDUSTRIAL
端子面层:Tin/Copper (Sn/Cu)
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:40 µs
接通时间:20000 µs
宽度:3 mm
Base Number Matches:1
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