欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
  •  
  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • BD90635HFP-CTR
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
更多
  • BD90635HFP-CTR图
  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
  • BD90635HFP-CTR
  • 数量5369 
  • 厂家ROHM 
  • 封装TO263 
  • 批号24+ 
  • 全新原装现货,欢迎询购!
  • QQ:1950791264QQ:1950791264 复制
    QQ:221698708QQ:221698708 复制
  • 0755-83222787 QQ:1950791264QQ:221698708
  • BD90635HFP-CTR图
  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • BD90635HFP-CTR
  • 数量34391 
  • 厂家ROHM 
  • 封装TO263 
  • 批号17+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:1091796029QQ:1091796029 复制
    QQ:916896414QQ:916896414 复制
  • 0755-82772151 QQ:1091796029QQ:916896414

产品型号BD90640EFJ-C的Datasheet PDF文件预览

Datasheet  
Input Voltage 3.5 V to 36 V  
Output SW Current 4 A / 2.5A / 1.25A  
1ch Step-Down Switching Regulator  
BD906xxEFJ-C  
General Description  
Key Specifications  
BD906xxEFJ-C is a step-down switching regulator  
controllers with integrated POWER MOS FET and has  
the capability to withstand high input voltage, providing a  
free setting function of operating frequency with external  
resistor. This switching regulator controller features a  
wide input voltage range (3.5 V to 36 V) and operating  
temperature range (-40 °C to +125 °C). Furthermore, an  
external synchronization input pin enables synchronous  
operation with external clock.  
Input Voltage Range:  
3.5 V to 36 V  
(Initial startup is over 3.9 V)  
0.8V to VIN  
Output Voltage Range:  
Output Switch Current:  
Selectable Operating Frequency: 50 kHz to 600 kHz  
Reference Voltage Accuracy:  
Shutdown Circuit Current:  
Operating Temperature Range:  
4 A / 2.5 A / 1.25 A (Max)  
±1 %  
0 µA (Typ)  
-40 °C to +125 °C  
Package  
HTSOP-J8  
W(Typ) x D(Typ) x H(Max)  
Features  
Minimal External Components  
Integrated Pch POWER MOS FET  
Low Dropout: 100 % ON Duty Cycle  
External Synchronization Enabled  
Soft Start Function: 1.38 ms (f = 500 kHz)  
Current Mode Control  
4.90 mm x 6.00 mm x 1.00 mm  
Over Current Protection  
Low Supply Voltage Error Prevention  
Thermal Shut Down Protection  
Short Circuit Protection  
HTSOP-J8  
Compact and High power HTSOP-J8 package  
mounted  
AEC-Q100 Qualified  
Applications  
Automotive Battery Powered Supplies  
(Cluster Panels, Car Multimedia)  
Industrial / Consumer Supplies  
Typical Application Circuit  
L1  
PVIN  
SW  
FB  
VC  
VO  
D1  
CO  
R1  
R2  
C2  
VIN  
VIN  
Cbulk  
CIN  
RT  
CRT  
RRT  
VEN/SYNC  
EN/SYNC  
R3  
C1  
GND  
Product structureSilicon monolithic integrated circuit This product has no designed protection against radioactive rays  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
1/29  
CVTSZ2211114001  
BD906xxEFJ-C  
Lineup  
Product Name  
BD90640EFJ-C  
4 A  
BD90620EFJ-C  
2.5 A  
BD90610EFJ-C  
1.25 A  
Output Switch Current  
Input Maximum Ratings  
Input Range (Note 1)  
42 V  
3.5 V to 36 V  
0.16 Ω  
POWER MOS FET ON Resistance  
Package  
HTSOP-J8  
3.75 W  
Power Dissipation (Note 2)  
(Note 1) Initial startup is over 3.9 V  
(Note 2) Reduce by 30 mW / °C, when mounted on 4-layer PCB of 70 mm × 70 mm × 1.6 mm.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
2/29  
TSZ2211115001  
BD906xxEFJ-C  
Pin Configuration  
1. RT  
2. SW  
8. FB  
7. PVIN  
6. VIN  
5. VC  
3. EN / SYNC  
4. GND  
Pin Description  
Pin No.  
Symbol  
Function  
1
2
3
4
5
6
7
8
RT  
SW  
Frequency Setting Resistor Connection  
Switching Output  
EN / SYNC  
GND  
VC  
Enable / Synchronizing Pulse Input  
GND  
Error Amp Output  
VIN  
Power Supply Input (Note 1)  
Power System Power Supply Input (Note 1)  
Output Voltage Feedback  
PVIN  
FB  
(Note 1) VIN and PVIN are shorted.  
Block Diagram  
PVIN  
7
UVLO  
VIN  
6
UVLO  
OCP  
VREF  
VREG  
OCP  
EN/SYNC  
EN/SYNC  
3
SCP_LATCH  
Current  
Sense  
SCP_  
LATCH  
RT  
SLOPE  
OSC  
1
TSD  
OCP  
TSD  
SCP  
CUR  
_COMP  
PWM_LATCH  
Pch POWER  
MOS FET  
S
R
ERROR_AMP  
FB  
Q
DRV  
+
-
8
-
+
+
0.8V  
SW  
2
4
OFF  
EN  
UVLO  
TSD  
GND  
SOFT  
START  
OCP  
SCP_LATCH  
VC  
5
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
3/29  
TSZ2211115001  
BD906xxEFJ-C  
Description of Blocks  
ERROR-AMP  
The ERROR-AMP block is an error amplifier and its inputs are the reference voltage 0.8 V (Typ) and the FBpin voltage.  
(Refer to recommended examples on p.16 to 17) The output VCpin controls the switching duty and output voltage Vo.  
These FBand VCpins are externally mounted for phase compensation. Inserting a capacitor and resistor between  
these pins enables adjustment of phase margin.  
SOFT START  
The function of the SOFT START block is to prevent the overshoot of the output voltage VO through gradually increasing  
the input of the error amplifier when the power supply turns ON, which also results to the gradual increase of the  
switching duty. The soft start time is set to 1.38 ms (f = 500 kHz).  
The soft start time is changed by setting of the oscillating frequency. (Refer to p.17)  
EN / SYNC  
The IC is in normal operation when the voltage on the “EN / SYNC” terminal is more than 2.6V. The IC is shut down when  
the voltage on the “EN / SYNC” terminal is less than 0.8V. Furthermore, external synchronization is possible when pulses  
are applied to the “EN / SYNC” terminal. The frequency range of the external synchronization is within ±20 % of the  
oscillation frequency and is limited by the external resistance connected to the RT pin.  
ex) When RRT is 27 kΩ (f = 500 kHz), the frequency range of the external synchronization is 400 kHz to 600 kHz.  
OSC (Oscillator)  
This circuit generates the input pulse wave of the SLOPE block. The frequency of the pulse wave can be configured by  
connecting a resistor to the RT pin. The range of the oscillating frequency is from 50 kHz to 600 kHz. (Refer to p.16  
Figure 13). The output of the OSC block send clock signals to PWM_LATCH. The generated pulses of the OSC block are  
also used as clock of the counter of SS and SCP_LATCH blocks.  
SLOPE  
This block generates saw tooth waves using the clock generated by the OSC block. The generated saw tooth waves are  
sent to the CUR_COMP block and to current sense.  
CUR_COMP  
The CUR_COMP block compares the signals between the VCpin and the combined signals from the SLOPE block and  
current sense. The output signals are sent to the PWM_LATCH block.  
PWM_LATCH  
The PWM_LATCH block is a LATCH circuit. The OSC block output (set) and CUR_COMP block output (reset) are the  
inputs of this block. The PWM_LATCH block outputs PWM signals.  
TSD (Thermal Shutdown)  
The TSD block prevents thermal destruction / thermal runway of the IC by turning OFF the output when the temperature  
of the chip reaches approximately 150 °C or more. When the chip temperature falls to a specified level, the output will be  
reset. However, since the TSD is designed to protect the IC, the chip temperature should be provided with the thermal  
shutdown detection temperature of less than approximately 150 °C.  
OCP (Over Current Protection)  
OCP is activated when the voltage between the drain and source (on-resistance × load current) of the P-ch POWER  
MOSFET when it is ON, exceeds the reference voltage which is internally set within the IC. This OCP is a self-return type.  
When OCP is activated, the duty will be small, and the output voltage will decrease. However, this protection circuit is  
only effective in preventing destruction from sudden accident. It does not support the continuous operation of the  
protection circuit (e.g. if a load, which significantly exceeds the output current capacitance, is connected).  
SCP (Short Circuit Protection) and SCP-LATCH  
While OCP is operating, and if the output voltage falls below 70 %, SCP will be activated. When SCP is active, the output  
will be turned OFF after a period of 1024 pulse. It extends the time that the output is OFF to reduce the average output  
current. In addition, during start-up of the IC, this feature is masked until it reaches a certain output voltage to prevent the  
wrong triggering of SCP.  
UVLO (Under Voltage Lock-Out)  
UVLO is a protection circuit that prevents low voltage malfunction. It prevents malfunction of the internal circuit from  
sudden rise and fall of power supply voltage. It monitors the VIN power supply voltage and the internal regulator voltage. If  
VIN is less than the threshold voltage 3.24 V (Typ), the Pch POWER MOS FET output is OFF and the soft-start circuit will  
be restarted. This threshold voltage has a hysteresis of 280 mV (Typ).  
DRV (Driver)  
This circuit drives the gate electrode of the Pch POWER MOS FET output. It reduces the increase of the Pch POWER  
MOS FET’s on-resistance by switching the driving voltage when the power supply voltage drop.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
4/29  
TSZ2211115001  
BD906xxEFJ-C  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
VINPVIN  
VSW  
Limits  
Unit  
V
Power Supply Voltage  
SW Pin Voltage  
42  
VIN  
VIN  
V
VEN / SYNC  
VRT, VVC, VFB  
PdEFJ  
V
EN / SYNC Pin Voltage  
RT, VC, FB Pin Voltage  
7
V
(Note 1)  
Power Dissipation  
3.75  
W
°C  
°C  
Storage Temperature Range  
Tstg  
-55 to +150  
150  
Tjmax  
Maximum Junction Temperature  
(Note 1) Reduce by 30 mW / °C, when mounted on 4-layerPCB of 70mm × 70mm × 1.6mm  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Recommended Operating Conditions  
Limits  
Parameter  
Symbol  
Unit  
Min  
3.5  
Max  
36  
(Note 1)  
VIN, PVIN  
Topr  
V
°C  
A
Operating Power Supply Voltage  
Operating Temperature Range  
-40  
-
+125  
4
BD90640EFJ-C  
BD90620EFJ-C  
BD90610EFJ-C  
ISWopr40  
ISWopr20  
ISWopr10  
VO  
Output Switch Current (Note2)  
-
2.5  
1.25  
VIN  
-
A
-
A
Output Voltage  
0.8  
250  
50  
22  
50  
-20  
10  
V
Min Pulse Width  
TONMIN  
fSW  
ns  
kHz  
kΩ  
kHz  
%
Oscillation Frequency  
Oscillation Frequency Set Resistance  
600  
330  
600  
+20  
90  
RRT  
Synchronous Operation Frequency Range  
Synchronous Operation Frequency  
External Clock Pulse Duty  
fSYNC  
fSYNC - RT  
DSYNC  
%
(Note 1) Initial startup is over 3.9 V.  
(Note 2) The Limits include output DC current and output ripple current.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
5/29  
TSZ2211115001  
BD906xxEFJ-C  
Electrical Characteristics (Unless otherwise specified, Ta = - 40 °C to +125 °C, VIN = 13.2 V, VEN / SYNC = 5 V)  
Guaranteed Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Typ  
Max  
1chip  
ISDN  
IIN  
-
-
0
5
μA  
VEN / SYNC = 0 V, Ta < 105 °C  
Io = 0 A, VFB = 2 V  
Shutdown Circuit Current  
Circuit Current  
2.2  
3.3  
mA  
SW Block  
POWER MOS FET ON Resistance  
RON  
-
4.0  
2.5  
1.25  
-
0.16  
6.4  
4.3  
2.20  
0
0.32  
Ω
A
ISW = 30 mA  
BD90640EFJ-C  
Operating Output  
Switch Current Of  
BD90620EFJ-C  
Overcurrent  
ISWLIMIT40  
ISWLIMIT20  
ISWLIMIT10  
IOLK  
-
-
A
Protection  
BD90610EFJ-C  
-
A
VIN = 36 V, VEN/SYNC = 0 V,  
Ta < 105 °C  
Output Leak Current  
Error Amp Block  
5
μA  
VREF1  
VREF2  
ΔVREF  
IB  
0.792  
0.784  
-
0.800  
0.800  
0.5  
0.808  
0.816  
-
V
V
VVC = VFB, Ta = 25 °C  
VVC = VFB  
Reference Voltage 1  
Reference Voltage 2  
Reference Voltage Input  
Regulation  
%
3.5 V ≤ VIN ≤ 36 V  
-1.0  
-76.5  
31.5  
135  
-
1.0  
μA  
Input Bias Current  
VC Sink Current  
IVCSINK  
IVCSOURCE  
GEA  
-54.0  
54.0  
270  
1.38  
-31.5  
76.5  
540  
1.63  
μA  
VVC = 1.25 V, VFB = 1.3 V  
VVC = 1.25 V, VFB = 0.3 V  
IVC = ±10 μA, VVC = 1.25 V  
RRT = 27 kΩ  
VC Source Current  
Trans Conductance  
Soft Start Time  
μA  
μA / V  
ms  
TSS  
1.13  
Current Sense Part  
Trans Conductance  
Oscillator Block  
GCS  
-
5.2  
-
A / V  
fSW  
450  
-
500  
1
550  
-
kHz  
%
RRT = 27 kΩ  
Oscillating Frequency  
Frequency Input Regulation  
Enable / Sync Input Block  
Threshold Voltage  
SYNC Current  
ΔfSW  
3.5 V ≤ VIN ≤ 36 V  
VEN / SYNC  
IEN / SYNC  
0.8  
-
1.9  
23  
2.6  
50  
V
μA  
VEN/SYNC = 5 V  
UVLO  
UVLO ON Mode Voltage  
UVLO OFF Mode Voltage  
UVLO Hysteresis  
VUVLO_ON  
VUVLO_OFF  
VUVLO_HYS  
-
-
-
3.24  
3.52  
280  
3.50  
3.90  
-
V
V
mV  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
6/29  
TSZ2211115001  
BD906xxEFJ-C  
Typical Performance Curves  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
From Top  
Ta = 125 °C  
Ta = 25 °C  
Ta = -40 °C  
From Top  
Ta = 125 °C  
Ta = 25 °C  
Ta = -40 °C  
0
5
10  
15  
20  
25  
30  
35  
40  
0
5
10  
15  
20  
25  
30  
35  
40  
Input Voltage : VIN [V]  
Input Voltage : VIN [V]  
Figure 1. Shutdown Circuit Current vs Input Voltage  
Figure 2. Circuit Current vs Input Voltage  
10  
9
8
7
6
5
4
3
2
1
0
0.30  
0.25  
0.20  
0.15  
From Top  
BD90640EFJ-C  
BD90620EFJ-C  
BD90610EFJ-C  
0.10  
From Top  
VIN = 3.5 V  
VIN = 13.2 V  
0.05  
Ta = 25 °C  
0.00  
-40 -20  
0
20 40 60 80 100 120  
0
5
10  
15  
20  
25  
30  
35  
40  
Ambient Temperature : Ta [˚C]  
Input Voltage : VIN [V]  
Figure 3. POWER MOSFET ON Resistance vs  
Ambient Temperature  
Figure 4. Switch Current Limit vs Input Voltage  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
7/29  
TSZ2211115001  
BD906xxEFJ-C  
1.0  
0.8  
0.6  
0.4  
0.2  
816  
812  
808  
804  
800  
796  
792  
788  
784  
VIN = 13.2 V  
VIN = 13.2 V  
0.0  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20 40 60 80 100 120  
Ambient Temperature : Ta [˚C]  
Ambient Temperature : Ta [˚C]  
Figure 5. Leak Current vs Ambient Temperature  
Figure 6. Reference Voltage vs Ambient Temperature  
1.63  
1.58  
1.53  
1.48  
1.43  
1.38  
1.33  
1.28  
1.23  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VIN = 13.2 V  
VFB = 0.8 V  
1.18  
1.13  
RRT=27kΩ  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20 40 60 80 100 120  
Ambient Temperature : Ta[˚C]  
Ambient Temperature : Ta [˚C]  
Figure 8. SS Time vs Ambient Temperature  
Figure 7. Input Bias Current vs Ambient Temperature  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
8/29  
TSZ2211115001  
BD906xxEFJ-C  
550  
540  
530  
520  
510  
500  
490  
480  
470  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
VIN=13.2V  
RRT=27kΩ  
460  
450  
-40 -20  
0
20 40 60 80 100 120  
-40 -20  
0
20  
40  
60  
80 100 120  
Ambient Temperature : Ta [˚C]  
Ambient Temperature : Ta[˚C]  
Figure 10. EN / SYNC Threshold Voltage  
vs Ambient Temperature  
Figure 9. Oscillation Frequency vs Ambient Temperature  
450  
400  
From Top  
Ta = 125 °C  
Ta = 25 °C  
Ta = -40 °C  
350  
300  
250  
200  
150  
100  
50  
From Top  
VO = 5 V  
VO = 3.3 V  
Refer to External  
Components on p.18 to 19  
VIN = 13.2 V  
BD90610EFJ-C Io<3.34A  
fSW = 500 kHz  
BD90620EFJ-C Io<1.84A  
Ta = 25 °C  
BD90610EFJ-C Io<0.59A  
0
0
5
10  
EN / SYNC Voltage : VEN / SYNC [V]  
Figure 11. EN / SYNC Current vs EN / SYNC Voltage  
15  
20  
25  
30  
35  
40  
Figure 12. Efficiency vs Output Current  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
9/29  
BD906xxEFJ-C  
Timing Chart  
Basic Operation  
VIN  
EN / SYNC  
SS  
SW  
VO  
Internal slope  
VC  
Over Current Protection Operation  
Normal pulse repetition at  
the following  
SW  
Over Current  
Detect Level  
IL  
Vo  
FB  
Short Current  
Detect Level  
VC  
*
TSS  
*
*
*
Internal SOFT START  
TOFF  
TOFF  
TOFF  
TOFFTSS terminal  
TOFF = 1024 / fSW [s]  
ex)fSW = 500[kHz]TOFF = 2.048[ms]  
tSS = 1.38 [ms] (typ)  
Output Voltage  
Short to GND  
Output Voltage  
Short Release  
Auto reset  
(Soft Start Operation)  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
10/29  
TSZ2211115001  
BD906xxEFJ-C  
External Synchronizing Function  
In order to activate the external synchronizing function, connect the frequency-setting resistor to the RT pin and then input a  
synchronizing signal to the EN / SYNC pin. For the synchronizing signal, input a pulse wave higher than the oscillation  
frequency.  
The external synchronizing operation frequency is limited by the external resistance of RRT pin. The allowable setting limit is  
within ±20 % of the oscillation frequency. (e.g. When RRT 27 kΩ)  
The external synchronous operation frequency limit is 400 kHz to 600 kHz because the oscillation frequency is 500 kHz.  
Furthermore, the pulse waves LOW voltage should be under 0.8 V and the HIGH voltage over 2.6 V (when the HIGH voltage  
is over 11 V the EN / SYNC input current increases), and the slew rate (rise and fall) under 20 V / µS. The duty of External  
sync pulse should be configured between 10 % and 90%.  
The frequency will synchronize with the external synchronizing operation frequency after three external sync pulses is  
sensed.  
L1  
VO  
PVIN  
VIN  
SW  
FB  
VC  
D1  
CO  
R1  
R2  
C2  
VIN  
Cbulk  
CIN  
RT  
CRT  
RRT  
EN/SYNC  
R3  
C1  
GND  
Eternal SYNC Sample Circuit  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
11/29  
TSZ2211115001  
BD906xxEFJ-C  
Selection of Components Externally Connected  
Necessary parameters in designing the power supply are as follows:  
Parameter  
Input Voltage  
Symbol  
VIN  
Specification Case  
6 V to 36 V  
Output Voltage  
VO  
5 V  
Output Ripple Voltage  
Input Range  
ΔVPP  
IO  
20 mVp-p  
Min 1.0 A / Typ 1.5 A / Max 2.0 A  
500 kHz  
Switching Frequency  
Operating Temperature Range  
fSW  
Topr  
-40 °C to +105 °C  
L1  
VO  
PVIN  
SW  
FB  
VC  
D1  
CO  
R1  
R2  
C2  
VIN  
VIN  
Cbulk  
CIN  
RT  
CRT  
RRT  
VEN/SYNC  
EN/SYNC  
R3  
C1  
GND  
Application Sample Circuit  
(1) Setting the output L constant  
When the switching regulator supplies electric current continuously to the load, the LC filter is necessary for the  
smoothness of the output voltage. The ΔIL that flows to the inductor becomes small when an inductor with a large  
inductance value is selected. Consequently, the voltage of the output ripple also becomes small. It is the trade-off  
between the size and the cost of the inductor.  
The inductance value of the inductor is shown in the next expression:  
(푉  
−푉표)×푉표  
퐼푁(푀퐴푋)  
L =  
[H]  
×푓 ×∆ꢀ  
푆푊 퐿  
퐼푁(푀퐴푋)  
Where:  
is the maximum input voltage  
ꢀꢂ (ꢃꢄꢅ)  
∆ꢆis the Inductor ripple current  
ΔIL is set to approximately 30 % of IO. If avoid discontinuous operation, ΔIL is set to make SW continuously pulsing (IL  
keeps continuously flowing) usually. The condition of the continuous operation is shown in the next expression:  
(푉  
−푉 )×푉  
ꢈ ꢈ  
퐼푁(푀퐴푋)  
>  
[A]  
2×푉  
×푓 ×ꢇ  
푆푊  
퐼푁(푀퐴푋)  
Where:  
is the Load Current  
V
V
SW  
SW  
t
t
t
A
IL  
A
IL  
Io  
t
ΔIL  
Io  
Continuous Action  
Discontinuous Action  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
12/29  
TSZ2211115001  
BD906xxEFJ-C  
The smaller the ΔIL, the Inductor core loss (iron loss) and loss due to ESR of the output capacitor, the smaller ΔVPP will  
be. ΔVPP is shown in the next expression.  
∆ꢀ  
푃푃 = ∆ꢆ× 퐸ꢉ푅 + 8×퐶 ×푓  
[V]  
・・・・・(a)  
푆푊  
Where:  
퐸ꢉ푅 is the equivalent series resistance of output capacitor  
is the output condenser capacity  
The maximum output electric current is limited to the overcurrent protection working current as shown in the next  
expression.  
푂(ꢃꢄꢅ) = ꢆꢋꢌꢇꢀꢃꢀ푇(ꢃꢀꢂ) ∆ꢀ  
[A]  
2
Where:  
IO (MAX) is the maximum output current  
ISWLIMIT (MIN) is the OCP operation current (Min)  
A
ISWLIMIT (MIN)  
IO  
IL  
t
IL peak  
In current mode control, when the IC is operating in Duty 50 % and in the condition of continuous operation, it is  
possible that sub-harmonic oscillation may occur. The slope compensation circuit is integrated into the IC in order to  
prevent sub-harmonic oscillation. Sub-harmonic oscillation depends on the rate of increase of output switch current IC.  
If the inductor value is small, the possibility of sub-harmonic oscillation is increased. And if the inductor value is large, it  
is possible that the IC will not operate in. The inductor value which prevents sub-harmonic oscillation is shown in the  
next expression.  
−푉  
L ≥ 2(1−퐷) × 푅푠 × 푉  
[H]  
2D−1  
퐼푁 (푀퐼푁)  
푂  
ꢎ =  
ꢀꢂ(ꢃꢀꢂ)  
ꢏ = 6 × ꢐ × ꢑ0−ꢒ  
ꢋꢌ  
Where:  
D is the switching pulse Duty.  
Rs is the coefficient of current sense4.0 µA / A)  
m is the inclination of slope compensator current  
The shielded type (closed magnetic circuit type) is the recommended type of inductor. Open magnetic circuit type can  
be used for low cost applications and if noise issues are not concerned. But in this case, there is magnetic field radiation  
between the parts and there should be enough spacing between the parts.  
For ferrite core inductor type, please note that magnetic saturation may occur. It is necessary not to saturate the core in  
all cases. Precautions must be taken into account on the given provisions of the current rating because it differs  
according to each manufacturer.  
Please confirm the rated current at the maximum ambient temperature of the application to the manufacturer.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
13/29  
TSZ2211115001  
BD906xxEFJ-C  
(2) Set of output Capacitor CO constant  
The output capacitor is selected on the basis of ESR that is required from the expression (a). ΔVPP can be reduced by  
using a capacitor with a small ESR. The ceramic capacitor is the best option that meets this requirement. The ceramic  
capacitor contributes to the size reduction of the set because it has small ESR. Please confirm frequency characteristic  
of ESR from the datasheet of the manufacturer, and consider ESR value is low in the switching frequency being used. It  
is necessary to consider the ceramic capacitor because the DC biasing characteristic is remarkable. For the voltage  
rating of the ceramic capacitor, twice or more than the maximum output voltage is usually required. By selecting these  
high voltages rating, it is possible to reduce the influence of DC bias characteristics. Moreover, in order to maintain good  
temperature characteristics, the one with the characteristic of X7R and X5R or more is recommended. Because the  
voltage rating of a mass ceramic capacitor is low, the selection becomes difficult in the application with high output  
voltage. In that case, please select electrolytic capacitor. Please consider having a voltage rating of 1.2 times or more of  
the output voltage when using electrolytic capacitor. Electrolytic capacitors have a high voltage rating, large capacity,  
small amount of DC biasing characteristic, and are generally cheap. Because main failure mode is OPEN, it is effective  
to use electrolytic capacitor for applications when reliability is required such as in-vehicle. But there are disadvantages  
such as, ESR is relatively high, and decreases capacitance value at low temperatures. In this case, please take note  
that ΔVPP may increase at low temperature conditions. Moreover, consider the lifetime characteristic of this capacitor  
because there is a possibility for it to dry up.  
These capacitors are rated in ripple current. The RMS values of the ripple electric current obtained in the next  
expression must not exceed the ratings ripple electric current.  
∆ꢀ  
퐶푂(ꢓꢃꢋ)  
=
[A]  
12  
Where:  
ICO (RMS) is the value of the ripple electric current  
In addition, with respect to CO, choose capacitance value less than the value obtained by the following equation.  
×(ꢀ −ꢀ  
)
)
ꢈ푆ꢔ퐴ꢕꢔ 푀퐴푋  
푆푆(푀퐼푁)  
ꢈ퐿퐼푀퐼ꢔ(푀퐼푁)  
(
푂(ꢃꢄꢅ)  
=
[F]  
Where:  
SWLIMIT (MIN) is the OCP operation switch current (Min)  
SS (MIN) is the Soft Start Time (Min)  
ISWSTART (MAX) is the maximum output current of boot  
I
T
There is a possibility that boot failure happens when the limits from the above-mentioned are exceeded. Especially if the  
capacitance value is extremely large, over-current protection may be activated by the inrush current at startup, and the  
output does not start. Please confirm this on the actual circuit. For stable transient response, the loop is dependent on  
the CO. Please select after confirming the setting of the phase compensation circuit.  
(3) Setting constant of capacitor CIN / Cbulk input  
The input capacitor is usually required for two types of decoupling: capacitors CIN and bulk capacitors Cbulk. Ceramic  
capacitors with values 1 µF to 10 µF are necessary for the decoupling capacitor. Ceramic capacitors are effective by being  
placed as close as possible to the VIN pin. Voltage rating is recommended to more than 1.2 times the maximum input  
voltage, or twice the normal input voltage. The bulk capacitor prevents the decrease in the line voltage and serves a  
backup power supply to keep the input potential constant. The low ESR electrolytic capacitor with large capacity is suitable  
for the bulk capacitor. It is necessary to select the best capacitance value as per set of application. When impedance on  
the input side is high because of wiring from the power supply to VIN is long, etc., and then high capacitance is needed. In  
actual conditions, it is necessary to verify that there is no problem when IC operation turns off the output due to the  
decrease in VIN at transient response. In that case, please consider not to exceed the rated ripple current of the capacitor.  
The RMS value of the input ripple electric current is obtained in the next expression.  
푉 ×(푉 −푉 )  
퐼푁  
퐶ꢀꢂ(ꢓꢃꢋ) = ꢆ푂(ꢃꢄꢅ)  
[A]  
퐼푁  
Where:  
CIN (RMS) is the RMS value of the input ripple electric current  
I
In addition, in automotive and other applications requiring high reliability, it is recommended that capacitors are connected  
in parallel to accommodate a multiple of electrolytic capacitors to minimize the chances of drying up. It is recommended by  
making it into two series + two parallel structures to decrease the risk of ceramic capacitor destruction due to short circuit  
conditions. The line has been improved to the summary respectively by 1pack in each capacitor manufacturer and  
confirms two series and two parallel structures to each manufacturer.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
14/29  
TSZ2211115001  
BD906xxEFJ-C  
(4) Setting output voltage  
Output voltage is governed by the following equation.  
= 0.ꢗ × ꢓ ꢙꢓ [V]  
Please set feedback resistor R2 below 30 to reduce the error margin by the bias current. In addition, since power  
efficiency is reduced with a small R1 + R2, please set the current flowing through the feedback resistor to be small as  
possible than the output current IO.  
(5) Selection of the schottky barrier diode  
The schottky barrier diode that has small forward voltage and short reverse recovery time is used for D1. The important  
parameters for the selection of the schottky barrier diode are the average rectified current and direct current  
inverse-direction voltage. Average rectified current IF (AVG) is obtained in the next expression:  
−푉  
퐼푁(푀퐴푋)  
퐹(ꢄ푉퐺) = ꢆ푂(ꢃꢄꢅ)  
×
[A]  
퐼푁(푀퐴푋)  
Where:  
IF (AVE) is the average rectified current  
The absolute maximum rating of the schottky barrier diode rectified current average is more than 1.2 times IF(AVG) and  
the absolute maximum rating of the DC reverse voltage is greater than or equal to 1.2 times the maximum input voltage.  
The loss of D1 is obtained in the next expression:  
)
× ꢁꢝ [W]  
(
퐼푁 푀퐴푋 ꢜ  
퐷푖 = ꢆ푂(ꢃꢄꢅ)  
×
퐼푁(푀퐴푋)  
Where:  
VF is the forward voltage in Io (MAX) condition  
Selecting a diode that has small forward voltage, and short reverse recovery time is highly effective. Please select a diode  
with 0.6 V Max of forward voltage. Please note that there is possibility of internal element destruction when a diode with a  
larger VF than this is used. Because the reverse recovery time of the schottky barrier diode is so short, that it is possible to  
disregard, the switching loss can be disregarded. When it is necessary for the diode to endure the state of output  
short-circuit, power dissipation ratings and the heat radiation ability are needed to be considered. The rated current that is  
required is about 1.5 times the overcurrent detection value.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
15/29  
TSZ2211115001  
BD906xxEFJ-C  
(6) Setting the oscillating frequency  
The internal oscillating frequency can be set by connecting a resistor to RT.  
The range that can be set is 50 kHz to 600 kHz, and the relation between resistance and the oscillation frequency is decided as  
shown in the figure below. When setting beyond this range, there is a possibility that there is no oscillation and IC operation cannot  
be guaranteed.  
RRT [kΩ]  
100  
110  
fSW [kHz]  
151  
139  
128  
119  
104  
98.  
88  
RRT [kΩ]  
22  
fSW [kHz]  
599  
555  
500  
455  
418  
386  
359  
329  
303  
281  
258  
235  
216  
197  
182  
165  
24  
27  
120  
130  
150  
160  
180  
200  
220  
240  
270  
300  
330  
30  
33  
36  
39  
43  
80  
47  
51  
73  
56  
68  
62  
61  
68  
55  
75  
51  
82  
91  
Figure 13. RRT vs fSW  
RRT vs fSW  
(7) Setting the phase compensation circuit  
A good high frequency response performance is achieved by setting the 0 dB crossing frequency, fc, (frequency at 0 dB  
gain) high. However, you need to be aware of the relationship trade-off between speed and stability. Moreover, DC / DC  
converter application is sampled by switching frequency, so the gain of this switching frequency must be suppressed. It  
is necessary to set the 0 dB crossing frequency to 1 / 10 or less of the switching frequency. In summary, target these  
characteristics as follows:  
When the gain is 1 (0 dB), phase lag is less than or equal to 135 ˚(More than 45 ˚ phase margin).  
0 dB crossing frequency is 1 / 10 times or less of the switching frequency. To improve the responsiveness, higher  
the phase compensation is set by the capacitor and resistor which are connected in series to the VC pin.  
Achieving stability by using the phase compensation is done by cancelling the fp1 and fp2 (error amp pole and  
power stage pole) of the regulation loop by use of fz1. fp1, fp2 and fz1 are determined in the following equations.  
1
f푍1  
f푃1  
f푃2  
=
=
=
[Hz]  
[Hz]  
2휋×ꢓ3×퐶1  
1
2휋×퐶 ×ꢓ  
ꢞ퐴  
[Hz]  
2휋×퐶 ×ꢄ  
Also, by inserting a capacitor in C2, phase lead fz2 can be added.  
1
fZ2  
=
[Hz]  
2휋×ꢓ1×퐶2  
Where:  
EA is the Error Amp trans conductance (270 µA / V)  
AV is the Error Amp Voltage Gain (78 dB)  
G
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
16/29  
TSZ2211115001  
BD906xxEFJ-C  
Vo  
Vo  
SW  
L1  
RESR  
CO  
RO  
D1  
C2  
R1  
R2  
ERROR AMP  
VREF  
VC  
R3  
C1  
Setting Phase Compensation Circuit  
Actually, the changes in the frequency characteristic are greatly affected by the type and the condition (temperature,  
etc.) of parts that are used, the wire routing and layout of the PCB.  
Please confirm stability and responsiveness in actual equipment.  
To check the actual frequency characteristics, use a FRA or a gain-phase analyzer. Moreover, the method of observing  
the degree of change by the loading response can be performed when these measuring instruments are not available.  
The phase margin degree is said to be low when there are lots of variation quantities after the output is made to change  
under no load to maximum load. It can also be observed that the phase margin degree is low when there is a lot of  
ringing frequencies after the transition of no load to maximum load, usually two times or more ringing than the standard.  
However, a quantitative phase margin degree cannot be confirmed.  
Maximum load  
Load  
Inadequate phase margin  
Output voltage  
Adequate phase margin.  
t
Measurement of Frequency Characteristic  
(8) Setting of soft start time (TSS)  
The soft start function is necessary to prevent inrush of coil current and output voltage overshoot at startup.  
TSS will be changed by setting the oscillating frequency.  
The production tolerance of TSS is 18.1%.TSS can be calculated by using the equation.  
ퟔퟗퟎ. ퟖ  
[s]  
푺푺  
=
푺푾  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
17/29  
TSZ2211115001  
BD906xxEFJ-C  
Application Examples  
Parameter  
Product Name  
Symbol  
IC  
Specification case  
BD90640EFJ-C  
6 V to 36 V  
VIN  
Input Voltage  
VO  
5 V  
Output Voltage  
ΔVPP  
IO  
20 mVp-p  
Output Ripple Voltage  
Output Current  
Min 1.0 A / Typ 1.5 A / Max 2.0 A  
500 kHz  
fSW  
Switching Frequency  
Operating Temperature  
Topr  
-40 °C to 105°C  
Specification Example 1  
L1  
VO  
PVIN  
VIN  
RT  
SW  
D1  
CO  
R100  
C2  
VIN  
R1  
R2  
Cbulk  
CIN  
FB  
CRT  
RRT  
VEN/SYNC  
EN/SYNC  
VC  
R3  
C1  
GND  
Reference Circuit 1  
No  
R1  
Package  
1608  
1608  
1608  
-
Parameters  
43 , 1 %, 1 / 16 W  
8.2 , 1 %, 1 / 16 W  
33 kΩ, 1 %, 1 / 16 W  
SHORT  
Part name(series)  
MCR01 series  
MCR01 series  
MCR01 series  
-
Type  
Manufacturer  
Chip resisters  
Chip resisters  
Chip resisters  
-
ROHM  
ROHM  
ROHM  
-
R2  
R3  
R100  
RRT  
C1  
27 kΩ, 1 %, 1 / 16 W  
3300 pF, R, 50 V  
OPEN  
1608  
1608  
-
MCR01 series  
GCM series  
-
Chip resisters  
ROHM  
MURATA  
-
Ceramic capacitors  
-
C2  
100 pF, CH, 50 V  
4.7 μF, X7R, 50 V  
22 μF, X7R, 10 V × 2  
220 μF, 50 V  
CRT  
CIN  
1608  
3216  
3216  
-
GCM series  
GCM series  
GCM series  
CD series  
Ceramic capacitors  
Ceramic capacitors  
Ceramic capacitors  
Electrolytic capacitors  
Coil  
MURATA  
MURATA  
MURATA  
NICHICON  
TDK  
CO  
Cbulk  
L1  
W 9.7 x H 4.5 x L 10 mm3  
4.7 μH  
CLF10040 series  
RB050L-40  
D1  
PMDS  
Average I = 3 A Max  
Schottky Diodes  
ROHM  
Parts List 1  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
Tektronix DPO5054  
FRA5087  
Tektronix DPO5054  
Vo 50mV/divAC  
Vo 10mV/divAC  
Io 500mA/divDC  
VIN=13.2V  
Io=1.5A 2.0A  
IN
Io=1.5A  
0
VIN=13.2V  
Io=1.5A  
0.0  
0.5  
1.0  
1.5  
2.0  
Output Current : Io[A]  
200μs/div  
2μs/div  
Output Ripple Voltage  
Load Change  
Conversion Efficiency  
Frequency Character  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
18/29  
TSZ2211115001  
BD906xxEFJ-C  
Parameter  
Product Name  
Symbol  
IC  
Specification case  
BD90640EFJ-C  
3.5 V to 20 V  
Input Voltage  
VIN  
Output Voltage  
VO  
3.3 V  
Output Ripple Voltage  
Output Current  
ΔVPP  
IO  
20 mVp-p  
Min 1.0 A / Typ 1.5 A / Max 2.0A  
500 kHz  
Switching Frequency  
Operating Temperature  
fSW  
Topr  
-40 °C to 125 °C  
Specification Example 2  
L1  
VO  
PVIN  
VIN  
RT  
SW  
D1  
CO  
R100  
C2  
VIN  
R1  
R2  
Cbulk  
CIN  
FB  
CRT  
RRT  
VEN/SYNC  
EN/SYNC  
VC  
R3  
C1  
GND  
Reference Circuit 2  
No  
R1  
Package  
1608  
1608  
1608  
-
Parameters  
47 kΩ, 1 %, 1 / 16 W  
15 kΩ, 1 %, 1 / 16 W  
6.8 kΩ, 1 %, 1 / 16 W  
SHORT  
Part name(series)  
MCR01 series  
MCR01 series  
MCR01 series  
-
Type  
Manufacturer  
Chip resisters  
Chip resisters  
Chip resisters  
-
ROHM  
ROHM  
ROHM  
-
R2  
R3  
R100  
RRT  
C1  
27 kΩ, 1 %, 1 / 16 W  
3300 pF, R, 50 V  
OPEN  
1608  
1608  
-
MCR01 series  
GCM series  
-
Chip resisters  
ROHM  
MURATA  
-
Ceramic capacitors  
-
C2  
100 pF, CH, 50 V  
4.7 μF, X7R, 50 V  
22 μF, X7R, 10 V × 2  
220 μF, 50 V  
CRT  
CIN  
1608  
3216  
3216  
-
GCM series  
GCM series  
GCM series  
CD series  
Ceramic capacitors  
Ceramic capacitors  
Ceramic capacitors  
Electrolytic capacitors  
Coil  
MURATA  
MURATA  
MURATA  
NICHICON  
TDK  
CO  
Cbulk  
L1  
W 9.7 x H 4.5 x L 10 mm3  
4.7 μH  
CLF10040 series  
RB050L-40  
D1  
PMDS  
Average I = 3 A Max  
Schottky Diodes  
ROHM  
Parts List 2  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
Tektronix DPO5054  
FRA5087  
Tektronix DPO5054  
Vo 50mV/divAC  
Vo 10mV/divAC  
Io 500mA/divDC  
VIN=13.2V  
Io=1.5A  
VIN=13.2V  
Io=1.5A 2.0A  
0
VIN=13.2V  
Io=1.5A  
0.0  
0.5  
1.0  
1.5  
2.0  
Output Current : Io[A]  
2μs/div  
200μs/div  
Output Ripple Voltage  
Frequency Characteristics  
Load Change  
Conversion Efficiency  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
19/29  
TSZ2211115001  
BD906xxEFJ-C  
Input Filter  
逆接保護Diode  
BD906xx  
EFJ-C  
L
D
C
C
C
C
C
C
C
C
TVS  
C
C
π型フィルタ  
Figure 14. Filter Circuit  
The input filter circuit for EMC measures is depicted in the above Figure 14.  
The π type filters are the three-element LC filters. When the decoupling capacitor for high frequency is insufficient, it uses π  
type filters.  
Because a large attenuation characteristic is obtained, an excellent characteristic can be obtained using an EMI filter.  
TVS (Transient Voltage Suppressors) are used for the first protection of the in-vehicle power supply line. Because it is  
necessary to endure high energy when the load is connected, a general zener diode is insufficient. The following are  
recommended. To protect it when the power supply such as BATTERY is accidentally connected in reverse, reverse polarity  
protection diode is needed.  
Device  
Part name(series)  
CLF series  
Manufacturer  
TDK  
L
L
XAL series  
Coilcraft  
C
CJ series  
NICHICON  
NICHICON  
VISHAY  
C
CZ series  
TVS  
D
SM8 series  
S3A thru S3M series  
VISHAY  
Parts of Filter Circuit  
Recommended Parts Manufacturer List  
Shown below is the list of the recommended parts manufacturers for reference.  
Device  
Type  
Electrolytic capacitors  
Ceramic capacitors  
Coils  
Manufacturer  
NICHICON  
MURATA  
TDK  
URL  
C
C
L
www.nichicon.com  
www.murata.com  
www.global.tdk.com  
www.coilcraft.com  
www.sumida.com  
www.vishay.com  
www.rohm.com  
L
Coils  
Coilcraft  
Sumida  
L
Coils  
D
D
Diodes  
VISHAY  
ROHM  
Diodes/Resisters  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
20/29  
TSZ2211115001  
BD906xxEFJ-C  
Directions for Pattern Layout of PCB  
C2  
R1  
R100  
R2  
1.RT  
8.FB  
7.PVIN  
6.VIN  
RRT  
CRT  
L1  
VO  
2.SW  
CO1  
CO2  
CIN1 CIN2 Cbulk  
D1  
3.EN/SYNC  
4.GND  
5.VC  
R3  
C1  
Exposed die pad is needed to be connected to GND.  
Application Circuit  
Arrange the wirings of the wide lines, shown above, as short as possible in a broad pattern.  
Locate the input ceramic capacitor CIN as close to the VIN - GND pin as possible.  
Locate RRT as close to the RT pin as possible.  
Locate R1 and R2 as close to the FB pin as possible, and provide the shortest wiring from the R1 and R2 to the FB pin.  
Locate R1 and R2 as far away from the L1 as possible.  
Separate Power GND (schottky diode, I/O capacitor`s GND) and Signal GND (RT, VC), so that SW noise does not have  
an effect on SIGNAL GND at all.  
The feedback frequency characteristics (phase margin) can be measured using FRA by inserting a resistor at the  
location of R100. However, this should be shorted during normal operation. R100 is option pattern for measuring the  
feedback frequency characteristics.  
VIN1  
VIN1  
PGND  
PGND  
PGND  
PGND  
Cbulk  
CO1  
CO2  
D1  
RRT  
CRT  
R2  
R1  
C2  
RT  
SW  
EN  
FB  
PVIN  
VIN  
VC  
CIN2  
CIN1  
GND  
L1  
VO  
VO  
GND  
GND  
C1  
EN/  
SYNC  
EN/  
SYNC  
Reference Layout Pattern (Top View)  
Reference Layout Pattern (Bottom View)  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
21/29  
BD906xxEFJ-C  
Power Dissipation  
For thermal design, be sure to operate the IC within the following conditions.  
(Since the temperatures described hereunder are all guaranteed temperatures, take margin into account.)  
1. The ambient temperature Ta is to be 125 °C or less.  
2. The chip junction temperature Tj is to be 150 °C or less.  
The chip junction temperature Tj can be considered in the following two patterns:  
To obtain Tj from the IC surface temperature Tc in actual use  
ꢠ푗 = ꢠ푐 + 휃푗푐 × ꢡ  
To obtain Tj from the ambient temperature Ta  
ꢠ푗 = ꢠ푎 + 휃푗푎 × ꢡ  
<Reference Value>  
θja : HTSOP-J8  
249.5 °C / W Single piece of IC  
153.2 °C / W 1-layer PCB  
113.6 °C / W 2-layer PCB (Copper foil area on the front side of PCB: 15mm x 15mm)  
59.2 °C / W 2-layer PCB (Copper foil area on the front side of PCB: 70mm x 70mm)  
33.3 °C / W 4-layer PCB (Copper foil area on the front side of PCB : 70mm x 70mm)  
PCB Size: 70mm x 70mm x 1.6mm (PCB incorporates thermal via)  
The heat loss W of the IC can be obtained by the formula shown below:  
푂  
2
W = 푅푂ꢂ × ꢆ푂  
×
+ ꢁ × ꢆ퐶퐶 + ꢠ푟 × ꢁ × ꢆ× ꢐ푠푤  
ꢀꢂ ꢀꢂ  
ꢀꢂ  
Where:  
RON is the ON Resistance of IC (Refer to page 7) [Ω]  
IO is the Load Current [A]  
VO is the Output Voltage [V]  
VIN is the Input Voltage [V]  
ICC is the Circuit Current (Refer to page 7) [A]  
Tr is the Switching Rise Time [S]  
fsw is the Oscillating Frequency [Hz]  
Tr  
(17 ns)  
VIN  
SW wave form  
GND  
2
①푅푂ꢂ × ꢆ푂  
②ꢢ × × ꢠ푟 × ꢁ × ꢆ×  
ꢀꢂ  
1
fsw  
T=  
= ꢠ푟 × ꢁ × ꢆ× ꢐ푠푤  
ꢀꢂ  
SW Wave Form  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
22/29  
TSZ2211115001  
BD906xxEFJ-C  
Thermal reduction characteristics  
HTSOP-J8  
3.75 W  
2.11 W  
1.10 W  
0.82 W  
0.50 W  
Figure 15. Thermal Reduction Characteristics  
Standalone IC  
Mounted on ROHM standard board (1-layer PCB)  
Mounted on ROHM standard board (2-layer PCB Copper foil area on the front side of PCB: 15 mm × 15 mm)  
Mounted on ROHM standard board (2-layer PCB Copper foil area on the front side of PCB: 70 mm × 70 mm)  
Mounted on ROHM standard board (4-layer PCB Copper foil area on the front side of PCB: 70 mm × 70 mm)  
PCB Size: 70mm×70mm×1.6mm (PCB incorporates thermal via)  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
23/29  
TSZ2211115001  
BD906xxEFJ-C  
I/O Equivalent Circuit  
VC  
RT  
Internal  
Supply  
Internal  
Supply  
Internal  
Supply  
VIN  
30kΩ  
VIN  
1kΩ  
1kΩ  
1kΩ  
VC  
RT  
30kΩ  
1kΩ  
4MΩ  
FB  
SW  
Internal  
Supply  
VIN  
PVIN  
Internal  
Supply  
VIN  
200kΩ  
30kΩ  
SW  
10kΩ  
30kΩ  
FB  
EN / SYNC  
VIN  
1333kΩ  
400kΩ  
EN/SYNC  
200kΩ  
185kΩ  
100kΩ  
250kΩ  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
24/29  
TSZ2211115001  
BD906xxEFJ-C  
Operational Notes  
1.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
terminals.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
Thermal Consideration  
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,  
increase the board size and copper area to prevent exceeding the Pd rating.  
6.  
7.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing  
of connections.  
8.  
9.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
25/29  
TSZ2211115001  
BD906xxEFJ-C  
11. Unused Input Pins  
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance  
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the  
power supply or ground line.  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Area of Safe Operation (ASO)  
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe  
Operation (ASO).  
15. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be  
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the  
TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat  
damage.  
16. Over Current Protection Circuit (OCP)  
This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is  
strongly advised not to subject the IC to prolonged shorting of the output.  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
26/29  
TSZ2211115001  
BD906xxEFJ-C  
Ordering Information  
B
D
9
0
6
4
0
E
F
J
- C  
E 2  
Package  
EFJ: HTSOP-J8  
Product Rank  
C: for Automotive  
Tape and Reel Information  
E2: Reel type embossed taping  
Product  
Name  
Output Switch Current  
90640: 4 A  
90620: 2.5 A  
90610: 1.25 A  
Marking Diagram  
HTSOP-J8 (TOP VIEW)  
Part Number Marking  
LOT Number  
Part Number  
Marking  
Output Switch Current  
4 A  
D90640  
D90620  
D90610  
2.5 A  
1.25 A  
1PIN MARK  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
27/29  
BD906xxEFJ-C  
Physical Dimension, Tape and Reel Information  
Package Name  
HTSOP-J8  
www.rohm.com  
© 2014 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
28/29  
BD906xxEFJ-C  
Revision History  
Date  
Revision  
001  
Changes  
New Release  
06.Jan.2014  
P.4 Description of OCP remove sentence Furthermore ~”  
P.6 Operating Output Switch Current Of Overcurrent Protection symbol change ISWLIMIT  
P.18 Parts List D1 Package change PMDS”  
.
07.Apr.2014  
002  
P.19 Parts List C2 change open”  
P.21 About Directions for Pattern Layout of PCB  
change and Signal GND (RT, VC,),”  
www.rohm.com  
TSZ02201-0T1T0AL00130-1-2  
07.Apr.2014 Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
29/29  
TSZ2211115001  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHM’s Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice – SS  
Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice – SS  
Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  
配单直通车
BD90640EFJ-C产品参数
型号:BD90640EFJ-C
是否Rohs认证: 符合
生命周期:Active
包装说明:,
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.74
模拟集成电路 - 其他类型:SWITCHING REGULATOR
峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!