BD9326EFJ-LBE2全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

产品型号BD9326EFJ-LBE2的Datasheet PDF文件预览

Datasheet

4.75V to 18V, 2A/3A/4A 1ch

Buck Converter with Integrated FET

BD9325FJ-LB BD9326EFJ-LB BD9327EFJ-LB

General Description

Key Specifications

 Input Voltage Range:

 Output Current

This is the product guarantees long time support in

4.75V to 18V

Industrial market.

The BD9325FJ-LB, BD9326EFJ-LB and BD9329EFJ

–LB are step-down regulators with built-in low resistance

high side N-Channel MOSFET. These ICs can supply

continuous output current of 2A / 3A / 4A respectively

over a wide input range, and provides not only fast

transient response, but also easy phase

compensation because of current mode control.

BD9327EFJ-LB :

BD9326EFJ-LB:

BD9325FJ-LB:

4.0A (Max)

3.0A (Max)

2.0A (Max)

 Switching Frequency:

 High Side FET ON-Resistance

BD9327EFJ-LB:

BD9326EFJ-LB:

BD9325FJ-LB:

 Low Side FET ON-Resistance:

 Standby Current:

 Operating Temperature Range:

380kHz (Typ)

0.11Ω(Typ)

0.12Ω(Typ)

0.16Ω(Typ)

10Ω(Typ)

Features

80μA (Typ)

-40°C to +85°C

 Long Time Support Product for Industrial

Applications.

 Low ESR Output Ceramic Capacitors are Available

 Low Standby Current during Shutdown Mode

 Feedback Voltage

Packages

(Typ.)

(Typ.) (Max.)

HTSOP-J8

SOP-J8

4.90mm x 6.00mm x 1.00mm

4.90mm x 6.00mm x 1.65mm

 0.9V ± 1.5%(Ta=25°C)

 0.9V ± 3.0%(Ta=-25°C to +85°C)

 Protection Circuit:

 Under Voltage Protection

 Thermal Shutdown

 Over-Current Protection

Applications

Industrial Equipment

Distributed Power System

Pre-Regulator for Linear Regulator

Typical Application Circuit

HTSOP-J8

SOP-J8

C_PC1

3300pF

R_DW

10k

R_PC

15k

C_SS

0.1μF

R_UP

27k

Thermal Pad

(For BD9326EFJ, BD9327EFJ)

V_IN=12V

V_OUT= 3.3V

C_CO1

10μH

C_VC1

10μF

20μF

Figure 1. Typical Application Circuit

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Block Diagram

V_IN

(TOP VIEW)

BST

VIN

COMP

GND

Figure 2. Pin Configuration

Figure 3. Block Diagram

Pin Description

Pin No.

Pin Name

BST

VIN

Function

High-side gate drive boost input

Power supply input terminal

Power switching output

Ground terminal

GND

Feedback input

COMP

Compensation node

Enable input

Soft start control input

Ordering Information

L B E 2

Package

FJ : SOP-J8

EFJ : HTSOP-J8

Part Number

BD932xxxx

Product class

LB for Industrial applications

Packaging and forming specification

E2: Embossed tape and reel

Lineup

High Side FET

ON resistance

(Typ.)

OUTPUT

CURRENT

(Max.)

Orderable

Part Number

Package

0.16 Ω

0.12 Ω

0.11 Ω

2.0 A

3.0 A

4.0 A

SOP-J8

Reel of 2500 BD9325FJ-LBE2

Reel of 2500 BD9326EFJ-LBE2

Reel of 2500 BD9327EFJ-LBE2

HTSOP-J8

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Absolute Maximum Ratings (Ta = 25°C)

Parameter

Symbol

V_IN

Rating

Unit

Supply Voltage [VIN]

Switch Voltage [SW]

V_SW

Power Dissipation for HTSOP-J8

Power Dissipation for SOP-J8

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

BST Voltage

Pd1

3.76 ^{(Note 1)}

0.67 ^{(Note 2)}

-40 to +85

-55 to +150

150

°C

Pd2

Topr

Tstg

Tjmax

V_BST

V_EN

V_SW+7

EN Voltage

All Other Pins

V_OTH

(Note 1) Mounted on 4- layer 70mmx70mmx1.6mm board. Reduce by 30.08mW/°C for Ta above 25°C.

(Note 2) Mounted on 1- layer 70mmx70mmx1.6mm board. Reduce by 5.4mW/°C for Ta above 25°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Recommended Operating Conditions (Ta= -40°C to +85°C)

Rating

Typ

Parameter

Symbol

Unit

Min

Max

Supply Voltage

SW Voltage

V_IN

V_SW

I_SW2

I_SW3

I_SW4

4.75

-0.5

+18

Output Current for BD9325FJ

Output Current for BD9326EFJ

2^{(Note 3)}

3^{(Note 3)}

4^{(Note 3)}

Output Current for BD9327EFJ

(Note 3) Pd, ASO should not be exceeded

Electrical Characteristics (Unless otherwise specified V_IN=12V Ta=25°C)

Limit

Typ

Parameter

Symbol

Unit

Conditions

Min

Max

Error Amplifier Block

FB Input Bias Current

Feedback Voltage1

Feedback Voltage2

SW Block – SW

I_FB

0.1

µA

V_FB1

V_FB2

0.886

0.873

0.900

0.914

0.927

Voltage Follower

Ta=-40°C to +85°C

Hi-Side FET ON-Resistance for

BD9325FJ

Hi-Side FET ON-Resistance for

BD9326EFJ

Hi-Side FET ON-Resistance for

BD9327EFJ

Low-Side FET ON-Resistance

Leak Current N-Channel

Switch Current Limit for BD9325FJ

Switch Current Limit for BD9326EFJ

Switch Current Limit for BD9327EFJ

Maximum Duty Cycle

R_ON2

R_ON3

R_ON4

0.16

0.12

0.11

I_SW= -0.8A ^{(Note 4)}

I_SW= 0.1A

R_ONL

I_LEAKN

I_LIMIT2

I_LIMIT3

I_LIMIT4

M_DUTY

µA

V_IN= 18V, V_SW= 0V

(Note 4)

2.5

3.5

4.5

(Note 4)

V_FB= 0V

General

Enable Sink Current

I_EN

V_EN

V_UVLO

V_HYS

I_SS

1.1

4.05

181

1.18

4.40

0.1

275

1.4

4.75

µA

V_EN= 12V

V_INRising

Enable Threshold Voltage

Under Voltage Lockout Threshold

Under Voltage Lockout Hysteresis

Soft Start Current

µA

kHz

µA

V_SS= 0 V

Soft Start Time

t_SS

1.6

380

2.1

C_SS= 0.1 µF

Operating Frequency

f_OSC

I_CC

300

460

4.3

170

Circuit Current

V_FB= 1.5V, V_EN= 12V

V_EN= 0V

Standby Current

I_QUI

(Note 4) See the lineup table .

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Typical Performance Curves

(Unless otherwise specified, V_IN= 12V Ta = 25°C)

V_IN:[V]

Figure 4. Circuit Current vs Input Voltage

(No Switching)

Figure 5. Standby Current vs Input Voltage

(IC Not Active)

V_FB:[V]

Temperature :[ °C ]

Figure 7. Feedback Voltage vs

Temperature

Figure 6. Input Bias Current vs

Feedback Voltage

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Typical Performance Curves - continued

390

380

370

360

350

340

330

320

-40

-20

Ta: [°C]

Temperature :[ °C ]

TEMPERATURE : [C]

Figure 9. Operating Frequency vs

Temperature

Figure 8. Hi-Side ON-Resistance

vs Temperature

C_SS: [μF]

I_OUT: [A]

Figure 11. Soft Start Time vs

Soft Start Capacitor

Figure 10. Efficiency vs Output Current

(V_IN= 12V V_OUT= 3.3V L=10µH)

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Typical Waveforms

Figure 12. Over-Current Protection

(V_OUTis shorted to GND)

Figure 13. Transient Response

(V_IN= 12V V_OUT= 3.3V L= 10µH C_OUT=22µF I_OUT= 0.2-1.0A )

Figure 15. Transient Response

(V_IN= 12V V_OUT= 3.3V L= 10µH C_OUT=22µF I_OUT= 0.2-3.0A)

Figure 14. Output Ripple Voltage

(V_IN= 12V V_OUT= 3.3V L= 10µH C_OUT=22µF I_OUT= 1.0A )

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Typical Waveforms - continued

Figure 17. Start Up Waveform

Figure 16. Output Ripple Voltage

(V_IN= 12V V_OUT= 3.3V L= 22µH C_SS= 0.1µF I_OUT= 0A)

(V_IN= 12V V_OUT= 3.3V L= 10µH C_OUT=22µF I_OUT= 3.0A)

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Application Information

1. Block Operation

(1) VREG

This block generates the constant-voltage needed for DC/DC boosting.

(2) VREF

This block generates the 2.9 V internal reference voltage of the Error Amp.

(3) TSD/UVLO

TSD (Thermal shutdown)/UVLO (Under Voltage Lockout) are protection circuit blocks. This circuit protects the device

from damages due to excessive heat and power dissipation. When the TSD circuit is triggered by temperature

exceeding the 175°C Maximum Junction Temperature, it shuts down the device. Once temperature falls below the

threshold set by a hysteresis, the device resumes operation.

UVLO circuit prevents error in the device operation due to either excessive or insufficient power supply voltage. It

monitors the voltage level at VIN pin and also the output of REG block. Once VIN voltage falls below 4.4V, the UVLO

circuit disables the device and resets the Soft-Start circuit. Typical UVLO Hysteresis is 100 mV.

(4) Error Amp Block (ERR)

This circuit compares the reference voltage and the feedback of output voltage. The COMP pin voltage, which is the

output of ERR block, determines the switching duty. During startup, the COMP pin voltage is limited by SS pin voltage

since the soft start is operated by the SS pin voltage.

(5) Oscillator Block (OSC)

This block generates the internal oscillating frequency of the IC.

(6) SLOPE Block

This circuit is used to generate triangular waveform from the clock created by OSC block. This triangular waveform is

sent to the PWM comparator.

(7) PWM Block

The COMP pin voltage, which is the output of ERR block, is compared to the SLOPE block's triangular waveform to

determine the switching duty. Since the switching duty is limited by the maximum duty ratio which is determined

internally, it does not become 100%.

(8) DRV Block

This circuit is a DC/DC driver block. A signal from the PWM serves as the input to drive the power FETs.

(9) OCP Block

OCP (Over-Current Protection) is a protection circuit block. The OCP block activates when the current flows through

the FET is detected, and OCP starts when it reached 2.5 / 3.5 / 4.5A (min). After OCP, switching will turn OFF and SS

capacitor will discharge. OCP is a self-recovery type (not latch).

(10) Soft Start Circuit

The soft-start feature reduces overshoot in the output by making the regulator reach steady-state gradually. The

soft-start capacitor, C_SS, which is connected to SS (pin 8) and GND (pin4), sets the soft-start time, t_SS

(Refer to Figure 23 to know how to set C_SS.)

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2. Selecting Application Components

(1) Output LC Constant (Buck Converter)

The inductance L to be used for the output is decided by the current rating I_LRand maximum input current value I_OMAX

of the inductor.

V_CC

I_OMAX+ ∆I_L/2

should not reach

the rated value level

I_L

OMAX mean current

Figure 18

Figure 19

Adjust I_OMAX+∆I_L/2 so that it won’t reach the current rating value I_LR. At this time, ∆I_Lcan be obtained by the following

equation.

V_O

∆I_L

(

V_CC− V_O

)

[ ]

V_CC

Set with sufficient margin because the inductance L value may have a tolerance of ± 30%.

For output capacitor C, select a capacitor which has the larger value in the ripple voltage V_PPpermissible value and

the drop voltage permissible value at the time of sudden load change.

Output ripple voltage is decided by the following equation.

∆I_L

V_O

∆V_PP= ∆I_L× R_ESR

[ ]

2C_OV_CC

Perform setting so that the voltage is within the permissible ripple voltage range.

For the drop voltage V_DRduring sudden load change, please perform the rough calculation by the following equation.

∆I_L

C_O

V_DR

×10µs

[ ]

However, 10μs is the rough calculation value of the DC/DC response speed.

Make Co settings so that these two values will be within the limit values.

(2) Loop Compensation

Choosing compensation Capacitor C1 and Resistor R3

The example of DC/DC converter application bode plot is shown in Figure 21. The compensation resistor R3 will set

the cross over frequency F_Cthat decides the stability and response speed of DC/DC converter. So compensation

resistor R3 has to be adjusted to adequate value for good stability and response speed.

The cross over frequency F_Ccan be adjusted by changing the compensation resistor R3 connected to COMP terminal.

Higher cross over frequency achieves good response speed, but less stability, and the lower cross over frequency

shows good stability, but worse response speed.

Usually, the 1/10 of DC/DC converter operating frequency is used for cross over frequency F_C. So please decide the

compensation resistor and capacitor using the following formula on setting F_Cto 1/10 of operating frequency at first.

After that, please measure and adjust the cross over frequency on your set (on the actual application) to meet the

desired speed and phase-margin.

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(a) Choosing Phase Compensation Resistor R3

Please decide the compensation resistor R3 by following the formula below.

R3 = 5800 × C_OUT× fc ×V_OUT

Ω

[ ]

Compensation Resister

Where

C_OUTis the Output capacitor connected to DC/DC output

V_OUTis the Output voltage

f_Cis the Desired cross over frequency (38kHz)

The larger value of R3, value of fc increases (response better and stability worse).

The smaller value of R3, value of fc decreases (response worse and stability better).

(b) Choosing Phase Compensation Capacitor C1

The phase delay which is from output LC filter, needs to be cancelled to stabilize the DC/DC converter, this is

done by inserting the phase lead.

The phase lead can be added by the zero introduced by the compensation resistor and capacitor.

The LC resonant frequency F_LCand the zero on compensation resistor and capacitor are expressed below.

f_LC

[

H_Z

]

LC Resonant Frequency

Zero C1 and R3

2π LC_OUT

f_Z

[

H_Z

]

2πC₁R₃

Please choose C1 to make f_Zto 1 / 3 of f_LC

Compensation Capacitor

C1 =

[ ]

2πf_LCR₃

The stability of the DC/DC converter is important. To ensure the operating stability, please check the loop

compensation if it has enough phase-margin. For the condition of loop compensation stability, the phase-lag must

be less than 150 degrees when gain is 0 dB. Namely over 30 degrees phase-margin is needed.

Lastly, after the calculation above, find measures to adjust the phase-margin to more than 30 degrees.

VOUT

(a)

Gain [dB]

COMP

GBW(b)

－

＋

PHASE

90°

－

Phase Margin

PHASE MARGIN

180°

－

180

－

Figure 20

Figure 21

(3) Design of Feedback Resistance Constant

Set the feedback resistance as shown below.

R1+ R2

Reference Voltage

V_OUT

Reference Voltage

[V]

＋

ERR

－

Figure 22

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(4) Soft Start Function

The buck converter has an adjustable Soft Start function to

prevent high inrush current during start up.

COMP

2.9V(typ)

ERRAMP

The soft-start time is set by the external capacitor connected

to SS pin.

The soft start time is given by;

70k(typ)

tss = 16200× C_SS

[ ]

C_SS

Please confirm the overshoot of the output voltage and inrush

current when deciding the SS capacitor value.

Figure 23

(5) EN Function

The EN terminal control the IC’s shut down.

Leaving EN terminal open will shutdown the IC.

To start the IC, EN terminal should be connected to V_INor the

other power source output.

V_IN

When the EN voltage exceed 1.2V (typ), the IC start

operating.

66kΩ(typ)

60kΩ(typ)

Figure 24. The Equivalent Internal Circuit

3. Selecting Application Components

Two high pulsing current flowing loops exist in the buck regulator system.

The first loop, when FET is ON, starts from the input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to

the output capacitors, and then returns to the input capacitor through GND.

The second loop, when FET is OFF, starts from the Schottky diode, to the inductor, to the output capacitor, and then

returns to the Schottky diode through GND.

To reduce the noise and improve the efficiency, please minimize these two loop area.

Especially input capacitor, output capacitor and Schottky diode should be connected to GND plane.

PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing

PCB Layout patterns.

V_IN

V_OUT

C_OUT

C_IN

FET

Figure 25. Current Loop in Buck Regulator System

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(1) The Thermal Pad on the back side of IC serves as heat sink for thermal conduction to the chip. Making the GND

plane as broad and wide as possible can help in thermal dissipation. Adding a lot of thermal via is also effective for

helping the spread of heat to the different layer.

(2) The input capacitors should be connected as close as possible to the VIN terminal.

(3) When there is unused area on PCB, please arrange the copper foil plane of DC nodes, such as GND, VIN and VOUT

for helping heat dissipation of IC or circumference parts.

(4) Make the trace of the switching line as short and thick as possible to coil to avoid the noise influence of AC signals to

combine with the other line.

(5) Keep sensitive signal traces such as trace connected FB and COMP away from SW pin.

(6) The inductor, the Schottky diode and the output capacitors should be placed close as possible to SW pin.

BST

VIN

C_IN

VIN

COMP

FET

GND

C_OUT

V_OUT

Figure 26. The Example of PCB Layout Pattern

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I/O Equivalence Circuit

1.BST

3.SW

5.FB

V_IN

REG

6.COMP

7.EN

8.SS

V_IN

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush

current may flow instantaneously due to the internal powering sequence and delays, especially if the IC

has more than one power supply. Therefore, give special consideration to power coupling capacitance,

power wiring, width of ground wiring, and routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 29. Example of monolithic IC structure

13. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

14. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

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TSZ02201-0323AAJ00440-1-2

09.Sep.2014 Rev.003

15/19

BD9325FJ-LB BD9326EFJ-LB BD9327EFJ-LB

Power Dissipation

HTSOP-J8 Package

On 70 × 70 × 1.6 mm glass epoxy PCB

4000

(4)3760mW

(1) 1-layer board (Backside copper foil area 0 mm × 0 mm)

(2) 2-layer board (Backside copper foil area 15 mm × 15 mm)

(3) 2-layer board (Backside copper foil area 70 mm × 70 mm)

(4) 4-layer board (Backside copper foil area 70 mm × 70 mm)

3000

(3)2110mW

2000

(2)1100mW

1000

(1)820mW

100

125 150

Figure 29. AMBIENT TEMPERATURE: Ta [°C]

SOP-J8 Package

4000

On 70 × 70 × 1.6 mm glass epoxy PCB

(1) 1-layer board (Backside copper foil area 0 mm × 0 mm)

3000

2000

1000

(1)675mW

100

125 150

Figure 30. AMBIENT TEMPERATURE: Ta [°C]

Marking Diagrams

SOP-J8(TOP VIEW)

HTSOP-J8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

Part Number Marking

Package

SOP-J8

Orderable Part Number

BD9325FJ-LBE2

D9325

D9326

D9327

HTSOP-J8

BD9326EFJ-LBE2

BD9327EFJ-LBE2

www.rohm.com

TSZ22111･15･001

TSZ02201-0323AAJ00440-1-2

16/19

09.Sep.2014 Rev.003

BD9325FJ-LB BD9326EFJ-LB BD9327EFJ-LB

Physical Dimensions, Tape and Reel information

Package Name

SOP-J8

www.rohm.com

TSZ22111･15･001

TSZ02201-0323AAJ00440-1-2

09.Sep.2014 Rev.003

17/19

BD9325FJ-LB BD9326EFJ-LB BD9327EFJ-LB

Physical Dimensions, Tape and Reel information - continued

Package Name

HTSOP-J8

www.rohm.com

TSZ22111･15･001

TSZ02201-0323AAJ00440-1-2

09.Sep.2014 Rev.003

18/19

BD9325FJ-LB BD9326EFJ-LB BD9327EFJ-LB

Revision History

Date

Revision

001

Changes

05.Aug.2013

New Release

Delete sentence “and log life cycle” in General Description and Futures.

Applied new style (“title” and “Physical Dimension Tape and Reel Information”).

Applied the ROHM Standard Style and improved understandability in all pages.

27.Feb.2014

09.Sep.2014

002

003

www.rohm.com

TSZ22111･15･001

TSZ02201-0323AAJ00440-1-2

09.Sep.2014 Rev.003

19/19

Daattaasshheeeett

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice – SS

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice – SS

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

Buy

BD9325FJ-LB - Web Page

Distribution Inventory

Part Number

Package

BD9325FJ-LB

SOP-J8

Unit Quantity

2500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2500

Taping

inquiry

Yes

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