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产品型号BD93291EFJ-E2的概述

芯片BD93291EFJ-E2的概述与应用分析 一、概述 BD93291EFJ-E2是由日本企业ROHM Semiconductor出品的一款高性能电源管理IC。其设计目标主要针对移动设备、便携式电子产品以及其他需要高效率电源管理的应用场景。该芯片具备多项优异特性,如高转化效率、宽输入电压范围以及丰富的保护功能,能够满足多种复杂的电源需求。 BD93291EFJ-E2采用了先进的Buck DC-DC转换技术,能够将输入电压有效地转换为稳定的输出电压。这种转换方式在现代电子产品中非常常见,它能有效提高电源利用效率,从而延长设备的使用时间。此外,BD93291EFJ-E2具备较高的负载响应速度,能够快速适应负载变化,为设备提供及时、稳定的电压供应。 二、详细参数 在技术规格方面,BD93291EFJ-E2具有以下关键参数: 1. 输入电压范围:支持宽范围输入电压,通常在4.5V至30V之...

产品型号BD93291EFJ-E2的Datasheet PDF文件预览

Datasheet  
Dual Synchronous Buck Converter  
BD93291EFJ  
Description  
The BD93291EFJ is a dual synchronous buck converter.  
It integrates wide input voltage range (8.0V to 26V) synchronous  
buck converter and low input voltage (Vout1 : 5.0V)  
synchronous buck converter.  
Features  
Dual Synchronous Buck Converter in small package.  
standby mode ( Istandby = 0uA )  
High Voltage Synchronous Buck Converter(Vout1)  
The IC also incorporates a new technology called  
H3RegTM, a Rohm proprietary control method which  
facilitates ultra-high transient response against changes in  
load. SLLM (Simple Light Load Mode) technology is also  
integrated to improve efficiency when powering lighter  
loads. For protection and ease of use, the IC also  
incorporates soft start.  
Space-saving and high efficient switching regulator can be  
achieved due to built-in N-MOSFET power transistor in  
HTSOP-J8 package.  
-
-
-
-
-
-
Wide input range(8.0V to 26V) *absolute voltage 30V  
H3RegTM DC/DC Converter Controller included  
Output Current 1.7A *1  
FET on resistance High-side 0.175Ω/Low-side 0.175Ω  
Internal soft-start function  
Switching Frequency 300 to 600kHz  
(*According to input/output conditions)  
Fixed output voltage (5.0V ± 1.5%; Normal Mode)  
-
Low Voltage Synchronous Buck Converter(Vout2)  
-
-
-
-
-
-
Input voltage range 5.0V(VOUT1)  
H3RegTM DC/DC Converter Controller included  
Output Current 0.5A *1  
Applications  
FET on resistance High-side 0.25Ω/Low-side 0.25Ω  
Internal soft-start function  
Switching Frequency 1.5M to 2.5MHz  
(*According to input/output conditions)  
Feedback voltage (0.8V ± 1.5%; Normal Mode)  
Distributed Power System  
Pre-Regulator for Linear Regulator  
-
Typical Application Circuit  
Protection Circuits  
Under Voltage Lockout Protection  
Thermal Shutdown  
Over Current Protection  
C_UP  
VOUT2  
R_DW  
HTSOP-J8 Package with Exposed thermal PAD.  
R_UP  
*1 Vout1 maximum output current capability is 2.5A, and  
Vout2 maximum output current capability is 1.5A with the  
optimal PCB power consumption design.  
C_CO2  
L2  
C_CO3  
Structure  
Silicon Monolithic Integrated Circuit  
Package  
Thermal Pad  
(to be shorted to GND)  
HTSOP-J8  
6.00mm x 4.90mm x 1.00mm  
PIN Configuration (TOP VIEW)  
L1  
VOUT1  
BD93291EFJ  
C_VC1  
C_BS  
C_CO1  
Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays  
www.rohm.com  
1/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ2211114001  
BD93291EFJ  
Daattaasshheeeett  
Block Diagram  
VIN  
BST  
EN  
VREG  
VREF  
VREF  
14V  
UVLO1  
TS
D
VOUT1  
VIN  
SW  
VOUT  
DRV  
LOGIC  
TM  
H3Reg  
Controller  
Block  
LVS  
LVS  
Vout1(5V, Fix)  
OCP  
Current  
Sense  
FB  
0.8V  
+
EN  
Soft  
Start  
TSD  
UVLO1  
VOUT  
UVLO2  
VOUT2  
SWL  
DRV  
TM  
Vout2(3.3V)  
H3Reg  
Controller  
Block  
LOGIC  
0.8V  
FBL  
+
OCP  
Current  
Sense  
EN  
Soft  
Start  
UVLO2  
TSD  
GND  
Pin Assignment and Pin Function  
No.  
Symbol  
Description  
Connect the inductor switching node of high voltage buck converter.  
This pin is connected to the source node of High side FET and the drain node of Low side FET.  
1
SW  
Connect 0.1uF Boot Strap capacitor between BST pin and SW pin.  
This capacitor is for generating the driving voltage of High-side N-channel MOSFET.  
2
3
BST  
EN  
This is Enable pin of BD93291EFJ.  
High input (2.3V typ.) is output active. Low input (1.8V typ.) is IC shutdown.  
The internal impedance of EN pin is high, therefore add capacitor between EN and GND pin to reduce  
noise influence when this pin is connected to high-impedance node.  
Power supply pin of high voltage buck converter.  
4
5
6
7
8
VIN  
GND  
FBL  
This pin is connected to power FET supply and internal control blocks of high voltage buck converter.  
Connect to 10uF(recommended value) ceramic capacitor for bias capacitor.  
This pin is Low-side N-channel MOSFET power ground of high voltage buck converter, Low-side  
N-channel MOSFET power ground of low voltage buck converter and analog ground of other blocks.  
This pin is output voltage feed-back pin of low voltage buck converter. Refer to ---page regarding the  
setting of output voltage.  
Connect the inductor switching node of low voltage buck converter.  
This pin is connected to the drain node of High side Pch-FET and the drain node of Low side FET.  
SWL  
VOUT  
This pin is power supply pin of low voltage buck converter and output voltage feed-back pin of high voltage  
buck converter. This pin is connected to power FET supply and internal control blocks of low voltage buck  
converter. Connect to 10uF(recommended value) ceramic capacitor for bias capacitor.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
TSZ2211115001  
BD93291EFJ  
Daattaasshheeeett  
Absolute maximum ratings (Ta = 25°C)  
Symbol  
Rating  
Unit  
Parameter  
Supply Voltage 1  
VIN  
VSW  
30  
30  
V
V
Switch Voltage 1  
Supply Voltage 2  
VOUT  
VSWL  
Pd  
7.0  
V
Switch Voltage 2  
7.0  
V
3760 *1  
29.27  
3.75  
mW  
/W  
/W  
Power Dissipation for HTSOP-J8  
Package thermal resistance θja *2  
Package thermal resistance θjc *2  
Operating Temperature Range  
Storage Temperature Range  
Junction Temperature  
BST Voltage  
θja  
θjc  
Topr  
Tstg  
Tjmax  
VBST  
VEN  
-40 to +85  
-55 to +150  
150  
VSW+7  
V
EN Voltage  
30  
V
*1 Derating in done 30.08 mW/for operating above Ta25(Mount on 4-layer 70.0mm×70.0mm×1.6mm board)  
*2 Mount on 4-layer 50mm x 30mm x 1.6mm application board  
Operation Range(Ta= -40 to 85)  
Symbol  
Min  
Typ  
Max  
Unit  
Parameter  
Supply Voltage 1  
Supply Voltage 2  
SW Voltage 1  
VIN  
VOUT  
VSW  
VSWL  
Vout1  
Vout2  
8.0  
-
14  
5.0  
-
26  
-
V
V
V
V
V
V
-0.5  
-0.5  
-
26  
5.5  
-
SW Voltage 2  
-
Output voltage range 1 (Fixed)  
Output voltage range 2  
5.0  
3.3  
0.8  
4.0  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
3/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
TSZ2211115001  
BD93291EFJ  
Daattaasshheeeett  
Electrical characteristics (unless otherwise specified VIN=14V, VOUT1=5V, VOUT2=3.3V Ta=25)  
Limits  
Symbol  
Unit  
Conditions  
Parameter  
Min  
Typ  
Max  
High Voltage Synchronous Buck Converter】  
Output Voltage  
±1.5%,normal mode  
ISW= -0.8A  
VOUT1  
4.925  
5.0  
5.075  
V
Hi-side FET On-resistance  
Lo-side FET On-resistance  
RONH1  
RONL1  
-
-
0.175  
0.175  
-
-
ISW= 0.8A  
VIN= 26V,  
VSW = 0V / 26V  
Hi/Lo-side FET Leak current  
ILEAK1  
-
0
10  
µA  
Switch Current Limit  
Soft-start time  
ILIMIT1  
VSS1  
3.0  
2.5  
-
-
A
5.0  
7.5  
ms  
Fsw1=450kHz(typ)  
Iout=0.3A  
ON Time  
TON1  
635  
-
794  
200  
953  
-
ns  
ns  
Minimum Off Time  
T OFF1  
Low Voltage Synchronous Buck Converter】  
Feed-back Voltage  
±1.5%,normal mode  
VFBL  
IFBL  
0.788  
0.8  
0
0.812  
V
µA  
FBL input bias current  
-1.0  
1.0  
Hi-side FET On-resistance  
Lo-side FET On-resistance  
ISWL= -0.8A  
ISWL= 0.8A  
RONH2  
RONL2  
-
-
0.25  
0.25  
-
-
VOUT1= 5.5V,  
VSWL = 0V / 5.5V  
Hi/Lo-side FET Leak current  
ILEAK2  
-
0
10  
µA  
Switch Current Limit  
Soft-start time  
ILIMIT2  
VSS1  
2.0  
-
-
A
1.25  
2.5  
3.75  
ms  
Fsw2=2MHz(typ)  
Iout=0.2A  
ON Time  
TON2  
264  
-
330  
50  
396  
-
ns  
ns  
Minimum Off Time  
General】  
T OFF3  
Enable Sink current  
VEN= 14V  
Rising  
IEN  
33  
2.2  
1.7  
7.1  
-
56  
2.3  
1.8  
7.5  
1.0  
2.5  
0.2  
73  
2.4  
1.9  
7.9  
-
µA  
V
Enable Threshold voltage 1  
Enable Threshold voltage 2  
VEN_R  
VEN_F  
VUVLO1  
VHYS1  
VUVLO2  
VHYS2  
Falling  
V
VIN Under Voltage Lockout threshold  
VIN Under Voltage Lockout Hysteresis  
VOUT Under Voltage Lockout threshold  
VOUT Under Voltage Lockout Hysteresis  
VIN rising  
V
V
VOUT rising  
2.3  
-
2.7  
-
V
V
VOUT= 5.5V, VEN=  
14V  
Circuit Current VIN  
ICC_VIN  
-
0.6  
1.5  
mA  
VFBL= 1.0V, VEN=  
14V  
Circuit Current VOUT  
Standby Current  
ICC_VOUT  
IQUI  
-
-
0.6  
0
1.5  
5
mA  
µA  
VEN= 0V  
* This product is not designed for protection against radioactive rays  
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© 2012 ROHM Co., Ltd. All rights reserved.  
4/21  
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TSZ2211115001  
BD93291EFJ  
Daattaasshheeeett  
Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V)  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
10  
100  
1000  
Iout2 [mA]  
10000  
10  
100  
1000  
Iout1 [mA]  
10000  
Figure 4. VOUT1 Efficiency  
Figure 5. VOUT2 Efficiency  
(VOUT1=5V, VOUT2=3.3V, L=2.2H)  
(VIN=14V, L=22H)  
VOUT1(AC)  
50mV/div  
VOUT2(AC)  
10mV/div  
SW  
5V/div  
SWL  
2V/div  
ISW  
1A/div  
ISWL  
1A/div  
1sec/div  
1sec/div  
Figure 6. VOUT1 Ripple voltage  
Figure 7. VOUT2 Ripple voltage  
(VIN=14V, L1=22H, COUT1=22F, Iout=1A)  
(VOUT1=5V, VOUT2=3.3V, L2=2.2H, COUT2=22F,  
Iout=0.3A)  
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Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued)  
5.20  
5.10  
5.00  
4.90  
4.80  
5.20  
5.10  
5.00  
4.90  
4.80  
Iout1=10mA  
Iout1=1A  
0
500  
1000  
1500  
2000  
2500  
8
10 12 14 16 18 20 22 24 26  
VIN[V]  
Iout1 [mA]  
Figure 8. VOUT1 Load Regulation  
Figure 9. VOUT1 Line Regulation  
(VIN=14V, L1=22H)  
(VIN=14V, L1=22H, Iout1=10mA / 1A)  
5.20  
5.10  
5.00  
4.90  
4.80  
800  
700  
600  
500  
400  
300  
200  
Iout1=10mA  
Iout1=1A  
-40  
-20  
0
20  
40  
60  
80  
5
10  
15  
20  
VIN [V]  
25  
30  
Temperature [℃]  
Figure 10. VOUT1 - Temperature  
(VIN=14V, L1=22H, Iout1=10mA/1A)  
Figure 11. SW_Frequency - VIN  
(VIN=14V, L1=22H, Iout1=1A)  
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Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued)  
EN  
2V/div  
EN  
2V/div  
VOUT1  
2V/div  
VOUT1  
2V/div  
VOUT2  
2V/div  
VOUT2  
2V/div  
IIN  
1A/div  
IIN  
1A/div  
4msec/div  
4msec/div  
Figure 12. Start up wave form  
(VIN=14V, VOUT1=5V, VOUT2=3.3V, L1=22H,  
Figure 13. Off wave form  
(VIN=14V, VOUT1=5V, VOUT2=3.3V, L1=22H,  
L2=2.2H, COUT1=22F, COUT2=2.2F, Iout1=2A,  
Iout2=1A)  
L2=2.2H, COUT1=22F, COUT2=2.2F, Iout1=2A,  
Iout2=1A)  
VOUT1 (AC)  
200mV/div  
VOUT1 (AC)  
200mV/div  
SW  
20V/div  
SW  
20V/div  
Iout1  
2A/div  
Iout1  
2A/div  
Iout1 0A->2A/10us  
Iout1 2A->0A/10us  
10sec/div  
10sec/div  
Figure 14. VOUT1 Transient Response  
(VIN=14V, VOUT1=5V, L=22H, COUT=22F)  
Iout=0->2A (SR=0.2A/sec)  
Figure 15. VOUT1 Transient Response  
(VIN=14V, VOUT1=5V, L=22H, COUT=22F)  
Iout=2->0A (SR=0.2A/sec)  
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Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued)  
VOUT2 (AC)  
20mV/div  
VOUT2 (AC)  
20mV/div  
SWL  
SWL  
2V/div  
2V/div  
Iout2 0A->200mA/10us  
Iout2 200mA->0A/10us  
Iout2  
Iout2  
200mA/div  
200mA/div  
10sec/div  
10sec/div  
Figure 16. VOUT2 Transient Response  
(VOUT1=5V, VOUT2=3.3V, L2=2.2H,  
COUT2=22F),  
Figure 17. VOUT2 Transient Response  
(VOUT1=5V, VOUT2=3.3V, L2=2.2H,  
COUT2=22F),  
Iout2=0->200mA (SR=20mA/sec)  
Iout2=200mA->0mA (SR=20mA/sec)  
VOUT2 200mV/div  
VOUT1 2V/div  
SW 20V/div  
SWL 2V/div  
Iout1  
2A/div  
Iout2  
2A/div  
2sec/div  
2sec/div  
Figure 18. VOUT1 OCP function  
Figure 19. VOUT2 OCP function  
(VIN=14V, VOUT1=5V, VOUT2=3.3V, L1=22H,  
COUT1=22F)  
(VIN=14V, VOUT1=5V, VOUT2=3.3V, L2=2.2H,  
COUT2=22F)  
(VOUT1 is shorted to GND)  
(VOUT2 is shorted to GND)  
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Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued)  
3.50  
3.40  
3.30  
3.20  
3.10  
3.00  
3.50  
3.40  
3.30  
3.20  
3.10  
3.00  
0
500  
1000  
Iout [mA]  
1500  
-40  
-20  
0
20  
40  
60  
80  
Temperature [℃]  
Figure 20. VOUT2 Load Regulation  
Figure 21. VOUT2 - Temperature  
(VOUT1=5V, L=2.2H)  
(VOUT1=5V, L=2.2H, Iout=1.5A)  
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Explanation of Operation  
The BD93291EFJ is a dual synchronous buck converter incorporating ROHM’s proprietary H3RegTM CONTROLLA system.  
When VOUT1 and VOUT2 drop due to a rapid load change, the system quickly restores VOUT1 and VOUT2 by increasing  
the frequency.  
1. H3RegTM System  
1-1. Normal Operation  
When FB falls below the threshold voltage (REF), a drop is detected, activating the H3RegTM CONTROLLA system.  
V
1
f
OUT  
[sec]  
(1)  
Ton  
V
IN  
HG (Gate of High side MOSFET) output is determined by the formula (1). LG (Gate of Low side MOSFET) output operates  
until FB voltage falls below REF voltage after HG becomes OFF. OFF time is restricted by MIN OFF Time ( VOUT1 :  
200nsec (typ.), VOUT2 : 50nsec (typ.) ).  
Hence, BD93291EFJ runs with a constant on-time by using the input and output voltage to set the internal on-time timer.  
1-2. VOUT drops due to a rapid load change  
When FB (VOUT) drops due to a rapid load change and the voltage remains below REF, the system quickly restores VOUT  
by shortening OFF time of HG (increasing the frequency), improving transient response as shown Figure 22 (b).  
FB  
FB  
REF  
REF  
Io  
HG  
LG  
HG  
LG  
(a) Normal operation  
(b) Rapid load change  
Figure 22. H3REG System  
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Timing Chart  
1. Soft Start Function  
Soft start is utilized when the EN pin is set high. Current control takes effect at startup, enabling a moderate “ramping start”  
on the output voltage. Soft start time of VOUT1 is 5.0msec (typ) and VOUT2 is 2.5ms (typ).  
EN  
5.0ms (typ)  
5V(fixed)  
2.5V (typ)  
VOUT1  
2.5ms (typ)  
3.3V  
VOUT2  
Figure 23. Soft Start Timing Chart  
Protection Operation  
1. OCP Operation  
Normally, when FB voltage falls below REF voltage, HG becomes high. However, if the peak current through the inductor  
(IL) exceeds OCP current value (IOCP) during HG=ON, HG become OFF immediately and IL is restricted by IOCP. As the result,  
the output voltage can decrease as the frequency and duty are changed.  
When OCP is released in the state that the output has decreased by OCP operation, the output voltage might rise up due to  
high-speed load response.  
Figure 24. OCP Timing Chart  
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2. TSD Operation (Self Recovery)  
TSD is self-activating. If the junction temperature exceeds Tj = 175, and HG, LG, and SS become Low.  
The IC becomes standby when TSD operating.  
When Tj falls below 150, it returns to standard operation.  
3. UVLO Operation  
UVLO operates when VIN voltage falls below 6.5V, and HG and LG become Low.  
The IC becomes standby when UVLO operating.  
UVLO is released when VIN goes up to 7.5V, and starts standard operation  
Selection of Components Externally Connected  
1. Output LC Filter Selection (Buck Converter)  
1-1. Inductor (L) Selection  
The Output LC filter is required to supply constant current to the output load. A larger value inductance at this filter results  
in less inductor ripple current (IL) and less output ripple voltage. However, the larger value inductors tend to have less  
fast load transient-response, a larger physical size, a lower saturation current and higher series resistance. A smaller  
value inductance has almost opposite characteristics above.  
The value of ΔIL is shown as formula (2). The larger value of the inductance or the faster switching frequency make the  
lower ripple voltage.  
V
V  
L f V  
V  
OUT  
IN  
OUT  
I  
[A]  
(2)  
(3)  
L
IN  
The proper output ripple current setting is about 30% of maximum output current.  
I 0.3 I  
[A]  
L
OUTMAX  
V V  
OUT  
V  
IN  
OUT  
L   
[H]  
(4)  
I f V  
L
IN  
(ΔIL : output ripple currentf : switching frequency)  
A larger current than the inductor’s rated current will cause magnetic saturation in the inductor, and decrease efficiency.  
When selecting an inductor, be sure to allow enough margins to assure that peak current does not exceed the inductor’s  
rated current value.  
To minimize loss of inductor and improve efficiency, choose a inductor with a low resistance (DCR, ACR).  
VIN  
IL  
L
HG  
SW  
VOUT  
COUT  
ΔIL  
LG  
Figure 25. Inductor Ripple Current  
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12/21  
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12. Nov. 2012 Rev.001  
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1-2. Output Capacitor (COUT) Selection  
Output Capacitor (COUT) has a considerable influence on output voltage regulation due to a rapid load change and  
smoothing output ripple voltage. Determine the capacitor by considering the value of capacity, the equivalent series  
resistance, and equivalent series inductance. Also, make sure the capacitor’s voltage rating is high enough for the set  
output voltage (including ripple).  
Output ripple voltage is determined as in formula (5) below.  
ΔVOUT=ΔIL/(8×COUT×f)+ESR×ΔIL +ESL×ΔIL / Ton  
[V]  
(5)  
(ΔIL Output ripple currentESR: Equivalent series resistanceESL: Equivalent series inductance)  
Also, give consideration to the conditions in formula (6) below for output capacitance, bearing in mind that output rise time  
must be established within the fixed soft start time. As output capacitance, bypass capacitor will be also connected to  
output load side (CEXT, Figure 26). Please set the over current detection value with regards to these capacitance.  
SS   
I  
I  
OCP  
OUT  
C
[F]  
(6)  
OUT  
V
OUT  
(SS : Soft Start time, IOCP : OCP Current Limit, IOUT : Output Current)  
Note: an improper output capacitor may cause startup malfunctions.  
VIN  
HG  
SW  
VOUT  
L
ESR  
CEXT  
Load  
LG  
ESL  
COUT  
Figure 26. Output Capacitor  
2. Input Capacitor (CIN) Selection  
VIN  
In order to prevent transient spikes in voltage, the input capacitor should have a low  
enough ESR resistance to fully support a large ripple current. The formula for ripple  
current IRMS is given in equation (7) as below.  
CIN  
HG  
VOUT  
SW  
VOUT (V VOUT  
)
IN  
[A]  
(7)  
IRMS IOUT  
L
V
COUT  
IN  
LG  
IOUT  
2
Where VIN =2×VOUT, IRMS=  
A low ESR capacitor is recommended to reduce ESR loss and improve efficiency.  
Capacitor Cout between VOUT and GND must be placed near the VOUT pin.  
Figure 27. Input Capacitor  
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3. VOUT2 Output Voltage Setting  
The IC controls output voltage as REFVFBL  
.
However, the actual output voltage will also reflect the average ripple voltage value.  
The VOUT2 output voltage is set with a resistor divider from the output node to the FBL pin. The formula for output voltage  
is given in (8) below:  
R_UP+RD_W  
VOUT2 =  
× REF +VOUT  
[V]  
[V]  
(8)  
R_DW  
REF = VFBL(TYP 0.8V) + 0.02 – (ON DUTY × 0.05)  
(9)  
VOUT2  
ON DUTY =  
(10)  
VOUT1  
C_UP is needed to feedback output voltage ripple to FBL pin, the value is calculated to  
11e-6 (+/-30%)  
C_UP =  
[F]  
(11)  
R_UP  
Please refer to eq. (5) regarding VOUT.  
VOUT1  
REF  
Output Voltage  
VOUT2  
R
S
Q
H3RegTM  
CONTROLLA  
Driver  
Circuit  
VFBL  
R_UP  
R_DW  
C_UP  
Figure 28. Output Voltage VOUT2 Setting  
4. Relationship between Output Voltage and ONTIME  
BD93291EFJ is a dual synchronous buck converter controlling constant ONTIME. The ONTIME (Ton) depends on the  
output voltage settings, as described by the formula (12).  
VOUT  
1
Ton≒  
[sec]  
(12)  
V
Frequency  
IN  
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PCB Layout Guide  
Two high pulsing current flowing loops exist in the buck regulator system.  
The first loop, when FET is ON, starts from the input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to the  
output capacitors, and then returns to the input capacitor through GND.  
The second loop, when FET is OFF, starts from the low FET, to the inductor, to the output capacitor, and then returns to the  
low FET through GND.  
To reduce the noise and improve the efficiency, please minimize these two loop area.  
Especially input capacitor and output capacitor should be connected to GND plain.  
PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing PCB  
Layout patterns.  
L
VIN  
VOUT  
COUT  
CIN  
FET  
GND  
Figure 29. Current loop Buck regulator system  
The thermal pad on the back side of IC has the great thermal conduction to the chip. So using the GND plain as broad and  
wide as possible can help thermal dissipation. And a lot of thermal via for helping the spread of heat to the different layer is  
also effective.  
The input capacitors (C_VC1 and C_CO3) should be connected as close as possible to the VIN or VOUT terminal.  
Especially, C_CO3 between VOUT and GND must be placed near the VOUT pin, and keep the distance "b" less than 2mm.  
When there is unused area on PCB, please arrange the copper foil plain of DC nodes, such as GND, VIN and VOUT for  
helping heat dissipation of IC or circumference parts.  
To avoid the noise influence from AC combination with the other line, keep the switching line such as SW and SWL not  
extend as much as possible, and trace shortly and thickly to coil L1 and L2.  
Keep sensitive signal traces such as trace connected FBL away from SW and SWL pins.  
The inductors and the output capacitors should be placed close to SW or SWL pins as much as possible.  
Keep VOUT pattern width "a" more than 3mm to stable the 5V output.  
Figure 30. Example of PCB layout pattern  
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List of Evaluation Board Components  
C_UP  
R_UP  
L2  
VOUT2  
C_CO2  
R_DW  
C_CO3  
Thermal Pad  
(to be shorted to GND)  
L1  
VOUT1  
C_CO1  
C_VC1  
C_BS  
Figure 31. Typical Application Circuit  
Recommended Components List (VIN=14V, VOUT1=5V, VOUT2=3.3V)  
Symbol  
C_VC1  
Part  
Ceramic Capacitor  
Ceramic Capacitor  
Coil  
Value  
10uF  
Manufacture  
murata  
murata  
TDK  
Series  
GRM32DF51H106ZA01L  
GRM188F11H104ZA01  
SLF10165 220M 2R4  
C_BST  
L1  
0.1uF  
22uH  
2.2uH  
22uF  
22uF  
10uF  
680pF  
16kΩ  
5.1kΩ  
L2  
Coil  
TDK  
VLF 4012S 2R2M 1R3  
GRM21BB31A226ME51L  
GRM21BB31A226ME51L  
GRM21BB31A106ME18  
GRM1882C1H681JA01  
MCR03 1608size Tolerance F  
MCR03 1608size Tolerance F  
C_CO1  
C_CO2  
C_CO3  
C_UP  
R_UP  
R_DW  
Ceramic Capacitor  
Ceramic Capacitor  
Ceramic Capacitor  
Ceramic Capacitor  
Resistance  
murata  
murata  
murata  
murata  
ROHM  
ROHM  
Resistance  
The above components list is an example. Please check actual circuit characteristics on the application carefully before use.  
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I/O Equivalence circuit  
SW  
BST  
EN  
EN  
VIN  
VIN  
REG  
BST  
VIN  
SW  
SW  
FBL  
SWL  
VOUT  
VOUT  
VOUT  
VOUT  
VOUT  
SWL  
SWL  
FBL  
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Operational Notes  
(1) Absolute Maximum Ratings  
Use of the IC in excess of absolute maximum ratings may result in damage to the IC. Assumptions should not be made  
regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are  
expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate  
the risk of damaging the IC.  
(2) GND voltage  
The potential of the GND pin must be the minimum potential in the system in all operating conditions.  
(3) Thermal design  
Use a thermal design that allows for a sufficient margin for power dissipation (Pd) under actual operating conditions  
(4) Inter-pin Shorts and Mounting Errors  
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in  
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by  
poor soldering or foreign objects may result in damage to the IC.  
(5) Operation in Strong Electromagnetic Fields  
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications  
where strong electromagnetic fields may be present.  
(6) ASO (Area of Safe Operation)  
When using the IC, ensure that operating conditions do not exceed absolute maximum ratings or ASO of the output  
transistors.  
(7) Testing on application boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to  
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be  
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent  
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.  
(8) Electrical Characteristics  
The electrical characteristics indicated in this datasheet may change upon the conditions of temperature, supply voltage,  
and external components. Please validate/verify your design at the worst case conditions.  
(9) Not of a radiation-resistant design.  
(10) Back Electromotive Force  
If a large inductive load is connected at the output pin that might cause introducing back electromotive force at the start up  
and at the output disable, please insert protection diodes.  
OUTPUT  
PIN  
Figure 32. Back Electromotive Force  
(11) Regarding input pins of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.  
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes  
and/or transistors. For example (refer to the figure below):、  
•When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode  
•When GND > Pin B, the PN junction operates as a parasitic transistor  
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
18/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
TSZ2211115001  
BD93291EFJ  
Daattaasshheeeett  
Resistor  
Transistor (NPN)  
Pin B  
Pin B  
Pin A  
B
C
E
Pin A  
C
E
P
B
N
N
P+  
P
P+  
N
N
P+  
P+  
P substrate  
N
N
Parasitic  
element  
Parasitic  
element  
P substrate  
GND  
GND  
GND  
Other adjacent  
elements  
Parasitic element  
GND  
Parasitic element  
Figure 33. Example of IC structure  
(12) Ground Wiring Pattern  
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but  
connected to a single ground potential within the application in order to avoid variations in the small-signal ground  
caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND  
voltage.  
(13) Operating Condition  
The electrical characteristics indicated in this datasheet are not guaranteed for the whole operational and temperature  
ranges, however these characteristics do not significantly fluctuate within the operational and temperature ranges.  
(14) Thermal shutdown (TSD) circuit  
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of  
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used  
after this function has activated, or in applications where the operation of this circuit is assumed. If the thermal shutdown  
is activated while the load current exists, the output may possibly be latched off at the release of the thermal shutdown.  
TSD ON Temp.[] (typ.)  
Hysteresis Temp[] (typ.)  
175  
25  
(15) Heat Sink (FIN)  
The heat sink (FIN) is connected to the substrate. Please connect it to GND.  
Status of this document  
The English version of this document is formal specification. A customer may use this translation version only for a reference to  
help reading the formal version.  
If there are any differences in translation version of this document formal version takes priority  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
19/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
TSZ2211115001  
BD93291EFJ  
Daattaasshheeeett  
Thermal Derating Curves  
4000  
3000  
(4)3760mW  
(3)2110mW  
(2)1100mW  
2000  
1000  
(1)820mW  
25  
HTSOP-J8 Package  
On 70 70 1.6 mm glass epoxy PCB  
(1) 1-layer board (Backside copper foil area 0 mm0 mm)  
(2) 2-layer board (Backside copper foil area 15 mm 15 mm)  
(3) 2-layer board (Backside copper foil area 70 mm 70 mm)  
(4) 4-layer board (Backside copper foil area 70 mm 70 mm)  
0
0
50  
75  
100  
125 150  
AMBIENT TEMPERATURE: Ta [°C]  
Figure 34. Thermal derating curve  
(HTSOP-J8)  
Ordering Information  
B D 9  
3
2
9
1 E F  
J
-
E 2  
Part Number  
Package  
EFJ: HTSOP-J8  
Packaging and forming specification  
E2: Embossed tape and reel  
Physical Dimension Tape and Reel Information  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2500pcs  
Quantity  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
Marking Diagram  
HTSOP-J8(TOP VIEW)  
Part Number Marking  
LOT Number  
D 9 3 2 9 1  
1PIN MARK  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
20/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
TSZ2211115001  
BD93291EFJ  
Daattaasshheeeett  
Revision History  
Date  
Revision  
Changes  
New Release  
12.Nov.2012  
001  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
21/21  
TSZ02201-0323AAJ00300-1-2  
12. Nov. 2012 Rev.001  
TSZ2211115001  
Daattaasshheeeett  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - GE  
Rev.002  
© 2014 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2014 ROHM Co., Ltd. All rights reserved.  
配单直通车
BD93291EFJ-E2产品参数
型号:BD93291EFJ-E2
是否Rohs认证: 符合
生命周期:Active
包装说明:HSOP,
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:11 weeks
风险等级:1.72
其他特性:ADJUSTABLE OUTPUT MODE FROM 0.8 TO 4 VOLT
模拟集成电路 - 其他类型:DUAL SWITCHING CONTROLLER
最大输入电压:26 V
最小输入电压:8 V
标称输入电压:14 V
JESD-30 代码:R-PDSO-G8
功能数量:1
端子数量:8
最高工作温度:85 °C
最低工作温度:-40 °C
标称输出电压:5 V
封装主体材料:PLASTIC/EPOXY
封装代码:HSOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG
峰值回流温度(摄氏度):NOT SPECIFIED
表面贴装:YES
切换器配置:BUCK
最大切换频率:2500 kHz
温度等级:INDUSTRIAL
端子形式:GULL WING
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
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