BD15KA5WFP原理图各脚功能电路原理芯片引脚定义引脚图及功能-中国IC网-芯三七

Secondary LDO Regulator Series for Local Power Supplies

500mA Secondary LDO Regulators

for Local Power Supplies

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

No.09024EAT01

●General Description

The BD□□KA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage

precision is ±1%. These secondary LDO regulators are offered in several output voltages and package lineups with or

without ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of

applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in overcurrent

protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown circuit.

●Features

1) Maximum output current : 500ｍA

2) Output voltage precision : ±1%

3) Low-saturation voltage with PMOS output : 0.12V Typ.(Io=200mA)

4) Built-in over-current protection circuit

5) Built-in thermal shutdown circuit

6) Shutdown switch(BD□□KA5WFP and BD□□KA5WF series)

7) TO252-3,TO252-5 and SOP8 package lineup

8) Operating temperature range : -40℃ to +105℃

9) Ceramic capacitor compatible(recommended capacitance : 1μF or greater)

●Applications

Microcontrollers and all electronic devices that use logic circuits

●Product line up

Part Number

BD□□KA5WFP

BD□□KA5WF

BD□□KA5FP

1.0

○

1.2

○

1.5

○

1.8

○

2.5

○

3.0

○

3.3

○

Variable

Package

TO252-5

SOP8

○

-

TO252-3

Part Number：BD□□KA5□□

a

b c

Symbol

Details

Output Voltage Designation

□□

10

Output Voltage(V)

1.0V(Typ.)

□□

25

Output Voltage(V)

2.5V(Typ.)

a

12

1.2V(Typ.)

30

3.0V(Typ.)

15

1.5V(Typ.)

33

3.3V(Typ.)

18

1.8V(Typ.)

00

Variable Output Typ

Switch

b

c

“W” included：Built-in shutdown switch

“W” not included：No shutdown switch

Package

FP：TO252-5 / TO252-3

F：SOP8

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2009.04 - Rev.A

1/9

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Absolute Maximum Ratings(Ta=25℃)

Symbol

Vcc

Limits

-0.3～+7.0^*1

-0.3～Vcc^*1

1200^*2

Unit.

V

Parameter

Power Supply Voltage

Output Control Terminal Voltage

TO252-3

VCTL

V

1300^*3

mW

Power Dissipation TO252-5

SOP8

Pd

687.6^*4

-40～+105

-55～+150

150

Operating Temperature Range

Ambient Storage Temperature

Topr

Tstg

℃

Maximum Junction Temperature

Tjmax

*1 Must not exceed Pd

*2 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃over 25℃.

*3 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃over 25℃.

*4 When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃over 25℃.

●Recommended Operating Range (Ta=25℃)

Parameter

Input Power Supply Voltage

Output Current

Symbol

Vcc

Io

Min.

2.3

0

Max.

5.5

Unit.

V

500

4.0

mA

V

Output Voltage Configuration Range^*5

Vo

1.0

0

Output Control Terminal Voltage

VCTL

Vcc

V

*5 Only BD00KA5WFP and BD00KA5WF

●Electrical Characteristics (abridged)

BD□□KA5WFP / WF / FP

(Unless specified otherwise,Ta=25℃,V_CTL=2V,Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V),Vcc=3.3V(Vo=2.5V),Vcc=5.0V(Vo=3.0V,3.3V))

Parameter

Symbol

Min.

Typ.

Vo(T)

Max.

Unit.

Conditions

Io＝200mA (Vo=1.0V,1.2V)

Io＝200mA (Vo≧1.5V)

Vo(T)-0.015

Vo(T)×0.99

Vo(T)+0.015

Vo(T)×1.01

V

Output Voltage

Vo

V

V_CTL=0V,Io=0mA

(during OFF mode)

Circuit Current at Shutdown

Isd

-

0

1

μA

Minimum I/O Voltage

Difference^*6

ΔVd

0.12

0.20

V

Io=200mA,Vcc=0.95×Vo

Output Current Capacity

Input Stability^*7

Io

500

-

mA

mV

Reg.I

Reg.L

-

10

25

35

75

Vcc=Vo+0.5V→5.5V,Io=200mA

Io=0mA→500mA

Load Stability

Output Voltage

Tcvo

-

±100

-

ppm/℃ Io=5mA,Tj=0～125℃

Temperature Coefficient^*8

Vo(T)：Preset output voltage value

*6 When Vo≧2.5V

*7 When 1.0≦Vo≦1.8V, Vcc=2.3V→5.5V

*8 Design guarantee(100% shipping inspection not performed)

BD00KA5WFP / WF

(Unless specified otherwise, Ta=25℃, Vcc=2.5V,VL＝2V,R1=30kΩ,R2=30kΩ^*9)

Parameter

Symbol

Min.

Typ.

Max.

Unit.

μA

V

Conditions

_CTL=0V, Io=0mA

(during OFF mode)

V

Circuit Current at Shutdown

Reference Voltage

Isd

-

0.742

-

0

1

V_ADJ

0.750

0.12

0.758

0.20

Io=50mA

Minimum I/O Voltage

Difference*10

ΔVd

V

Io=200mA,Vcc=0.95×Vo

Output Current Capacity

Input Stability

Io

500

-

mA

mV

Reg.I

Reg.L

-

10

25

35

75

Vcc=Vo+0.5V→5.5V,Io=200mA

Io=0mA→500mA

Load Stability

Output Voltage

Tcvo

-

±100

-

ppm/℃ Io=5mA,Tj=0～125℃

Temperature Coefficient^*11

*9

VOUT=VADJ×(R1+R2)÷R1(V)

VADJ×0.75V(Typ.)

*10 When Vo≧2.5V

*11 Design guarantee(100% shipping inspection not performed)

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2009.04 - Rev.A

2/9

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Reference Data (Unless specified otherwise, Vcc=25V,V_CTL=2V,and Io=0mA)

0.5

0.4

0.3

0.2

0.1

0.0

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

[BD15KA5WFP]

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

SUPPLY VOLTAGE:VCC[V]

Fig.1 Circuit current

Fig.2 Input Stability

（Io=0mA）

Fig.3 Input Stability

（Io=500mA）

300

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

60

[BD15KA5WFP]

55

50

45

40

35

30

25

20

15

10

5

[BD15KA5WFP]

[BD33KA5WFP]

250

200

150

100

50

0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5

OUTPUT CURRENT:IOUT[A]

100

1000

10000

100000

0

50 100 150 200 250 300 350 400 450 500

10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90

OUTPUT CURRENT:IOUT[mA]

FREQUENCY:f[Hz]

Fig.4 Load Stability

Fig.5 Input/Output Voltage Difference

Fig.6 Ripple Rejection

（ein=10dBV,Io=100mA）

（Vcc=3.135V）

10

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.6

1.5

1.4

[BD15KA5WFP]

8

6

4

2

0

-40

-20

0

20

40

60

80

100

-40

-20

0

20

40

60

80

100

0.0

0.1

0.2

0.3

0.4

0.5

TEMPERATURE:Ta[

]

OUTPUT CURRENT:IOUT[A]

℃

TEMPERATURE

:Ta[℃]

Fig.7 Output Voltage

Fig.9 Circuit Current by load Level

Fig.8 Circuit Current

Temperature Characteristics

（Io=5mA）

200

2.0

1.9

1.8

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

[BD15KA5WFP]

180

160

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

140

120

100

80

60

40

20

0

0.3

0.2

0.1

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

100

120

140

160

180

200

CONTROL VOLTAGE:VCTL[V]

TEMPERATURE:[

℃]

Fig.10 CTL Voltage vs. Output Voltage

Fig.11 CTL Voltage vs. Output Current

3/9

Fig.12 Thermal Shutdown

Circuit Characteristics (Io=5mA)

www.rohm.com

2009.04 - Rev.A

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Block diagrams, Standard circuit examples

[BD00KA5WFP]

[BD00KA5WF]

＊Output voltage configuration

GND(FIN)

1μF

VOUT=VADJ×（R1+R2）÷R1(V)

：VADJ=0.75V(Typ.)

：A value of approximately 30kΩ

is recommended for R1.

GND(7PIN)

Vcc(8PIN)

GND(6PIN) CTL (5PIN)

Vref

Driver

Vref

Driver

OCP

＊Output voltage configuration

VOUT=VADJ×（R1+R2）÷R1(V)

：VADJ=0.75V(Typ.)

OCP

OUT (4PIN)

R2

TSD

Vcc (2PIN)

CTL (1PIN)

TOP VIEW

FIN

TSD

：A value of approximately 30kΩ

is recommended for R1.

OUT(1PIN)

R2

N.C.(3PIN)

1μF

ADJ(5PIN)

R1

1μF

ADJ(2PIN)

R1

N.C.(3PIN) N.C.(4IN)

Fig.13

1μF

TO252-5(BD00KA5WFP)

Pin No.

PinName

Function

Fig.16

TOP VIEW

1

2

CTL

Vcc

Output voltage ON/OFF control

Power supply voltage input

Unconnected terminal

Voltage output

8

5

3

SOP8(BD00KA5WF)

3

N.C.

OUT

ADJ

GND

1 2

4

5

Pin No.

Pin Name

OUT

Function

Voltage output

4

TO252-5

1

2

3

4

5

6

7

8

5

Output voltage configuration terminal

GND

ADJ

Output voltage configuration terminal

FIN

1

4

SOP8

N.C.

CTL

GND

Vcc

Unconnected terminal

Output voltage ON/OFF control

GND

[BD□□KA5WFP]

GND(FIN)

Vref

Power supply voltage input

Driver

R2

[BD□□KA5WF]

R1

1μF

TSD

OCP

GND(7PIN)

Vcc(8PIN)

GND(6PIN) CTL (5PIN)

TOP VIEW

FIN

Vcc (2PIN)

OUT (4PIN)

CTL (1PIN)

N.C.(3PIN)

N.C.(5PIN)

1μF

Vref

Driver

Fig.14

TO252-5(BD□□KA5WFP)

R2

TSD

OCP

Pin No.

Pin Name

CTL

Function

1

2

Output voltage ON/OFF control

Power supply voltage input

Unconnected terminal

Voltage output

R1

OUT(1PIN)

N.C.(3PIN)

Vcc

3

N.C.

1 2

N.C.(3PIN) N.C.(4IN)

4

5

4

OUT

TO252-5

1μF

5

N.C.

Unconnected terminal

GND

TOP VIEW

Fig.17

FIN

GND

8

5

SOP8(BD□□KA5WF)

Pin No.

Pin Name

Function

1

2

3

4

5

6

7

8

OUT

Voltage output

1

4

Vref

Driver

R2

SOP8

N.C.

Unconnected terminal

CTL

GND

Vcc

Output voltage ON/OFF control

GND

R1

TSD

OCP

N.C.(2PIN)

Power supply voltage input

Vcc (1PIN)

1μF

OUT (3PIN)

1μF

TOP VIEW

FIN

N.C. pins are electrically open to the inside of the IC chip.

Fig.15

TO252-5(BD□□KA5FP)

Pin No.

Pin Name

Vcc

Function

1

2

Power supply voltage input

Unconnected terminal

Voltage output

2

N.C.

3

OUT

1

3

TO252-3

FIN

GND

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2009.04 - Rev.A

4/9

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Input / Output Equivalent Circuit Diagrams

Vcc Vcc

Vcc

※

With BD00KA5WFP/WF,R1and R2 are connected

outside the IC between ADJ and GND and

between OUT and ADJ.

31.25kΩ 2kΩ

25kΩ

OUT

ADJ

CTL

R2

R1

(BD00KA5WFP/WF)

Fig.18

Fig.19

●Thermal Design

TO252-5

TO252-3

SOP8

2.0

1.6

1.2

0.8

0.4

2.0

1000

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ²

θja=96.2(℃/W)

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ²

θja=104.2(℃/W)

(1)When using a standard board:

θj-c=181.8(℃/W)

1.6

1.2

0.8

0.4

0.0

800

600

400

200

0

(2) When using an IC alone

θj-a=222.2(℃/W)

1.30

687.6mW

562.6mW

1.20

(1)

(2)

0.0

0

25

50

75

100

125

150

0

25

50

75

100

125

150

0

25

50

75

100

125

150

Ambient temperature：Ta(℃)

周囲温度：Ta(℃)

Ambient temperature：Ta(℃)

Am周bi囲ent温tem度pe：raTtuare(℃^：T)a(℃)

Fig.20 Power Dissipation heat

reducing characteristics

Fig.21 Power Dissipation heat

reducing characteristics

Fig.22 Power Dissipation heat

reducing characteristics

When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.

The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the

maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient

consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal

damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.

Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high,

so please operate the IC at temperatures less than the acceptable loss Pd.

Vcc：

Vo：

Input voltage

Output voltage

Load current

Circuit current

The calculation method for power consumption Pc(W) is as follows :

Pc = (Vcc-Vo)×Io+Vcc×Icca

Io：

Icca：

Acceptable loss Pd≧Pc

Solving for the load current IO in order to operate within the acceptable loss,

Pd – Vcc×Icca

Io≦

Vcc－Vo

It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.

Calculation Example

Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V

BA10KA5WFP（TO252-5 packaging）

0.676－2.5×Icca

Io≦

θja=96.2℃/W → -10.4mW/℃

2.5-1.0

Io≦440mA (Icca : 2mA)

25℃=1300mW → 85℃=676mW

Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating

temperature ranges.

The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is :

Pc=Vcc×(Icca+Ishort)

*Ishort : Short circuit current

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2009.04 - Rev.A

5/9

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Terminal Vicinity Settings and Cautions

・Vcc Terminal

Please attach a capacitor (greater than 1μF) between Vcc and GND.

The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the

operation on actual board.

・GND Terminal

Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not

arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not

be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns

as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.

・CTL Terminal

31.25kΩ

The CTL terminal is turned ON at 2.0V and higher, and OFF at

0.8V and lower, within the operating power supply voltage

range.The power supply and the CTL terminal may be started

up and shut down in any order without problems.

CTL

25kΩ

Fig.23 Input equivalent circuit

●Vo Terminal

Please be sure to attach an anti-oscillation capacitor between Vo and GND.

100

Oscillation region

発振領域

OUT

10

1

Stable region

安定領域

IC

ESR

1μF

Cin

Vcc

1μF

Vcc OUT

1μF

CTL GND ADJ R2

R1

VCTL

2V

Io(ROUT)

0.1

0.01

R1=30kΩ,R2=2kΩ

0

100

200

300

400

500

Io(mA)

Iout(mA)

Fig.24 Output Equivalent Circuit

Fig.25 ESR-Io Characteristics

Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the

capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series

resistance (ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally

have favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high

voltage capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R,

is recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after

sufficiently confirming its properties according to its specifications in the actual application.

120

100

80

60

40

20

0

120

100

80

60

40

20

0

120

100

80

60

40

20

0

50V Max.Input

16V Max.Input

X7R

X5R

Y5V

10V Max.Input

16V Max.Input

10V Max.Input

Vdc=0

0

1

2

3

4

0

1

2

3

4

-25

0

25

Temp(℃)

50

75

直^D流^Cバ^bypイ^assア^Vス^dc(V^V)dc（V)

(a) Capacitance-bypass

DC bypass Vdc(V)

直流バイアスVdc（V)

（b）Capacitance-bypass

（C）Capacitance-temperature

characteristics (Y5V)

characteristics（X5R,X7R）

characteristics（X5R,X7R,Y5V）

Fig.26 :General characteristics of ceramic capacitors

6/9

www.rohm.com

2009.04 - Rev.A

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Other Caution

○Protection Circuits

Over-current Protection Circuit

A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when

there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current

is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance

capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,

it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the

over-current protection circuit has negative current capacity characteristics with regard to temperature.

○Thermal Shutdown Circuit (Thermal Protection)

This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As

shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously

exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal

shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the

chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12 for the temperatures

at which the temperature protection circuit operates).

There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to

avoid leaving the IC in the overloaded state.

○Reverse Current

In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode

be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).

Reverse current

OUT

Vcc

CTL

GND

Fig.27 : Bypass diode

○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N

junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as :

- a parasitic diode when the electric potential relationship is GND> Terminal A, GND> Terminal B, or

- a parasitic transistor when the electric potential relationship is Terminal B > GND> Terminal A.

Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference

between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in

ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND

(P-board) to the input terminal.

Transistor (NPN)

B

Resistor

(Pin A)

(Pin B)

O

(Pin B)

E

C

E

B

GND

N

P+

P

N

GND

P

P+

Parasitic element

or transistor

N

P

N

P+

N

Parasitic element

GND

P

(Pin A)

Parasitic element

or transistor

GND

Fig. 28 : Basic structure example

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2009.04 - Rev.A

7/9

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

●Ordering part number

B D

1 8

K A 5

W

F P - E 2

Part number

Shutdown switch パッケージ

W : Include FP ：TO252-3

TO252-5

：SOP8

Output voltage Current capacity

Packaging and forming specification

E2: Embossed tape and reel

500mA

00:Variable

Other:Fixed

F

TO252-3

Tape

Embossed carrier tape

6.5 0.2

C0.5

+0.2

Quantity

2000pcs

5.1

-

0.1

2.3 0.2

E2

0.5 0.1

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

FIN

(

)

1

2

3

0.65

0.75

2.3 0.2

0.65

0.5 0.1

1.0 0.2

2.3 0.2

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

1pin

Reel

(Unit : mm)

∗

TO252-5

Tape

Embossed carrier tape

2.3 0.2

0.5 0.1

6.5 0.2

Quantity

2000pcs

C0.5

+0.2

5.1

-0.1

E2

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

FIN

3

1

2

4 5

0.5 0.1

1.0 0.2

0.5

1.27

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

1pin

Reel

(Unit : mm)

∗

www.rohm.com

2009.04 - Rev.A

8/9

Technical Note

BD□□KA5,BD□□KA5W Series,BD00KA5W Series

SOP8

5.0 0.2

(MAX 5.35 include BURR)

Tape

Embossed carrier tape

2500pcs

+

−

6

°

4°

4

°

Quantity

8

7

6

5

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2

3

4

0.595

+0.1

0.17

-

0.05

S

1.27

Direction of feed

1pin

0.42 0.1

Reel

(Unit : mm)

Order quantity needs to be multiple of the minimum quantity.

∗

www.rohm.com

2009.04 - Rev.A

9/9

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,

fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of

any of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R0039

A

型号:	BD15KA5WFP
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	TO-252
包装说明：	TO-252,
针数：	4
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.68
最大输入电压：	5.5 V
最小输入电压：	2.3 V
JESD-30 代码：	R-PSSO-G5
JESD-609代码：	e2
长度：	6.5 mm
功能数量：	1
端子数量：	5
工作温度TJ-Max：	150 °C
最大输出电流 1：	0.5 A
最大输出电压 1：	1.515 V
最小输出电压 1：	1.485 V
标称输出电压 1：	1.5 V
封装主体材料：	PLASTIC/EPOXY
封装代码：	TO-252
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
认证状态：	Not Qualified
调节器类型：	FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度：	2.5 mm
表面贴装：	YES
端子面层：	Tin/Copper (Sn/Cu)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	SINGLE
处于峰值回流温度下的最长时间：	10
宽度：	5.5 mm
Base Number Matches：	1

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