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产品型号BD26IC0WEFJ-E2的Datasheet PDF文件预览

Datasheet  
1A Variable / Fixed Output  
LDO Regulators  
BDxxIC0WEFJ / BDxxIC0WHFV  
General Description  
BDxxIC0W series devices are LDO regulators with an output current of 1.0A. The output accuracy is ±1% of the output  
voltage. Both fixed and variable output voltage devices are available. The output voltage of the variable output voltage  
device can be varied from 0.8 to 4.5V using external resistors. Various fixed output voltage devices that do not use external  
resistors are also available. These LDO regulators are available in two package types: HTSOP-J8 (4.90mm x 6.00mm x  
1.00mm) and HVSOF6 (1.60mm x 3.00mm x 0.75mm), and can be used in a wide variety of digital appliances. These  
devices have built in over current protection to protect the device when output is shorted, 0µA shutdown mode and thermal  
shutdown circuit to protect the device during over load conditions. These LDO regulators are usable with ceramic capacitors  
that enable a smaller layout and longer life.  
Features  
„ +/-1% output voltage accuracy  
Package  
HTSOP-J8  
HVSOF6  
(Typ.)  
(Typ.)  
(Max.)  
4.90mm x 6.00mm x 1.00mm  
1.60mm x 3.00mm x 0.75mm  
„ Built-in Over Current Protection circuit (OCP)  
„ Built-in Thermal Shut Down circuit (TSD)  
„ Zero µA Shutdown mode  
Key Specifications  
Input Power Supply Voltage range:  
Output Voltage range(Variable type):  
2.4V to 5.5V  
0.8V to 4.5V  
Output Voltage(Fixed type):  
1.0V/1.2V/1.25V/1.5V  
1.8V/2.5V/2.6V/3.0V/3.3V  
(1.25V/2.6V:HVSOF6 only)  
1.0A (Max.)  
Output Current:  
Shutdown Current:  
Operating Temperature Range:  
0 µA (Typ.)  
-25 to +85℃  
HTSOP-J8  
HVSOF6  
Typical Application Circuit  
VCC  
VO  
FB  
VCC  
VO  
COUT  
COUT  
CIN  
CIN  
R1  
R2  
VO_S  
EN  
EN  
GND  
FIN  
GND  
FIN  
CIN,COUT : Ceramic Capacitor  
CIN,COUT : Ceramic Capacitor  
Output voltage variable type  
Output voltage fixed type  
Product structureSilicon monolithic integrated circuit This product is not designed with protection against radioactive rays.  
www.rohm.com  
TSZ02201-0R6R0A600430-1-2  
21.Dec.2012 Rev.002  
© 2012 ROHM Co., Ltd. All rights reserved.  
1/23  
TSZ2211114001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Ordering Information  
B D x x I  
C
0 W  
y
y y -  
z z  
Part  
Output  
Input  
Output  
Shutdown  
Package  
Packaging and forming specification  
Number voltage  
voltage  
range  
current mode  
00:Variable :7V  
C0:1.0A  
EFJ : HTSOP-J8 E2 : Emboss tape reel(HTSOP-J8)  
HFV : HVSOF6 GTR : Emboss tape reel(HVSOF6)  
“W”included  
10:1.0V  
12:1.2V  
1C:1.25V  
15:1.5V  
18:1.8V  
25:2.5V  
26:2.6V  
30:3.0V  
33:3.3V  
www.rohm.com  
TSZ02201-0R6R0A600430-1-2  
21.Dec.2012 Rev.002  
© 2012 ROHM Co., Ltd. All rights reserved.  
2/23  
TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Block Diagram  
BD00IC0WEFJ / BD00IC0WHFV (Variable output voltage type)  
VCC  
OCP  
SOFT  
START  
VO  
FB  
EN  
TSD  
GND  
Fig.1 Block Diagram  
Pin Configuration and Pin Description  
(HTSOP-J8)  
Pin No.  
Pin name  
VO  
Pin Function  
1
Output pin  
Feedback pin  
GND pin  
1
2
3
4
8
VO  
FB  
VCC  
2
FB  
3
GND  
N.C  
EN  
7
N.C  
4
No Connect (Connect to GND or leave OPEN)  
Enable pin  
6
N.C  
GND  
N.C  
5
6
N.C  
N.C  
VCC  
No Connect (Connect to GND or leave OPEN)  
No Connect (Connect to GND or leave OPEN)  
Input pin  
5
EN  
7
8
Reverse  
FIN  
Substrate (Connect to GND)  
(HVSOF6)  
Pin No.  
Pin name  
VO  
Pin Function  
1
Output pin  
Vo  
FB  
1
2
3
Vcc  
6
5
4
2
FB  
Feedback pin  
3
GND  
EN  
GND pin  
N.C  
EN  
4
Enable pin  
5
6
N.C  
No Connect (Connect to GND or leave OPEN)  
Input pin  
GND  
VCC  
Reverse  
FIN  
Substrate (Connect to GND)  
www.rohm.com  
TSZ02201-0R6R0A600430-1-2  
21.Dec.2012 Rev.002  
© 2012 ROHM Co., Ltd. All rights reserved.  
3/23  
TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Block Diagram  
BDxxIC0WEFJ / BDxxIC0WHFV (Fixed output voltage type)  
VCC  
OCP  
SOFT  
START  
VO  
EN  
TSD  
VO_S  
GND  
Fig.2 Block Diagram  
Pin Configuration and Pin Description  
(HTSOP-J8)  
Pin No.  
Pin name  
VO  
Pin Function  
1
Output pin  
1
8
VO  
VO_S  
GND  
N.C  
VCC  
2
VO_S  
GND  
N.C  
Output voltage monitor pin  
GND pin  
3
2
3
4
7
N.C  
4
No Connect (Connect to GND or leave OPEN)  
Enable pin  
6
N.C  
5
EN  
6
N.C  
No Connect (Connect to GND or leave OPEN)  
No Connect (Connect to GND or leave OPEN)  
Input pin  
5
EN  
7
8
N.C  
VCC  
Reverse  
FIN  
Substrate (Connect to GND)  
(HVSOF6)  
Pin No.  
Pin name  
VO  
Pin Function  
Output pin  
1
1
2
3
VCC  
VO  
VO_S  
GND  
6
5
4
2
VO_S  
GND  
EN  
Output voltage monitor pin  
GND pin  
3
N.C  
EN  
4
Enable pin  
5
6
N.C  
No Connect (Connect to GND or leave OPEN)  
Input pin  
VCC  
Reverse  
FIN  
Substrate (Connect to GND)  
www.rohm.com  
TSZ02201-0R6R0A600430-1-2  
21.Dec.2012 Rev.002  
© 2012 ROHM Co., Ltd. All rights reserved.  
4/23  
TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Symbol  
Ratings  
Unit  
Power supply voltage  
EN voltage  
VCC  
VEN  
7.0 *1  
V
V
7.0  
2110 *2  
Power dissipation  
HTSOP-J8  
Pd  
mW  
Operating Temperature Range  
Storage Temperature Range  
Topr  
Tstg  
Tjmax  
-25 to +85  
-55 to +150  
+150  
Junction Temperature  
*1 Not to exceed Pd  
*2 Reduced by 16.9mW/for each increase in Ta of 1over 25. (when mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer)  
Recommended Operating Ratings (Ta=25)  
Ratings  
Parameter  
Symbol  
Unit  
Min.  
2.4  
0.0  
0.8  
0.0  
Max.  
5.5  
Input power supply voltage  
EN voltage  
VCC  
VEN  
VO  
IO  
V
V
V
A
5.5  
Output voltage setting range  
Output current  
4.5  
1.0  
Electrical Characteristics (Unless otherwise noted, Ta=25, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
Typ.  
0
Max.  
5
Circuit current at shutdown mode  
Bias current  
ISTB  
ICC  
-
µA VEN=0V, OFF mode  
µA  
-
250  
-
500  
1
Line regulation  
Reg.Ii  
Reg IO  
VCO1  
VCO2  
VCO3  
VCO4  
VFB  
-1  
%
%
V
VCC=( VO+0.6V )5.5V  
IO=01.0A  
Load regulation  
-1.5  
-
1.5  
Minimum dropout voltage1  
Minimum dropout voltage2  
Minimum dropout voltage3  
Minimum dropout voltage4  
Output reference voltage(variable type)  
Output voltage(Fixed type)  
EN Low voltage  
-
0.10  
0.20  
0.30  
0.40  
0.800  
Vo  
-
0.15  
0.30  
0.45  
0.60  
0.808  
Vo×1.01  
0.8  
VCC=3.3V, IO=250mA  
VCC=3.3V, IO=500mA  
VCC=3.3V, IO=750mA  
VCC=3.3V, IO=1.0A  
IO=0A  
-
V
-
V
-
V
0.792  
V
VO  
Vo×0.99  
V
IO=0A  
VEN_Low  
VEN_High  
IEN  
0
2.4  
1
V
EN High voltage  
-
5.5  
V
EN Bias current  
3
9
µA  
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TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Typical Performance Curves  
(Unless otherwise noted, Ta=25, EN=3V, VCC=3.3V, R1=16kΩ, R2=7.5kΩ)  
V
V
O
O
I
IO  
I
O
Fig.4  
Fig.3  
Transient Response(01.0A)  
Co=1.0µF  
Transient Response(1.00A)  
Co=1.0µF  
VEN  
VEN  
VCC  
VCC  
VO  
VO  
Fig.5  
Input sequence1  
Co=1.0µF  
Fig.6  
OFF sequence 1  
Co=1.0µF  
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TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
VEN  
VEN  
VCC  
VCC  
VO  
VO  
Fig.8  
Fig.7  
OFF sequence 2  
Co=1.0µF  
Input sequence2  
Co=1.0µF  
Ta[]  
Fig.10  
Ta-VO (IO=0A)  
Fig.9  
Ta-VFB  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Ta[]  
Ta[]  
Fig.12  
Fig.11  
Ta-ICC  
Ta-ISTB (VEN=0V)  
Ta[]  
VCC[V]  
Fig.14  
Ta-IEN  
Fig.13  
VCC-ISTB (VEN=0V)  
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TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
IO[A]  
IO[A]  
Fig.16  
IO-VO (VO=1.5V)  
Fig.15  
IO-VO (VO=1.2V)  
IO[A]  
IO[A]  
Fig.18  
IO-VO (VO=2.5V)  
Fig.17  
IO-VO (VO=1.8V)  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
IO[A]  
VCC[V]  
Fig.19  
IO-VO (VO=3.3V)  
Fig.20  
VCC-VO (IO=0A)  
Ta[]  
IO[A]  
Fig.22  
OCP  
(VCC=5V, VO=3.3V)  
Fig.21  
TSD (IO=0A)  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
IO[A]  
IO[A]  
Fig.23  
OCP  
Fig.24  
OCP  
(VCC=5V, VO=2.5V)  
(VCC=5V, VO=1.8V)  
IO[A]  
IO[A]  
Fig.25  
OCP  
Fig.26  
OCP  
(VCC=5V, VO=1.5 V)  
(VCC=5V, VO=1.2 V)  
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TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
IO[A]  
IO[A]  
Fig.27  
OCP  
Fig.28  
OCP  
(VCC=3.3V, VO=2.5V)  
(VCC=3.3V, VO=1.8V)  
IO[A]  
IO[A]  
Fig.30  
OCP  
(VCC=3.3V, VO=1.2 V)  
Fig.29  
OCP  
(VCC=3.3V, VO=1.5 V)  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
IO[A]  
IO[A]  
Fig.31  
ESR-IO characteristics  
(Co=2.2µF)  
Fig.32  
IO-ICC  
Ta[]  
Fig.34  
Fig.33  
PSRR(IO=0A)  
Minimum dropout Voltage 1  
(VCC=3.3V, IO=1.0A)  
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BDxxIC0WEFJ / BDxxIC0WHFV  
IO[A]  
IO[A]  
Fig.35  
Fig.36  
Minimum dropout Voltage2  
(VCC=2.4V)  
Minimum dropout Voltage3  
(VCC=3.3V)  
IO[A]  
Fig.37  
Minimum dropout Voltage4  
(VCC=5.0V)  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Power Dissipation  
HTSOP-J8  
4.0  
3.76W  
Measurement condition: mounted on a ROHM  
board,  
Substrate size: 70mm × 70mm × 1.6mm  
(Substrate with thermal via)  
Solder the thermal pad to Ground  
3.0  
IC only  
θj-a=249.5/W  
2.11W  
2.0  
1-layercopper foil are :0mm×0mm)  
θj-a=153.2/W  
2-layercopper foil are :15mm×15mm)  
θj-a=113.6/W  
2-layercopper foil are :70mm×70mm)  
θj-a=59.2/W  
1.10W  
1.0  
0.82W  
0.50W  
4-layercopper foil are :70mm×70mm)  
θj-a=33.3/W  
0
0
25  
50  
75  
100  
125  
150  
AmbientTemperature:Ta []  
HVSOF6  
4.0  
Measurement condition: mounted on a ROHM  
board,  
Substrate size: 70mm × 70mm × 1.6mm  
(Substrate with thermal via)  
Solder the thermal pad to Ground  
3.0  
2.0  
single-layer(copper foil are :2%)  
θj-a=147.1/W  
single-layer(copper foil are :18%)  
θj-a=89.3/W  
1.7W  
single-layer(copper foil are :51%)  
θj-a=73.5/W  
1.4W  
1.0  
0.0  
0.85W  
0
25  
50  
75  
100  
150  
Ambient Temperature: Ta [] 125  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed  
temperature limits and thermal design should allow sufficient margin beyond these limits.  
1. Ambient temperature Ta can be no higher than 85.  
2. Chip junction temperature (Tj) can be no higher than 150.  
Chip junction temperature can be determined as follows:  
Calculation based on ambient temperature (Ta)  
Tj=Ta+θj-a×P  
Reference values>  
1-layer substrate (copper foil density 0mm×0mm)  
2-layer substrate (copper foil density 15mm×15mm)  
2-layer substrate (copper foil density 70mm×70mm)  
4-layer substrate (copper foil density 70mm×70mm)  
θj-aHTSOP-J8 153.2/W  
113.6/W  
59.2/W  
33.3/W  
Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)  
Most of the heat loss that occurs in the BDxxIC0W series is generated from the output Pch FET. Power loss is determined by  
the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as the output current  
conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in mind that heat dissipation  
may vary substantially depending on the substrate employed (due to the power package incorporated in the BDxxIC0W  
series )make certain to factor conditions such as substrate size into the thermal design.  
Power consumption [W] = Input voltage (VCC) - Output voltage (VO) ×IO(Ave)  
Example) When VCC=3.3V, VO=2.5V, IO(Ave) = 0.1A  
Power consumption [W] = 3.3V - 2.5V ×0.1A  
=0.08[W]  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Input-to-Output Capacitor  
It is recommended that a capacitor (over 1uF) is placed near pins between the input pin and GND as well as the output pin  
and GND. A capacitor, between input pin and GND, is valid when the power supply impedance is high or trace is long. Also,  
as for the capacitor between the output pin and GND, the greater the capacitance, the more sustainable the line regulation  
will be and the capacitor will make improvements of characteristics depending on the load. However, please check the  
actual functionality of this part by mounting it on a board for the actual application. Ceramic capacitors usually have different,  
thermal and equivalent series resistance characteristics, and moreover capacitance decreases gradually in use.  
For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application.  
10  
0
Rated Voltage10V  
B1 characteristics  
Rated Voltage10V  
B characteristics  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
Rated Voltage6.3V  
B characteristics  
Rated Voltage:10V  
F characteristics  
Rated Voltage4V  
X6S characteristics  
0
1
2
3
4
DC Bias Voltage [V]  
Ceramic capacitor capacity – DC bias characteristics  
(Characteristics example)  
Equivalent Series Resistance ESR (Output Capacitor)  
10.00  
1.00  
0.10  
0.01  
To prevent oscillations, please attach a capacitor between  
VO and GND. Capacitors usually have ESR (Equivalent  
Series Resistance). Operation will be stable in the ESR-IO  
range shown to the right. Ceramic, tantalum and  
electrolytic Capacitors have different ESR values, so  
please ensure that you are using a capacitor that operates  
in the stable operating region shown on the right. Finally,  
please evaluate in the actual application.  
Safety area  
CO=1uF  
0
0.2  
0.4  
Io [A]  
0.6  
0.8  
1
ESR – IO characteristics  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Evaluation Board Circuit  
U1  
C3  
C7  
8
1
2
3
VCC  
N.C  
N.C  
EN  
VO  
C6  
C5  
C2  
C1  
R1  
R2  
7
FB  
GND  
6
5
GND  
N.C.  
SW1  
VO  
EN  
4
FIN  
Evaluation Board Parts List  
Designation Value  
Part No.  
Company Designation Value  
Part No.  
Company  
R1  
R2  
R3  
R4  
R5  
R6  
C1  
C2  
C3  
16kΩ MCR01PZPZF1602  
7.5kΩ MCR01PZPZF7501  
ROHM  
C4  
C5  
C6  
C7  
C8  
C9  
C10  
U1  
U2  
1µF  
ROHM  
CM105B105K10A  
KYOCERA  
1µF  
CM105B105K16A  
KYOCERA  
BD00IC0WEFJ  
ROHM  
Board Layout  
EN  
GND  
CIN  
(
)
VCC  
VIN  
R1  
R2  
COUT  
VO  
PCB layout considerations:  
Input capacitor CIN connected to VCC (Vin) should be placed as close to VCC(VIN) pin as possible.  
Output capacitor COUT also should be placed as close to IC pin as possible. In case the part is connected to inner layer  
GND plane, please use several through holes.  
FB pin has comparatively high impedance and can be affected by noise, so stray capacitance should be as small as  
possible. Please take care of this during layout.  
Please make GND pattern wide enough to handle thermal dissipation.  
For output voltage setting  
Output voltage can be set by FB pin voltage (0.800V typ.) and external resistance R1, R2.  
R1+R2  
VO = VFB×  
R2  
(The use of resistors with R1+R2=1k to 90k is recommended)  
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BDxxIC0WEFJ / BDxxIC0WHFV  
I/O Equivalent Circuits (Variable type:BD00IC0WEFJ)  
8pin(VCC) / 1pin(VO)  
8pin(VCC  
2pin(FB)  
5pin(EN)  
)
2pin(FB)  
5pin(EN)  
520kΩ  
1pn(VO)  
480kΩ  
I/O Equivalent Circuits (Fixed typeBDxxIC0WEFJ)  
8pin(VCC) / 1pin(VO)  
2pin(VO_S  
)
5pin(EN)  
8pin(VCC  
)
2pin(VO_S  
)
520kΩ  
5pin(EN)  
480kΩ  
1pin(VO)  
I/O Equivalent Circuits (Variable type:BD00IC0WHFV)  
6pin(VCC) / 1pin(VO) 2pin(FB)  
6pin(VCC  
4pin(EN)  
)
2pin(FB)  
4pin(EN)  
520kΩ  
1pn(VO)  
480kΩ  
I/O Equivalent Circuits (Fixed typeBDxxIC0WHFV)  
6pin(VCC) / 1pin(VO)  
2pin(VO_S  
)
4pin(EN)  
6pin(VCC  
)
2pin(VO_S  
)
4pin(EN)  
520kΩ  
480kΩ  
1pin(VO)  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Operational Notes  
(1) Absolute maximum ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can  
break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.  
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as  
fuses.  
(2) Connecting the power supply connector backward  
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power  
supply lines. An external direction diode can be added.  
(3) Power supply lines  
Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply  
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply  
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in  
a circuit, note that capacitance values are reduced at low temperatures and over time.  
(4) GND voltage  
The potential of the GND pin must be minimum potential under all operating conditions.  
(5) Thermal design  
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.  
(6) Off-leakage at high temperature.  
Off-leakage at high temperature may increase because of manufacturing variations.  
Design should consider the typical & worst cases shown below.  
Ta-Ileak  
0.5  
0.4  
worst  
0.3  
0.2  
0.1  
typ  
0
25  
50  
75  
100  
125  
150  
Temperature (℃)  
(7) Inter-pin shorts and mounting errors  
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any  
connection error or if pins are shorted together.  
(8) Actions in strong electromagnetic field  
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to  
malfunction.  
(9) ASO  
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.  
(10) Thermal shutdown circuit  
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is  
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.  
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit  
is assumed.  
TSD ON Temperature[] (typ.)  
Hysteresis Temperature [] (typ.)  
BDxxIC0W series  
175  
15  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
(11)Testing on application boards  
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.  
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or  
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic  
measure. Use similar precaution when transporting or storing the IC.  
(12) Regarding input pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.  
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic  
diode or transistor. For example, the relation between each potential is as follows:  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes  
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
C
E
Pin A  
B
C
E
N
N
P+  
P
N
P+  
P+  
P
P+  
N
N
N
Parasitic  
element  
P substrate  
P substrate  
Parasitic  
GND  
GND  
element  
Other adjacent elements  
GND  
GND  
Parasitic element  
Parasitic element  
(13) Ground Wiring Pattern.  
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,  
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage  
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change  
the GND wiring pattern of any external components, either.  
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Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Physical Dimension Tape and Reel Information  
HTSOP-J8  
<Tape and Reel information>  
4.9 0.1  
(MAX 5.25 include BURR)  
Tape  
Embossed carrier tape  
2500pcs  
(3.2)  
+
Quantity  
6
°
°
4°  
4  
8
7
2
6
3
5
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
4
1PIN MARK  
+0.05  
-0.03  
0.545  
0.17  
S
1.27  
+0.05  
0.42  
0.08  
-
0.04  
M
0.08  
S
Direction of feed  
1pin  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
HVSOF6  
<Tape and Reel information>  
1.6 0.1  
(MAX 1.8 include BURR)  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
6
5 4  
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
(1.2)  
(1.4)  
1pin  
1
2 3  
0.145 0.05  
S
0.1  
S
0.22 0.05  
0.5  
Direction of feed  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
Marking Diagram  
HTSOP-J8(TOP VIEW)  
xx  
Product Name  
BD00IC0WEFJ  
BD10IC0WEFJ  
BD12IC0WEFJ  
BD15IC0WEFJ  
BD18IC0WEFJ  
BD25IC0WEFJ  
BD30IC0WEFJ  
BD33IC0WEFJ  
Part Number Marking  
LOT Number  
00  
10  
12  
15  
18  
25  
30  
33  
x x I C 0 W  
1PIN MARK  
HVSOF6(TOP VIEW)  
Part Number Marking  
xx  
B0  
Product Name  
BD00IC0WHFV  
BD10IC0WHFV  
BD12IC0WHFV  
BD1CIC0WHFV  
BD15IC0WHFV  
BD18IC0WHFV  
BD25IC0WHFV  
BD26IC0WHFV  
BD30IC0WHFV  
BD33IC0WHFV  
BT  
BU  
BS  
BV  
BW  
BX  
BR  
BY  
BZ  
xx  
LOT Number  
1PIN MARK  
www.rohm.com  
TSZ02201-0R6R0A600430-1-2  
21.Dec.2012 Rev.002  
© 2012 ROHM Co., Ltd. All rights reserved.  
22/23  
TSZ2211115001  
Datasheet  
BDxxIC0WEFJ / BDxxIC0WHFV  
Revision History  
Date  
Revision  
Changes  
6.Jul.2012  
21.Dec.2012  
001  
002  
New Release.  
The description was modified.  
www.rohm.com  
TSZ02201-0R6R0A600430-1-2  
21.Dec.2012 Rev.002  
© 2012 ROHM Co., Ltd. All rights reserved.  
23/23  
TSZ2211115001  
Daattaasshheeeett  
Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
配单直通车
BD26TD2WNVX产品参数
型号:BD26TD2WNVX
生命周期:Active
零件包装代码:SON
包装说明:1 X 1 MM, 0.60 MM PITCH, ROHS COMPLIANT, SSON-4
针数:4
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.69
最大回动电压 1:0.54 V
最大输入电压:5.5 V
最小输入电压:1.7 V
JESD-30 代码:S-PDSO-N4
长度:1 mm
功能数量:1
端子数量:4
工作温度TJ-Max:125 °C
最大输出电流 1:0.2 A
最大输出电压 1:2.626 V
最小输出电压 1:2.574 V
标称输出电压 1:2.6 V
封装主体材料:PLASTIC/EPOXY
封装代码:HVSON
封装形状:SQUARE
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:0.6 mm
表面贴装:YES
技术:CMOS
端子形式:NO LEAD
端子节距:0.65 mm
端子位置:DUAL
宽度:1 mm
Base Number Matches:1
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