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产品型号BD27400GUL的Datasheet PDF文件预览

Datasheet  
Small-sized Class-D Speaker Amplifiers  
Filter-Less Class-D  
Monaural Speaker Amplifier  
BD27400GUL  
General Description  
Key Specifications  
BD27400GUL is a low voltage drive class-D monaural  
speaker amplifier that was developed for cellular  
telephones, mobile audio products and the others.  
The LC filter of the speaker output is unnecessary and  
the external part can compose a speaker amplifier at  
three.  
Because the efficiency is high and is low consumption  
power with the class-D operation, it is the optimal for the  
application of the battery drive.  
Operating voltage Range:  
Circuit current(No signal):  
Circuit current(Stand by):  
Output Power(RL=8Ω):  
Output Power(RL=4Ω):  
Start-up time:  
2.5V to 5.5V  
2.9mA(Typ)  
0.1μA(Typ)  
0.85W(Typ)  
2.5W(Typ)  
3.0msec(Typ)  
-40°C to +85°C  
Operating Temperature Range:  
Package(s)  
W(Typ) x D(Typ) x H(Max)  
Also Current consumption of 0μA when standby and fast  
transitions from standby to active with little pop noise  
make it is suitable for applications that switch repeatedly  
between suspended and active.  
VCSP50L1  
1.50mm x 1.50mm x 0.55mm  
Features  
High output power  
2.5W typ.(VDD=5V, RL=4Ω, THD+N=10%, BTL  
Very small package 9-Pin WL-CSP  
Gain selectable by external resistor  
LC Filter less  
Protection circuitry  
(Short protection, Thermal shutdown,  
Under voltage lockout)  
Analogue differential input / PWM digital output  
Pop noise suppression circuitry  
VCSP50L1  
Applications  
Mobile phone, Smart phone, Digital video camera  
+VBAT  
Typical Application Circuit(s)  
CS  
VDD B1  
B2  
PVDD  
STBY  
C2  
Bias  
OSC  
OUT-  
A3  
IN+  
A1  
Ri  
Ri  
H-  
Bridge  
PWM  
OUT+  
C3  
IN-  
C1  
GND A2  
B3  
PGND  
Figure 1. Application circuit  
Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays  
.www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
1/19  
TSZ22111 14 001  
BD27400GUL  
Pin Configuration(s)  
Bottom View  
IN-  
STBY  
OUT+  
PGND  
C
B
A
PVDD  
VDD  
IN+  
GND  
OUT-  
1
3
2
Figure.2 Pin configuration  
Pin Description(s)  
No.  
Name  
I/O  
I
Function  
A1  
IN+  
Positive input terminal  
GND terminal  
(Connect to PGND terminal)  
A2  
A3  
B1  
B2  
B3  
C1  
C2  
C3  
GND  
OUT-  
VDD  
P
O
P
P
P
I
Negative output terminal  
Power supply terminal  
(Connect to PVDD terminal)  
Power supply terminal  
(Connect to VDD terminal)  
PVDD  
PGND  
IN-  
Power GND terminal  
(Connect to GND terminal)  
Negative input terminal  
Stand by control terminal  
Positive output terminal  
STBY  
OUT+  
I
O
Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply.  
PVDD  
B2  
VDD B1  
Block Diagram(s)  
STBY  
C2  
Bias  
OSC  
OUT-  
A3  
IN+  
A1  
H-  
Bridge  
PWM  
IN-  
C1  
OUT+  
C3  
B3  
A2  
PGND  
GND  
Figure.3 Block diagram  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
2/19  
BD27400GUL  
Absolute Maximum Ratings(Ta = 25°C)  
Parameter  
Symbol  
Rating  
Unit  
V
W
V
Power Supply Voltage  
VDDmax  
Pd  
7.0  
Power Dissipation  
0.69 (Note 1)  
-0.3 to VDD+0.3  
-0.3 to VDD+0.3  
-55 to +150  
150  
STBY Terminal Input Voltage Range  
IN+, IN- Terminal Voltage Range  
Storage Temperature Range  
Maximum Junction Temperature  
Operating Temperature Range  
Vstby  
Vin  
V
Tstg  
°C  
°C  
°C  
Tjmax  
Topr  
-40 to +85  
(Note 1) Derating in done 5.52 mW/°C for operating above Ta25°C (Mount on 1-layer 50.0mm x 58.0mm x 1.6mm board)  
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over  
the absolute maximum ratings.  
Recommended Operating Conditions(Ta= -40°C to +85°C)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Power Supply Voltage  
VDD  
VIC  
2.5  
3.6  
-
5.5  
V
V
Common Mode Input Voltage Range  
+0.5  
VDD-0.8  
Electrical Characteristics(Unless otherwise specified Ta=25°C.VDD=3.6V.RL=8Ω.BTL Connection)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Conditions  
Circuit current (No signal)  
Circuit current (Standby)  
Output power 1  
ICC  
mA  
µA  
Active mode, No load  
Standby mode  
-
-
2.9  
0.1  
5.4  
ISTBY  
-
-
-
8 Ω, f=1kHz, THD+N=1% *1  
8 Ω, f=1kHz, THD+N=10% *1  
PO1  
PO2  
PO3  
450  
550  
-
680  
850  
2.5  
mW  
mW  
Output power 2  
Output power 3  
-
W
V
V
4 Ω, f=1kHz, THD+N=10% *1  
BTL, RL=100kΩ  
285kΩ 300kΩ  
Ri  
315kΩ  
Ri  
Voltage gain  
Gain  
Ri  
0.18  
40  
64  
55  
150  
250  
3
Total harmonic distortion  
Output noise voltage  
Power supply ripple rejection ratio  
Common mode rejection ratio  
Input impedance  
THD+N  
Vno  
%
8 Ω, f=1kHz,0.4W  
-
-
µVrms A-weighting  
-
-
-
-
PSRR  
CMRR  
Zin  
dB  
dB  
0.1Vp-p, f=217Hz  
0.1Vp-p, f=217Hz  
-
-
kΩ  
kHz  
msec  
V
-
-
Switching Frequency  
Start-up time  
fOSC  
200  
1
300  
5
Ton  
STBY  
threshold  
voltage  
High level  
Low level  
VSTBYH  
VSTBYL  
RSTBY  
Active mode  
Stand by mode  
1.4  
-
VDD  
0.4  
390  
V
0
-
STBY input impedance  
kΩ  
210  
300  
*1: Band-width = 40030kHz, BTL=Bridge Tied Load (Voltage between A3-C3.)  
Gain adjustment≫  
Please use a gain adjustment below 26dB (Input Resistor Ri15kΩ)  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
3/19  
TSZ22111 15 001  
BD27400GUL  
Typical Performance Curves  
Figure.5  
Figure.4  
Figure.7  
Figure.6  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
4/19  
TSZ22111 15 001  
BD27400GUL  
Typical Performance Curves - continued  
Figure.9  
Figure.8  
Figure.10  
Figure.11  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
5/19  
BD27400GUL  
Typical Performance Curves - continued  
Figure.12  
Figure.13  
Figure.14  
Figure.15  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
6/19  
BD27400GUL  
Typical Performance Curves - continued  
Figure.16  
Figure.17  
Figure.19  
Figure.18  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
7/19  
BD27400GUL  
Typical Performance Curves - continued  
Figure.20  
Figure.21  
Figure.23  
Figure.22  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
8/19  
BD27400GUL  
Typical Performance Curves - continued  
Figure.25  
Figure.24  
Figure.27  
Figure.26  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
9/19  
BD27400GUL  
Typical Performance Curves - continued  
Figure.28  
Figure.29  
Figure.30  
Figure.31  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
10/19  
BD27400GUL  
Typical Performance Curves - continued  
Figure.32  
Figure.33  
Figure.34  
Figure.35  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
TSZ22111 15 001  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
11/19  
BD27400GUL  
Application Example(s)  
Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply.  
(1)Differential input  
+VBAT  
CS  
VDD B1  
B2  
PVDD  
STBY  
C2  
HActive  
LSTBY  
STBY  
Bias  
OSC  
control  
+
OUT-  
A3  
IN+  
A1  
Ri  
Ri  
-
H-  
Bridge  
Differential  
Input  
PWM  
OUT+  
C3  
IN-  
C1  
+
-
GND A2  
B3  
PGND  
Figure.36 Differential input for mobile phone  
+VBAT  
CS  
VDD B1  
B2  
PVDD  
STBY  
HActive  
LSTBY  
STBY  
control  
C2  
Bias  
OSC  
OUT-  
A3  
IN+  
A1  
Ci  
Ci  
+
-
Ri  
Ri  
H-  
Bridge  
Differential  
PWM  
Input  
OUT+  
C3  
IN-  
C1  
+
-
GND A2  
B3  
PGND  
Figure.37 Differential input with coupling input capacitors  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
12/19  
TSZ22111 15 001  
BD27400GUL  
(2)Single-Ended input  
+VBAT  
CS  
VDD B1  
B2  
PVDD  
STBY  
C2  
STBY  
HActive  
Bias  
OSC  
control  
LSTBY  
OUT-  
A3  
IN+  
A1  
Ci  
Ci  
Single End  
Input  
Ri  
Ri  
H-  
Bridge  
PWM  
OUT+  
C3  
IN-  
C1  
GND A2  
B3  
PGND  
Figure.38 Single-Ended input  
It is possible to input audio signal from IN+ terminal, or IN- terminal when single-end mode.  
Don't make the input terminal (no input terminal, C1 terminal in above figure) open.  
Pop noise may be caused when the power supply starts up or the standby is released, if input terminal is opened.  
Connect non signal input side(C1 in above figure)to GND through Ci, and make the value of Ri, Ci of non signal input side  
same as the value of signal input side (A1 in above figure).  
Pop noise may be caused if each values of Ci, Ri are different, because the values of Ci, Ri decide the rise of Input terminal  
DC voltage when start-up. Difference of input terminal DC voltages may make pop noise.  
Make the value of Ri, Ci of non signal input side same as the value of signal input side when making LPF(Low Pass Filter) at  
previous stage of Ci.  
Put external input resistor Ri as close as possible to this IC.  
Selection of Components Externally Connected  
Description of External components  
Input coupling capacitor (Ci) and input resistor (Ri).  
It makes an Input coupling capacitor 0.1uF. Input impedance is 150kΩ.  
It sets cutoff frequency fc by the following formula by input coupling capacitor Ci and input impedance Ri.  
1
fc  
[Hz]  
2π RiCi  
In case of Ri=150kΩ , Ci=0.1uF, it becomes fc = about 10 Hz.  
Power decoupling capacitor (CS)  
It makes a power decoupling capacitor 10 μF.  
When making capacitance of the power decoupling capacitor, there is an influence in the Audio characteristic.  
When making small, careful for the Audio characteristic at the actual application.  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
13/19  
TSZ22111 15 001  
BD27400GUL  
Power Dissipation  
690  
(*1) ROHM standard board mounted. Board size 50mm×58mm,1layer  
Material: FR4 glass-epoxy (copper foil area: not more than 3%)  
derating in done at 5.52mW/°C above Ta=+25°C.  
0
25  
75  
Ambient Temperature [°C]  
50  
100  
125  
150  
I/O equivalence circuits  
Pin name  
Pin No.  
IN+  
IN-  
A1  
C1  
VDD  
150k  
IN+  
IN-  
-
+
GND  
OUT+  
OUT-  
C3  
A3  
VDD  
OUT+  
OUT-  
GND  
300k  
STBY  
C2  
VDD  
STBY  
GND  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
14/19  
TSZ22111 15 001  
BD27400GUL  
Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the ICs power  
supply pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3.  
4.  
Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
Thermal Consideration  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when  
the IC is mounted on a 50mm×58mm glass epoxy board. In case of exceeding this absolute maximum rating,  
increase the board size and copper area to prevent exceeding the Pd rating.  
6.  
7.  
Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush  
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC  
has more than one power supply. Therefore, give special consideration to power coupling capacitance,  
power wiring, width of ground wiring, and routing of connections.  
8.  
9.  
Operation Under Strong Electromagnetic Field  
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
10. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
15/19  
TSZ22111 15 001  
BD27400GUL  
Operational Notes continued  
11. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
12. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should  
be avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Figure 39. Example of monolithic IC structure  
13. Ceramic Capacitor  
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
14. Thermal Shutdown Circuit(TSD)  
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always  
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction  
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below  
the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no  
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from  
heat damage.  
15. Over Current Protection Circuit (OCP)  
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This  
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should  
not be used in applications characterized by continuous operation or transitioning of the protection circuit.  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
16/19  
TSZ22111 15 001  
BD27400GUL  
Ordering Information  
B D 2 7 4 0 0 G U L -  
E 2  
Part Number  
Package  
GUL:VCSP50L1  
(WL-CSP)  
Packaging and forming specification  
E2: Embossed tape and reel  
Marking Diagrams  
Vcsp50L1(TOP VIEW)  
Part Number Marking  
LOT Number  
7
4
0
0
1PIN MARK  
Part Number Marking  
7400  
Package  
Orderable Part Number  
VCSP50L1  
BD27400GUL-E2  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
17/19  
TSZ22111 15 001  
BD27400GUL  
Physical Dimension Tape and Reel Information  
Package Name  
VCSP50L1(BD27400GUL)  
< Tape and Reel Information >  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
Direction of feed  
E2  
The direction is the pin 1 of product is at the upper left when you  
hold reel on the left hand and you pull out the tape on the right hand  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
18/19  
TSZ22111 15 001  
BD27400GUL  
Revision History  
Date  
Revision  
Changes  
05.Apr.2012  
05.Nov.2012  
001  
002  
New Release  
All. Change to a new format  
p.3.  
Change unit of a Output Power3 mW -> W  
Change the value of PSRR 56dB->64dB  
23.Apr.2014  
11.May.2017  
003  
004  
p.17 Change Part Number Marking  
p.18 Change to a new format at Physical Dimension Tape and Reel Information  
P.17 Change Part Number Marking  
www.rohm.com  
TSZ02201-0C1C0E754430-1-2  
11.May.2017 Rev.004  
© 2012 ROHM Co., Ltd. All rights reserved.  
19/19  
TSZ22111 15 001  
Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
配单直通车
BD27400GUL-E2产品参数
型号:BD27400GUL-E2
是否Rohs认证: 符合
生命周期:Active
包装说明:,
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.33.00.01
Factory Lead Time:10 weeks
风险等级:1.7
商用集成电路类型:AUDIO AMPLIFIER
峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIED
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