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  • 北京元坤伟业科技有限公司

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  • BD37A41FVM-TR
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  • 深圳市芯脉实业有限公司

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  • 厂家Rohm Semiconductor 
  • 封装8-VSSOP,8-MSOP(0.110,2.80mm 宽) 
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  • 封装8-MSOP 
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  • 深圳市芯福林电子有限公司

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  • 深圳市芯鹏泰科技有限公司

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  • 数量7536 
  • 厂家Rohm Semiconductor 
  • 封装8-MSOP 
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  • 封装IC SUPERVISOR 1 CHANNEL 8MSOP 
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  • 数量20000 
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产品型号BD37A41FVM-TR的概述

芯片BD37A41FVM-TR的概述 BD37A41FVM-TR是一款由传统半导体制造商制造的电源管理集成电路(PMIC),主要用于电源调节和电池管理应用。这款芯片在消费电子、工业设备以及便携式医疗设备等领域得到了广泛应用,其多功能性和高集成度使其成为设计工程师的热门选择。随着便携式设备和物联网(IoT)产品的兴起,对高效能电源管理解决方案的需求也日益增长,BD37A41FVM-TR正好满足此类需求。 该芯片采用现代CMOS技术,具有低功耗特性和高输入电压范围,同时提供多种输出电压选项,适合不同应用场景。通过内置的控制电路,BD37A41FVM-TR能够自动调节输出电压,以适应负载变化,从而有效提高电源效率并延长电池寿命。 BD37A41FVM-TR的详细参数 BD37A41FVM-TR的技术参数如下: - 输入电压范围:2.5V至5.5V - 输出电压:可调范围从0.8V至输出电压上...

产品型号BD37A41FVM-TR的Datasheet PDF文件预览

Datasheet  
Voltage Detectors  
Voltage Detector ICs with Watchdog Timer  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
General Description  
Key Specifications  
The BD37A19FVM, BD37A41FVM, BD87A28FVM,  
BD87A29FVM, BD87A34FVM, BD87A41FVM and  
BD99A41F are watchdog timer reset ICs. It delivers a  
high precision detection voltage of 1.5% and a  
super-low current consumption of 5 µA (Typ.). It can be  
used in a wide range of electronic devices to monitor  
power supply voltages and in system operation to  
prevent runaway operation.  
RESET power supply voltage range:  
WDT power supply voltage range:  
High precision detection voltage:  
(Ta = 25)  
(Ta = 40to 105)  
Super-low current consumption:  
1.0V to 10V  
2.5V to 10V  
1.5%  
2.5%  
5μA(Typ.)  
Operating temperature range:  
-40to +105℃  
Packages  
W (Typ.) x D (Typ.) x H (Max.)  
2.90mm x 4.00mm x 0.90mm  
Features  
MSOP8  
Built-in watchdog timer  
Reset delay time can be set with the CT pin's  
external capacitance  
Watchdog timer monitor time and reset time can be  
set with the CTW pin's external capacitance.  
Output circuit type: N-channel open drain  
Applications  
SOP8  
5.00mm x 6.20mm x 1.71mm  
All devices using microcontrollers or DSP, including  
vehicle equipment, displays, servers, DVD players,  
and telephone systems  
Ordering Information  
B D 3 7 A 1 9 F V M  
-
T R  
Part Number  
Detection Voltage Package  
Packaging and forming specification  
FVM : MSOP8  
TR: Embossed tape and reel  
E2: Embossed tape and reel  
37AWDT H Active  
87AWDT L Active  
99AWDT H Active  
191.9V  
282.8V  
292.9V  
343.4V  
414.1V  
F
: SOP8  
Lineup  
Detection voltage (Typ.)  
INH logic  
Package  
Reel of 3000  
Orderable Part Number  
H: Active  
MSOP8  
MSOP8  
MSOP8  
MSOP8  
MSOP8  
MSOP8  
SOP8  
1.9V  
4.1V  
2.8V  
2.9V  
3.4V  
4.1V  
4.1V  
BD37A19FVM-TR  
BD37A41FVM-TR  
BD87A28FVM-TR  
BD87A29FVM-TR  
BD87A34FVM-TR  
BD87A41FVM-TR  
BD99A41F-E2  
H: Active  
L: Active  
L: Active  
L: Active  
L: Active  
H: Active  
Reel of 3000  
Reel of 3000  
Reel of 3000  
Reel of 3000  
Reel of 3000  
Reel of 2500  
Product structureSilicon monolithic integrated circuit This product has not designed protection against radioactive rays  
.www.rohm.com  
TSZ02201-0T2T0AN00130-1-2  
25.Apr.2013 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
1/15  
TSZ2211114001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Pin Configurations  
MSOP8  
(TOP VIEW)  
SOP8  
(TOP VIEW)  
8
7
6
5
8
7 6 5  
1
2
3 4  
1
2
3
4
Figure 1. Pin Configurations  
Pin Descriptions  
BD37AxxFVM  
Function  
BD87AxxFVM / BD99A41F  
Function  
Pin  
No.  
Pin  
No.  
name  
name  
1
2
3
4
5
CLK  
CT  
Clock input from microcontroller  
1
2
3
4
5
CTW WDT time setting capacitor connection pin  
Reset delay time setting capacitor  
connection pin  
Reset delay time setting capacitor  
connection pin  
CT  
CTW WDT time setting capacitor connection pin  
VDD Power supply pin  
CLK  
Clock input from microcontroller  
GND GND pin  
N.C.  
NC pin  
VDD Power supply pin  
WDT ON/OFF setting pin  
INH=H/L:WDT=OFF/ON(BD87AxxFVM)  
INH=H/L:WDT=ON/OFF(BD99A41F)  
6
GND GND pin  
6
INH  
WDT ON/OFF setting pin  
INH=H/L:WDT=ON/OFF  
7
8
INH  
7
8
N.C. NC pin  
RESET Reset output pin  
RESET Reset output pin  
Block Diagrams  
BD37AxxFVM  
BD87AxxFVM / BD99A41F  
VDD  
VDD  
RESET  
RESET  
8
8
CTW  
CLK  
1
1
R
S
R
S
Q
Q
+
+
Vref  
Vref  
N.C.  
CT  
INH  
CT  
2
7
2
3
7
VDD  
VDD  
Pulse  
Generation  
Circuit  
+
+
INH  
R
Q
R
S
CLK  
GND  
Q
CTW  
3
6
6
S
+
+
Pulse  
Generation  
Circuit  
VthH  
VthL  
VthH  
VthL  
GND  
VDD  
N.C.  
VDD  
4
4
5
5
CT pin capacitor: 470pF to 3.3µF  
CTW pin capacitor: 0.001µF to 10µF  
Figure 2.Block Diagrams  
2/15  
www.rohm.com  
TSZ02201-0T2T0AN00130-1-2  
25.Apr.2013 Rev.002  
© 2013 ROHM Co., Ltd. All rights reserved.  
TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Absolute Maximum Ratings (Ta=25)  
Parameter  
Symbol  
VDD  
Ratings  
Unit  
V
Power supply voltage *1  
0.3 to 10  
0.3 to VDD + 0.3  
0.3 to VDD + 0.3  
0.3 to VDD + 0.3  
0.3 to VDD + 0.3  
0.3 to VDD + 0.3  
470*2  
CT pin voltage  
VCT  
V
CTW pin voltage  
VCTW  
VRESET  
VINH  
V
RESET pin voltage  
INH pin voltage  
V
V
CLK pin voltage  
VCLK  
V
Power dissipation  
Pd  
mW  
550*3  
Operating ambient temperature  
Storage temperature  
Topr  
Tstg  
40 to + 105  
55 to + 125  
125  
Maximum junction temperature  
Tjmax  
*1 Do not exceed Pd.  
*2 MSOP8 : Reduced by 4.70 mW/over 25, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).  
*3 SOP8 : Reduced by 5.50 mW/over 25, when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm).  
Recommended Operating Ratings(Ta = 40to 105)  
Parameter  
Symbol  
VDD RESET  
VDD WDT  
Min.  
1.0  
Max.  
10  
Unit  
V
RESET power supply voltage  
WDT power supply voltage  
2.5  
10  
V
Electrical Characteristics  
(Unless otherwise specified, Ta = 40to 105, VDD = 5V)  
Limits  
Typ.  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
Max.  
[Overall]  
Total supply current 1  
(during WDT operation)  
Total supply current 2  
(when WDT stopped)  
INH : WDT ON Logic Input  
CTW = 0.1µF  
IDD1  
IDD2  
5
5
14  
14  
µA  
µA  
INH : WDT OFF Logic Input  
Output leak current  
VDD = VDS = 10V  
Ileak  
IOL  
1
µA  
Output current capacity  
[RESET]  
VDD = 1.2V, VDS = 0.5V  
0.7  
mA  
1.9V Detect  
Ta = 25℃  
VDET1  
VDET1  
VDET1  
VDET1  
VDET1  
VDET2  
VDET2  
VDET2  
VDET2  
VDET2  
Vrhys  
1.871  
2.758  
2.886  
3.349  
4.039  
1.852  
2.730  
2.857  
3.315  
4.007  
1.900  
2.800  
2.930  
3.400  
4.100  
1.900  
2.800  
2.930  
3.400  
4.100  
1.929  
2.842  
2.974  
3.451  
4.162  
1.948  
2.870  
3.003  
3.485  
4.202  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
2.8V Detect  
Detection  
2.9V Detect  
voltage 1  
Ta = 25℃  
Ta = 25℃  
3.4V Detect  
4.1V Detect  
1.9V Detect  
2.8V Detect  
Ta = 25℃  
Ta = 25℃  
Ta = 40to 105℃  
Ta = 40to 105℃  
Ta = 40to 105℃  
Ta = 40to 105℃  
Ta = 40to 105℃  
Ta=40℃~105℃  
Ta=40℃~105℃  
Ta=40℃~105℃  
Ta=40℃~105℃  
Ta=40℃~105℃  
Detection  
2.9V Detect  
voltage 2  
3.4V Detect  
4.1V Detect  
1.9V Detect  
2.8V Detect  
VDET×0.03 VDET×0.13 VDET×0.19  
VDET×0.018 VDET×0.045 VDET×0.060  
VDET×0.02 VDET×0.05 VDET×0.06  
VDET×0.02 VDET×0.05 VDET×0.07  
VDET×0.018 VDET×0.035 VDET×0.050  
Vrhys  
Hysteresis  
2.9V Detect  
width  
Vrhys  
3.4V Detect  
Vrhys  
4.1V Detect  
Vrhys  
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TSZ02201-0T2T0AN00130-1-2  
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3/15  
TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Electrical Characteristics - Continued  
(Unless otherwise specified, Ta = 40to 105, VDD = 5V)  
Limits  
Typ.  
Parameter  
Symbol  
TPLH  
Unit  
ms  
Conditions  
CT = 0.001µF *1  
Min.  
3.9  
Max.  
10.1  
RESET transmission  
delay time: low high  
6.9  
When VDD = VDET 0.5V  
Delay circuit resistance  
Delay pin threshold voltage  
Delay pin output current  
VCT = GND  
Rrst  
VCTH  
ICT  
5.8  
VDD×0.3  
150  
10.0  
VDD×0.45  
14.5  
VDD×0.6  
MΩ  
V
RL = 470KΩ  
VDD = 1.50V, VCT = 0.5V  
VOL 0.4V, RL = 470KΩ  
µA  
V
Min. operating voltage  
[WDT]  
VOPL  
1.0  
WDT monitor time  
CTW = 0.01µF *2  
CTW = 0.01µF *3  
TwH  
TwL  
7.0  
2.4  
10.0  
3.3  
20.0  
7.0  
ms  
ms  
ns  
V
WDT reset time  
Clock input pulse width  
CLK high threshold voltage  
CLK low threshold voltage  
INH high threshold voltage  
INH low threshold voltage  
CTW charge current  
TWCLK  
500  
VCLKH VDD × 0.8  
VDD  
VCLKL  
VINHH  
VINHL  
ICTWC  
ICTWO  
0
VDD × 0.8  
0
VDD × 0.3  
VDD  
V
V
VDD × 0.3  
0.75  
V
VCTW = 0.2V  
VCTW = 0.8V  
0.25  
0.50  
1.50  
µA  
µA  
CTW discharge current  
0.75  
2.00  
*1  
*2  
*3  
TPLH can be varied by changing the CT capacitance value.  
TPLH (s) 0.69 × Rrst (M) × CT (µF) Rrst = 10 M(Typ.)  
TwH can be varied by changing the CTW capacitance value.  
TwH (s) (0.5 × CTW (µF))/ICTWC (µA) ICTWC = 0.5 µA  
TwL can be varied by changing the CTW capacitance value.  
TwL (s) (0.5 × CTW (µF))/ICTWO (µA) ICTWO = 1.5 µA  
(Typ.)  
(Typ.)  
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TSZ2211115001  
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25.Apr.2013 Rev.002  
4/15  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Typical Performance Curves  
(Unless otherwise specified, Ta = 25) : 4.1V Detection  
12  
10  
8
10  
8
Ta=105℃  
6
6
Ta=25℃  
4
Ta=-40℃  
4
2
2
0
0
0
2
4
6
8
10  
0
2
4
6
8
10  
SUPPLY VOLTAGE: VDD [V]  
SUPPLY VOLTAGE: VDD [V]  
Figure 4. Total Supply Current  
Figure 3. Detection Voltage  
2
1.5  
1
400  
350  
300  
250  
200  
150  
100  
50  
0.5  
0
-0.5  
-1  
0
0
1
2
3
4
5
0
1
2
3
4
5
CTW PIN VOLTAGE: VCTW [V]  
SUPPLY VOLTAGE: VDD [V]  
Figure 5. Delay Pin Current vs Power Supply Voltage  
Figure 6. CTW Charge Discharge Current  
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TSZ02201-0T2T0AN00130-1-2  
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5/15  
TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Typical Performance Curves – continued  
(Unless otherwise specified, Ta = 25) : 4.1V Detection  
2
10000  
1000  
100  
10  
Ta=105℃  
1.5  
1
Ta=25℃  
Ta=-40℃  
0.5  
1
0
0.0001  
0.001  
0.01  
0.1  
0
2
4
6
8
10  
CT PIN CAPACITY: CT [µF]  
RESET VOLTAGE: VRESET [V]  
Figure 7. Output Current  
Figure 8. T RESET Transmission  
Delay Time vs Capacitance  
5
4.75  
4.5  
10000  
1000  
100  
10  
LH  
Moniter Time  
4.25  
4
Reset Time  
HL  
1
3.75  
3.5  
0.1  
0.001  
0.01  
0.1  
1
10  
-40  
0
40  
80  
CTW PIN CAPACITY: CTW [V]  
AMBIENT TEMPERATURE: Ta [  
]
Figure 9. WDT Time vs Capacitance  
Figure 10. Detection Voltage vs Temperature  
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TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Typical Performance Curves – continued  
(Unless otherwise specified, Ta = 25) : 4.1V Detection  
13  
12  
11  
10  
9
1
0.75  
0.5  
0.25  
0
8
-40  
0
40  
80  
-40  
0
40  
80  
]
AMBIENT TEMPERATURE: Ta [  
AMBIENT TEMPERATURE: Ta [  
]
Figure 11. Operating Marginal Voltage  
vs Temperature  
Figure 12. CT Pin Circuit Resistance  
vs Temperature  
15  
12  
9
10  
9
8
6
7
3
6
0
5
-40  
0
40  
80  
-40  
0
40  
80  
]
AMBIENT TEMPERATURE: Ta [  
Figure 14. WDT Time vs Temperature  
AMBIENT TEMPERATURE: Ta [  
]
Figure 13. RESET Transmission Delay Time  
vs Temperature  
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7/15  
TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Timing chart  
VDETH  
VDD  
VDET  
VDETH=VDET+Vrhys  
WDT circuit turns off when INH is low  
WDT circuit turns off when INH is high  
0
INH  
(BD37AxxFVMBD99A41F)  
0
INH  
(BD87AxxFVM)  
0
CLK  
0
*4 TWCLK TWCLK  
VCT  
VCTH  
0
VthH  
VthL  
VCTW  
0
*2  
*1  
*3  
TWH  
TWL  
TPLH  
RESET  
0
④ ⑤  
③  
④⑤⑧  
④ ⑤⑩ ⑪  
④ ⑤⑩ ③  
Figure 15. Timing Chart  
Explanation  
The RESET pin voltage (RESET) switches to low when the power supply voltage (VDD) falls to 0.8 V.  
The external capacitor connected to the CT pin begins to charge when VDD rises above the reset detection voltage  
(VDETH). The RESET signal stays low until VDD reaches the VDETH voltage and switches to high when VDD reaches  
or exceeds the VDETH voltage. The RESET transmission delay time TPLH allowed to elapse before RESET switches  
from low to high is given by the following equation:  
TPLH (s) 0.69 × Rrst × CT (µF)   [1]  
Rrst denotes the IC's built-in resistance and is designed to be 10 M(Typ.). CT denotes the external capacitor  
connected to the CT pin.  
The external capacitor connected to the CTW pin begins to charge when RESET rises, triggering the watchdog timer.  
The CTW pin state switches from charge to discharge when the CTW pin voltage (VCTW) reaches VthH, and RESET  
switches from high to low. The watchdog timer monitor time TWH is given by the following equation:  
TWH (s) (0.5 × CTW (µF))/(ICTWC)   [2]  
ICTWC denotes the CTW charge current and is designed to be 0.50 µA (Typ.). CTW denotes the external capacitor  
connected to the CTW pin.  
The CTW pin state switches from charge to discharge when VCTW reaches VthL, and RESET switches from low to  
high. The watchdog timer reset time TWL is given by the following equation:  
TWL (s) (0.5 × CTW (µF))/(ICTWO)   [3]  
ICTWO denotes the CTW discharge current and is designed to be 1.50 µA (Typ.).  
The CTW pin state may not switch from charge to discharge when the CLK input pulse width TWCLK is short. Use a  
TWCLK input pulse width of at least 500 ns.  
TWCLK 500 ns (Min.)  
When a pulse (positive edge trigger) of at least 500 ns is input to the CLK pin while the CTW pin is charging, the CTW  
state switches from charge to discharge. Once it discharges to VthL, it will charge again.  
Watchdog timer operation is forced off when the INH pin switches to low (L: BD37Axx Series. BD99A41F, H:  
BD87AxxSeries). At that time, only the watchdog timer is turned off. Reset detection is performed normally.  
The watchdog timer function turns on when the INH pin switches to high(H: BD37Axx Series. BD99A41F, L:  
BD87AxxSeries). The external capacitor connected to the CTW pin begins to charge at that time.  
RESET switches from high to low when VDD falls to the RESET detection voltage (VDET) or lower.  
When VDD falls to 0 V, the RESET signal stays low until VDD reaches 0.8 V.  
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TSZ02201-0T2T0AN00130-1-2  
25.Apr.2013 Rev.002  
8/15  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Power Dissipation  
MSOP8  
SOP8  
800  
800  
600  
400  
200  
When mounted on a glass epoxy board  
(70 mm 70 mm 1.6mm) ja = 212.8 (°C /W)  
When mounted on a glass epoxy board  
(70 mm 70 mm 1.6mm) ja = 181.8 (°C /W)  
600  
400  
200  
550mW  
470mW  
105℃  
105℃  
0
0
0
25  
50  
75  
100  
125  
0
25  
50  
75  
100  
125  
AMBIENT TEMPERATURE: Ta []  
AMBIENT TEMPERATURE: Ta []  
Figure 16. Power Dissipation  
I/O equivalence circuit  
CLK  
INH  
CT  
VDD  
VDD  
VDD  
VDD  
10MΩ(Typ.)  
INH  
CT  
CLK  
CTW  
RESET  
VDD  
VDD  
RESET  
CTW  
Figure 17. I/O equivalence circuit  
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9/15  
TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
External settings for pins and precautions  
1) Connect a capacitor (0.001 µF to 1,000 µF) between the VDD and GND pins when the power line impedance is high. Use  
of the IC when the power line impedance is high may result in oscillation.  
2) External capacitance  
A capacitor must be connected to the CTW pin. When using a large capacitor such as 1 µF, the INH pin must allow a  
CTW discharge time of at least 2 ms. The power-on reset time is given by equation [1] on page 8. The WDT time is given  
by equations [2] and [3] on page 8. The setting times are proportional to the capacitance value from the equations, so the  
maximum and minimum setting times can be calculated from the electrical characteristics according to the capacitance.  
Note however that the electrical characteristics do not include the external capacitor's temperature characteristics.  
Operational Notes  
1) Absolute maximum ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can  
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If  
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,  
such as fuses.  
2) GND voltage  
The potential of GND pin must be minimum potential in all operating conditions.  
3) Thermal design  
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating  
conditions.  
4) Inter-pin shorts and mounting errors  
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any  
connection error or if pins are shorted together.  
5) Actions in strong electromagnetic field  
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to  
malfunction.  
6) Testing on application boards  
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.  
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or  
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic  
measure. Use similar precaution when transporting or storing the IC.  
7) Regarding input pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.  
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic  
diode or transistor. For example, the relation between each potential is as follows:  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes  
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.  
Resistor  
Transistor (NPN)  
B
(Pin B)  
(Pin A)  
(Pin B)  
C
E
B
C
E
P
P
GND  
P+  
P+  
P+  
P+  
N
N
P substrate  
GND  
Parasitic element or  
transistor  
N
P
N
N
N
Parasitic element  
GND  
(Pin A)  
Parasitic element  
Parasitic element  
or transistor  
Figure 18. Example of IC structure  
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TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
8) Ground Wiring Pattern  
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,  
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage  
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change  
the GND wiring pattern of any external components, either.  
9) Applications or inspection processes with modes where the potentials of the VDD pin and other pins may be reversed  
from their normal states may cause damage to the IC’s internal circuitry or elements. Use an output pin capacitance of  
1000 µF or lower in case VDD is shorted with the GND pin while the external capacitor is charged. It is recommended to  
insert a diode for preventing back current flow in series with VDD or bypass diodes between Vcc and each pin.  
Back current prevention diode  
Bypass diode  
VDD  
Pin  
Figure 19.  
10) When VDD falls below the operating marginal voltage, output will be open. When output is being pulled up to input,  
output will be equivalent to VDD.  
11) Input pin  
The CLK and INH pins comprise inverter gates and should not be left open. (These pins should be either pulled up or  
down.) Input to the CLK pin is detected using a positive edge trigger and does not affect the CLK signal duty. Input the  
trigger to the CLK pin within the TWH time.  
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TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Physical Dimension, Tape and Reel Information  
Package Name  
MSOP8  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1pin  
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
Reel  
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TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Physical Dimension, Tape and Reel Information – continued  
Package Name  
SOP8  
(Max 5.35 (include.BURR))  
(UNIT : mm)  
PKG : SOP8  
Drawing No. : EX112-5001-1  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2500pcs  
Quantity  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
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TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Marking Diagrams  
MSOP8(TOP VIEW)  
SOP8(TOP VIEW)  
Part Number Marking  
Part Number Marking  
LOT Number  
LOT Number  
1PIN MARK  
1PIN MARK  
Part Number Marking  
Package  
Part Number  
D3719  
MSOP8  
Reel of 3000  
BD37A19FVM-TR  
D3741  
D8728  
D8729  
D8734  
D8741  
99A41  
MSOP8  
MSOP8  
MSOP8  
MSOP8  
MSOP8  
SOP8  
Reel of 3000  
Reel of 3000  
Reel of 3000  
Reel of 3000  
Reel of 3000  
Reel of 2500  
BD37A41FVM-TR  
BD87A28FVM-TR  
BD87A29FVM-TR  
BD87A34FVM-TR  
BD87A41FVM-TR  
BD99A41F-E2  
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14/15  
TSZ2211115001  
Datasheet  
BD37Axx Series  
BD87Axx Series  
BD99A41F  
Revision History  
Date  
Revision  
001  
002  
Changes  
12.Apr.2013  
New Release  
P.8 Explanation modified.  
P.9 Figure 17. I/O equivalence circuit the error in writing of the part of CLK was corrected.  
25.Apr.2013  
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Daattaasshheeeett  
Notice  
General Precaution  
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2) All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
Precaution on using ROHM Products  
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific  
Applications.  
2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3) Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4) The Products are not subject to radiation-proof design.  
5) Please verify and confirm characteristics of the final or mounted products in using the Products.  
6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual  
ambient temperature.  
8) Confirm that operation temperature is within the specified range described in the product specification.  
9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Precaution for Mounting / Circuit board design  
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the  
ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Precautions Regarding Application Examples and External Circuits  
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2) You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
QR code printed on ROHM Products label is for ROHM’s internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,  
please consult with ROHM representative in case of export.  
Precaution Regarding Intellectual Property Rights  
1) All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable  
for infringement of any intellectual property rights or other damages arising from use of such information or data.:  
2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the information contained in this document.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
Other Precaution  
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
5) The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice - Rev.004  
© 2013 ROHM Co., Ltd. All rights reserved.  
配单直通车
BD37A41FVM-TR产品参数
型号:BD37A41FVM-TR
是否无铅:不含铅
是否Rohs认证:符合
生命周期:Active
IHS 制造商:ROHM CO LTD
零件包装代码:MSOP
包装说明:VSSOP, TSSOP8,.16
针数:8
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:8 weeks
风险等级:2.22
Samacsys Confidence:3
Samacsys Status:Released
Samacsys PartID:1647322
Samacsys Pin Count:8
Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Small Outline Packages
Samacsys Footprint Name:BD37A41FVM-TR
Samacsys Released Date:2020-05-13 01:39:00
Is Samacsys:N
其他特性:DETECTION THRESHOLD VOLTAGE IS 4.1V
可调阈值:NO
模拟集成电路 - 其他类型:POWER SUPPLY MANAGEMENT CIRCUIT
JESD-30 代码:R-PDSO-G8
长度:2.9 mm
信道数量:1
功能数量:1
端子数量:8
最高工作温度:105 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:VSSOP
封装等效代码:TSSOP8,.16
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V
认证状态:Not Qualified
座面最大高度:0.9 mm
子类别:Power Management Circuits
最大供电电流 (Isup):0.014 mA
最大供电电压 (Vsup):10 V
最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):5 V
表面贴装:YES
温度等级:INDUSTRIAL
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.8 mm
Base Number Matches:1
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