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产品型号BD3650FP-M的Datasheet PDF文件预览

Power Management ICs for Automotive Body Control  
LDO  
Regulator  
BD3650FP-M  
No.10039EAT08  
Description  
The BD3650FP-M is low-saturation regulator.  
This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a  
thermal shutdown circuit that protects the IC from thermal damage due to overloading.  
Features  
1) Output Current: 0.3A  
2) High Output Voltage Precision : ±2%  
3) Low saturation with PDMOS output  
4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits  
5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading  
6) Low ESR Capacitor  
7) TO252-3 packaging  
Applications  
Onboard devices (vehicle equipment, car stereos, satellite navigation systems, etc.)  
Absolute maximum ratings(Ta=25)  
Parameter  
Supply voltage  
Symbol  
Vcc  
Ratings  
-0.3+36.0  
1.2  
Unit  
V
*1  
*2  
Pd  
W
Power dissipation  
Operating temperature range  
Storage temperature range  
Maximum Junction Temperature  
Topr  
Tstg  
-40+125  
-55+150  
150  
Tjmax  
*1  
*2  
Not to exceed Pd.  
TO252-3:Reduced by 9.6mW /over Ta = 25, when mounted on glass epoxy board: 70mm×70mm×1.6mm.  
Operating conditions(Ta=-40+125)  
Parameter  
Symbol  
Vcc  
Min.  
5.6  
0
Max.  
30.0  
0.3  
Unit  
V
*3  
Supply Voltage  
Output current  
Io  
A
*3  
Consider the voltage drop (dropout voltage) due to the output current.  
NOTE: This product is not designed for protection against radioactive rays.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
1/10  
Technical Note  
BD3650FP-M  
Electrical characteristics  
Unless otherwise specified, Ta=-40+125,Vcc=10V, Io=0mA setting  
Parameter  
Symbol  
Ib  
Min  
Typ  
0.5  
5.00  
0.2  
60  
Max  
1.0  
5.10  
0.4  
Unit  
mA  
V
Conditions  
Bias Current  
Output voltage  
Dropout Voltage  
Ripple Rejection  
Line Regulation  
Load Regulation  
Vo  
4.90  
Io=200mA  
ΔVd  
R.R.  
Reg.I  
Reg.L  
V
Vcc=Vo×0.95, Io=200mA  
f=120Hz, ein=1Vrms,  
Io=100mA  
45  
dB  
mV  
mV  
5
35  
Vcc=5.630V  
10  
50  
Io=10mA300mA  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
2/10  
Technical Note  
BD3650FP-M  
Reference data  
Unless otherwise specified, Ta=-40℃~+125, Vcc=10V, Io=0mA  
6.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1.0  
5.0  
0.8  
4.0  
125℃  
0.6  
3.0  
25℃  
-40℃  
125℃  
25℃  
0.4  
0.2  
0.0  
-40℃  
125℃  
25℃  
2.0  
1.0  
0.0  
-40℃  
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30  
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 30  
0
2
4
6 8 10 12 14 16 18 20 2224 26 28 30  
SUPPLY VOLTAGE: Vcc[V]  
SUPPLY VOLTAGE: Vcc[V]  
SUPPLY VOLTAGE: Vcc[V]  
Fig.1 Circuit Current  
Fig.2 Line Regulation  
(Io=0mA)  
Fig.3 Line Regulation  
(Io=200mA)  
80  
70  
60  
50  
40  
30  
20  
10  
0
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
300  
250  
200  
150  
100  
50  
125℃  
-40℃  
25℃  
25℃  
-40℃  
-40℃  
125℃  
125℃  
25℃  
0
100  
1000  
10000  
100000 1000000  
0
250  
500  
750 1000 1250 1500  
0
100  
200  
300  
FREQUENCY: f [Hz]  
OUTPUT CURRENT: Io[mA]  
OUTPUT CURRENT: Io[mA]  
Fig.4 Load Stability  
Fig.5 Dropout Voltage  
(Vcc=4.75V)  
Fig.6 Ripple Rejection  
(Io=100mA)  
(Io=0mA300mA)  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
25℃  
125℃  
-40℃  
0
50  
100  
150  
200  
250  
300  
130  
140  
150  
160  
170  
180  
190  
-40 -20  
0
20 40 60 80 100 120  
AMBIENT TEMPERATURE: Ta [℃]  
AMBIENT TEMPERATURE: Ta[℃]  
OUTPUT CURRENT: io[mA]  
Fig.7 Output Voltage  
Temperature Characteristics  
Fig.8 Circuit Current  
(lo=0mA300 mA)  
Fig.9 Thermal Shutdown  
Circuit Characteristics  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
3/10  
Technical Note  
BD3650FP-M  
Measurement circuit for electrical data  
Vcc  
Vo  
Vo  
Vcc  
Vo  
Vcc  
2.2 µF  
4.7 µF  
2.2µF  
4.7µF  
2.2 µF  
4.7 µF  
GND  
GND  
GND  
200mA  
Measurement Circuit of Fig.1  
Measurement Circuit of Fig.2  
Measurement Circuit of Fig.3  
Vo  
Vcc  
Vcc  
Vo  
Vo  
Vcc  
1Vrms  
2.2 µF  
2.2 µF  
4.7 µF  
4.7 µF  
2.2 µF  
4.7 µF  
GND  
GND  
GND  
4.75V  
10V  
10V  
100mA  
Measurement Circuit of Fig.4  
Measurement Circuit of Fig.5  
Measurement Circuit of Fig.6  
Vo  
Vcc  
Vo  
Vo  
Vcc  
Vcc  
4.7µF  
2.2µF  
4.7µF  
2.2 µF  
2.2 µF  
4.7µF  
GND  
GND  
GND  
10V  
10V  
10V  
Measurement Circuit of Fig.7  
Measurement Circuit of Fig.8  
Measurement Circuit of Fig.9  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
4/10  
Technical Note  
BD3650FP-M  
Block Diagram  
GND  
FIN  
VREFBandgap Reference  
OCPOver Current Protection Circuit  
TSDThermal Shut Down Circuit  
DriverPower Transistor Driver  
VREF  
DRIVER  
OCP  
TSD  
1
2
3
Vcc  
N.C.  
Vo  
Fig.10  
Pin No.  
Pin Name  
Function  
1
2
Vcc  
N.C.  
Vo  
Power supply pin  
N.C. pin  
3
Output pin  
GND  
FIN  
GND  
Package dimension (TOP VIEW)  
I/O Equivalent Circuits (Resistance value is typical value.)  
pin  
pin  
Vo  
Vcc  
Vcc  
100 kΩ  
Vcc  
Vo  
IC  
83.5 kΩ  
15kΩ  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
5/10  
Technical Note  
BD3650FP-M  
Thermal Dissipation Curve  
5
5
4
3
2
1
0
ROHM standard board  
ROHM standard board  
Board size:70mm×70mm×1.6mm  
foil area:7mm×7mm  
2-layer board(back surface copper foil area:15mm×15mm)  
2-layer board(back surface copper foil area:70mm×70mm)  
4-layer board(back surface copper foil area:70mm×70mm)  
4.80  
3.50  
Board size70mm×70mm×1.6mm  
foil area:7mm×7mm  
TO252-3:θja=104.2(/W)  
4
3
2
1
0
①θja=67.6(/W)  
②θja=35.7(/W)  
③θja=26.0(/W  
1.85  
1.20  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Ambient Temperature: Ta  
Ambient Temperature: Ta  
(℃)  
(℃)  
Fig.11  
Fig.12  
(Reference Data)  
When using at temperatures over Ta=25, please refer to the heat reducing characteristics shown in Fig.11 and Fig.12.  
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC  
at temperatures less than the maximum junction temperature Tjmax.  
Fig.11 and Fig.12 shows the acceptable loss and heat reducing characteristics of the TO252-3 package. Even when the  
ambient temperature Ta is a normal temperature (25), the chip (junction) temperature Tj may be quite high so please  
operate the IC at temperatures less than the acceptable loss Pd.  
The calculation method for power consumption Pc(W) is as follows :(Fig.12)  
Pc=(VccVo)×Io+Vcc×Ib  
Acceptable loss PdPc  
Solving this for load current Io in order to operate within the acceptable loss,  
VCC  
Vo:  
Io:  
Ib:  
Ishort:  
:
Input voltage  
Output voltage  
Load current  
Circuit current  
Short current  
PdVCCIb  
VCC VO  
IO ≦  
(Please refer to Figs.8 for Ib.)  
It is then possible to find the maximum load current IOMAX with respect to the  
applied voltage Vcc at the time of thermal design.  
Calculation Example)  
When Ta=85, Vcc=10V, Vo=5V  
2.469 10Ib  
Fig.12:θja=26.0/W -38.4mW/℃  
25=4.80W 85=2.496W  
IO ≦  
5
IO300mA (Ib:0.5mA)  
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating  
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :  
Pc=VCC×(Ib+Ishort)  
(Please refer to Fig.4 for Ishort.)  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
6/10  
Technical Note  
BD3650FP-M  
Notes for use  
1. Absolute maximum ratings  
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may  
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open  
mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,  
consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.  
2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external  
circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.  
3. GND potential  
The potential of the GND pin must be the minimum potential in the system in all operating conditions.  
Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.  
4. Ground wiring pattern  
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but  
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused  
by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage.  
The power supply and ground lines must be as short and thick as possible to reduce line impedance.  
5. Inter-pin shorts and mounting errors  
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in  
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by  
poor soldering or foreign objects) may result in damage to the IC.  
6. Operation in strong electromagnetic fields  
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications  
where strong electromagnetic fields may be present.  
7. Testing on application boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to  
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be  
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent  
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.  
8. Thermal consideration  
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.  
Consider Pc that does not exceed Pd in actual operating conditions. (PdPc)  
Tjmax : Maximum junction temperature=150[] , Ta : Peripheral temperature[] ,  
θja : Thermal resistance of package-ambience[/W], Pd : Package Power dissipation [W],  
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current  
Package Power dissipation  
Power dissipation  
: Pd (W)=(TjmaxTa)/θja  
: Pc (W)=(VccVo)×Io+Vcc×Ib  
9. Vcc pin  
Insert a capacitor(capacitor2.2µF) between the Vcc and GND pins.  
The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.11 - Rev.A  
7/10  
Technical Note  
BD3650FP-M  
10. Output pins  
It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable  
capacitance values range from 4.7µF to 1000µF. Ceramic capacitors can be used as long as their ESR value is low  
enough to prevent oscillation (0.001to 2). Abrupt fluctuations in input voltage and load conditions may affect the  
output voltage.  
Output capacitance values should be determined only through sufficient testing of the actual application.  
Vcc=5.6V30V  
Io=0A0.3A  
Ta=-40℃~+125℃  
Cin=2.2µF100µF Cout=4.7µF100µF  
10  
Unstable operating region  
1
0.1  
0.01  
0.001  
0
50  
100  
150  
200  
250  
300  
Io(mA)  
Cout_ESR vs Io(reference data)  
Vcc  
Vo  
Cout  
(4.7µF)  
Vcc  
Cin  
(5.630V)  
(2.2µF)  
GND  
Io (ROUT)  
ESR  
(0.001Ω~)  
Operation Notes10 Measurement circuit  
11. Over current protection circuit (OCP)  
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output  
capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit  
output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other  
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.  
However, the IC should not be used in applications characterized by the continuous or transitive operation of the  
protection circuits.  
12. Thermal shutdown circuit (TSD)  
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of  
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used  
after this function has activated, or in applications where the operation of this circuit is assumed.  
13. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal  
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in  
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent  
reverse current flow, or insert bypass diodes between Vcc and each pin.  
www.rohm.com  
2010.11 - Rev.A  
8/10  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD3650FP-M  
14. Positive voltage surges on VCC pin  
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 36V  
on the VCC pin.  
Vcc  
GND  
15. Negative voltage surges on VCC pin  
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the  
VCC pin.  
Vcc  
GND  
16. Output protection diode  
Loads with large inductance components may cause reverse current flow during startup or shutdown. In such cases, a  
protection diode should be inserted on the output to protect the IC.  
17. Regarding input pins of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.  
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes  
and/or transistors. For example (refer to the figure below):  
When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode  
When GND > Pin B, the PN junction operates as a parasitic transistor  
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Transistor (NPN)  
Resistor  
(Pin B)  
(Pin A)  
(Pin B)  
B
C
E
C
E
B
N
P
P+  
P+  
P+  
P+  
P
GND  
N
N
N
N
P
Parasitic elements  
or transistors  
N
N
Parasitic elements  
GND  
P substrate  
GND  
(Pin A)  
Parasitic elements  
or transistors  
Parasitic elements  
Example of Simple Monolithic IC Architecture  
www.rohm.com  
2010.11 - Rev.A  
9/10  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD3650FP-M  
Ordering part number  
B D  
3
6
5
0
F
P
-
M
E
2
ROHM  
model Name  
Part No.  
Package  
FP : TO252-3  
Packaging and forming specification  
E2: Embossed tape and reel  
www.rohm.com  
2010.11 - Rev.A  
10/10  
© 2010 ROHM Co., Ltd. All rights reserved.  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-  
controller or other safety device). ROHM shall bear no responsibility in any way for use of any  
of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
R1010  
A
配单直通车
BD3650FP-M产品参数
型号:BD3650FP-M
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:TO-252
包装说明:ROHS COMPLIANT, TO-252, 3 PIN
针数:4
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.69
最大回动电压 1:0.4 V
最大输入电压:30 V
最小输入电压:5.6 V
JESD-30 代码:R-PSSO-G2
JESD-609代码:e2
长度:6.5 mm
功能数量:1
端子数量:2
工作温度TJ-Max:150 °C
最大输出电流 1:0.3 A
最大输出电压 1:5.1 V
最小输出电压 1:4.9 V
标称输出电压 1:5 V
封装主体材料:PLASTIC/EPOXY
封装代码:TO-252
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
认证状态:Not Qualified
调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:2.5 mm
表面贴装:YES
端子面层:Tin/Copper (Sn/Cu)
端子形式:GULL WING
端子节距:2.3 mm
端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:5.5 mm
Base Number Matches:1
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