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产品型号BD3852MUZ-Z的Datasheet PDF文件预览

Datasheet  
Shock Sensor (Impact Sensor) IC  
BD3852MUZ-Z  
General Description  
Key Specifications  
BD3852MUZ-Z is connected with an external shock  
sensor. It is equipped with a function to amplify the shock  
detection signal from the shock sensor and transmit the  
amplified signal externally.  
It delivers high S/N characteristics and is ideal for control  
system applications such as HDD processing.  
Recommended Operating Power  
Supply Voltage Range:  
Notch Frequency:  
Notch Attenuation Rate:  
Current Consumption:  
Recommended Operating  
Temperature Range:  
1.6 V to 2.3 V  
31 kHz (Typ)  
-23 dB (Max)  
3.9 mA (Typ)  
-40 °C to +85 °C  
Features  
Package  
VQFN16Z3030A  
W (Typ) x D (Typ) x H (Max)  
3.0 mm x 3.0 mm x 0.4 mm  
Operating Power Supply Voltage Range:  
1.6 V to 2.3 V, Single Power Supply Operation  
Freely Tunable Frequency Characteristics and the  
Gain according to Applications  
Built-in Notch Filter for Reducing the Effect of the  
Shock Sensor Resonance Point  
(fO: 31 kHz)  
Applications  
HDD/light Pick-up Shock Detection and Write  
Protection  
HDD/light Pick-up Inertial Force Fluctuation Feed  
Forward Control  
Typical Application Circuit  
Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 14 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
1/14  
BD3852MUZ-Z  
Pin Configuration  
Pin Description  
Pin No.  
Pin Name  
EN  
Function  
Enable input pin (H input: Power ON, L input: Power saving)  
Pull-down at 50 kΩ inside the IC  
1
2
NC  
Connect to the GND pin  
Reference output pin (0.8 V)  
OP-AMP2 non-inverting input pin  
OP-AMP2 output pin  
3
REF2  
A2IP  
A2O  
4
5
6
A2IM  
FO  
OP-AMP2 inverting input pin  
Filter output pin  
7
8
NC  
Connect to the GND pin  
OP-AMP1 output pin  
9
A1O  
10  
11  
12  
13  
14  
15  
16  
-
NC  
Connect to the GND pin  
Connect to the GND pin  
Power supply voltage pin  
OP-AMP1 non-inverting input pin  
OP-AMP1 inverting input pin  
Reference output pin (0.4 V)  
Ground pin  
NC  
VCC  
A1IP  
A1IM  
REF1  
GND  
EXP-PAD  
The EXP-PAD connect to the GND pin  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
2/14  
BD3852MUZ-Z  
Block Diagram  
Description of Blocks  
OP-AMP1: Detects the charge signal generated in the shock sensor by the charge amplifier configuration.  
Filter: Amplifies by 13.9 dB with the preamplifier, and attenuates the fO component of the shock sensor resonance frequency  
(Typ: 31 kHz) with the notch filter.  
OP-AMP2: Serves as the amplifier for the signal amplification and the filter. (The gain is configurable using add-on R and C.)  
VREF: Generates the REF1 and REF2 output voltages.  
PS: Switches between the power saving and power ON states according to the EN pin input voltage.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
3/14  
BD3852MUZ-Z  
Absolute Maximum Ratings  
Parameter  
Symbol  
Rating  
Unit  
Power Supply Voltage  
Input Voltage  
VCC  
VA1IM, VA1IP, VA2IM, VA2IP, VEN  
VA1O, VA2O, VFO, VREF1, VREF2  
Tjmax  
4.5  
V
V
-0.3 to VCC + 0.3  
-0.3 to VCC + 0.3  
150  
Output Voltage  
V
Maximum Junction Temperature  
Storage Temperature  
°C  
°C  
Tstg  
-55 to +150  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing  
board size and copper area so as not to exceed the maximum junction temperature rating.  
Power Dissipation  
Parameter  
Symbol  
Pd  
Rating  
3.00  
Unit  
W
Power Dissipation(Note 1)  
(Note 1) When a 114.3 mm x 76.2 mm x 1.6 mm glass epoxy substrate (JEDEC substrate) is mounted. Reduced at 24.9 mW/°C in Ta > 25 °C.  
Recommended Operating Conditions  
Operating Range  
Parameter  
Symbol  
Unit  
Min  
1.6  
-40  
Typ  
1.8  
Max  
2.3  
VCC  
V
Power Supply Voltage  
Operating Temperature  
Topr  
+25  
+85  
°C  
(Note 2) A short circuit between the adjacent pins, reverse connection, rotated connection, short circuit with the power supply, ground fault, and so on may  
destroy the IC. Since an overload voltage or overload current may be applied to peripheral components, pay sufficient attention during the design and  
installation.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
4/14  
BD3852MUZ-Z  
Electrical Characteristics (VCC = 1.8 V, Ta = 25 °C unless otherwise specified.)  
Standard Values  
Parameter  
Symbol  
Unit  
Conditions  
Min  
1.6  
Typ  
3.9  
Max  
4.5  
ICC  
mA  
μA  
H input to the EN pin  
L input to the EN pin  
Current Consumption  
ICCPS  
-
-
10  
1. EN Pin  
Standard Values  
Typ  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Max  
VIH1  
VIL1  
RUD  
VCC x 0.7  
-0.3  
-
-
VCC + 0.3  
V
V
Input Voltage  
VCC x 0.3  
65  
Built-in Pull-down Resistance  
35  
50  
kΩ  
2. OP-AMP Characteristics  
(1) OP-AMP1  
Standard Values  
Typ  
Parameter  
Symbol  
VDC1  
Unit  
V
Conditions  
Min  
0.3  
Max  
0.5  
Output DC Voltage  
0.4  
With no signal  
Difference between the output  
DC voltage with no load and the  
output DC voltage when 80 µA is  
subtracted  
Difference between the output  
DC voltage with no load and the  
output DC voltage when 80 µA is  
added  
Output Load Fluctuations  
(Source)  
VSOURCE1  
-100  
-
-
-
mV  
mV  
Output Load Fluctuations  
(Sink)  
VSINK1  
-
+100  
(2) OP-AMP2  
Parameter  
Standard Values  
Typ  
Symbol  
Unit  
Conditions  
Min  
-50  
Max  
+50  
Input Current  
IIN  
-
nA  
V
When the A2IP and REF2 pins  
are connected  
Output DC Voltage 1  
VDC21  
VDC22  
VOL2  
VOH2  
0.67  
0.75  
-
0.80  
0.80  
-
0.93  
0.85  
0.3  
-
When 0.8 V is input to the A2IP  
pin  
Output DC Voltage 2  
V
Output Voltage Range (L side)  
Output Voltage Range (H side)  
V
VCC - 0.3  
80  
-
-
V
Current flowing into the A2O pin  
when VCC - 0.3 V is applied to the  
A2O pin  
Current flowing out of the A2O pin  
when 0.3 V is applied to the A2O  
pin  
Output Source Current  
Output Sink Current  
IASO2  
-
-
µA  
μA  
IASI2  
80  
-
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
5/14  
BD3852MUZ-Z  
2. OP-AMP Characteristics – continued  
(3) Filter  
Standard Values  
Typ  
Parameter  
Symbol  
Unit  
mV  
Conditions  
Min  
200  
Max  
600  
Output DC Voltage  
VDC3  
400  
Difference between the output  
DC voltage with no load and the  
output DC voltage when 80 µA is  
subtracted  
Difference between the output  
DC voltage with no load and the  
output DC voltage when 80 µA is  
added  
Output Load Fluctuations  
(Source)  
VSOURCE3  
-100  
-
-
-
mV  
mV  
Output Load Fluctuations  
(Sink)  
VSINK3  
-
+100  
Voltage Gain  
GV  
-
-
13.9  
-
-
dB  
dB  
Attenuation rate at fO = 31 kHz  
when the signal amplitude of the  
A1O pin is 5 mVpp  
Notch Attenuation Rate  
ATT  
-23  
(4) VREF  
Standard Values  
Typ  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Max  
0.45  
REF1 Output Voltage  
REF2 Output Voltage  
VREF1  
VREF2  
VREF2SO  
0.35  
0.40  
0.80  
V
V
With no load  
With no load  
0.68  
-100  
0.92  
-
Difference in the output DC  
voltages with no load and when  
80 µA is subtracted  
Difference in the output DC  
voltages with no load and when  
80 µA is added  
REF2 Output Load Fluctuations  
(Source)  
-
-
mV  
mV  
REF2 Output Load Fluctuations  
(Sink)  
VREF2SI  
-
+100  
Reference Data(Note 3)  
(Note 3) No shipping test is performed for the reference data.  
1. OP-AMP1  
Standard Values  
Typ  
Parameter  
Input Bias Voltage  
Symbol  
Unit  
Conditions  
Min  
-
Max  
-
VIN  
ZIN  
fT1  
0.4  
60  
V
With no signal  
Input Impedance  
-
-
-
-
MΩ  
MHz  
GBW (Cut-off Frequency)  
1.5  
2. OP-AMP2  
Standard Values  
Typ  
Parameter  
Symbol  
fT2  
Unit  
Conditions  
Conditions  
Min  
-
Max  
-
GBW (Cut-off Frequency)  
1.5  
MHz  
3. Filter  
Standard Values  
Typ  
Parameter  
Symbol  
fO  
Unit  
kHz  
Min  
-
Max  
-
When the signal amplitude of the  
A1O pin is 5 mVpp  
Notch Frequency  
31  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
6/14  
BD3852MUZ-Z  
Reference Data – continued  
4. Specifications of the EN Pin at Startup and during Power Saving  
Standard Values  
Typ  
Parameter  
Symbol  
tSD  
Unit  
μs  
Conditions  
Min  
-
Max  
10  
Time elapsed after the EN pin  
input is changed from H to L until  
the REF2 output voltage is  
decreased to 10 % of VREF2 or  
less  
Shutdown Time  
6
Time elapsed after the EN pin  
input is changed from H to L until  
the REF2 output voltage is  
increased to 90 % of VREF2 or  
more  
Startup Time  
tSU  
-
10  
50  
ms  
Application Example  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
7/14  
BD3852MUZ-Z  
I/O Equivalence Circuits  
(1) EN  
(3) REF2  
(4) A2IP  
(5) A2O  
(6) A2IM  
(7) FO  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
8/14  
BD3852MUZ-Z  
I/O Equivalence Circuits – continued  
(9), (14) A1O/A1IM  
(13), (15) A1IP/REF1  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
9/14  
BD3852MUZ-Z  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply  
pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
6. Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow  
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.  
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing  
of connections.  
7. Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject  
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should  
always be turned off completely before connecting or removing it from the test setup during the inspection process. To  
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and  
storage.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
10/14  
BD3852MUZ-Z  
Operational Notes – continued  
8. Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and  
unintentional solder bridge deposited in between pins during assembly to name a few.  
9. Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge  
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause  
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power  
supply or ground line.  
10. Regarding the Input Pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them  
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a  
parasitic diode or transistor. For example (refer to figure below):  
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.  
When GND > Pin B, the P-N junction operates as a parasitic transistor.  
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual  
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to  
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be  
avoided.  
Resistor  
Transistor (NPN)  
Pin A  
Pin B  
Pin B  
B
E
C
Pin A  
B
C
E
P
P+  
P+  
N
P+  
P
P+  
N
N
N
N
N
N
N
Parasitic  
Elements  
Parasitic  
Elements  
P Substrate  
GND GND  
P Substrate  
GND  
GND  
Parasitic  
Elements  
Parasitic  
Elements  
N Region  
close-by  
Example of Monolithic IC Structure  
11. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
11/14  
BD3852MUZ-Z  
Ordering Information  
B
D
3
8
5
2
M
U
Z
-
ZTR  
Package  
MUZ:  
Packaging and forming specification  
TR: Embossed tape and reel  
VQFN16Z3030A  
Marking Diagram  
VQFN16Z3030A (TOP VIEW)  
Part Number Marking  
B D 3  
8 5 2  
LOT Number  
Pin 1 Mark  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
12/14  
BD3852MUZ-Z  
Physical Dimension and Packing Information  
Package Name  
VQFN16Z3030A  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
11.Mar.2020 Rev.001  
13/14  
BD3852MUZ-Z  
Revision History  
Date  
Revision  
001  
Changes  
11.Mar.2020  
New Release  
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0E3E0FZ00890-1-2  
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Notice  
Precaution on using ROHM Products  
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,  
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you  
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport  
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car  
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or  
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.  
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any  
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific  
Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are designed and manufactured for use under standard conditions and not under any special or  
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any  
special or extraordinary environments or conditions. If you intend to use our Products under any special or  
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of  
product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PGA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PGA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
配单直通车
BD3860K产品参数
型号:BD3860K
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:QFP
包装说明:QFP-44
针数:44
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.74
Is Samacsys:N
信道分离:95 dB
商用集成电路类型:TONE CONTROL CIRCUIT
谐波失真:0.01%
JESD-30 代码:S-PQFP-G44
JESD-609代码:e3/e2
长度:10 mm
频带数量:2
信道数量:2
功能数量:1
端子数量:44
最高工作温度:85 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:QFP
封装等效代码:QFP44,.5SQ,32
封装形状:SQUARE
封装形式:FLATPACK
峰值回流温度(摄氏度):260
电源:9 V
认证状态:Not Qualified
座面最大高度:2.25 mm
子类别:Other Consumer ICs
最大压摆率:35 mA
最大供电电压 (Vsup):9.5 V
最小供电电压 (Vsup):7 V
表面贴装:YES
技术:BICMOS
温度等级:INDUSTRIAL
端子面层:TIN/TIN COPPER
端子形式:GULL WING
端子节距:0.8 mm
端子位置:QUAD
处于峰值回流温度下的最长时间:10
宽度:10 mm
Base Number Matches:1
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