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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • BF2040WE6814XT
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
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  • BF2040WE6814XT图
  • 北京中其伟业科技有限公司

     该会员已使用本站16年以上
  • BF2040WE6814XT
  • 数量1439 
  • 厂家INFINEON 
  • 封装SOT-343 
  • 批号16+ 
  • 特价,原装正品,绝对公司现货库存,原装特价!
  • QQ:2880824479QQ:2880824479 复制
  • 010-62104891 QQ:2880824479

产品型号BF2040WH6814XTSA1的Datasheet PDF文件预览

BF2040...  
Silicon N-Channel MOSFET Tetrode  
For low noise , high gain controlled  
input stages up to 1GHz  
Operating voltage 5 V  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
ESD (Electrostatic discharge) sensitive device, observe handling precaution!  
Type  
Package  
SOT143  
SOT143R 1=D  
SOT343 1=D  
Pin Configuration  
Marking  
NFs  
NFs  
BF2040  
BF2040R  
BF2040W  
1=S  
2=D  
2=S  
2=S  
3=G2 4=G1  
3=G1 4=G2  
3=G1 4=G2  
-
-
-
-
-
-
NFs  
Maximum Ratings  
Parameter  
Drain-source voltage  
Symbol  
V
DS  
Value  
8
Unit  
V
40  
10  
7
mA  
Continuous drain current  
Gate 1/ gate 2-source current  
Gate 1 (external biasing)  
Total power dissipation  
I
D
±I  
G1/2SM  
V
mW  
+V  
G1SE  
P
tot  
T 76 °C, BF2040, BF2040R  
200  
200  
S
T 94 °C, BF2040W  
S
°C  
Storage temperature  
Channel temperature  
T
T
-55 ... 150  
150  
stg  
ch  
Thermal Resistance  
Parameter  
Channel - soldering point  
Symbol  
R
thchs  
Value  
Unit  
K/W  
1)  
BF2040, BF2040R  
BF2040W  
370  
280  
1
For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2007-06-01  
1
BF2040...  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
10  
6
6
-
-
-
-
V
Drain-source breakdown voltage  
V
(BR)DS  
I = 20 µA, V  
= 0 , V  
= 0  
D
G1S  
G2S  
15  
15  
50  
50  
50  
-
Gate1-source breakdown voltage  
+I = 10 mA, V = 0 , V = 0  
+V  
+V  
(BR)G1SS  
(BR)G2SS  
G1SS  
G1S  
G2S  
DS  
-
Gate2-source breakdown voltage  
+I = 10 mA, V = 0 , V = 0  
G2S  
G1S  
DS  
-
nA  
Gate1-source leakage current  
= 5 V, V = 0 , V = 0  
+I  
+I  
V
G1S  
G2S  
DS  
-
-
Gate2-source leakage current  
= 5 V, V = 0 , V = 0  
G2SS  
V
G2S  
G1S  
DS  
-
-
µA  
mA  
V
Drain current  
= 5 V, V  
I
DSS  
V
= 0 , V  
= 4 V  
G2S  
DS  
G1S  
-
15  
Drain-source current  
= 5 V, V = 4 V, R = 100 kΩ  
I
DSX  
V
DS  
G2S  
G1  
Gate1-source pinch-off voltage  
= 5 V, V = 4 V, I = 20 µA  
V
V
0.3  
0.3  
0.6  
0.7  
-
-
G1S(p)  
G2S(p)  
V
DS  
G2S  
D
Gate2-source pinch-off voltage  
= 5 V, I = 20 µA  
V
DS  
D
2007-06-01  
2
BF2040...  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
37  
-
typ. max.  
AC Characteristics - (verified by random sampling)  
Forward transconductance  
42  
-
g
mS  
fs  
V
= 5 V, I = 15 mA, V  
= 4 V  
DS  
D
G2S  
2.9  
3.4 pF  
Gate1 input capacitance  
= 5 V, I = 15 mA, V  
f = 10 MHz  
C
C
G
F
g1ss  
dss  
p
V
= 4 V,  
DS  
D
G2S  
-
1.6  
-
Output capacitance  
V
= 5 V, I = 15 mA, V  
= 4 V,  
= 4 V,  
= 4 V,  
DS  
D
G2S  
G2S  
G2S  
f = 10 MHz  
Power gain  
20  
-
23  
-
dB  
V
= 5 V, I = 15 mA, V  
DS  
D
f = 800 MHz  
1.6  
2.2 dB  
Noise figure  
V
= 5 V, I = 15 mA, V  
DS  
D
f = 800 MHz  
45  
50  
-
Gain control range  
G  
p
V
= 5 V, V  
= 4 ...0 V , f = 800 GHz  
DS  
G2S  
2007-06-01  
3
BF2040...  
Total power dissipation P = ƒ(T )  
Total power dissipation P = ƒ(T )  
tot S  
tot  
S
BF2040, BFD2040R  
BF2040W  
220  
mW  
220  
mA  
180  
160  
140  
120  
100  
80  
180  
160  
140  
120  
100  
80  
60  
60  
40  
40  
20  
20  
0
0
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Drain current I = ƒ(I )  
Output characteristics I = ƒ(V )  
D DS  
D
G1  
V
= 4V  
V
V
= 4 V  
= Parameter  
G2S  
G2S  
G1S  
26  
mA  
28  
mA  
24  
22  
1.4V  
22  
20  
18  
16  
14  
12  
10  
8
20  
18  
16  
14  
12  
10  
8
1.3V  
1.2V  
1.1V  
1V  
6
6
4
4
2
2
0
0
µA  
V
0
10 20 30 40 50 60 70  
90  
0
1
2
3
4
5
6
7
8
10  
I
V
DS  
G1  
2007-06-01  
4
BF2040...  
Gate 1 current I = ƒ(V  
)
G1S  
Gate 1 forward transconductance  
G1  
V
V
= 5V  
g = ƒ(I )  
DS  
fs  
D
= Parameter  
V
= 5V, V  
= Parameter  
G2S  
DS  
G2S  
195  
µA  
45  
mS  
4V  
4V  
165  
150  
135  
120  
105  
90  
35  
30  
25  
20  
15  
10  
5
3.5V  
3.5V  
3V  
3V  
2.5V  
2V  
75  
2.5V  
2V  
60  
45  
30  
15  
0
0
V
mA  
0
0.4 0.8 1.2  
1.6  
2
2.4  
3.2  
G1S  
0
4
8
12 16 20 24 28 32  
40  
V
I
D
Drain current I = ƒ(V  
)
Drain current I = ƒ(V  
)
D
G1S  
D
GG  
V
V
= 5V  
V
= 5V, V  
= 4V, R = 80kΩ  
DS  
DS  
G2S  
G1  
=gate1 supply voltage)  
= Parameter  
(connected to V  
, V  
G2S  
GG GG  
16  
28  
mA  
4V  
mA  
3V  
24  
22  
20  
18  
16  
14  
12  
10  
8
12  
10  
8
2V  
6
1.5V  
4
6
4
2
2
0
0
0
V
V
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6  
2
1
2
3
5
V
V
GG  
G1S  
2007-06-01  
5
BF2040...  
Drain current I = ƒ(V  
)
Crossmodulation V  
= (AGC)  
D
GG  
unw  
V
= 4V  
V
= 5 V  
G2S  
DS  
R
= Parameter in kΩ  
G1  
120  
28  
mA  
70  
dBµV  
24  
22  
20  
18  
16  
14  
12  
10  
8
80  
90  
110  
105  
100  
95  
110  
130  
90  
6
4
85  
2
0
80  
V
dB  
0
1
2
3
4
5
6
8
0
5
10 15 20 25 30 35 40  
50  
V
=V  
AGC  
GG DS  
2007-06-01  
6
BF2040...  
Cossmodulation test circuit  
VAGC  
VDS  
4n7  
R1  
10kΩ  
2.2 uH  
4n7  
4n7  
RL  
50Ω  
4n7  
50 Ω  
RGEN  
50Ω  
RG1  
VGG  
Semibiased  
2007-06-01  
7
Package SOT143  
BF2040...  
Package Outline  
±0.1  
1
±0.1  
2.9  
B
1.9  
0.1 MAX.  
4
3
1
2
A
0.2  
+0.1  
-0.05  
0.08...0.1  
5
0.8  
0...8˚  
+0.1  
-0.05  
0.4  
M
M
0.2  
0.25  
B
A
1.7  
Foot Print  
0.8 1.2 0.8  
1.2  
0.8  
0.8  
Marking Layout (Example)  
Manufacturer  
2005, June  
RF s  
Date code (YM)  
Pin 1  
BFP181  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
3.15  
1.15  
Pin 1  
2007-06-01  
8
Package SOT143R  
BF2040...  
Package Outline  
±0.1  
1
±0.1  
2.9  
B
0.1 MAX.  
1.9  
4
1
3
2
A
0.2  
+0.1  
-0.05  
0.8  
+0.1  
-0.05  
0.4  
0˚...  
A
8˚  
1.7  
M
0.2  
M
0.25  
B
Foot Print  
0.8  
1.2  
0.8  
0.8 0.8  
1.2  
Marking Layout (Example)  
Reverse bar  
2005, June  
Date code (YM)  
Pin 1  
Manufacturer  
BFP181R  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
3.15  
Pin 1  
1.15  
2007-06-01  
9
Package SOT343  
BF2040...  
Package Outline  
±0.1  
0.9  
±0.2  
2
0.1 MAX.  
0.1  
1.3  
A
4
1
3
2
0.15  
+0.1  
+0.1  
-0.05  
0.3  
0.15  
-0.05  
+0.1  
0.6  
4x  
-0.05  
M
0.2  
A
M
0.1  
Foot Print  
0.6  
1.15  
0.9  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
BGA420  
Type code  
Pin 1  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
2.15  
Pin 1  
1.1  
2007-06-01  
10  
BF2040...  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2007.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2007-06-01  
11  
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