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产品型号BH9992GU的Datasheet PDF文件预览

1/8  
Structure  
Silicon Monolithic Integrated Circuit  
Product Name  
For DSC handshake guard, signal processing and motor driving IC  
Model Name  
F u n c t i o n  
BH9992GU  
GYROAMP 2ch  
HALLAMP 2ch  
R-2R type 8bit D/A converter 5ch  
R-2R type 10bit D/A converter 2ch  
No dead zone system PWM Driver  
SAW wave oscillator  
Regulator  
Rail to Rail AMP  
Absolute maximum ratings  
Item  
Symbol  
VC, VDD, PVCC  
PD  
Standard value  
7.0  
1400  
Unit  
V
mW  
Power supply voltage  
Power dissipation (*1)  
Operation temperature  
range  
TOPR  
-10~70  
Storage temperature  
range  
H Bridge output current1  
H Bridge output current2  
(*2)  
TSTG  
IOUT1  
IOUT2  
-40~125  
300  
mA  
mA  
500  
*1 Mounting board specification(Rohm standard board) Material:The glass fabric base epoxy  
Dimensions:50[mm]×58[mm]×1.75[mm] (8 layers)  
When using it at Ta=25℃ or more, 14 [mW] of 1[℃] decreases.  
*2 Instantaneous current(1[us] or less)  
Operating condition  
Item  
Symbol  
VC  
VDD  
PVCC  
FSCLK  
Min.  
3.0  
2.5  
3.0  
Typ.  
3.3  
3.0  
5.0  
1.0  
Max.  
5.5  
5.5  
5.5  
Unit  
V
V
V
MHz  
(*3)  
VC power supply voltage  
VDD power supply voltage(≦VC)  
PVCC power supply voltage  
Serial clock frequency  
4.0  
DACOUT limit load capacity 1  
(DAC0OUT,DAC3OUT,DAC4OUT)  
Between VDDOUT and GND,  
load capacity  
CLA1  
0.1  
μF  
μF  
CLVDDOUT  
1.0  
30.0  
*3 When VDDOUT is used, the Min. operating condition of VC power supply voltage is 3.2[V].  
・A radiation is not designed.  
REV. D  
2/8  
Physical Dimension  
Package type nama : VCSP85H4  
BH9992  
Lot. No.  
CHIP Backside PIN Arrangement  
AMP4  
+IN  
AMP4  
AMP3  
-IN  
AMP3  
+IN  
AMP11  
+IN  
H
G
F
AGND  
-IN  
AMP4  
OUT  
AMP7  
OUT  
AMP7  
-IN  
AMP9  
+IN  
AMP2  
OUT  
AMP2  
-IN  
AMP3  
OUT  
AMP11  
OUT  
AMP13  
OUT  
AMP13  
-IN  
VDD2  
AMP1  
OUT  
AMP1  
-IN  
AMP11  
-IN  
AMP13  
+IN  
GND1  
VDD1  
VDD  
OUT  
AMP9  
-IN  
DAC4  
OUT  
DAC0  
OUT  
DAC3  
OUT  
DAC6  
OUT  
VREF1  
IN  
AMP14  
OUT  
AMP14  
-IN  
E
VC1  
AMP9  
OUT  
AMP8  
-IN  
AMP8  
OUT  
AMP12  
-IN  
AMP12  
OUT  
AMP14  
+IN  
D
C
AMP10  
-IN  
AMP10  
OUT  
DAC5  
OUT  
AMP12  
+IN  
XSTBY  
LD  
VC2  
AMP10  
+IN  
B
A
GND3  
VC3  
DATA  
CLK  
GND2  
PGND2  
PGND1  
2
OUT1F  
3
OUT1R  
4
PVCC  
5
OUT2R  
6
OUT2F  
7
1
8
Please keep open for ꢀꢀꢀꢀthe terminal, when you use.  
Fig.1 Physical Dimension (Unit : mm)  
REV. D  
3/8  
PIN Description  
PIN No.  
1-A  
Pin Name  
Pin explanation  
PIN No.  
1-E  
Pin Name  
VDDOUT  
Pin explanation  
VDD regulator  
output  
2-A  
3-A  
4-A  
5-A  
PGND1  
OUT1F  
OUT1R  
PVCC  
Power block ground  
CH1 forward output  
CH1 reverse output  
Power block power  
supply  
2-E  
3-E  
4-E  
5-E  
VC1  
VC power supply  
AMP7-input  
DAC4 output  
DAC0 output  
AMP7-IN  
DAC4OUT  
DAC0OUT  
6-A  
OUT2R  
CH2 reverse output  
6-E  
VREF1IN  
AMP reference  
input  
7-A  
8-A  
1-B  
2-B  
3-B  
4-B  
OUT2F  
AMP10+IN  
GND3  
VC3  
CH2 forward output  
7-E  
8-E  
1-F  
2-F  
3-F  
4-F  
AMP14OUT  
AMP14-IN  
GND1  
AMP2-IN  
AMP7OUT  
AMP1OUT  
AMP14 output  
AMP14-input  
GND  
AMP2-input  
AMP7 output  
AMP10 output  
AMP10+Input  
GND  
VC power supply  
Serial data loading  
input  
LD  
5-B  
6-B  
7-B  
8-B  
1-C  
2-C  
3-C  
4-C  
5-C  
6-C  
7-C  
8-C  
1-D  
2-D  
3-D  
4-D  
5-D  
6-D  
7-D  
8-D  
DATA  
CLK  
GND2  
Serial data input  
Serial clock input  
GND  
Power block ground  
AMP10-input  
AMP10 output  
Standby control input  
DAC6 output  
DAC5 output  
VC power supply  
AMP12+input  
AMP9-input  
AMP9 output  
AMP8-input  
AMP8 output  
DAC3 output  
AMP12-input  
AMP12 output  
AMP14+input  
5-F  
6-F  
7-F  
8-F  
1-G  
2-G  
3-G  
4-G  
5-G  
6-G  
7-G  
8-G  
1-H  
2-H  
3-H  
4-H  
5-H  
6-H  
7-H  
8-H  
AMP1-IN  
AMP11-IN  
VDD1  
AMP13+IN  
AMP9+IN  
AMP2OUT  
AMP4OUT  
AMP3OUT  
VDD2  
AMP11OUT  
AMP13OUT  
AMP13-IN  
AMP4+IN  
AMP4-IN  
AMP3-IN  
AMP3+IN  
AGND  
AMP1-input  
AMP11-input  
VDD power supply  
AMP13+input  
AMP9+input  
AMP2 output  
AMP4 output  
AMP3 output  
VDD power supply  
AMP11 output  
AMP13 output  
AMP13-input  
PGND2  
AMP10-IN  
AMP10OUT  
XSTBY  
DAC6OUT  
DAC5OUT  
VC2  
AMP12+IN  
AMP9-IN  
AMP9OUT  
AMP8-IN  
AMP8OUT  
DAC3OUT  
AMP12-IN  
AMP12OUT  
AMP14+IN  
AMP4+input  
AMP4- input  
AMP3- input  
AMP3+ input  
Analog GND  
AMP11+input  
AMP11+IN  
REV. D  
4/8  
Whole Block Diagram  
GYRO AMP1  
(VDD)  
HALL AMP2  
(VDD)  
HALL AMP1  
(VDD)  
VREF1IN  
AMP12-IN  
AMP13-IN  
VDD1  
AMP7OUT  
AMP7-IN  
AMP9+IN  
AMP2-IN  
AMP8-IN  
GND1  
GYRO AMP2  
(VDD)  
AMP14OUT  
AMP13+IN  
DAC6OUT  
AMP12OUT  
AMP14-IN  
DAC5OUT  
AMP14+IN  
VC2  
VDD (VC)  
DAC7ch  
(VC standard voltage is VDD)  
VC1  
VDDOUT  
AMP9OUT  
PWM1  
(VC)  
PWM2  
(VC)  
AMP9-IN  
XSTBY  
LOGIC  
(VC)  
AMP12+IN  
GND2  
AMP10OUT  
AMP10-IN  
VC3  
LD  
DATA  
AMP10+IN  
GND3  
PGND  
Pre  
Driver1  
VC,  
Pre  
Driver2  
VC,  
POWER Driver1  
(PVCC)  
POWER Driver2  
(PVCC)  
CLK  
PVCC  
PVCC  
F.2 Wole Blck Diagram  
REV. D  
5/8  
Electrical characteristic  
◎Circuit current(VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted.)  
Standard value  
Min. Typ. Max.  
Item  
Symbol  
ISTBY  
ICC1  
Unit  
Notes  
Current consumption 1 at standby  
(VC+VDD+PVCC)  
Current consumption1 when operating  
(VC+VDD)  
Current consumption2 when operating  
(VC+VDD)  
Current consumption3 when operating  
(PVCC)  
1.5  
4.0  
10  
μA XSTBY, CLK, DI, LD=L  
DAC0=080H  
mA  
6.0  
DAC1,2,3,4,5,6=000H  
DAC0=080H, DAC1,2,3,4,=0FFH  
DAC 5,6,=3FFH  
ICC2  
11.0 16.5  
25 50  
mA  
ICC3  
μA XSTBY=H, POWSTBY_N=”0”  
◎HALL Sensor input _AMP  
(VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0=080H, DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted)  
Standard value  
Min. Typ. Max.  
Item  
Symbol  
Unit  
Notes  
<HALL_AMP (A1,A2)>  
DAC1, 2=0FFH  
External 500[Ω], 270[Ω]  
DAC1, 2=0FFH  
Outflow current 5.0[mA],  
DAC1, 2=000H  
Inflow current 5.0[mA], VIN=250[mV]  
Output voltage  
H1VOUT  
H1VOH  
H1VOL  
2.50  
2.40  
V
V
V
Output voltage range (Hi)  
(Open loop)  
Output voltage range (Low)  
(Open loop)  
0.4  
◎HALL Sensor output _AMP  
(VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0, DAC3, DAC4=080H, DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted)  
Standard value  
Item  
Symbol  
Unit  
Notes  
Min. Typ. Max.  
<HALL_AMP (A3,A4,A9,A10)>  
Output voltage 1  
(Open loop)  
H2VOUT1  
H2VOUT2  
2.9  
V
V
VINP=1.2[V], VINN=1.1[V]  
VINP=1.1[V], VINN=1.2[V]  
Output voltage 2  
(Open loop)  
0.2  
VIN=10[mVpp] (Differential voltage input)  
f=100[Hz]  
Voltage gain  
H2GVD  
H2fc  
38.5 40.0 41.5  
dB  
Cutoff frequency  
4.1  
2.8  
8.1  
12.1  
kHz -3[dB], Capa 10[pF]  
<HALL_AMP (A5-A7, A6-A8)>  
VINP Input=1.125, VINN Input=0.375  
Output voltage 1  
Output voltage 2  
Output voltage 3  
Output voltage 4  
H3VOUT1  
H3VOUT2  
H3VOUT3  
H3VOUT4  
V
V
V
HALLSW1,3=ON, HALLSW2=OFF  
DAC0=0BFH, DAC3,4=040H  
VINP Input=0.375, VINN Input=1.125  
HALLSW1,3=ON, HALLSW2=OFF  
DAC0=040H, DAC3,4=0BFH  
VINP Input=0.0[V], VINN Input=3.0[V]  
HALLSW2=ON, HALLSW1,3=OFF  
DAC3,4=0AAH  
0.2  
2.8  
VINP Input=0.0[V], VINN Input=0.0[V]  
HALLSW2=ON, HALLSW1,3=OFF  
DAC3,4=055H  
0
0.2  
1.5  
V
VIN=10[mVpp] (Differential voltage input)  
f=100[Hz]  
Voltage gain  
H3GVD  
H3fc  
-1.5  
dB  
Cutoff frequency  
23.0 46.0 69.0  
kHz -3[dB], Capa 33[pF]  
REV. D  
6/8  
◎GYRO_AMP  
(VC=3.3[V], VDD=3.0[V], PVCC=5.0[V], DAC0=080H, DAC0OUT=VREF1IN, Ta=25[℃] except as otherwise noted)  
Standard value  
Item  
Symbol  
Unit  
Notes  
Min. Typ. Max.  
<GYRO_AMP (A11,A12)>  
Output voltage 1  
(Open loop)  
G1VOUT1  
G1VOUT2  
2.9  
V
V
VINP =1.2[V], VINN =1.1[V]  
VINP =1.1[V], VINN =1.2[V]  
Output voltage 2  
(Open loop)  
0.2  
VIN=10[mVpp] (Differential voltage input)  
f=100[Hz]  
Voltage gain  
G1GVD  
G1fc  
38.5 40.0 41.5  
4.1 8.1  
dB  
Cutoff frequency  
12.1 kHz -3[dB], Capa 33[pF]  
<GYRO_AMP (A13,A14)>  
GYROSW2=ON,  
Output voltage 1  
Output voltage 2  
G2VOUT1 1.30 1.50 1.70  
V
V
GYROSW1, At GYROSW3=OFF,  
VINP=open  
GYROSW1, GYROSW2=ON,  
At GYROSW3=OFF,  
G2VOUT2  
1.1  
1.50 1.90  
VINP=open  
GYROSW2=ON, At GYROSW3=OFF  
VIN=10[mVpp] (Differential voltage input)  
f=100[Hz]  
Voltage gain  
G2GVD  
G2fc  
36.3 37.8 39.3  
dB  
kHz  
dB  
GYROSW2=ON, At GYROSW3=OFF  
-3[dB], Capa 100[pF]  
Cutoff frequency  
Voltage gain  
1.1  
2.1  
3.1  
GYROSW2=ON, At GYROSW3=ON  
VIN=10[mVpp] (Differential voltage input)  
f=100[Hz]  
G2GVD2  
G2fc2  
32.5 34.0 35.5  
GYROSW2=ON, At GYROSW3=ON  
-3[dB], Capa 100[pF]  
Cutoff frequency  
1.7  
3.3  
4.9  
kHz  
REV. D  
7/8  
Directions  
1.Absolute maximum ratings  
This IC might be destroyed when the absolute maximum ratings, such as impressed voltages  
(VC,PVCC,VDD) or the operating temperature range (TOPR) is exceeded, and whether the destruction is  
short circuit mode or open circuit mode cannot be specified. Please take into consideration the physical  
countermeasures for safety, such as fusing, if a particular mode that exceeds the absolute maximum rating  
is assumed.  
2.Reverse polarity connection  
Connecting the power line to the IC in reverse polarity (from that recommended) will damage the part.  
Please utilize the direction protection device as a diode in the supply line.  
3.Power supply line  
Due to switching and EMI noise generated by magnetic components (inductors and motors), using  
electrolytic and ceramic suppress filter capacitors close to the IC power input terminals (Vcc and GND) is  
recommended. Please note: the electrolytic capacitor value decreases at lower temperatures.  
4.GND line  
The ground line is where the lowest potential and transient voltages are connected to the IC.  
5.Thermal design  
Do not exceed the power dissipation (Pd) of the package specification rating under actual operation, and  
please design enough temperature margins. (Refer to page 10.)  
6.Short circuit mode between terminals and wrong mounting  
Do not mount the IC in the wrong direction and be careful about the reverse-connection of the power  
connector. Moreover, this IC might be destroyed when the dust short the terminals between them or GND.  
7.Radiation  
Strong electromagnetic radiation can cause operation failures.  
8.ASO(Area of Safety Operation.)  
Do not exceed the maximum ASO and the absolute maximum ratings of the output driver.  
9.TSD(Thermal shut-down)  
The TSD is activated when the junction temperature (Tj) reaches 1750C(with +/-250C hysteresis), and the  
output terminal is switched to Hi-z. The TSD circuit aims to intercept IC from high temperature. The  
guarantee and protection of IC are not purpose. Therefore, please do not use this IC after TSD circuit  
operates, nor use it for assumption that operates the TSD circuit.  
10.Capacitor between output and GND  
If a large capacitor is connected between the output and GND, this IC might be destroyed when Vcc  
becomes 0V or GND, because the electric charge accumulated in the capacitor flows to the output. Please  
set said capacitor to smaller than 0.1μF.  
REV. D  
8/8  
11.Inspection by the set circuit board  
The stress might hang to IC by connecting the capacitor to the terminal with low impedance. Then, please  
discharge electricity in each and all process. Moreover, in the inspection process, please turn off the power  
before mounting the IC, and turn on after mounting the IC. In addition, please take into consideration the  
countermeasures for electrostatic damage, such as giving the earth in assembly process, transportation or  
preservation.  
12.Each input terminal  
This IC is a monolithic IC, and has P+ isolation and P substrate for the element separation. Therefore, a  
parasitic PN junction is firmed in this P-layer and N-layer of each element. For instance, the resistor or the  
transistor is connected to the terminal as shown in the figure below. When the GND voltage potential is  
greater than the voltage potential at Terminals A or B, the PN junction operates as a parasitic diode. In  
addition, the parasitic NPN transistor is formed in said parasitic diode and the N layer of surrounding  
elements close to said parasitic diode. These parasitic elements are formed in the IC because of the voltage  
relation. The parasitic element operating causes the wrong operation and destruction. Therefore, please be  
careful so as not to operate the parasitic elements by impressing to input terminals lower voltage than  
GND(P substrate). Please do not apply the voltage to the input terminal when the power-supply voltage is  
not impressed. Moreover, please impress each input terminal lower than the power-supply voltage or equal  
to the specified range in the guaranteed voltage when the power-supply voltage is impressing.  
Resister  
Transistor(NPN)  
TerminalꢀB  
TerminalꢀB  
TerminalꢀA  
C
B
E
TerminalꢀA  
C
E
B
Parasitic  
element  
P+  
P
P+  
P+  
P
P+  
Surrounding  
elements  
Parasitic  
element  
P-Substrate  
P-Substrate  
GND  
Parasitic  
element  
Parasitic  
element  
GND  
GND  
GND  
Simplified structure of IC  
13.Earth wiring pattern  
Use separate ground lines for control signals and high current power driver outputs. Because these high  
current outputs that flows to the wire impedance changes the GND voltage for control signal. Therefore,  
each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of  
external parts, it is similar to the above-mentioned.  
14.Reverse brake  
When you do the reversal brake from the high-velocity revolution note the counter electromotive force.  
Moreover, confirm the output current enough and examine the rotational speed which uses the reversal  
brake.  
15.About the capacitor between PVCC-PGND  
The PVCC-PGND capacitor absorbs the change in a steep voltage and the current because of the PWM drive. As a result,  
there is a role to suppress the disorder of the PVCC voltage. However, the effect decreases by the influence of the wiring  
impedance etc. if the capacitor becomes far from IC. Arrange the PVCC-PGND capacitor near IC.  
16.Bypass capacitor  
Between the supply power supplies connect the bypass capacitor(0.1μF) near the pin of this IC.  
REV. D  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
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The Products are not designed or manufactured to be used with any equipment, device or  
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instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,  
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of  
any of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
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More detail product informations and catalogs are available, please contact us.  
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© 2009 ROHM Co., Ltd. All rights reserved.  
R0039  
A
配单直通车
BH9992GU产品参数
型号:BH9992GU
是否Rohs认证:符合
生命周期:Active
IHS 制造商:ROHM CO LTD
零件包装代码:BGA
包装说明:VFBGA,
针数:64
Reach Compliance Code:compliant
HTS代码:8542.39.00.01
风险等级:5.6
Is Samacsys:N
模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:S-PBGA-B64
JESD-609代码:e1
长度:4.33 mm
功能数量:1
端子数量:64
最高工作温度:70 °C
最低工作温度:-10 °C
封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA
封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
认证状态:Not Qualified
座面最大高度:1 mm
最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V
表面贴装:YES
温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL
端子节距:0.5 mm
端子位置:BOTTOM
宽度:4.33 mm
Base Number Matches:1
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