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产品型号BLF245112的概述

芯片BLF245112的概述 BLF245112是一款高功率RF功率放大器,专为无线通信和广播应用设计。该芯片在其领域内以其出色的传输性能和可靠性而广受欢迎。BLF245112的运行频率范围涵盖多个关键频段,使其在多种系统中具有广泛的适用性,如移动通信基站、卫星通讯、雷达系统及相关无线设备。凭借其优良的增益特性和相对较低的功耗,BLF245112成为现代射频电路中一款不可或缺的组件。 芯片BLF245112的详细参数 BLF245112的主要参数如下: 1. 工作频率: 该芯片的工作频率范围通常为2400 MHz至2500 MHz,这一频段涵盖了许多无线通信应用。 2. 功率增益: 典型功率增益可达到30 dB,设计师可以根据具体应用需求进行电路优化,以达到更好的性能。 3. 输出功率: 最大输出功率可以达到10W(38 dBm),为要求高功率传输的应用提供了良好的支持。 4. 功耗:...

产品型号BLF245B的Datasheet PDF文件预览

DISCRETE SEMICONDUCTORS  
DATA SHEET  
BLF245B  
VHF push-pull power MOS  
transistor  
September 1992  
Product specification  
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
FEATURES  
PIN CONFIGURATION  
High power gain  
Easy power control  
Good thermal stability  
1
4
3
page  
Gold metallization ensures  
excellent reliability.  
d
2
g
g
2
s
5
1
DESCRIPTION  
d
1
2
Top view  
MSB018  
Dual push-pull silicon N-channel  
enhancement mode vertical D-MOS  
transistor designed for large signal  
amplifier applications in the VHF  
frequency range.  
MBB157  
Fig.1 Simplified outline and symbol.  
The transistor is encapsulated in a  
4-lead, SOT279 balanced flange  
envelope, with a ceramic cap. The  
mounting flange provides the  
common source connection for the  
transistors.  
CAUTION  
The device is supplied in an antistatic package. The gate-source input must  
be protected against static charge during transport and handling.  
WARNING  
PINNING - SOT279  
Product and environmental safety - toxic materials  
PIN  
DESCRIPTION  
gate 1  
This product contains beryllium oxide. The product is entirely safe provided  
that the BeO disc is not damaged. All persons who handle, use or dispose of  
this product should be aware of its nature and of the necessary safety  
precautions. After use, dispose of as chemical or special waste according to  
the regulations applying at the location of the user. It must never be thrown  
out with the general or domestic waste.  
1
2
3
4
5
drain 1  
gate 2  
drain 2  
source  
QUICK REFERENCE DATA  
RF performance at Th = 25 °C in a push-pull common source test circuit.  
f
VDS  
(V)  
PL  
(W)  
GP  
(dB)  
ηD  
(%)  
MODE OF OPERATION  
CW, class-B  
(MHz)  
175  
28  
30  
> 14  
> 55  
September 1992  
2
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
LIMITING VALUES  
In accordance with the Absolute Maximum System (IEC 134).  
Per transistor section unless otherwise specified.  
SYMBOL  
VDS  
PARAMETER  
drain-source voltage  
CONDITIONS  
MIN.  
MAX.  
65  
UNIT  
V
±VGS  
ID  
gate-source voltage  
DC drain current  
20  
4.5  
75  
V
A
Ptot  
total power dissipation  
up to Tmb = 25 °C; total device; −  
W
both sections equally loaded  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
150  
200  
°C  
°C  
THERMAL RESISTANCE  
THERMAL  
RESISTANCE  
SYMBOL  
PARAMETER  
CONDITIONS  
Rth j-mb  
thermal resistance from  
junction to mounting base  
total device; both sections equally loaded  
2.3 K/W  
Rth mb-h  
thermal resistance from  
total device; both sections equally loaded  
0.3 K/W  
mounting base to heatsink  
MRA922  
MRA929  
2
10  
120  
handbook, halfpage  
handbook, halfpage  
I
D
P
tot  
(A)  
(W)  
(2)  
10  
80  
(1)  
(1)  
(2)  
40  
1
1  
10  
0
2
10  
10  
1
0
40  
80  
120  
160  
V
(V)  
o
DS  
T
( C)  
h
(1) Current in this area may be limited by RDS(on)  
.
(1) Continuous operation.  
(2) Tmb = 25 °C.  
(2) Short-time operation during mismatch.  
Total device; both sections equally loaded.  
Total device; both sections equally loaded.  
Fig.2 DC SOAR.  
Fig.3 Power/temperature derating curves.  
September 1992  
3
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
CHARACTERISTICS (per section)  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
V(BR)DSS  
PARAMETER  
CONDITIONS  
ID = 5 mA; VGS = 0  
MIN. TYP. MAX. UNIT  
drain-source breakdown voltage  
drain-source leakage current  
gate-source leakage current  
gate-source threshold voltage  
forward transconductance  
drain-source on-state resistance  
on-state drain current  
65  
V
IDSS  
IGSS  
VGS(th)  
gfs  
VGS = 0; VDS = 28 V  
1
mA  
µA  
V
±VGS = 20 V; VDS = 0  
1
ID = 5 mA; VDS = 10 V  
2
4.5  
ID = 0.75 A; VDS = 10 V  
ID = 0.75 A; VGS = 10 V  
VGS = 10 V; VDS = 10 V  
VGS = 0; VDS = 28 V; f = 1 MHz  
VGS = 0; VDS = 28 V; f = 1 MHz  
VGS = 0; VDS = 28 V; f = 1 MHz  
600  
850  
0.8  
5
mS  
RDS(on)  
IDSX  
Cis  
1.5  
A
input capacitance  
60  
40  
4.5  
pF  
pF  
pF  
Cos  
output capacitance  
Crs  
feedback capacitance  
MGP180  
MGP181  
6
2
handbook, halfpage  
handbook, halfpage  
T.C.  
T = 25 °C  
j
I
(mV/K)  
D
(A)  
0
125 °C  
4
2  
4  
6  
2
0
8  
2
3
0
4
8
12  
16  
1
10  
10  
10  
V
(V)  
I
(mA)  
GS  
D
VDS = 10 V.  
VDS = 10 V.  
Fig.4 Temperature coefficient of gate-source  
voltage as a function of drain current, typical  
values per section.  
Fig.5 Drain current as a function of gate-source  
voltage, typical values per section.  
September 1992  
4
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
MGP182  
MGP183  
2
160  
handbook, halfpage  
handbook, halfpage  
C
(pF)  
R
DS(on)  
()  
120  
80  
1
C
C
is  
os  
40  
0
0
0
0
40  
80  
120  
160  
10  
20  
30  
40  
T (°C)  
V
(V)  
j
DS  
ID = 0.75 A; VGS = 10 V  
VGS = 0; f = 1 MHz.  
Fig.6 Drain-source on-state resistance as a  
Fig.7 Input and output capacitance as functions  
of drain-source voltage, typical values per  
section.  
function of junction temperature, typical  
values per section.  
MGP184  
20  
handbook, halfpage  
C
rs  
(pF)  
10  
0
0
10  
20  
30  
40  
V
(V)  
DS  
VGS = 0; f = 1 MHz.  
Fig.8 Feedback capacitance as a function of  
drain-source voltage, typical values per  
section.  
September 1992  
5
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
APPLICATION INFORMATION FOR CLASS-B OPERATION  
Th = 25 °C; Rth mb-h = 0.3 K/W; unless otherwise specified.  
RF performance in a push-pull, common source, class-B test circuit.  
f
VDS  
(V)  
IDQ  
(mA)  
PL  
(W)  
GP  
(dB)  
ηD  
(%)  
MODE OF OPERATION  
CW, class-B  
(MHz)  
175  
28  
2 × 25  
30  
> 14  
> 55  
typ. 18  
typ. 65  
Ruggedness in class-B operation  
The BLF245B is capable of withstanding a load mismatch  
corresponding to VSWR = 50 through all phases, under  
the following conditions:  
VDS = 28 V, f = 175 MHz at rated output power.  
MGP186  
MGP185  
40  
20  
80  
handbook, halfpage  
handbook, halfpage  
G
p
P
G
L
p
η
D
(W)  
30  
(dB)  
15  
60  
40  
20  
0
η
D
20  
10  
10  
5
0
0
0
0
0.5  
1.0  
1.5  
2.0  
10  
20  
30  
40  
P
(W)  
P
(W)  
IN  
L
Class-B operation; VDS = 28 V; IDQ = 2 × 25 mA;  
ZL = 8.8 + j12.7 ; f = 175 MHz.  
Class-B operation; VDS = 28 V; IDQ = 2 × 25 mA;  
ZL = 8.8 + j12.7 ; f = 175 MHz.  
Fig.10 Load power as a function of input power,  
typical values.  
Fig.9 Power gain and efficiency as functions of  
output power, typical values.  
September 1992  
6
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
bnok,lfuapgedwith  
+V  
D
R3  
R5  
C11  
C12  
C13  
+V  
G
C7  
C8  
L10  
C14  
R7  
C15  
R1  
D.U.T.  
L14  
L16  
L18  
C25  
C26  
L20  
L1  
L4  
L6  
L8  
L12  
C1  
C2  
50 Ω  
output  
50 Ω  
input  
L2  
C3  
C4  
C5  
C6  
C27  
C21  
C22  
C23  
C24  
L21  
L3  
L5  
L7  
L9  
L13  
L17  
L15  
C16  
L22  
L19  
R2  
C17  
R8  
C10  
L11  
C9  
C18  
C19  
C20  
+V  
R6  
G
MGP187  
R4  
f = 175 MHz.  
+V  
D
Fig.11 Test circuit for class-B operation.  
List of components (see test circuit)  
COMPONENT  
C1, C2  
DESCRIPTION  
VALUE  
270 pF  
DIMENSIONS  
CATALOGUE NO.  
multilayer ceramic chip capacitor  
(note 1)  
C3  
multilayer ceramic chip capacitor  
(note 1)  
24 pF  
C4  
film dielectric trimmer  
4 to 60 pF  
91 pF  
2222 809 08002  
C5, C25, C26  
multilayer ceramic chip capacitor  
(note 1)  
C6, C22, C24  
film dielectric trimmer  
5 to 60 pF  
100 nF  
2222 809 08003  
2222 852 47104  
C7, C9, C12, C14, multilayer ceramic chip capacitor  
C17, C19  
September 1992  
7
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
COMPONENT  
C8, C10  
DESCRIPTION  
VALUE  
680 pF  
DIMENSIONS  
CATALOGUE NO.  
multilayer ceramic chip capacitor  
(note 1)  
C11, C20  
C13, C18  
C15, C16  
multilayer ceramic chip capacitor  
electrolytic capacitor  
10 nF  
2222 852 47103  
10 µF, 63 V  
100 pF  
multilayer ceramic chip capacitor  
(note 1)  
C21, C27  
C23  
multilayer ceramic chip capacitor  
(note 1)  
75 pF  
36 pF  
55 Ω  
multilayer ceramic chip capacitor  
(note 1)  
L1, L3, L20, L22  
L2, L21  
L4, L5  
stripline (note 2)  
semi-rigid cable  
stripline (note 2)  
stripline (note 2)  
stripline (note 2)  
length 111 mm  
width 2.5 mm  
50 Ω  
length 111 mm  
ext. dia. 2.2 mm  
49.5 Ω  
49.5 Ω  
49.5 Ω  
length 28 mm  
width 3 mm  
L6, L7  
length 22.5 mm  
width 3 mm  
L8, L9  
length 4.5 mm  
width 3 mm  
L10, L11  
L12, L13  
grade 3B Ferroxcube RF choke  
stripline (note 2)  
4312 020 36642  
49.5 Ω  
length 21 mm  
width 3 mm  
L14, L15  
4 turns enamelled 1 mm copper  
wire  
70 nH  
length 9 mm  
int. dia. 6 mm  
leads 2 × 5 mm  
L16, L17  
L18, L19  
stripline (note 2)  
stripline (note 2)  
49.5 Ω  
49.5 Ω  
length 30 mm  
width 3 mm  
length 26 mm  
width 3 mm  
R1, R2  
R3, R4  
R5, R6  
R7, R8  
0.4 W metal film resistor  
10 turns potentiometer  
0.4 W metal film resistor  
0.4 W metal film resistor  
10 Ω  
50 Ω  
205 kΩ  
10 Ω  
Notes  
1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality.  
2. The striplines are on a double copper-clad printed circuit board, with epoxy glass dielectric (εr = 4.5),  
thickness 116 inch. The other side of the board is fully metallized and used as a ground plane. The ground planes on  
each side of the board are connected together by means of copper straps and hollow rivets.  
September 1992  
8
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
+V  
+V  
D
G
C12  
C13  
C11  
L20  
L10  
C14  
L1 + L2  
R7  
C15  
L14  
L16  
C7  
C8  
C25  
C23  
L18  
L19  
C24  
C26  
C1  
R1  
L12  
C3  
C4  
C5  
C6  
C21  
C22  
L4  
L5  
L6  
L7  
L8  
L9  
C27  
R2  
L13  
C2  
L17  
L15  
C10  
C9  
C16  
R8  
C17  
L11  
L21 + L22  
C18  
C19  
L3  
C20  
MBA378  
+V  
+V  
D
G
200 mm  
rivet  
rivet  
copper  
strap  
copper  
strap  
copper  
strap  
copper  
strap  
rivet  
rivet  
110 mm  
copper  
strap  
copper  
strap  
copper  
strap  
copper  
strap  
rivet  
rivet  
MBA377  
The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being fully  
metallized to serve as a ground. Earth connections are made by means of copper straps and hollow rivets for a  
direct contact between the upper and lower sheets.  
Fig.12 Component layout for 175 MHz test circuit.  
September 1992  
9
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
MGP188  
MGP189  
10  
30  
handbook, halfpage  
handbook, halfpage  
Z
i
Z
L
()  
()  
5
r
i
20  
0
X
R
L
x
i
10  
5  
L
0
0
10  
0
100  
200  
300  
400  
100  
200  
300  
400  
f (MHz)  
f (MHz)  
Class-B operation; VDS = 28 V; IDQ = 2 × 25 mA;  
RGS = 10 ; PL = 30 W (total device).  
Class-B operation; VDS = 28 V; IDQ = 2 × 25 mA;  
RGS = 10 ; PL = 30 W (total device).  
Fig.13 Input impedance as a function of frequency  
(series components), typical values per  
section.  
Fig.14 Load impedance as a function of frequency  
(series components), typical values per  
section.  
MGP190  
25  
handbook, halfpage  
G
p
(dB)  
20  
15  
10  
5
handbook, halfpage  
Z
Z
L
MBA379  
i
0
0
100  
200  
300  
400  
f (MHz)  
Class-B operation; VDS = 28 V; IDQ = 2 × 25 mA;  
RGS = 10 ; PL = 30 W (total device).  
Fig.15 Definition of MOS impedance.  
Fig.16 Power gain as a function of frequency,  
typical values per section.  
September 1992  
10  
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
PACKAGE OUTLINE  
Flanged double-ended ceramic package; 2 mounting holes; 4 leads  
SOT279A  
D
A
F
5
U
B
1
q
C
w
2
H
c
M
C
1
1
2
4
3
H
U
E
2
A
w
p
M
A
B
1
w
3
b
M
Q
e
0
5
10 mm  
scale  
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)  
c
A
b
D
E
e
F
H
H
p
Q
q
U
U
w
w
w
3
UNIT  
1
1
2
1
2
1.66  
1.39  
6.84  
6.01  
9.28  
9.01  
5.97  
5.71  
3.05 12.96 4.96  
2.54 11.93 4.19  
3.48  
3.22  
4.35  
4.03  
24.90 5.97  
24.63 5.71  
0.16  
0.10  
18.42  
0.725  
0.51  
0.02  
1.02 0.25  
0.04 0.01  
mm  
3.05  
0.065  
0.055  
0.269  
0.237  
0.365 0.235  
0.355 0.225  
0.120 0.51  
0.100 0.47  
0.137 0.171  
0.127 0.159  
0.235  
0.225  
0.006  
0.004  
0.195  
0.165  
0.98  
0.97  
inches  
0.12  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
SOT279A  
97-06-28  
September 1992  
11  
Philips Semiconductors  
Product specification  
VHF push-pull power MOS transistor  
BLF245B  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
September 1992  
12  
配单直通车
BLF245B产品参数
型号:BLF245B
生命周期:Transferred
IHS 制造商:NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV
包装说明:,
Reach Compliance Code:unknown
风险等级:5.75
Is Samacsys:N
配置:Single
最大漏极电流 (Abs) (ID):4.5 A
FET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE
最高工作温度:200 °C
极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):75 W
子类别:FET General Purpose Power
表面贴装:NO
Base Number Matches:1
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