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产品型号BLM15AG221SH1D的概述

芯片 BLM15AG221SH1D 概述 BLM15AG221SH1D 是一款由日本村田制作所(Murata Manufacturing Co., Ltd.)生产的高性能电感器,其主要功能为抑制电磁干扰(EMI)和调节高频信号。该芯片广泛应用于通信设备、消费电子、以及各种工业自动化设备中,以确保系统的稳定运行和提升信号质量。 详细参数 BLM15AG221SH1D 的技术参数包括: - 类型:双层厚膜电感 - 直流电阻(DCR):0.12Ω(典型值) - 额定电流:400mA(最大值依应用而定) - 工作温度范围:-55°C 至 +125°C - 电感值:220Ω(±20%) - 包尺寸:1.6mm x 0.8mm x 0.7mm - 封装类型:片式表面安装(SMD) - 材料:陶瓷基底和电感金属膜 上述参数使得 BLM15AG221SH1D 成为一种在高频环境下表现优良的电感器,能够...

产品型号BLM15AG221SH1D的Datasheet PDF文件预览

Reference Only  
Reference Spec.No.JENF243A-9103H-01  
P1/8  
Chip Ferrite Bead BLM15□□□□□SH1D  
Reference Specification [AEC-Q200]  
1.Scope  
This reference specification applies to Chip Ferrite Bead BLM15_SH series for Automotive Electronics  
based on AEC-Q200.  
2.Part Numbering  
(ex.) BL  
M
(2)  
15  
(3)  
AG  
(4)  
102  
(5)  
S
H
1
(8)  
D
(9)  
(1)  
(6) (7)  
(1)Product ID  
(2)Type  
(3)Dimension (L×) (6)Performance  
(4)Characteristics  
(5)Typical Impedance at 100MHz (8)Numbers of Circuit  
(9)Packaging (D:Taping)  
(7)Category(for Automotive Electronics)  
3.Rating  
DC Resistance  
(max.) (*1)  
(refer to below  
comment)  
Impedance ()  
(at 100MHz)(*1)  
(refer to below comment)  
Rated  
Current  
(mA)  
Customer  
Part Number  
MURATA  
Part Number  
ESD Rank  
2 :2kV  
Initial  
Values  
Values After  
Testing  
0.10  
0.20  
0.35  
0.45  
0.70  
1.1  
515  
40100  
BLM15AG100SH1D  
BLM15AG700SH1D  
BLM15AG121SH1D  
BLM15AG221SH1D  
BLM15AG601SH1D  
BLM15AG102SH1D  
BLM15BB050SH1D  
BLM15BB100SH1D  
BLM15BB220SH1D  
BLM15BB470SH1D  
BLM15BB750SH1D  
BLM15BB121SH1D  
BLM15BB221SH1D  
BLM15BD471SH1D  
BLM15BD601SH1D  
BLM15BD102SH1D  
BLM15BD182SH1D  
1000  
500  
500  
300  
300  
200  
500  
300  
300  
300  
300  
300  
200  
200  
200  
200  
200  
0.05  
0.15  
0.25  
0.35  
0.60  
1.0  
120±25%  
220±25%  
600±25%  
1000±25%  
5±25%  
0.08  
0.10  
0.20  
0.35  
0.40  
0.55  
0.80  
0.60  
0.65  
0.90  
1.4  
0.15  
0.15  
0.30  
0.45  
0.50  
0.65  
0.90  
0.70  
0.75  
1.0  
10±25%  
22±25%  
47±25%  
75±25%  
120±25%  
220±25%  
470±25%  
600±25%  
1000±25%  
1800±25%  
2
1.5  
Operating Temperature : -55°C to +125°C  
Storage Temperature : -55°C to +125°C  
(*1)  
Standard Testing Conditions  
Unless otherwise specified   
Temperature : Ordinary Temp. (15 °C to 35 °C )  
In case of doubt   
Temperature : 20°C±2 °C  
Humidity : Ordinary Humidity (25%(RH) to 85%(RH))  
Humidity : 60%(RH) to 70%(RH)  
Atmospheric pressure : 86kPa to 106kPa  
4.Style and Dimensions  
1.0±0.05  
0.5±0.05  
Equivalent Circuit  
0.25±0.1  
Resistance element becomes  
dominant at high frequencies.  
(
)
: Electrode  
(in mm)  
Unit Weight (Typical value)  
0.001g  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
P2/8  
5.Marking  
No marking.  
6.Specifications  
6-1.Electrical Performance  
No.  
Item  
Specification  
Meet item 3.  
Test Method  
6-1-1 Impedance  
Measuring Frequency : 100MHz±1MHz  
Measuring Equipment : KEYSIGHT4291A or the equivalent  
Test Fixture : KEYSIGHT16192A or the equivalent  
Measuring Equipment : Digital multi meter  
6-1-2 DC Resistance  
Meet item 3.  
*Except resistance of the Substrate and Wire  
6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)  
AEC-Q200 Rev.D issued June. 1 2010  
AEC-Q200  
Murata Specification / Deviation  
No.  
Stress  
Test Method  
3
High  
Temperature  
Exposure  
1000hours at 125 deg C  
Set for 24hours  
at room temperature,  
then measured.  
Meet Table A after testing.  
Table A  
Appearance No damage  
Impedance  
Change  
Within ±30%  
(at 100MHz)  
DC  
Resistance  
Meet item 3.  
4
Temperature Cycling 1000cycles  
-55 deg C to +125 deg C  
Meet Table A after testing.  
Set for 24hours  
at room temperature,  
then measured.  
5
7
Destructive  
Physical Analysis  
Per EIA469  
No electrical tests  
No defects  
Biased Humidity  
1000hours at 85 deg C, 85%RH Meet Table A after testing.  
Apply max rated current.  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
AEC-Q200  
P3/8  
Murata Specification / Deviation  
No.  
Stress  
Test Method  
Meet Table A after testing.  
If the rated current of parts exceed 1A,  
the operating temperature should be 85 deg C.  
8
Operational Life  
Apply 125 deg C 1000hours  
Set for 24hours at  
room temperature,  
then measured  
9
External Visual  
Visual inspection  
No abnormalities  
No defects  
10 Physical Dimension Meet ITEM 4  
Style and Dimensions)  
12 Resistance  
to Solvents  
Per MIL-STD-202 Method 215 Not Applicable  
13 Mechanical Shock  
Per MIL-STD-202 Method 213 Meet Table A after testing.  
Condition F:  
1500g's(14.7N)/0.5ms/Half sine  
14 Vibration  
5g's(0.049N) for 20 minutes Meet Table A after testing.  
12cycles each of 3 oritentations  
Test from 10-2000Hz.  
15 Resistance  
Solder temperature  
260C+/-5 deg C  
Pre-heating: 150C +/-10 deg C, 60s to 90s  
to Soldering Heat  
Immersion time 10s  
Meet Table A after testing.  
17 ESD  
Per AEC-Q200-002  
ESD Rank: Meet Item 3 (Rating)  
BLM15AG sereis: Meet Table A after testing.  
BLM15BB/BD series: Meet Table B after testing.  
Table B  
Appearance No damage  
Impedance  
Change  
Within ±40%  
(at 100MHz)  
DC  
Resistance  
Meet item 3.  
18 Solderability  
Per J-STD-002  
Measured : Impedance  
Per UL-94  
Method b : Not Applicable  
95% of the terminations is to be soldered.  
19 Electrical  
No defects  
Characterization  
20 Flammability  
21 Board Flex  
Not Applicable  
Epoxy-PCB(1.6mm)  
Meet Table A after testing.  
Deflection 2mm(min)  
60s minimum holding time  
22 Terminal Strength  
Per AEC-Q200-006  
Per ISO-7637-2  
Murata deviation request: 5N  
No defects  
30 Electrical  
Transient  
Not Applicable  
Conduction  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
P4/8  
7.Specification of Packaging  
7-1.Appearance and Dimensions (8mm-wide paper tape)  
2.0±0.05  
4.0±0.1  
2.0±0.05  
1.5+0.1  
-0  
0.8max.  
0.65(Typ.)  
(in mm)  
Direction of Feed  
(1) Taping  
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed  
by top tape and bottom tape.  
(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.  
(3) Spliced point:The base tape and top tape have no spliced point  
(4) Cavity:There shall not be burr in the cavity.  
(5) Missing components number  
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not  
continuous. The specified quantity per reel is kept..  
7-2.Tape Strength  
(1)Pull Strength  
Top tape  
5N min.  
Top tape  
Bottom tape  
165 to 180 degree  
F
(2)Peeling off force of Cover tape  
0.1N to 0.6N (Minimum value is typical.)  
*Speed of Peeling off:300mm/min  
Bottom tape  
Base tape  
7-3.Taping Condition  
(1)Standard quantity per reel  
Quantity per 180mm reel  
10000 pcs. / reel  
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.  
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape  
for more than 5 pitch.  
(4)Marking for reel  
The following items shall be marked on a label and the label is stuck on the reel.  
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2) , Quantity, etc)  
1) « Expression of Inspection No. »  
□□ OOOO   
(1)  
(2)  
(3)  
(1) Factory Code  
(2) Date  
First digit  
: Year / Last digit of year  
Second digit  
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D  
Third, Fourth digit : Day  
(3) Serial No.  
2) « Expression of RoHS marking »  
ROHS – Y ()  
(1) (2)  
(1) RoHS regulation conformity parts.  
(2) MURATA classification number  
(5)Outside package  
These reels shall be packed in the corrugated cardboard package and the following items shall be marked  
on a label and the label is stuck on the box.  
(Customer name, Purchasing order number, Customer part number, MURATA part number,  
RoHS marking(2) ,Quantity, etc)  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
P5/8  
(6)Dimensions of reel and taping(leader-tape, trailer-tape)  
Trailer  
Leader  
160 min.  
2.0±0.5  
Label  
190 min.  
210 min.  
Top tape  
Empty tape  
13.0±0.2  
60+1  
-
0
Direction of feed  
21.0±0.8  
+1  
-0  
9.0  
13.0±1.4  
+0  
180  
-3  
(in mm)  
7-4. Specification of Outer Case  
Outer Case Dimensions  
(mm)  
Label  
Standard Reel Quantity in Outer Case  
(Reel)  
H
W
D
H
186  
186  
93  
5
D
Above Outer Case size is typical. It is depend on a quantity of an  
W
order.  
8. Caution  
8-1.Rating  
Do not use products beyond the Operating Temperature Range and Rated Current.  
8-2.Surge current  
Excessive surge current (pulse current or rush current) than specified rated current applied to the  
product may cause a critical failure, such as an open circuit, burnout caused by excessive  
temperature rise.  
Please contact us in advance in case of applying the surge current.  
8-3.Fail Safe  
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage  
that may be caused by the abnormal function or the failure of our products.  
8-4.Limitation of Applications  
Please contact us before using our products for the applications listed below which require especially high  
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.  
(1)Aircraft equipment  
(6)Disaster prevention / crime prevention equipment  
(7)Traffic signal equipment  
(8)Transportation equipment (trains, ships, etc.)  
(9) Data-processing equipment  
(2)Aerospace equipment  
(3)Undersea equipment  
(4)Power plant control equipment  
(5)Medical equipment  
(10)Applications of similar complexity and /or reliability  
requirements to the applications listed in the above  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
P6/8  
9. Notice  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
9-1.Land pattern designing  
Standard land dimensions (Reflow soldering)  
Chip Ferrite Bead  
0.5  
Solder Resist  
0.4  
Pattern  
1.2 to 1.4  
(in mm)  
9-2.Soldering Conditions  
Products can be applied to reflow soldering.  
(1) Flux,Solder  
Flux  
Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )  
Do not use water-soluble flux.  
Solder  
Use Sn-3.0Ag-0.5Cu solder  
Standard thickness of solder paste : 100 µm to 200 m  
(2) Soldering conditions  
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited  
to 150max. Also cooling into solvent after soldering should be in such a way that the temperature difference  
is limited to 100max.  
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting  
in the deterioration of product quality.  
(3) Soldering profile  
Temp.  
(℃)  
260℃  
230℃  
Limit Profile  
245℃±3℃  
220℃  
180  
150  
Standard Profile  
30s~60s  
60s max.  
90s±30s  
Time.(s)  
Standard Profile  
150180°C 90s±30s  
above 220°C30s60s  
245±3°C  
Limit Profile  
Pre-heating  
Heating  
above 230°C60s max.  
260°C,10s  
Peak temperature  
Cycle of reflow  
2 times  
2 times  
9-3. Soldering iron  
Pre-heating: 150°C, 1 min  
Tip temperature: 350°C max.  
Soldering iron output: 80W max.  
Tip diameter:φ3mm max.  
Soldering time : 3(+1,-0) seconds. Times : 2times max.  
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack  
on the ferrite material due to the thermal shock.  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
9-4.Solder Volume  
P7/8  
Solder shall be used not to be exceeded as shown below.  
Upper Limit  
Recommendable  
t
1/3TtT  
(T:Chip thickness)  
Accordingly increasing the solder volume, the mechanical stress to product is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
9-5.Attention regarding P.C.B. bending  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.  
<Products direction>  
a
Products shall be located in the sideways  
b
direction (Length:ab) to the mechanical  
stress.  
Poor example  
Good example  
(2) Components location on P.C.B. separation.  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures as  
possible to reduce stress.  
Contents of Measures  
Stress Level  
(1) Turn the mounting direction of the component parallel to the board separation surface.  
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from the board separation surface.  
A
A
A
>
>
>
D *1  
B
C
C
Perforation  
B
D
A
Slit  
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.  
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.  
(3) Mounting Components Near Screw Holes  
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs  
during the tightening of the screw. Mount the component in a position as far away from the screw holes as  
possible.  
Recommended  
Screw Hole  
9-6.Mounting density  
Add special attention to radiating heat of products when mounting the inductor near the products with heating.  
The excessive heat by other products may cause deterioration at joint of this product with substrate.  
MURATA MFG.CO.,LTD.  
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
9-7. Operating Environment  
P8/8  
Do not use this product under the following environmental conditions, on deterioration of the Insulation  
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.  
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and  
etc.  
(the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)  
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.  
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.  
9-8. Resin coating  
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of  
resin to be used for coating / molding products. So please pay your careful attention when you select resin.  
In prior to use, please make the reliability evaluation with the product mounted in your application set.  
9-9.Cleaning Conditions  
Products shall be cleaned on the following conditions.  
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)  
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon  
at the mounted products and P.C.B.  
Power:20W/max. Frequency:28kHz to 40kHz Time:5 min max.  
(3)Cleaner  
1.Alternative cleaner  
Isopropyl alcohol (IPA)  
2.Aqueous agent  
PINE ALPHA ST-100S  
(4)There shall be no residual flux and residual cleaner after cleaning.  
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water  
in order to remove the cleaner.  
(5)Other cleaning  
Please contact us.  
9-10. Handling of a substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to  
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening  
screw to the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
9-11.Storage Conditions  
(1)Storage period  
Use the products within 6 months after delivered.  
Solderability should be checked if this period is exceeded.  
(2)Storage conditions  
Products should be stored in the warehouse on the following conditions.  
Temperature : -10°C to 40°C  
Humidity  
: 15% to 85% relative humidity  
No rapid change on temperature and humidity  
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization  
of electrode, resulting in poor solderability.  
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.  
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.  
Products should be stored under the airtight packaged condition.  
(3)Delivery  
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.  
10 .  
!
Note  
(1)Please make sure that your product has been evaluated in view of your specifications with our product being  
mounted to your product.  
(2)You are requested not to use our product deviating from the agreed specifications.  
(3)The contents of this reference specification are subject to change without advance notice. Please approve  
our product specifications or transact the approval sheet for product specifications before ordering.  
MURATA MFG.CO.,LTD.  
配单直通车
BLM15AG221SH1D产品参数
型号:BLM15AG221SH1D
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
包装说明:0402
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8504.50.80.00
Factory Lead Time:6 weeks
风险等级:0.94
外壳代码:0402
构造:Chip Bead
最大直流电阻:0.35 Ω
滤波器类型:FERRITE CHIP
最大频率:100 MHz
最小频率:100 MHz
高度:0.5 mm
JESD-609代码:e3
长度:1 mm
材料:Ferrite
安装类型:SURFACE MOUNT
功能数量:1
最高工作温度:125 °C
最低工作温度:-55 °C
输出阻抗:220 OHM Ω
包装方法:TAPE
物理尺寸:L1.0XB0.5XH0.5 (mm)/L0.039XB0.02XH0.02 (inch)
额定电流:0.3 A
子类别:Other Filters
端子面层:Tin (Sn)
宽度:0.5 mm
Base Number Matches:1
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