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产品型号BLP05H6700XRGY的Datasheet PDF文件预览

BLP05H6700XR;  
BLP05H6700XRG  
Power LDMOS transistor  
Rev. 2 — 13 September 2018  
Product data sheet  
1. Product profile  
1.1 General description  
A 700 W extra rugged LDMOS power transistor optimized for broadcast, industrial,  
aerospace and defense applications in the HF to 600 MHz band.  
Table 1.  
Application information  
Test signal  
f
VDS  
(V)  
50  
PL  
Gp  
ηD  
(MHz)  
108  
(W)  
700  
(dB)  
26  
(%)  
75  
pulsed RF  
1.2 Features and benefits  
Easy power control  
Integrated dual sided ESD protection enables class C operation and complete switch  
off of the transistor  
Excellent ruggedness VSWR 65 : 1  
High efficiency  
Excellent thermal stability  
Designed for broadband operation (HF to 600 MHz)  
50 V operation for easy broadband matching  
Package available in both straight leads and gull wing form  
For RoHS compliance see the product details on the Ampleon website  
1.3 Applications  
Industrial, scientific and medical applications  
Broadcast transmitter applications  
Aerospace and defense applications  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
2. Pinning information  
Table 2.  
Pin  
Pinning  
Description  
Simplified outline  
Graphic symbol  
BLP05H6700XR (SOT1138-3)  
1
2
3
4
5
gate 2  
gate 1  
drain 1  
drain 2  
source  
4
4
1
3
2
1
2
5
[1]  
3
aaa-003574  
BLP05H6700XRG (SOT1204-3)  
1
2
3
4
5
gate 2  
gate 1  
drain 1  
drain 2  
source  
4
4
1
3
2
1
2
5
[1]  
3
aaa-003574  
[1] Connected to flange.  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
BLP05H6700XR  
-
-
plastic, heatsink small outline package; 4 leads (flat) SOT1138-3  
plastic, heatsink small outline package; 4 leads SOT1204-3  
BLP05H6700XRG  
4. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDS  
Parameter  
Conditions  
Min  
Max  
135  
+11  
Unit  
V
drain-source voltage  
gate-source voltage  
storage temperature  
case temperature  
junction temperature  
-
VGS  
6  
V
Tstg  
65  
+150 C  
Tcase  
Tj  
-
-
150  
225  
C  
C  
[1]  
[1] Continuous use at maximum temperature will affect the reliability, for details refer to the online MTF  
calculator.  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
2 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
5. Thermal characteristics  
Table 5.  
Symbol Parameter  
Rth(j-case) thermal resistance from junction to case Tj = 150 C  
Thermal characteristics  
Conditions  
Typ  
Unit  
[1][2]  
[3]  
0.21 K/W  
0.064 K/W  
Zth(j-case) transient thermal impedance from  
junction to case  
Tj = 150 C; tp = 100 s;  
= 20 %  
[1] Tj is the junction temperature.  
[2]  
Rth(j-c) is measured under RF conditions.  
[3] see Figure 1.  
amp00265  
0.25  
Z
th(j-c)  
(K/W)  
0.2  
(7)  
(6)  
(5)  
(4)  
(3)  
(2)  
(1)  
0.15  
0.1  
0.05  
0
-7  
-6  
-5  
-4  
-3  
-2  
-1  
t
10  
10  
10  
10  
10  
10  
10  
1
(s)  
p
(1) = 1 %  
(2) = 2 %  
(3) = 5 %  
(4) = 10 %  
(5) = 20 %  
(6) = 50 %  
(7) = 100 % (DC)  
Fig 1. Transient thermal impedance from junction to case as a function of pulse  
duration  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
3 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
6. Characteristics  
Table 6.  
DC characteristics  
Tj = 25 °C per section; unless otherwise specified.  
Symbol Parameter Conditions  
V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 2.75 mA 135  
Min  
Typ  
Max Unit  
-
-
V
VGS(th)  
VGSq  
IDSS  
gate-source threshold voltage  
gate-source quiescent voltage  
drain leakage current  
VDS = 10 V; ID = 275 mA 1.33 1.9  
2.33  
V
VDS = 50 V; ID = 50 mA  
VGS = 0 V; VDS = 50 V  
VGS = VGS(th) + 3.75 V;  
-
-
-
2.1  
-
-
V
1.4  
-
A  
A
IDSX  
drain cut-off current  
36  
VDS = 10 V  
IGSS  
gate leakage current  
VGS = 11 V; VDS = 0 V  
-
-
-
140  
-
nA  
RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V;  
ID = 9.625 A  
0.16  
Table 7.  
AC characteristics  
Tj = 25 °C per section; unless otherwise specified.  
Symbol Parameter Conditions  
feedback capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz  
Min Typ  
Max Unit  
Crs  
-
-
-
2.75  
297  
104  
-
-
-
pF  
pF  
pF  
Ciss  
Coss  
input capacitance  
output capacitance  
VGS = 0 V; VDS = 50 V; f = 1 MHz  
VGS = 0 V; VDS = 50 V; f = 1 MHz  
Table 8.  
RF characteristics  
Test signal: pulsed RF; tp = 100 μs; δ = 20 %; f = 108 MHz; RF performance at VDS = 50 ;  
Dq = 100 mA; Tcase = 25 °C; unless otherwise specified; in a class-AB production test circuit.  
I
Symbol  
Parameter  
Conditions  
PL = 700 W  
PL = 700 W  
PL = 700 W  
Min  
25  
-
Typ  
26  
Max  
Unit  
Gp  
power gain  
-
-
-
dB  
dB  
%
RLin  
D  
input return loss  
drain efficiency  
13  
75  
72  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
4 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
amp00266  
600  
C
oss  
(pF)  
500  
400  
300  
200  
100  
0
0
10  
20  
30  
40  
50  
60  
V
(V)  
DS  
VGS = 0 V; f = 1 MHz.  
Fig 2. Output capacitance as a function of drain-source voltage; typical values per  
section  
7. Test information  
7.1 Ruggedness in class-AB operation  
The BLP05H6700XR and the BLP05H6700XRG are capable of withstanding a load  
mismatch corresponding to VSWR > 65 : 1 through all phases under the following  
conditions: VDS = 50 V; IDq = 100 mA; PL = 700 W pulsed; f = 108 MHz.  
7.2 Impedance information  
drain 1  
gate 1  
Z
Z
L
i
gate 2  
drain 2  
001aan207  
Fig 3. Definition of transistor impedance  
Table 9.  
Typical push-pull impedance  
Simulated Zi and ZL device impedance; impedance info at VDS = 50 V and PL = 700 W.  
f
Zi  
ZL  
(MHz)  
108  
(Ω)  
(Ω)  
5.9 j19.1  
5.5 + j1.1  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
5 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
7.3 Test circuit  
200 mm  
C23  
-
+
L3  
R5  
R3  
L1  
T2  
C6  
C8  
C10  
C12  
R1  
C14  
C17  
C2  
C4  
C3  
C20  
C21  
C5  
C1  
C16  
80 mm  
C18  
C19  
C22  
C15  
R2  
C9  
C7  
C13  
R6  
L2  
C11  
T1  
R4  
L4  
17 mm  
22 mm  
-
+
C24  
amp00267  
Printed-Circuit Board (PCB): Taconic RF-35; r = 3.5 F/m; thickness = 0.765 mm; thickness copper plating = 35 m.  
See Table 10 for a list of components.  
Fig 4. Component layout for class-AB production test circuit  
Table 10. List of components  
For test circuit see Figure 4.  
Component Description  
Value  
Remarks  
ATC 100B  
ATC 100B  
ATC 100B  
ATC 100B  
[1]  
[1]  
[1]  
[1]  
C1  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
multilayer ceramic chip capacitor  
510 pF  
62 pF  
C2, C3  
C4  
20 pF  
C5  
160 pF  
4.7 F, 100 V  
820 pF  
820pF  
C6, C7  
C8, C9  
C10, C11  
C12, C13  
C14, C15  
C16  
[1]  
[1]  
ATC 100B  
ATC 100B  
4.7 F, 100 V  
91 pF  
[1]  
[1]  
[1]  
[1]  
[1]  
ATC 100B  
ATC 100B  
ATC 100B  
ATC 100B  
ATC 100B  
36 pF  
C17  
22 pF  
C18, C19  
C20, C21  
47 pF  
120 pF  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
6 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
Table 10. List of components …continued  
For test circuit see Figure 4.  
Component Description  
Value  
Remarks  
[1]  
C22  
multilayer ceramic chip capacitor  
220 pF  
ATC 100B  
C23, C24  
L1, L2  
L3, L4  
R1, R2  
R3, R4  
R5, R6  
T1, T2  
electrolytic capacitor  
air inductor  
2200 F, 64 V  
10 turns, d = 2 mm  
6 turns, d = 2 mm  
4.7 k  
0.5 mm copper wire  
0.5 mm copper wire  
SMD 1206  
air inductor  
resistor  
shunt resistor  
metal film resistor  
semi rigid coax  
0.01   
FC4L110R010FER  
10 , 0.6 W  
50 , 160 mm  
EZ 86-TP/M17  
[1] American Technical Ceramics type 100B or capacitor of same quality.  
7.4 Graphical data  
amp0026  
amp00268  
63  
28  
26  
24  
22  
20  
80  
60  
40  
20  
0
PP  
L
G
η
D
(%)  
p
(dBm)  
(dB)  
Iddeeaall PP  
L
61  
(2)  
(1)  
59  
57  
55  
G
p
PP  
L
η
D
0
100 200 300 400 500 600 700 800  
(W)  
28  
29  
30  
31  
32  
33  
34  
35  
P
P (dBm)  
L
i
VDS = 50 V; IDq = 100 mA; f = 108 MHz; tp = 100 s;  
= 20 %.  
VDS = 50 V; IDq = 100 mA; f = 108 MHz; tp = 100 s;  
= 20 %.  
(1) PL(1dB) = 58.4 dBm (692 W)  
(2) PL(3dB) = 58.8 dBm (765 W)  
Fig 5. Power gain and drain efficiency as function of  
output power; typical values  
Fig 6. Output power as a function of input power;  
typical values  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
7 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
amp00270  
amp00271  
30  
28  
26  
24  
22  
20  
80  
60  
40  
20  
0
G
η
D
(%)  
p
(dB)  
(1)  
(2)  
(3)  
(4)  
(1)  
(2)  
(3)  
(4)  
0
100 200 300 400 500 600 700 800  
(W)  
0
100 200 300 400 500 600 700 800  
P
P (W)  
L
L
VDS = 50 V; f = 108 MHz; tp = 100 s; = 20 %.  
VDS = 50 V; f = 108MHz; tp = 100 s; = 20 %.  
(1) IDq = 50 mA  
(2) IDq = 100 mA  
(3) IDq = 200 mA  
(4) IDq = 400 mA  
(1) IDq = 50 mA  
(2) IDq = 100 mA  
(3) IDq = 200 mA  
(4) IDq = 400 mA  
Fig 7. Power gain as a function of output power;  
typical values  
Fig 8. Drain efficiency as a function of output power;  
typical values  
amp00272  
amp00273  
(6)  
30  
80  
(2)  
(3)  
(5)  
(4)  
(1)  
G
η
D
(%)  
p
(dB)  
28  
26  
24  
22  
20  
60  
40  
20  
0
(6)  
(5)  
(4)  
(3)  
(2)  
(1)  
0
100 200 300 400 500 600 700 800  
(W)  
0
100 200 300 400 500 600 700 800  
(W)  
P
P
L
L
IDq = 100 mA; f = 108 MHz; tp = 100 s; = 20 %.  
IDq = 100 mA; f = 108 MHz; tp = 100 s; = 20 %.  
(1) VDS = 25 V  
(2) VDS = 30 V  
(3) VDS = 35 V  
(4) VDS = 40 V  
(5) VDS = 45 V  
(6) VDS = 50 V  
(1) VDS = 25 V  
(2) VDS = 30 V  
(3) VDS = 35 V  
(4) VDS = 40 V  
(5) VDS = 45 V  
(6) VDS = 50 V  
Fig 9. Power gain as a function of output power;  
typical values  
Fig 10. Drain efficiency as a function of output power;  
typical values  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
8 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
8. Package outline  
SOT1138-3  
(18.01)  
(15.44)  
(2.15)  
(0.75)  
E
0.10 (4)  
A
6.85  
3
4
0.05 A  
L
16.00  
P
2.00 0.1Z  
0.10  
R0.16 max.  
1
2
metal protrusion 4x  
1.57 (5)  
0.22 0.05  
(ground) in corners (2)  
0.25 B  
5.85(3)  
L
B
R1.00  
20.75(1)  
20.57  
0.05 B  
+0.08  
L
3.92  
-
0.03  
B
R0.32  
(0.20) molding compound rim  
around the perimeter of the heatsink  
pin 5 (6)  
R0.60 (4x)  
Min. 15.5  
Min. 18.5  
1
Tolerances unless otherwise stated:  
Angle:  
Revision:  
Revision date:  
Package outline drawing:  
SOT1138-3  
7/26/2018  
B
1°  
Dimension:  
B
0.05  
units in mm.  
Third angle projection  
Sheet 1 of 2  
Fig 11. Package outline SOT1138-3 (sheet 1 of 2)  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
9 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
SOT1138-3  
Drawing Notes  
Description  
Items  
(1)  
Dimensions are excluding mold protrusion. All areas located adjacent to the leads have a maximum mold protrusion of 0.25  
mm (per side) and max. 0.62 mm in length.  
At all other areas the mold protrusion is maximum 0.15 mm per side. See also detail B.  
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).  
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.  
The lead coplanarity over all leads is 0.1 mm maximum.  
(2)  
(3)  
(4)  
(5)  
(6)  
(7)  
Dimension is measured 0.5 mm from the edge of the top package body.  
The hatched area indicates the exposed metal heatsink.  
The leads and exposed heatsink are plated with matte Tin (Sn).  
location of metal protrusion (2)  
B
DETAIL A  
SCALE 25:1  
A
lead dambar  
location  
DETAIL  
B
SCALE 50:1  
1
Tolerances unless otherwise stated:  
Angle:  
Revision:  
Revision date:  
Package outline drawing:  
SOT1138-3  
7/26/2018  
B
1°  
Dimension:  
B
0.05  
units in mm.  
Third angle projection  
Sheet 2 of 2  
Fig 12. Package outline SOT1138-3 (sheet 2 of 2)  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
10 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
SOT1204-3  
(18.01)  
(15.44)  
(2.15)  
(0.75)  
6.85  
R1.38  
A
4
3
0.05 A  
L
16.00  
P
2.00 0.1  
Z
2
R0.16 max.  
1
metal protrusion 4x  
C
(ground) in corners (2)  
5.85 (3)  
0.25 B  
L
20.75(1)  
0.05 B  
L
+
-
0.08  
DETAIL  
C
3.92  
R1.00  
0.03  
SCALE 25:1  
R0.32  
H
B
20.57  
0.10  
(0.20) molding compound rim  
around the perimeter of the heatsink  
+
0.06  
0.02  
0.00  
(6)  
-
+
4°  
3°  
3.0°  
Gage plane  
0.35 (7)  
-
Seating plane  
R0.60(4x)  
pin 5 (4)  
Min. 15.5  
Min. 18.5  
1
Tolerances unless otherwise stated:  
Angle:  
Revision:  
Revision date:  
Package outline drawing:  
SOT1204-3  
7/26/2018  
B
1°  
Dimension:  
B
0.05  
units in mm.  
Third angle projection  
Sheet 1 of 2  
Fig 13. Package outline SOT1204-3 (sheet 1 of 2)  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
11 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
SOT1204-3  
Drawing Notes  
Description  
Items  
(1)  
Dimensions are excluding mold protrusion. All areas located adjacent to the leads have a maximum mold protrusion of 0.25  
mm (per side) and 0.62 mm max. in length.  
At other areas the mold protrusion is maximum 0.15 mm per side. See also detail B.  
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).  
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.  
The hatched area indicated the exposed heatsink.  
(2)  
(3)  
(4)  
(5)  
The leads and exposed heatsink are plated with matte Tin (Sn).  
Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the  
heatsink is higher than the bottom of the lead.  
(6)  
(7)  
Gage plane (foot length) to be measured from the seating plane.  
location of metal protrusion (2)  
B
DETAIL  
A
SCALE 25:1  
A
lead dambar  
location  
DETAIL  
B
SCALE 50:1  
1
Tolerances unless otherwise stated:  
Angle:  
Revision:  
Revision date:  
Package outline drawing:  
SOT1204-3  
7/26/2018  
B
1°  
Dimension:  
B
0.05  
units in mm.  
Third angle projection  
Sheet 2 of 2  
Fig 14. Package outline SOT1204-3 (sheet 2 of 2)  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
12 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
9. Handling information  
CAUTION  
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling  
electrostatic sensitive devices.  
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or  
equivalent standards.  
Table 11. ESD sensitivity  
ESD model  
Class  
C2A [1]  
2 [2]  
Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002  
Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001  
[1] CDM classification C2A is granted to any part that passes after exposure to an ESD pulse of 500 V.  
[2] HBM classification 2 is granted to any part that passes after exposure to an ESD pulse of 2000 V.  
10. Abbreviations  
Table 12. Abbreviations  
Acronym  
ESD  
Description  
ElectroStatic Discharge  
HF  
High Frequency  
LDMOS  
MTF  
Laterally Diffused Metal-Oxide Semiconductor  
Median Time to Failure  
SMD  
Surface Mounted Device  
RoHS  
VSWR  
Restriction of Hazardous Substances  
Voltage Standing Wave Ratio  
11. Revision history  
Table 13. Revision history  
Document ID  
Release date Data sheet status  
Change notice Supersedes  
- BLP05H6700XR_H6700XRG v.1  
BLP05H6700XR_H6700XRG 20180913  
v.2  
Product data sheet  
Modifications  
Table 2 on page 2: package outline versions changed to SOT1138-3 and SOT1204-3  
Table 3 on page 2: package outline versions changed to SOT1138-3 and SOT1204-3  
Figure 4 on page 6: figure updated  
Section 8 on page 9: package outline versions changed from SOT1138-2 and  
SOT1204-2 to SOT1138-3 and SOT1204-3  
BLP05H6700XR_H6700XRG 20170217  
v.1  
Product data sheet  
-
-
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
13 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
12. Legal information  
12.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.ampleon.com.  
Ampleon product can reasonably be expected to result in personal injury,  
12.2 Definitions  
death or severe property or environmental damage. Ampleon and its  
suppliers accept no liability for inclusion and/or use of Ampleon products in  
such equipment or applications and therefore such inclusion and/or use is at  
the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. Ampleon does not give any representations or  
warranties as to the accuracy or completeness of information included herein  
and shall have no liability for the consequences of use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. Ampleon makes no representation  
or warranty that such applications will be suitable for the specified use without  
further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local Ampleon sales office. In  
case of any inconsistency or conflict with the short data sheet, the full data  
sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using Ampleon products, and Ampleon accepts no liability for  
any assistance with applications or customer product design. It is customer’s  
sole responsibility to determine whether the Ampleon product is suitable and  
fit for the customer’s applications and products planned, as well as for the  
planned application and use of customer’s third party customer(s). Customers  
should provide appropriate design and operating safeguards to minimize the  
risks associated with their applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
Ampleon and its customer, unless Ampleon and customer have explicitly  
agreed otherwise in writing. In no event however, shall an agreement be valid  
in which the Ampleon product is deemed to offer functions and qualities  
beyond those described in the Product data sheet.  
Ampleon does not accept any liability related to any default, damage, costs or  
problem which is based on any weakness or default in the customer’s  
applications or products, or the application or use by customer’s third party  
customer(s). Customer is responsible for doing all necessary testing for the  
customer’s applications and products using Ampleon products in order to  
avoid a default of the applications and the products or of the application or  
use by customer’s third party customer(s). Ampleon does not accept any  
liability in this respect.  
12.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, Ampleon does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. Ampleon takes no responsibility for  
the content in this document if provided by an information source outside of  
Ampleon.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall Ampleon be liable for any indirect, incidental, punitive,  
special or consequential damages (including - without limitation - lost profits,  
lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — Ampleon products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written  
individual agreement. In case an individual agreement is concluded only the  
terms and conditions of the respective agreement shall apply. Ampleon  
hereby expressly objects to applying the customer’s general terms and  
conditions with regard to the purchase of Ampleon products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, Ampleon’s aggregate and cumulative liability towards customer  
for the products described herein shall be limited in accordance with the  
Terms and conditions of commercial sale of Ampleon.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Right to make changes — Ampleon reserves the right to make changes to  
information published in this document, including without limitation  
specifications and product descriptions, at any time and without notice. This  
document supersedes and replaces all information supplied prior to the  
publication hereof.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Suitability for use — Ampleon products are not designed, authorized or  
warranted to be suitable for use in life support, life-critical or safety-critical  
systems or equipment, nor in applications where failure or malfunction of an  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
14 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
Non-automotive qualified products — Unless this data sheet expressly  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
states that this specific Ampleon product is automotive qualified, the product  
is not suitable for automotive use. It is neither qualified nor tested in  
accordance with automotive testing or application requirements. Ampleon  
accepts no liability for inclusion and/or use of non-automotive qualified  
products in automotive equipment or applications.  
12.4 Trademarks  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without Ampleon’ warranty of the product for such  
automotive applications, use and specifications, and (b) whenever customer  
uses the product for automotive applications beyond Ampleon’ specifications  
such use shall be solely at customer’s own risk, and (c) customer fully  
indemnifies Ampleon for any liability, damages or failed product claims  
resulting from customer design and use of the product for automotive  
applications beyond Ampleon’ standard warranty and Ampleon’ product  
specifications.  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Any reference or use of any ‘NXP’ trademark in this document or in or on the  
surface of Ampleon products does not result in any claim, liability or  
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of  
the NXP group of companies and any reference to or use of the ‘NXP’  
trademarks will be replaced by reference to or use of Ampleon’s own  
trademarks.  
13. Contact information  
For more information, please visit: http://www.ampleon.com  
For sales office addresses, please visit: http://www.ampleon.com/sales  
BLP05H6700XR_H6700XRG  
All information provided in this document is subject to legal disclaimers.  
© Ampleon Netherlands B.V. 2018. All rights reserved.  
Product data sheet  
Rev. 2 — 13 September 2018  
15 of 16  
BLP05H6700XR; BLP05H6700XRG  
Power LDMOS transistor  
14. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
2
3
4
5
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5  
Ruggedness in class-AB operation. . . . . . . . . . 5  
Impedance information . . . . . . . . . . . . . . . . . . . 5  
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 7  
7.1  
7.2  
7.3  
7.4  
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Handling information. . . . . . . . . . . . . . . . . . . . 13  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13  
9
10  
11  
12  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
12.1  
12.2  
12.3  
12.4  
13  
14  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© Ampleon Netherlands B.V. 2018.  
All rights reserved.  
For more information, please visit: http://www.ampleon.com  
For sales office addresses, please visit: http://www.ampleon.com/sales  
Date of release: 13 September 2018  
Document identifier: BLP05H6700XR_H6700XRG  
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BLP05H675XR产品参数
型号:BLP05H675XR
生命周期:Transferred
包装说明:,
Reach Compliance Code:unknown
风险等级:5.75
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