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产品型号BQ24071RHLRG4的概述

BQ24071RHLRG4芯片概述 BQ24071RHLRG4是德州仪器(Texas Instruments)出品的一款高性能锂离子电池充电管理芯片,专为移动设备的电源管理设计。其主要集成了多种功能,如电池充电、充电显示指示、输入电流限制以及多种保护机制等,旨在提供高效、安全的电池充电解决方案。 该芯片支持高达1A的充电电流,并能够通过外部电阻设置充电电压,以适应不同电池类型的需要。BQ24071RHLRG4内置了多种保护功能,如过充、过流保护及温度保护等,以确保电池在各种情况下的安全性。其设计目标主要聚焦于避免电池过热、延长电池寿命以及提高充电效率,使其成为便携式设备和无线产品的理想选择。 BQ24071RHLRG4的详细参数 1. 电气参数 - 输入电压范围:4.5V 至 16V - 充电电流:高达 1A - 充电电压:可调至4.2V - 静态电流:最大20μA - 温度范围:-...

产品型号BQ24071RHLRG4的Datasheet PDF文件预览

bq24070  
bq24071  
www.ti.com  
SLUS694F MARCH 2006REVISED DECEMBER 2009  
SINGLE-CHIP LI-ION CHARGE AND SYSTEM POWER-PATH MANAGEMENT IC  
Check for Samples: bq24070, bq24071  
1
FEATURES  
DESCRIPTION  
Small 3,5 mm × 4,5 mm QFN Package  
Designed for Single-Cell Li-Ion- or  
Li-Polymer-Based Portable Applications  
The bq24070 and bq24071 are highly integrated  
Li-ion linear charger and system power-path  
management devices targeted at space-limited  
portable applications. The bq24070/1 offer DC supply  
(AC adapter) power-path management with  
autonomous power-source selection, power FETs  
and current sensors, high-accuracy current and  
voltage regulation, charge status, and charge  
termination, in a single monolithic device.  
Integrated Dynamic Power-Path Management  
(DPPM) Feature Allowing the AC Adapter to  
Simultaneously Power the System and Charge  
the Battery  
Power Supplement Mode Allows Battery to  
Supplement the AC Input Current  
Autonomous Power Source Selection (AC  
Adapter or BAT)  
The  
bq24070/1  
power  
the  
system  
while  
independently charging the battery. This feature  
reduces the charge and discharge cycles on the  
battery, allows for proper charge termination and  
allows the system to run with an absent or defective  
battery pack. This feature also allows for the system  
to instantaneously turn on from an external power  
source in the case of a deeply discharged battery  
pack. The IC design is focused on supplying  
continuous power to the system when available from  
the AC adapter or battery sources.  
Supports Up to 2 Amps Total Current  
Thermal Regulation for Charge Control  
Charge Status Outputs for LED or System  
Interface Indicates Charge and Fault  
Conditions  
Reverse Current, Short-Circuit, and Thermal  
Protection  
Power Good Status Outputs  
4.4-V and 6-V Options for System Output  
Regulation Voltage  
APPLICATIONS  
Smart Phones and PDA  
MP3 Players  
Digital Cameras and Handheld Devices  
Internet Appliances  
POWER FLOW DIAGRAM  
AC Adapter  
VDC  
(2)  
IN  
OUT  
System  
GND  
Q1  
PACK+  
BAT  
40 mΩ  
+
PACK−  
Q2  
bq24070/1  
UDG−04082  
(1) See Figure 2 and functional block diagram for more detailed feature information.  
(2) P-FET back gate body diodes are disconnected to prevent body diode conduction.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2009, Texas Instruments Incorporated  
bq24070  
bq24071  
SLUS694F MARCH 2006REVISED DECEMBER 2009  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
DESCRIPTION (CONTINUED)  
The MODE pin selects the priority of the input sources. If an input source is not available, then the battery is  
selected as the source. With the MODE pin high, the bq24070/1 attempts to charge from the input at the charge  
rate set by ISET1 pin. With the MODE pin low, the bq24070/1 defaults to USB charging at the charge rate. This  
feature allows the use of a single connector (mini-USB cable), where the host programs the MODE pin according  
to the source that is connected (AC adaptor or USB port). Table 1 summarizes the MODE pin function.  
Table 1. Power Source Selection Function Summary  
MODE STATE  
AC  
ADAPTER  
MAXIMUM  
SYSTEM  
POWER  
SOURCE  
USB BOOT-UP  
FEATURE  
CHARGE RATE(1)  
Low  
Present  
Absent  
Present  
Absent  
ISET2  
N/A  
USB  
Battery  
AC  
Enabled  
Disabled  
Disabled  
Disabled  
High  
ISET1  
N/A  
Battery  
(1) Battery charge rate is always set by ISET1, but may be reduced by a limited input source (ISET2 USB mode) and IOUT system load.  
ORDERING INFORMATION(1)  
BATTERY  
VOLTAGE (V)  
PART  
PACKAGE  
MARKING  
TA  
OUT PIN  
STATUS  
NUMBER(2) (3)  
4.2  
4.2  
4.2  
4.2  
Regulated to 4.4 V(4)  
Regulated to 4.4 V(4)  
Regulated to 6 V  
bq24070RHLR  
bq24070RHLT  
bq24071RHLR  
bq24071RHLT  
Production  
Production  
Production  
Production  
BRQ  
BRQ  
BTR  
BTR  
–40°C to 125°C  
Regulated to 6 V  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) The RHL package is available in the following options:  
R - taped and reeled in quantities of 3,000 devices per reel.  
T - taped and reeled in quantities of 250 devices per reel.  
(3) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for  
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including  
bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(4) If AC < VO(OUT-REG), the AC is connected to the OUT pin by a P-FET, (Q1).  
2
Submit Documentation Feedback  
Copyright © 2006–2009, Texas Instruments Incorporated  
Product Folder Link(s): bq24070 bq24071  
 
bq24070  
bq24071  
www.ti.com  
SLUS694F MARCH 2006REVISED DECEMBER 2009  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
bq24070/1  
Input voltage  
Input voltage  
IN (DC voltage with respect to VSS)  
–0.3 V to 18 V  
BAT, CE, DPPM, PG, Mode, OUT, ISET1, ISET2, STAT1,  
STAT2, TS, (all DC voltages wrt VSS)  
–0.3 V to 7 V  
VREF (DC voltage wrt VSS)  
TMR  
–0.3 V to VO(OUT) + 0.3 V  
–0.3 V to VO + 0.3 V  
3.5 A  
Input current  
OUT  
BAT(2)  
4 A  
Output current  
–4 A to 3.5 A  
Output source current (in  
VREF  
30 mA  
regulation at 3.3 V VREF  
)
Output sink current  
PG, STAT1, STAT2,  
15 mA  
–65°C to 150°C  
–40°C to 150°C  
300°C  
Storage temperature range, Tstg  
Junction temperature range, TJ  
Lead temperature (soldering, 10 seconds)  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage  
values are with respect to the network ground terminal unless otherwise noted.  
(2) Negative current is defined as current flowing into the BAT pin.  
RECOMMENDED OPERATING CONDITIONS  
MIN  
MAX UNIT  
(1)  
VCC Supply voltage (VIN  
)
4.35  
16  
2
V
A
IAC  
TJ  
Input current  
Operating junction temperature range  
–40  
125  
°C  
(1) Verify that power dissipation and junction temperatures are within limits at maximum VCC  
.
DISSIPATION RATINGS  
T
A 40°C  
DERATING FACTOR  
PACKAGE  
θJA  
46.87 °C/W  
POWER RATING  
TA > 40°C  
20-pin RHL(1)  
1.81 W  
21 mW/°C  
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is  
connected to the ground plane by a 2×3 via matrix.  
Copyright © 2006–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): bq24070 bq24071  
bq24070  
bq24071  
SLUS694F MARCH 2006REVISED DECEMBER 2009  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
over junction temperature range (0°C TJ 125°C) and the recommended supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT BIAS CURRENTS  
ICC(SPLY)  
ICC(SLP)  
Active supply current, VCC  
VVCC > VVCC(min)  
1
2
2
5
mA  
VIN < V(BAT)  
2.6 V VI(BAT) VO(BAT-REG)  
Excludes load on OUT pin  
Sleep current (current into BAT  
pin)  
,
VI(AC) 6V, Total current into IN pin with  
ICC(IN-STDBY)  
Input standby current  
chip disabled, Excludes all loads, CE=LOW,  
after t(CE-HOLDOFF) delay  
200  
μA  
Total current into BAT pin with input present  
and chip disabled;  
ICC(BAT-STDBY)  
BAT standby current  
Excludes all loads, CE=LOW,  
after t(CE-HOLDOFF) delay,  
45  
1
65  
5
0°C TJ 85°C(1)  
IIB(BAT)  
Charge done current, BAT  
Charge DONE, input supplying the load  
OUT PIN-VOLTAGE REGULATION  
bq24070  
bq24071  
V
I(AC) 4.4 V + VDO  
I(AC) 6 V + VDO  
4.4  
6.0  
4.5  
6.3  
Output regulation  
voltage  
VO(OUT-REG)  
V
V
OUT PIN – DPPM REGULATION  
V(DPPM-SET)  
I(DPPM-SET)  
SF  
DPPM set point(2)  
DPPM current source  
DPPM scale factor  
VDPPM-SET < VOUT  
2.6  
95  
3.8  
105  
V
Input present  
100  
μA  
V(DPPM-REG) = V(DPPM-SET) × SF  
1.139  
1.150  
1.162  
OUT PIN – FET (Q1, Q2) DROP-OUT VOLTAGE RDS(on)  
)
V
I(AC) VCC(min), Mode = High,  
V(ACDO)  
AC to OUT dropout voltage(3)  
300  
40  
475  
100  
II(AC) = 1 A, (IO(OUT)+ IO(BAT)), or no input  
mV  
BAT to OUT dropout voltage  
(discharging)  
V(BATDO)  
VI (BAT) 3 V, II(BAT)= 1.0 A, VCC < VI(BAT)  
OUT PIN - BATTERY SUPPLEMENT MODE  
Enter battery supplement mode  
(battery supplements OUT current VI(BAT)> 2 V  
in the presence of input source  
VI(OUT)  
VI(BAT)  
– 60 mV  
VBSUP1  
V
VI(OUT)  
VI(BAT)  
– 20 mV  
VBSUP2  
Exit battery supplement mode  
VI(BAT)> 2 V  
OUT PIN - SHORT CIRCUIT  
Current source between BAT to OUT for  
IOSH1  
BAT to OUT short-circuit recovery short-circuit recovery to  
I(OUT) VI(BAT) –200 mV  
10  
mA  
V
RSHAC  
AC to OUT short-circuit limit  
VI(OUT) 1 V  
500  
BAT PIN CHARGING – PRECHARGE  
Precharge to fast-charge transition  
threshold  
V(LOWV)  
TDGL(F)  
IO(PRECHG)  
V(PRECHG)  
Voltage on BAT  
2.9  
3
3.1  
V
De-glitch time for fast-charge to  
precharge transition(4)  
tFALL = 100 ns, 10 mV overdrive,  
VI(BAT) decreasing below threshold  
22.5  
ms  
1 V < VI(BAT) < V(LOWV), t < t(PRECHG)  
IO(PRECHG) = (K(SET) × V(PRECHG))/ RSET  
,
Precharge range  
10  
150  
275  
mA  
mV  
Precharge set voltage  
1 V < VI(BAT) < V(LOWV), t < t(PRECHG)  
225  
250  
BAT PIN CHARGING - CURRENT REGULATION  
VI (BAT) > V(LOWV), Mode = High  
IOUT(BAT) = (K(SET) × V(SET) / RSET),  
VI(OUT) > VO(OUT-REG) + V(DO-MAX)  
(5)  
IO(BAT)  
RPBAT  
Battery charge current range  
BAT to OUT pullup  
100  
1000  
1000  
1500  
mA  
VI (BAT)< 1 V  
(1) This includes the quiescent current for the integrated LDO.  
(2) V(DPPM-SET) is scaled up by the scale factor for controlling the output voltage V(DPPM-REG)  
.
(3) VDO(max), dropout voltage is a function of the FET, RDS(on), and drain current. The dropout voltage increases proportionally to the  
increase in current.  
(4) All de-glitch periods are a function of the timer setting and is modified in DPPM or thermal regulation modes by the percentages that the  
program current is reduced.  
(5) When input current remains below 2 A, the battery charging current may be raised until the thermal regulation limits the charge current.  
4
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SLUS694F MARCH 2006REVISED DECEMBER 2009  
ELECTRICAL CHARACTERISTICS (continued)  
over junction temperature range (0°C TJ 125°C) and the recommended supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Voltage on ISET1, VVCC 4.35 V,  
Battery charge current set  
voltage(6)  
V(SET)  
VI(OUT)- VI(BAT) > V(DO-MAX)  
,
2.47  
2.50  
2.53  
V
VI(BAT) > V(LOWV)  
100 mA IO(BAT) 1.5 A  
10 mA IO(BAT) 100 mA(7)  
375  
300  
425  
450  
450  
600  
K(SET)  
Charge current set factor, BAT  
USB MODE INPUT CURRENT LIMIT  
I(USB) USB input port current range  
ISET2 = Low  
ISET2 = High  
80  
90  
100  
500  
mA  
V
400  
BAT PIN CHARGING VOLTAGE REGULATION, VO (BAT-REG) + V (DO-MAX) < VCC, ITERM < IBAT(OUT) 1 A  
Battery charge voltage  
4.2  
VO(BAT-REG)  
TA = 25°C  
–0.5%  
–1%  
0.5%  
1%  
Battery charge voltage regulation  
accuracy  
CHARGE TERMINATION DETECTION  
Charge termination detection  
range  
VI(BAT) > V(RCH),  
I(TERM)  
10  
150  
mA  
mV  
I(TERM) = (K(SET) × V(TERM))/ RSET  
VI(BAT) > V(RCH) , Mode = High  
VI(BAT) > V(RCH) , Mode = Low  
230  
95  
250  
100  
270  
130  
Charge termination set voltage,  
measured on ISET1  
V(TERM)  
tFALL = 100 ns, 10 mV overdrive,  
ICHG increasing above or decreasing below  
threshold  
De-glitch time for termination  
detection  
TDGL(TERM)  
22.5  
ms  
TEMPERATURE SENSE COMPARATORS  
VLTF  
VHTF  
ITS  
High voltage threshold  
Temp fault at V(TS) > VLTF  
Temp fault at V(TS) < VHTF  
2.465  
0.485  
94  
2.500  
0.500  
100  
2.535  
0.515  
106  
V
V
Low voltage threshold  
Temperature sense current source  
μA  
R(TMR) = 50 k, VI(BAT) increasing or  
decreasing above and below;  
100-ns fall time, 10-mv overdrive  
De-glitch time for temperature fault  
detection(8)  
TDGL(TF)  
22.5  
ms  
BATTERY RECHARGE THRESHOLD  
VO(BAT-  
REG)  
–0.075  
VO(BAT-REG)  
–0.100  
VO(BAT-REG)  
–0.125  
VRCH  
Recharge threshold voltage  
V
R(TMR) = 50 k, VI(BAT) increasing  
or decreasing below threshold,  
100-ns fall time, 10-mv overdrive  
De-glitch time for recharge  
detection(8)  
TDGL(RCH)  
22.5  
ms  
STAT1, STAT2, AND PG, OPEN DRAIN (OD) OUTPUTS(9)  
IOL = 5 mA, An external pullup  
resistor 1 K required.  
VOL  
Low-level output saturation voltage  
Input leakage current  
0.25  
5
V
ILKG  
1
μA  
ISET2, CE INPUTS  
VIL  
Low-level input voltage  
0
1.4  
–1  
0.4  
1
V
VIH  
High-level input voltage  
Low-level input current, CE  
High-level input current, CE  
Low-level input current, ISET2  
High-level input current, ISET2  
Holdoff time, CE  
IIL  
IIH  
μA  
IIL  
VISET2 = 0.4 V  
VISET2 = VCC  
–20  
3.3  
IIH  
40  
t(CE-HLDOFF)  
CE going low only  
6.2  
ms  
(6) For half-charge rate, V(SET) is 1.25 V ± 25 mV.  
(7) Specification is for monitoring charge current via the ISET1 pin during voltage regulation mode, not for a reduced fast-charge level.  
(8) All de-glitch periods are a function of the timer setting and is modified in DPPM or thermal regulation modes by the percentages that the  
program current is reduced.  
(9) See Charger Sleep mode for PG (VCC = VIN) specifications.  
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ELECTRICAL CHARACTERISTICS (continued)  
over junction temperature range (0°C TJ 125°C) and the recommended supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
MODE INPUT  
Falling HiLow; 280 K ± 10% applied when  
low.  
VIL  
Low-level input voltage  
0.975  
1
1.025  
V
VIH  
High-level input voltage  
Input RMode sets external hysteresis  
VIL + .01  
–1  
VIL + .024  
V
IIL  
Low-level input current, Mode  
μA  
TIMERS  
K(TMR)  
Timer set factor  
t(CHG) = K(TMR) × R(TMR)  
0.313  
30  
0.360  
0.414  
100  
s/Ω  
kΩ  
(10)  
R(TMR)  
External resistor limits  
0.09 ×  
t(CHG)  
t(PRECHG)  
I(FAULT)  
Precharge timer  
0.10 × t(CHG) 0.11 × t(CHG)  
1
s
Timer fault recovery pullup from  
OUT to BAT  
kΩ  
CHARGER SLEEP THRESHOLDS (PG THRESHOLDS, LOW POWER GOOD)  
VVCC  
VI(BAT)  
+125 mV  
V
(UVLO) VI(BAT) VO(BAT-REG)  
,
,
(11)  
V(SLPENT)  
V(SLPEXIT)  
t(DEGL)  
Sleep-mode entry threshold  
Sleep-mode exit threshold  
De-glitch time for sleep mode(12)  
No t(BOOT-UP) delay  
V
VVCC  
VI(BAT)  
+190 mV  
V(UVLO) VI(BAT) VO(BAT-REG)  
(11)  
No t(BOOT-UP) delay  
R(TMR) = 50 k,  
V(IN) decreasing below threshold, 100-ns fall  
time, 10-mv overdrive  
22.5  
150  
ms  
ms  
START-UP CONTROL BOOT-UP  
t(BOOT-UP) Boot-up time  
SWITCHING POWER SOURCE TIMING  
On the first application of input with Mode  
Low  
120  
180  
50  
When input applied. Measure from:  
Switching power source from input [PG: Lo Hi to I(IN) > 5 mA],  
tSW-BAT  
μs  
to battery  
I(OUT) = 100 mA,  
RTRM = 50 K  
THERMAL SHUTDOWN REGULATION(13)  
T(SHTDWN)  
Temperature trip  
TJ (Q1 and Q3 only)  
TJ (Q1 and Q3 only)  
TJ (Q2)  
155  
30  
Thermal hysteresis  
°C  
TJ(REG)  
UVLO  
V(UVLO)  
Temperature regulation limit  
115  
135  
Undervoltage lockout  
Hysteresis  
Decreasing VCC  
2.45  
2.50  
27  
2.65  
V
mV  
VREF OUTPUT  
Active only if AC or USB is present,  
VO(VREF)  
Output regulation voltage  
3.3  
V
VI(OUT) VO(VREF) + (IO(VREF) × RDS(on))  
Regulation accuracy(14)  
Output current  
–5%  
5%  
20  
50  
1
IO(VREF)  
RDS(on)  
mA  
On resistance  
OUT to VREF  
(15)  
C(OUT)  
Output capacitance  
μF  
(10) To disable the fast-charge safety timer and charge termination, tie TMR to the VREF pin. Tying the TMR pin high changes the timing  
resistor from the external value to an internal 50 kΩ ±25%, which can add an additional tolerance to any timed specification. The TMR  
pin normally regulates to 2.5 V when the charge current is not restricted by the DPPM or thermal feedback loops. If these loops become  
active, the TMR pin voltage will be reduced proportionally to the reduction in charge current and the clock frequency will be reduced by  
the same percentage (timed durations will count down slower, extending their time). The TMR pin is clamped at 0.80 V, for a maximum  
time extension of 2.5 V ÷ 0.8 V × 100 = 310%.  
(11) The IC is considered in sleep mode when IN is absent (PG = OPEN DRAIN).  
(12) Does not declare sleep mode until after the de-glitch time and implement the needed power transfer immediately according to the  
switching specification.  
(13) Reaching thermal regulation reduces the charging current. Battery supplement current is not restricted by either thermal regulation or  
shutdown. Input power FETs turn off during thermal shutdown. The battery FET is only protected by a short-circuit limit which typically  
does not cause a thermal shutdown (input FETs turning off) by itself.  
(14) In standby mode (CE low) the accuracy is ±10%.  
(15) VREF output capacitor not required, but one with a value of 0.1 μF is recommended.  
6
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DEVICE INFORMATION  
bq24070/1RHL  
RHL PACKAGE  
(TOP VIEW)  
GND  
STAT1  
STAT2  
IN  
2
3
4
5
6
7
8
9
19  
18  
17  
16  
15  
14  
13  
12  
1
20  
PG  
OUT  
OUT  
OUT  
TMR  
DPPM  
TS  
BAT  
BAT  
ISET2  
MODE  
CE  
10  
11  
TERMINAL FUNCTIONS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
IN  
NO.  
4
I
Charge input voltage  
PG  
18  
5, 6  
9
O
Power-good status output (open-drain)  
BAT  
CE  
I/O Battery input and output.  
I
I
Chip enable input (active high)  
Dynamic power-path management set point (account for scale factor)  
DPPM  
ISET1  
13  
10  
I/O Charge current set point and precharge and termination set point  
Charge current set point for USB port. (High = 500 mA, Low = 100 mA) See half-charge current mode  
using ISET2.  
ISET2  
7
I
OUT  
15, 16, 17  
O
I
Output terminal to the system  
MODE  
STAT1  
STAT2  
8
2
3
Power source selection input (Low for USB mode current limit)  
Charge status output 1 (open-drain)  
O
O
Charge status output 2 (open-drain)  
Timer program input programmed by resistor. Disable fast-charge safety timer and termination by tying  
TMR  
14  
I/O  
TMR to VREF  
.
TS  
12  
19, 20  
1
I/O Temperature sense input  
GND  
VREF  
I
Ground input  
O
Internal reference signal  
Ground input (the thermal pad on the underside of the package) There is an internal electrical connection  
between the exposed thermal pad and VSS pin of the device. The exposed thermal pad must be  
connected to the same potential as the VSS pin on the printed-circuit board. Do not use the thermal pad as  
the primary ground input for the device. VSS pin must be connected to ground at all times.  
VSS  
11  
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FUNCTIONAL BLOCK DIAGRAM  
Short−Circuit Recovery  
500  
BAT  
Short−Circuit  
Recovery  
V
O(OUT)  
OUT  
100 mA /  
Q1  
IN  
500 mA  
V
1 k  
Fault  
Recovery  
3.3 V  
REF  
10 mA  
V
SET  
+
I
(SNS)  
V
IO(AC)  
Charge  
Enable  
V
I(BAT)  
AC  
Q2  
V
I (SNS)  
+
BAT  
V
O(OUT)  
O(OUT−REG)  
GND  
V
V
I(ISET1)  
ISET1  
UVLO  
V
O(BAT−REG)  
TMR  
Oscillator  
V
I(BAT)  
+
V
(BAT)  
I
V
O(BAT−REG)  
V
I(ISET1)  
+
BAT  
V
O(OUT)  
Fast Precharge  
Charge  
Enable  
DPPM  
V
DPPM  
SET  
I
(DPPM)  
Scaling  
+
V
+
DPPM  
60 mV  
Disable−  
Sleep  
+
V
T
J
I(BAT)  
+
+
+
1 V  
V
V
T
O(OUT)  
(HTF)  
J(REG)  
*
200 mV  
I
(TS)  
Suspend  
Thermal  
Shutdown  
TS  
1 V  
*
V
(LTF)  
280 k  
Power Source Selection  
MODE  
CE  
AC Charge Enable  
BAT Charge Enable  
500 mA/ 100 mA  
V
O(BAT−REG)  
Charge  
Control  
Timer  
and  
Display  
Logic  
Fast Precharge  
Recharge  
Precharge  
V
BAT  
*
1C − 500 mA  
C/S − 100 mA  
ISET2  
V
BAT  
*
PG  
V
(SET)  
V
GND  
Term  
I(ISET1)  
*
STAT1  
STAT2  
Sleep  
V
BAT  
*
V
IN  
VSS  
*
Signal Deglitched  
UDG−04084  
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SLUS694F MARCH 2006REVISED DECEMBER 2009  
FUNCTIONAL DESCRIPTIONS  
SIGMA  
4.44  
VOUT, VAC = 5.5 V  
II = 100 A  
+3 Sigma  
4.42  
4.4  
Mean  
4.38  
4.36  
4.34  
4.32  
-3 Sigma  
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
T - Temperatures - oC  
Figure 1. Typical OUT Voltage Regulation, bq24070  
CHARGE CONTROL  
The bq24070/1 supports a precision Li-ion or Li-polymer charging system suitable for single-cell portable devices.  
See a typical charge profile, application circuit, and an operational flow chart in Figure 2 through Figure 4,  
respectively.  
Pre-Conditioning  
Phase  
Current Regulation Phase  
Voltage Regulation and Charge Termination Phase  
Regulation  
Voltage  
Regulation  
Current  
Charge  
Voltage  
Minimum  
Charge  
Charge  
Complete  
Voltage  
Charge  
Current  
Pre−  
Conditioning  
and Term  
Detect  
UDG−04087  
Figure 2. Charge Profile  
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bq24070/1  
AC Adapter  
VDC  
GND  
4
IN  
1
V
REF  
OUT 15  
OUT 16  
OUT 17  
10 µF  
System  
10 µF  
20 GND  
14 TMR  
Battery P ack  
PACK+  
BAT  
BAT  
5
6
+
1 µF  
PACK−  
R
TMR  
7
ISET2  
2
STAT1  
STAT2  
GND  
PG  
3
19  
18  
9
TEMP  
TS 12  
13  
DPPM  
R
SET  
ISET1 10  
VSS 11  
R
DPPM  
CE  
8
MODE  
Control and  
Status Signals  
UDG−04083  
Figure 3. Typical Application Circuit  
10  
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SLUS694F MARCH 2006REVISED DECEMBER 2009  
POR  
SLEEP MODE  
Vcc > V  
I(BAT)  
checked at all  
times?  
Indicate SLEEP  
MODE  
No  
Yes  
Regulate  
I
O(PRECHG)  
Reset and Start  
timer  
V
< V  
(LOWV)  
I(BAT)  
t
Yes  
Indicate Charge−  
In−Progress  
(PRECHG)  
?
No  
Reset all timers,  
Start t timer  
(CHG)  
Regulate Current  
or Voltage  
Indicate Charge−  
In−Progress  
No  
V
<V  
(LOWV)  
I(BAT)  
Yes  
Yes  
No  
t
(PRECHG)  
Expired?  
t
(CHG)  
Expired?  
Yes  
No  
Yes  
Fault Condition  
Indicate Fault  
Yes  
V
<V  
(LOWV)  
I(BAT)  
?
No  
V
> V  
(RCH)  
I(BAT)  
?
I
(TERM)  
No  
detection?  
No  
Enable I  
(F AUL T)  
current  
Yes  
No  
Yes  
V
> V  
?
I(BAT)  
(RCH)  
T urn off charge  
Indicate DONE  
Yes  
Yes  
Disable I  
(F AUL T)  
current  
No  
V
< V  
?
I(BAT)  
(RCH)  
Figure 4. Charge Control Operational Flow Chart  
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Autonomous Power Source Selection, Mode Control Pin  
With the MODE input low, the bq24070/1 defaults to USB-mode charging, and the supply current is limited by the  
ISET2 pin (100 mA for ISET2 = Low, 500 mA for ISET2 = High). If an input source is not available, then the  
battery is selected as the source.  
Boot-Up Sequence  
In order to facilitate the system start-up and USB enumeration, the bq24070/1 offers a proprietary boot-up  
sequence. On the first application of power to the bq24070/1, this feature enables the 100-mA USB charge rate  
for a period of approximately 150 ms, (t(BOOT-UP)), ignoring the ISET2 and CE inputs setting. At the end of this  
period, the bq24070/1 implement CE and ISET2 input settings. Table 1 indicates when this feature is enabled.  
See Figure 9.  
Power-Path Management  
The bq24070/1 powers the system while independently charging the battery. This feature reduces the charge  
and discharge cycles on the battery, allows for proper charge termination, and allows the system to run with an  
absent or defective battery pack. This feature gives the system priority on input power, allowing the system to  
power up with a deeply discharged battery pack. This feature works as follows:  
AC Adapter  
(2)  
IN  
OUT  
VDC  
GND  
System  
Q1  
PACK+  
PACK−  
BAT  
40 mΩ  
+
Q2  
bq24070/1  
UDG−04082  
Figure 5. Power-Path Management  
Case 1: AC Mode (Mode = High)  
System Power  
In this case, the system load is powered directly from the AC adapter through the internal transistor Q1 (see  
Figure 5). The output is regulated at 4.4 V (bq24070). If the system load exceeds the capacity of the supply, the  
output voltage drops down to the battery's voltage.  
Charge Control  
When in AC mode the battery is charged through switch Q2 based on the charge rate set on the ISET1 input.  
Dynamic Power-Path Management (DPPM)  
This feature monitors the output voltage (system voltage) for input power loss due to brown outs, current limiting,  
or removal of the input supply. If the voltage on the OUT pin drops to a preset value, V(DPPM) × SF, due to a  
limited amount of input current, then the battery charging current is reduced until the output voltage stops  
dropping. The DPPM control tries to reach a steady-state condition where the system gets its needed current and  
the battery is charged with the remaining current. No active control limits the current to the system; therefore, if  
the system demands more current than the input can provide, the output voltage drops just below the battery  
voltage and Q2 turns on which supplements the input current to the system. DPPM has three main advantages.  
1. This feature allows the designer to select a lower power wall adapter, if the average system load is moderate  
compared to its peak power. For example, if the peak system load is 1.75 A, average system load is 0.5 A  
and battery fast-charge current is 1.25 A, the total peak demand could be 3 A. With DPPM, a 2-A adaptor  
could be selected instead of a 3.25-A supply. During the system peak load of 1.75 A and charge load of 1.25  
A, the smaller adaptor’s voltage drops until the output voltage reaches the DPPM regulation voltage  
threshold. The charge current is reduced until there is no further drop on the output voltage. The system gets  
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its 1.75-A charge and the battery charge current is reduced from 1.25 A to 0.25 A. When the peak system  
load drops to 0.5 A, the charge current returns to 1 A and the output voltage returns to its normal value.  
2. Using DPPM provides a power savings compared to configurations without DPPM. Without DPPM, if the  
system current plus charge current exceed the supply’s current limit, then the output is pulled down to the  
battery. Linear chargers dissipate the unused power (VIN-VOUT) × ILOAD. The current remains high (at current  
limit) and the voltage drop is large for maximum power dissipation. With DPPM, the voltage drop is less  
(VIN-V(DPPM-REG)) to the system which means better efficiency. The efficiency for charging the battery is the  
same for both cases. The advantages include less power dissipation, lower system temperature, and better  
overall efficiency.  
3. The DPPM sustains the system voltage no matter what causes it to drop, if at all possible. It does this by  
reducing the noncritical charging load while maintaining the maximum power output of the adaptor.  
Note that the DPPM voltage, V(DPPM), is programmed as follows:  
V
+ I  
  R  
  SF  
(DPPM)  
(DPPM−REG)  
(DPPM)  
(1)  
where  
R(DPPM) is the external resistor connected between the DPPM and VSS pins.  
I(DPPM) is the internal current source.  
SF is the scale factor as specified in the specification table.  
The safety timer is dynamically adjusted while in DPPM mode. The voltage on the ISET1 pin is directly  
proportional to the programmed charging current. When the programmed charging current is reduced, due to  
DPPM, the ISET1 and TMR voltages are reduced and the timer’s clock is proportionally slowed, extending the  
safety time. In normal operation V(TMR) = 2.5 V; and, when the clock is slowed, V(TMR) is reduced. When  
V(TMR) = 1.25 V, the safety timer has a value close to 2 times the normal operation timer value. See Figure 6  
through Figure 7.  
Case 2: USB Mode (Mode = L)  
System Power  
In this case, the system load is powered from a USB port through the internal switch Q1 (see Figure 5). Note that  
in this case, Q1 regulates the total current to the 100-mA or 500-mA level, as selected on the ISET2 input. The  
output, VOUT, is regulated to 4.4 V (bq24070). The system's power management is responsible for keeping its  
system load below the USB current level selected (if the battery is critically low or missing). Otherwise, the output  
drops to the battery voltage; therefore, the system should have a low-power mode for USB power application.  
The DPPM feature keeps the output from dropping below its programmed threshold, due to the battery charging  
current, by reducing the charging current.  
Charge Control  
When in USB mode, Q1 regulates the input current to the value selected by the ISET2 pin (0.1/0.5 A). The  
charge current to the battery is set by the ISET1 resistor (typically > 0.5 A). Because the charge current typically  
is programmed for more current than the USB current limit allows, the output voltage drops to the battery voltage  
or DPPM voltage, whichever is higher. If the DPPM threshold is reached first, the charge current is reduced until  
VOUT stops dropping. If VOUT drops to the battery voltage, the battery is able to supplement the input current to  
the system.  
Dynamic Power-Path Management (DPPM)  
The theory of operation is the same as described in CASE 1, except that Q1 is restricted to the USB current level  
selected by the ISET2 pin.  
Note that the DPPM voltage, V(DPPM), is programmed as follows:  
V
+ I  
  R  
  SF  
(DPPM)  
(DPPM−REG)  
(DPPM)  
(2)  
where  
R(DPPM) is the external resistor connected between the DPPM and VSS pins.  
I(DPPM) is the internal current source.  
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SF is the scale factor as specified in the specification table.  
Feature Plots  
Figure 6 illustrates DPPM and battery supplement modes as the output current (IOUT) is increased; channel 1  
(CH1) VAC = 5.4 V; channel 2 (CH2) VOUT; channel 3 (CH3) IOUT = 0 to 2.2 A to 0 A; channel 4 (CH4) VBAT = 3.5  
V; I(PGM-CHG) = 1 A. In typical operation, bq24070/1 (VOUT = 4.4 Vreg), through an AC adaptor overload condition  
and recovery. The AC input is set for ~5.1 V (1.5 A current limit), I(CHG) = 1 A, V(DPPM-SET) = 3.7 V, V(DPPM-OUT)  
=
1.15 × V(DPPM-SET) = 4.26 V, VBAT = 3.5 V, Mode = H, and USB input is not connected. The output load is  
increased from 0 A to ~2.2 A and back to 0 A as shown in the bottom waveform. As the IOUT load reaches 0.5 A,  
along with the 1-A charge current, the adaptor starts to current limit, the output voltage drops to the DPPM-OUT  
threshold of 4.26 V. This is DPPM mode. The AC input tracks the output voltage by the dropout voltage of the  
AC FET. The battery charge current is then adjusted back as necessary to keep the output voltage from falling  
any further. Once the output load current exceeds the input current, the battery has to supplement the excess  
current and the output voltage falls just below the battery voltage by the dropout voltage of the battery FET. This  
is the battery supplement mode. When the output load current is reduced, the operation described is reversed as  
shown. If the DPPM-OUT voltage was set below the battery voltage, during input current limiting, the output falls  
directly to the battery's voltage.  
Under USB operation, when the loads exceeds the programmed input current thresholds a similar pattern is  
observed. If the output load exceeds the available USB current, the output instantly goes into the battery  
supplement mode.  
V
AC  
V
OUT  
V
V
Reg. @ 4.4 V (bq24070)  
OUT  
= 4.26 V, DPPM Mode  
DPPM − OUT  
VOUT VOUT, BAT Supplement Mode  
I
I
CHG  
OUT  
Figure 6. DPPM and Battery Supplement Modes  
Figure 7 illustrates when Mode is toggled low for 500 μs. Power transfers from AC to USB to AC; channel 1  
(CH1) VAC = 5.4 V; channel 2 (CH2) V(USB) = 5 V; channel 3 (CH3) VOUT; output current, IOUT = 0.25 A; channel  
4 (CH4) VBAT = 3.5 V; and I(PGM-CHG) = 1 A. When the Mode went low (1st div), the AC FET opened, and the  
output fell until the USB FET turned on. Turning off the active source before turning on the replacement source is  
referred to as break-before-make switching. The rate of discharge on the output is a function of system  
capacitance and load. Note the cable IR drop in the AC and USB inputs when they are under load. At the 4th  
division, the output has reached steady-state operation at the DPPM voltage level (charge current has been  
reduced due to the limited USB input current). At the 6th division, the Mode goes high and the USB FET turns off  
followed by the AC FET turning on. The output returns to its regulated value, and the battery returns to its  
programmed current level.  
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Break Before Make  
V
AC  
V
USB  
V
V
OUT  
BAT  
System Capacitance  
Powering System  
DPPM Mode  
USB is Charging System Capacitance  
Hi  
PSEL  
Low  
Figure 7. Toggle Mode Low  
Figure 8 illustrates when a battery is inserted for power up; channel 1 (CH1) VAC = 0 V; channel 2 (CH2) VUSB  
0 V; channel 3 (CH3) VOUT; output current, IOUT = 0.25 A for VOUT > 2 V; channel 4 (CH4) VBAT = 3.5 V; C(DPPM)  
=
=
0 pF. When there are no power sources and the battery is inserted, the output tracks the battery voltage if there  
is no load (<10 mA of load) on the output, as shown. If a load is present that keeps the output more than 200 mV  
below the battery, a short-circuit condition is declared. At this time, the load has to be removed to recover. A  
capacitor can be placed on the DPPM pin to delay implementing the short-circuit mode and get unrestricted (not  
limited) current.  
V
BAT  
V
OUT  
Figure 8. Insert Battery – Power-Up Output via BAT  
Figure 9 illustrates USB boot up and power-up via USB; channel 1 (CH1) V(USH) = 0 to 5 V; channel 2 (CH2) USB  
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input current (0.2 A/div); Mode = Low; CE = High; ISET2 = High; VBAT = 3.85 V; V(DPPM) = 3.0 V (V(DPPM) × 1.15 <  
VBAT, otherwise DPPM mode increases time duration). When a USB source is applied (if AC is not present), the  
CE pin and ISET2 pin are ignored during the boot-up time and a maximum input current of 100 mA is made  
available to the OUT or BAT pins. After the boot-up time, the IC implements the CE and ISET2 pins as  
programmed.  
V
AC  
I
USB  
Figure 9. USB Boot-Up Power-Up  
Battery Temperature Monitoring  
The bq24070/1 continuously monitors battery temperature by measuring the voltage between the TS and VSS  
pins. An internal current source provides the bias for most-common 10 knegative-temperature coefficient  
thermistors (NTC) (see Figure 10). The device compares the voltage on the TS pin against the internal V(LTF) and  
V(HTF) thresholds to determine if charging is allowed. Once a temperature outside the V(LTF) and V(HTF) thresholds  
is detected, the device immediately suspends the charge. The device suspends charge by turning off the power  
FET and holding the timer value (i.e., timers are not reset). Charge is resumed when the temperature returns to  
the normal range. The allowed temperature range for 103AT-type thermistor is 0°C to 45°C. However, the user  
may increase the range by adding two external resistors. See Figure 11.  
PACK+  
PACK+  
bq24070/1  
bq24070/1  
+
+
PACK−  
RT1  
I
TS  
PACK−  
TS  
I
TS  
TS  
NTC  
TEMP  
NTC  
12  
12  
LTF  
LTF  
BATTERY  
PACK  
V
LTF  
BATTERY  
PACK  
V
LTF  
RT2  
V
HTF  
HTF  
V
HTF  
HTF  
UDG−04086  
UDG−04085  
Figure 10. TS Pin Configuration  
Figure 11. TS Pin Thresholds  
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Battery Pre-Conditioning  
During a charge cycle, if the battery voltage is below the V(LOWV) threshold, the bq24070/1 applies a precharge  
current, IO(PRECHG), to the battery. This feature revives deeply discharged cells. The RSET resistor, connected  
between the ISET1 and VSS pins, determines the precharge rate. The V(PRECHG) and K(SET) parameters are  
specified in the specifications table. Note that this applies to both AC-mode and USB-mode charging.  
V
  K  
(SET)  
(PRECHG)  
I
+
O (PRECHG)  
R
SET  
(3)  
The bq24070/1 activates a safety timer, t(PRECHG), during the conditioning phase. If V(LOWV) threshold is not  
reached within the timer period, the bq24070/1 turns off the charger and enunciates FAULT on the STAT1 and  
STAT2 pins. The timeout is extended if the charge current is reduced by DPPM or thermal regulation. See the  
Timer Fault Recovery section for additional details.  
Battery Charge Current  
The bq24070/1 offers on-chip current regulation with programmable set point. The RSET resistor, connected  
between the ISET1 and VSS pins, determines the charge level. The charge level may be reduced to give the  
system priority on input current (see DPPM). The V(SET) and K(SET) parameters are specified in the specifications  
table.  
V
  K  
(SET)  
(SET)  
I
+
O (OUT)  
R
SET  
(4)  
When powered from a USB port, the input current available (0.1 A/0.5 A) is typically less than the programmed  
(ISET1) charging current, and therefore, the DPPM feature attempts to keep the output from being pulled down  
by reducing the charging current.  
The charge level, during AC mode operation only (Mode = High), can be changed by a factor of 2 by setting the  
ISET2 pin high (full charge) or low (half charge). The voltage on the ISET1 pin, VSET1, is divided by 2 when in  
the half constant current charge mode. Note that with Mode low, the ISET2 pin controls only the 0.1 A/0.5 A USB  
current level.  
See the section titled Power-Path Management for additional details.  
Battery Voltage Regulation  
The voltage regulation feedback is through the BAT pin. This input is tied directly to the positive side of the  
battery pack. The bq24070/1 monitors the battery-pack voltage between the BAT and VSS pins. When the  
battery voltage rises to the VO(REG) threshold, the voltage regulation phase begins and the charging current  
begins to taper down.  
If the battery is absent, the BAT pin cycles between charge done (VO(REG)) and charging (battery recharge  
threshold, ~4.1 V).  
See Figure 8 for power up by battery insertion.  
As a safety backup, the bq24070/1 also monitors the charge time in the charge mode. If charge is not terminated  
within this time period, t(CHG), the bq24070/1 turns off the charger and enunciates FAULT on the STAT1 and  
STAT2 pins. See the DPPM operation under Case 1 for information on extending the safety timer during DPPM  
operation. See theTimer Fault Recovery section for additional details.  
Temperature Regulation and Thermal Protection  
In order to maximize charge rate, the bq24070/1 features a junction temperature regulation loop. If the power  
dissipation of the IC results in a junction temperature greater than the TJ(REG) threshold, the bq24070/1 throttles  
back on the charge current in order to maintain a junction temperature around the TJ(REG) threshold. To avoid  
false termination, the termination detect function is disabled while in this mode.  
The bq24070/1 also monitors the junction temperature, TJ, of the die and disconnects the OUT pin from the IN  
input if TJ exceeds T(SHTDWN). This operation continues until TJ falls below T(SHTDWN) by the hysteresis level  
specified in the specification table.  
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The battery supplement mode has no thermal protection. The Q2 FET continues to connect the battery to the  
output (system), if input power is not sufficient; however, a short-circuit protection circuit limits the battery  
discharge current such that the maximum power dissipation of the part is not exceeded under typical design  
conditions.  
Charge Timer Operation  
As a safety backup, the bq24070/1 monitors the charge time in the charge mode. If the termination threshold is  
not detected within the time period, t(CHG), the bq24070/1 turns off the charger and enunciates FAULT on the  
STAT1 and STAT2 pins. The resistor connected between the TMR and VSS, RTMR, determines the timer period.  
The K(TMR) parameter is specified in the specifications table. In order to disable the charge timer, eliminate RTMR  
,
connect the TMR pin directly to the VREF pin. Note that this action eliminates the fast-charge safety timer (it does  
not disable or reset the pre-charge safety timer), and also clears any timer fault. TMR pin should not be left  
floating.  
t
+ K  
  R  
(TMR) (TMR)  
(CHG)  
(5)  
While in the thermal regulation mode or DPPM mode, the bq24070/1 dynamically adjusts the timer period in  
order to provide the additional time needed to fully charge the battery. This proprietary feature is designed to  
prevent against early or false termination. The maximum charge time in this mode, t(CHG-TREG), is calculated by  
Equation 6.  
t
  V  
(SET)  
(CHG)  
+
t
(CHG−TREG)  
V
(SET*REG)  
(6)  
Note that because this adjustment is dynamic and changes as the ambient temperature changes and the charge  
level changes, the timer clock is adjusted. It is difficult to estimate a total safety time without integrating the  
above equation over the charge cycle. Therefore, understanding the theory that the safety time is adjusted  
inversely proportionately with the charge current and the battery is a current-hour rating, the safety time  
dynamically adjusts appropriately.  
The V(SET) parameter is specified in the specifications table. V(SET-TREG) is the voltage on the ISET pin during the  
thermal regulation or DPPM mode and is a function of charge current. (Note that charge current is dynamically  
adjusted during the thermal regulation or DPPM mode.)  
I
  R  
(OUT)  
+
(SET)  
V
(SET−TREG)  
K
(SET)  
(7)  
All de-glitch times also adjusted proportionally to t(CHG-TREG)  
.
Charge Termination and Recharge  
The bq24070/1 monitors the voltage on the ISET1 pin, during voltage regulation, to determine when termination  
should occur. Termination occurs when the charge current tapers down to either 1/10th of the programmed fast  
charge rate (when the MODE pin is high) or 1/25th of the programmed fast charge rate (when the MODE pin is  
low). Once the termination threshold, I(TERM), is detected the bq24070/1 terminates charge. The RSET resistor,  
connected between the ISET1 and VSS pins, programs the fast charge current level and thus the current  
termination threshold level. The V(TERM) and K(SET) parameters are specified in the specifications table. Note that  
this applies to both AC and USB charging.  
V
  K  
(TERM)  
(SET)  
I
+
(TERM)  
R
SET  
(8)  
After charge termination, the bq24070/1 re-starts the charge once the voltage on the BAT pin falls below the  
V(RCH) threshold. This feature keeps the battery at full capacity at all times.  
Sleep and Standby Modes  
The bq24070/1 charger circuitry enters the low-power sleep mode if the input is removed from the circuit. This  
feature prevents draining the battery into the bq24070/1 during the absence of input supply. Note that in sleep  
mode, Q2 remains on (i.e., battery connected to the OUT pin) in order for the battery to continue supplying power  
to the system.  
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The bq24070/1 enters the low-power standby mode if while input power is present, the CE input is low. In this  
suspend mode, internal power FET Q1 (see Figure 5) is turned off, the BAT input is used to power the system  
through the OUT pin. This feature is designed to limit the power drawn from the input supply (such as USB  
suspend mode).  
Charge Status Outputs  
The open-drain (OD) STAT1 and STAT2 outputs indicate various charger operations as shown in Table 2. These  
status pins can be used to drive LEDs or communicate to the host processor. Note that OFF indicates the  
open-drain transistor is turned off. Note that this assumes CE = High.  
Table 2. Status Pins Summary  
CHARGE STATE  
Precharge in progress  
STAT1  
ON  
STAT2  
ON  
Fast charge in progress  
ON  
OFF  
ON  
Charge done  
OFF  
OFF  
Charge suspend (temperature), timer fault, and sleep mode  
OFF  
PG, Outputs (Power Good)  
The open-drain pin, PG, indicates when input power is present, and above the battery voltage. The  
corresponding output turns ON (low) when exiting sleep mode (input voltage above battery voltage). This output  
is turned off in the sleep mode (open drain). The PG pin can be used to drive an LED or communicate to the  
host processor. Note that OFF indicates the open-drain transistor is turned off.  
CE Input (Chip Enable)  
The CE (chip enable) digital input is used to disable or enable the IC. A high-level signal on this pin enables the  
chip, and a low-level signal disables the device and initiates the standby mode. The bq24070/1 enters the  
low-power standby mode when the CE input is low with input present. In this suspend mode, internal power FET  
Q1 (see block diagram) is turned off; the battery (BAT pin) is used to power the system via Q2 and the OUT pin.  
This feature is designed to limit the power drawn from the input supply (such as USB suspend mode).  
Charge Disable Functions  
The DPPM input can be used to disable the charge process. This can be accomplished by floating the DPPM  
pin.  
Timer Fault Recovery  
As shown in Figure 4, bq24070/1 provides a recovery method to deal with timer fault conditions. The following  
summarizes this method:  
Condition 1: Charge voltage above recharge threshold (V(RCH)) and timeout fault occurs.  
Recovery Method: bq24070/1 waits for the battery voltage to fall below the recharge threshold. This could  
happen as a result of a load on the battery, self-discharge, or battery removal. Once the battery falls below the  
recharge threshold, the bq24070/1 clears the fault and starts a new charge cycle. A POR or CE toggle also  
clears the fault.  
Condition 2: Charge voltage below recharge threshold (V(RCH)) and timeout fault occurs.  
Recovery Method: Under this scenario, the bq24070/1 applies the I(FAULT) current. This small current is used to  
detect a battery removal condition and remains on as long as the battery voltage stays below the recharge  
threshold. If the battery voltage goes above the recharge threshold, then the bq24070/1 disables the I(FAULT)  
current and executes the recovery method described for condition 1. Once the battery falls below the recharge  
threshold, the bq24070/1 clears the fault and starts a new charge cycle. A POR or CE toggle also clears the  
fault.  
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Short-Circuit Recovery  
The output can experience two types of short-circuit protection, one associated with the input and one with the  
battery.  
If the output drops below ~1 V, an input short-circuit condition is declared and the input FET, Q1 is turned off. To  
recover from this state, a 500-pullup resistor from the input is applied (switched) to the output. To recover, the  
load on the output has to be reduced {Rload > 1 V × 500 / (Vin–Vout)} such that the pullup resistor is able to lift  
the output voltage above 1 V, for the input FET to be turned back on.  
If the output drops 200 mV below the battery voltage, the battery FET, Q2 is considered in short circuit and the  
battery FET turns off. To recover from this state, there is a 10-mA current source from the battery to the output.  
Once the output load is reduced, such that the 10-mA current source can pick up the output within 200 mV of the  
battery, the FET turns back on.  
If the short is removed, and the minimum system load is still too large [R<(VBat-200 mV) / 10 mA], the  
short-circuit protection can be temporarily defeated. The battery short-circuit protection can be disabled  
(recommended only for a short time) if the voltage on the DPPM pin is less than 1 V. Pulsing this pin below 1 V,  
for a few microseconds, should be enough to recover.  
This short-circuit disable feature was implemented mainly for power up when inserting a battery. Because the  
BAT input voltage rises much faster than the OUT voltage (Vout<Vbat-200 mV), with most any capacitive load on  
the output, the part can get stuck in short-circuit mode. Placing a capacitor between the DPPM pin and ground  
slows the VDPPM rise time, during power up, and delays the short-circuit protection. Too large a capacitance on  
this pin (too much of a delay) could allow too-high currents if the output was shorted to ground. The  
recommended capacitance is 1 nF to 10 nF. The VDPPM rise time is a function of the 100-μA DPPM current  
source, the DPPM resistor, and the capacitor added.  
VREF  
The VREF is used for internal reference and compensation (3.3 V typ). Additionally, it can be used to disable the  
safety timer and termination by connecting the TMR to the VREF pin. For internal compensation, the VREF pin  
requires a minimum 0.1 μF ceramic capacitor. The VREF capacitor should not exceed 1 μF.  
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APPLICATION INFORMATION  
Selecting the Input and Output Capacitors  
In most applications, all that is needed is a high-frequency decoupling capacitor on the input. A 0.1-μF ceramic  
capacitor, placed in close proximity to IN to VSS pins, works well. In some applications depending on the power  
supply characteristics and cable length, it may be necessary to add an additional 10-μF ceramic capacitor to the  
input.  
The bq24070/1 only requires a small output capacitor for loop stability. A 0.1-μF ceramic capacitor placed  
between the OUT and VSS pin is typically sufficient.  
It is recommended to install a minimum of 33-μF capacitor between the BAT pin and VSS (in parallel with the  
battery). This ensures proper hot plug power up with a no-load condition (no system load or battery attached).  
Thermal Considerations  
The bq24070/1 is packaged in a thermally enhanced MLP package. The package includes a QFN thermal pad to  
provide an effective thermal contact between the device and the printed-circuit board (PCB). Full PCB design  
guidelines for this package are provided in the application note entitled QFN/SON PCB Attachment (SLUA271).  
The power pad should be tied to the VSS plane. The most common measure of package thermal performance is  
thermal impedance (θJA) measured (or modeled) from the chip junction to the air surrounding the package  
surface (ambient).  
The mathematical expression for θJA is:  
T * T  
J
A
q
+
JA  
P
(9)  
where  
TJ = chip junction temperature  
TA = ambient temperature  
P = device power dissipation  
Factors that can greatly influence the measurement and calculation of θJA include:  
whether or not the device is board mounted  
trace size, composition, thickness, and geometry  
orientation of the device (horizontal or vertical)  
volume of the ambient air surrounding the device under test and airflow  
whether other surfaces are in close proximity to the device being tested  
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal power  
FET. It can be calculated from Equation 10:  
P + ƪǒV  
Ǔ ǒ  
  I  
BATǓƫ) ƪǒV  
Ǔ ǒ BATǓƫ  
  I  
* V  
) I  
* V  
IN  
OUT  
OUT  
OUT  
BAT  
(10)  
Due to the charge profile of Li-xx batteries, the maximum power dissipation is typically seen at the beginning of  
the charge cycle when the battery voltage is at its lowest. See Figure 2. Typically the Li-ion battery's voltage  
quickly (< 2 V minutes) ramps to approximately 3.5 V, when entering fast charge (1-C charge rate and battery  
above 3 V). Therefore, it is customary to perform the steady-state thermal design using 3.5 V as the minimum  
battery voltage because the system board and charging device does not have time to reach a maximum  
temperature due to the thermal mass of the assembly during the early stages of fast charge. This theory is easily  
verified by performing a charge cycle on a discharged battery while monitoring the battery voltage and chargers  
power pad temperature.  
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PCB Layout Considerations  
It is important to pay special attention to the PCB layout. The following provides some guidelines:  
To obtain optimal performance, the decoupling capacitor from the input terminal to VSS and the output filter  
capacitor from OUT to VSS should be placed as close as possible to the bq24070/1, with short trace runs to  
both signal and VSS pins.  
All low-current VSS connections should be kept separate from the high-current charge or discharge paths  
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the  
power ground path.  
The high-current charge paths into IN and from the BAT and OUT pins must be sized appropriately for the  
maximum charge current in order to avoid voltage drops in these traces.  
The bq24070/1 is packaged in a thermally enhanced MLP package. The package includes a QFN thermal  
pad to provide an effective thermal contact between the device and the printed-circuit board. Full PCB design  
guidelines for this package are provided in the application note entitled QFN/SON PCB Attachment  
(SLUA271).  
22  
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Copyright © 2006–2009, Texas Instruments Incorporated  
Product Folder Link(s): bq24070 bq24071  
bq24070  
bq24071  
www.ti.com  
SLUS694F MARCH 2006REVISED DECEMBER 2009  
Changes from Revision E (October 2009) to Revision F  
Page  
Changed Charge Termination and Recharge description .................................................................................................. 18  
Copyright © 2006–2009, Texas Instruments Incorporated  
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Product Folder Link(s): bq24070 bq24071  
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Jul-2013  
PACKAGING INFORMATION  
Orderable Device  
BQ24070RHLR  
BQ24070RHLRG4  
BQ24070RHLT  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
RHL  
20  
20  
20  
20  
20  
20  
20  
20  
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
BRQ  
BRQ  
BRQ  
BRQ  
BTR  
BTR  
BTR  
BTR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
RHL  
RHL  
RHL  
RHL  
RHL  
RHL  
RHL  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
BQ24070RHLTG4  
BQ24071RHLR  
BQ24071RHLRG4  
BQ24071RHLT  
250  
Green (RoHS  
& no Sb/Br)  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
BQ24071RHLTG4  
250  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Jul-2013  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
27-Jul-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ24070RHLR  
BQ24070RHLR  
BQ24070RHLT  
BQ24070RHLT  
BQ24071RHLR  
BQ24071RHLT  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
RHL  
RHL  
RHL  
RHL  
RHL  
RHL  
20  
20  
20  
20  
20  
20  
3000  
3000  
250  
330.0  
330.0  
180.0  
180.0  
330.0  
180.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
3.8  
3.8  
3.8  
3.8  
3.8  
3.8  
4.8  
4.8  
4.8  
4.8  
4.8  
4.8  
1.6  
1.3  
1.3  
1.6  
1.6  
1.6  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
250  
3000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
27-Jul-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ24070RHLR  
BQ24070RHLR  
BQ24070RHLT  
BQ24070RHLT  
BQ24071RHLR  
BQ24071RHLT  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
VQFN  
RHL  
RHL  
RHL  
RHL  
RHL  
RHL  
20  
20  
20  
20  
20  
20  
3000  
3000  
250  
367.0  
370.0  
195.0  
210.0  
367.0  
210.0  
367.0  
355.0  
200.0  
185.0  
367.0  
185.0  
35.0  
55.0  
45.0  
35.0  
35.0  
35.0  
250  
3000  
250  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
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requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
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Applications  
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Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
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www.ti.com/security  
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配单直通车
BQ24071RHLRG4产品参数
型号:BQ24071RHLRG4
是否无铅:不含铅
是否Rohs认证:符合
生命周期:Obsolete
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:QFN
包装说明:3.50 X 4.50 MM, GREEN, PLASTIC, QFN-20
针数:20
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.18
Is Samacsys:N
可调阈值:YES
模拟集成电路 - 其他类型:POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码:R-PQCC-N20
JESD-609代码:e4
长度:4.5 mm
湿度敏感等级:2
信道数量:1
功能数量:1
端子数量:20
最高工作温度:125 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN
封装等效代码:LCC20/24,.14X.18,20
封装形状:RECTANGULAR
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260
电源:4.3/16 V
认证状态:Not Qualified
座面最大高度:1 mm
子类别:Power Management Circuits
最大供电电流 (Isup):2 mA
最大供电电压 (Vsup):16 V
最小供电电压 (Vsup):4.35 V
表面贴装:YES
温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD
端子节距:0.5 mm
端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.5 mm
Base Number Matches:1
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