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产品型号BQ24072RGTTG4的Datasheet PDF文件预览

bq24072, bq24073  
bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
1.5A USB-FRIENDLY Li-Ion BATTERY CHARGER AND POWER-PATH MANAGEMENT IC  
1
FEATURES  
DESCRIPTION  
Fully Compliant USB Charger  
Selectable 100mA and 500mA Maximum  
Input Current  
The bq2407x series of devices are integrated Li-ion  
linear chargers and system power path management  
devices  
targeted  
at  
space-limited  
portable  
100mA Maximum Current Limit Ensures  
Compliance to USB-IF Standard  
applications. The devices operate from either a USB  
port or AC adapter and support charge currents up to  
1.5A. The input voltage range with input overvoltage  
protection supports unregulated adapters. The USB  
input current limit accuracy and start up sequence  
allow the bq2407x to meet USB-IF inrush current  
specification. Additionally, the input dynamic power  
management (VIN-DPM) prevents the charger from  
crashing incorrectly configured USB sources.  
Input based Dynamic Power Management  
(VIN-DPM) for Protection Against Poor USB  
Sources  
28V Input Rating with Overvoltage Protection  
Integrated Dynamic Power Path Management  
(DPPM) Function Simultaneously and  
Independently Powers the System and  
Charges the Battery  
The bq2407x features dynamic power path  
management (DPPM) that powers the system while  
simultaneously and independently charging the  
battery. The DPPM circuit reduces the charge current  
when the input current limit causes the system output  
to fall to the DPPM threshold; thus, supplying the  
system load at all times while monitoring the charge  
current separately. This feature reduces the number  
of charge and discharge cycles on the battery, allows  
for proper charge termination and enables the system  
to run with a defective or absent battery pack.  
Supports up to 1.5A Charge Current with  
Current Monitoring Output (ISET)  
Programmable Input Current Limit up to 1.5A  
for Wall Adapters  
System Output Tracks Battery Voltage  
(bq24072)  
Programmable Termination Current (bq24074)  
Battery Disconnect Function with SYSOFF  
Input (bq24075, bq24079)  
Typical Application Circuit  
Programmable Pre-Charge and Fast-Charge  
Safety Timers  
1kW  
1kW  
Reverse Current, Short-Circuit and Thermal  
Protection  
NTC Thermistor Input  
Proprietary Start Up Sequence Limits Inrush  
Current  
IN  
SYSTEM  
IN  
OUT  
10  
11  
13  
1mF  
4.7mF  
Status Indication – Charging/Done, Power  
Good  
bq24075  
bq24079  
5
8
EN2  
BAT  
VSS  
2
3
Small 3 mm × 3 mm 16 Lead QFN Package  
System  
ON/OFF  
Control  
15  
SYSOFF  
4.7mF  
PACK+  
TEMP  
1
TS  
APPLICATIONS  
Smart Phones  
PACK-  
Portable Media Players  
Portable Navigation Devices  
Low-Power Handheld Devices  
1.18kW  
1.13kW  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2008–2009, Texas Instruments Incorporated  
 
 
 
 
bq24072, bq24073  
bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
DESCRIPTION (CONTINUED)  
Additionally, the regulated system input enables instant system turn-on when plugged in even with a totally  
discharged battery. The power-path management architecture also permits the battery to supplement the system  
current requirements when the adapter cannot deliver the peak system currents, enabling the use of a smaller  
adapter.  
The battery is charged in three phases: conditioning, constant current, and constant voltage. In all charge  
phases, an internal control loop monitors the IC junction temperature and reduces the charge current if the  
internal temperature threshold is exceeded. The charger power stage and charge current sense functions are  
fully integrated. The charger function has high accuracy current and voltage regulation loops, charge status  
display, and charge termination. The input current limit and charge current are programmable using external  
resistors.  
ORDERING INFORMATION  
PART NUMBER  
OPTIONAL  
FUNCTION  
VOVP  
VBAT(REG)  
VOUT(REG)  
VDPPM  
MARKING  
(1)(2)  
bq24072RGTR  
bq24072RGTT  
bq24073RGTR  
bq24073RGTT  
bq24074RGTR  
bq24074RGTT  
bq24075RGTR  
bq24075RGTT  
bq24079RGTR  
bq24079RGTT  
6.6 V  
6.6 V  
6.6 V  
6.6 V  
10.5 V  
10.5 V  
6.6 V  
6.6 V  
6.6 V  
6.6 V  
4.2V  
4.2V  
4.2V  
4.2V  
4.2V  
4.2V  
4.2V  
4.2V  
4.1V  
4.1V  
VBAT + 225 mV  
VBAT + 225 mV  
4.4 V  
VO(REG) – 100 mV  
VO(REG) – 100 mV  
VO(REG) – 100 mV  
VO(REG) – 100 mV  
VO(REG) – 100 mV  
VO(REG) – 100 mV  
4.3 V  
TD  
TD  
CKP  
CKP  
CKQ  
CKQ  
BZF  
BZF  
CDU  
CDU  
ODI  
TD  
4.4 V  
TD  
4.4 V  
ITERM  
ITERM  
SYSOFF  
SYSOFF  
SYSOFF  
SYSOFF  
4.4 V  
5.5 V  
5.5 V  
4.3 V  
5.5 V  
4.3 V  
5.5 V  
4.3 V  
ODI  
(1) The RGT package is available in the following options:  
R - taped and reeled in quantities of 3,000 devices per reel.  
T - taped and reeled in quantities of 250 devices per reel.  
(2) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for  
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including  
bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
2
Submit Documentation Feedback  
Copyright © 2008–2009, Texas Instruments Incorporated  
Product Folder Link(s): bq24072 bq24073 bq24074 bq24075, bq24079  
bq24072, bq24073  
bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
ABSOLUTE MAXIMUM RATINGS(1)  
over the 0°C to 125°C operating free-air temperature range (unless otherwise noted)  
VALUE  
–0.3 to 28  
–0.3 to 5  
UNIT  
V
IN (with respect to VSS)  
BAT (with respect to VSS)  
V
VI  
Input Voltage  
Input Current  
OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, TMR, ITERM,  
SYSOFF, TD (with respect to VSS)  
–0.3 to 7  
V
II  
IN  
1.6  
A
A
OUT  
5
5
Output Current  
(Continuous)  
IO  
BAT (Discharge mode)  
BAT (Charging mode)  
CHG, PGOOD  
A
1.5(2)  
A
Output Sink Current  
Junction temperature  
Storage temperature  
15  
mA  
°C  
°C  
TJ  
–40 to 150  
–65 to 150  
Tstg  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage  
values are with respect to the network ground terminal unless otherwise noted.  
(2) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces  
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge  
current may not be reached.  
DISSIPATION RATINGS  
POWER RATING  
PACKAGE(1)  
RθJA  
RθJC  
TA 25°C  
TA = 85°C  
(2)  
RGT  
39.47 °C/W  
2.4 °C/W  
2.3 W  
225mW  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is  
connected to the ground plane by a 2x3 via matrix.  
RECOMMENDED OPERATING CONDITIONS  
MIN  
4.35  
4.35  
4.35  
MAX  
26  
UNIT  
IN voltage range  
V
VI  
’72, ’73, ‘75, '79  
‘74  
6.4  
IN operating voltage range  
V
10.2  
1.5  
IIN  
Input current, IN pin  
A
A
IOUT  
IBAT  
ICHG  
TJ  
Current, OUT pin  
4.5  
Current, BAT pin (Discharging)  
Current, BAT pin (Charging)  
Junction Temperature  
4.5  
A
1.5(1)  
125  
8000  
3000  
15  
A
–40  
1100  
590  
0
°C  
RILIM  
RISET  
RITERM  
RTMR  
Maximum input current programming resistor  
(2)  
Fast-charge current programming resistor  
Termination current programming resistor  
Timer programming resistor  
k  
kΩ  
18  
72  
(1) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces  
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge  
current may not be reached.  
(2) Use a 1% tolerance resistor for RISET to avoid issues with the RISET short test when using the maximum charge current setting.  
Copyright © 2008–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): bq24072 bq24073 bq24074 bq24075, bq24079  
bq24072, bq24073  
bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
ELECTRICAL CHARACTERISTICS  
Over junction temperature range (0° TJ 125°C) and the recommended supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT  
UVLO  
Vhys  
Undervoltage lock-out  
VIN: 0 V 4 V  
VIN: 4 V 0 V  
3.2  
3.3  
3.4  
V
Hysteresis on UVLO  
200  
300  
mV  
Input power detected when VIN > VBAT + VIN(DT)  
VBAT = 3.6 V, VIN: 3.5 V 4 V  
VIN(DT)  
Input power detection threshold  
Hysteresis on VIN(DT)  
55  
20  
80  
130  
mV  
mV  
ms  
Vhys  
VBAT = 3.6 V, VIN: 4 V 3.5 V  
Time measured from VIN: 0 V 5 V 1 µs  
rise-time to PGOOD = LO  
tDGL(PGOOD)  
Deglitch time, input power detected status  
1.2  
VIN: 5 V 7 V  
VIN: 5 V 11 V  
VIN: 7 V 5V  
VIN: 11 V 5 V  
(’72, ’73, ’75, '79)  
(’74)  
6.4  
6.6  
10.5  
110  
175  
50  
6.8  
VOVP  
Vhys  
Input overvoltage protection threshold  
Hysteresis on OVP  
V
10.2  
10.8  
(’72, ’73, ’75, '79)  
(’74)  
mV  
tDGL(OVP)  
tREC  
Input overvoltage blanking time (OVP fault deglitch)  
Input overvoltage recovery time  
µs  
Time measured from VIN: 11 V 5 V with 1 µs  
fall-time to PGOOD = LO  
1.2  
ms  
ILIM, ISET SHORT CIRCUIT DETECTION (CHECKED DURING STARTUP)  
ISC  
Current source  
VIN > UVLO and VIN > VBAT + VIN(DT)  
VIN > UVLO and VIN > VBAT + VIN(DT)  
1.3  
mA  
mV  
VSC  
520  
QUIESCENT CURRENT  
CE = LO or HI, input power not detected,  
No load on OUT pin, TJ = 85°C  
IBAT(PDWN)  
Sleep current into BAT pin  
6.5  
µA  
µA  
EN1= HI, EN2=HI, VIN = 6 V, TJ= 85°C  
EN1= HI, EN2=HI, VIN = 10 V, TJ= 85°C  
50  
IIN  
Standby current into IN pin  
Active supply current, IN pin  
200  
CE = LO, VIN = 6 V, no load on OUT pin,  
VBAT > VBAT(REG), (EN1, EN2) (HI, HI)  
ICC  
1.5  
mA  
POWER PATH  
VDO(IN-OUT)  
VIN – VOUT  
VIN = 4.3 V, IIN = 1A, VBAT = 4.2V  
IOUT = 1 A, VIN = 0 V, VBAT > 3 V  
VIN > VOUT + VDO(IN-OUT), VBAT < 3.2 V  
300  
50  
475  
100  
3.5  
mV  
mV  
VDO(BAT-OUT)  
VBAT – VOUT  
3.3  
3.4  
OUT pin voltage regulation (bq24072)  
VBAT  
150mV  
+
VBAT  
225mV  
+
VBAT  
270mV  
+
VIN > VOUT + VDO(IN-OUT), VBAT 3.2 V  
VO(REG)  
V
OUT pin voltage regulation (bq24073, bq24074)  
OUT pin voltage regulation (bq24075, bq24079)  
VIN > VOUT + VDO(IN-OUT)  
VIN > VOUT + VDO(IN-OUT)  
EN1 = LO, EN2 = LO  
4.3  
5.4  
90  
4.4  
5.5  
4.5  
5.6  
95  
100  
500  
mA  
IINmax  
Maximum input current  
EN1 = HI, EN2 = LO  
450  
475  
EN2 = HI, EN1 = LO  
KILIM/RILIM  
1610  
1525  
A
ILIM = 500mA to 1.5A  
1500  
1330  
200  
1720  
1720  
1500  
AΩ  
KILIM  
Maximum input current factor  
ILIM = 200mA to 500mA  
EN2 = HI, EN1 = LO, RILIM = 8 kto 1.1 kΩ  
IINmax  
VIN-DPM  
Programmable input current limit range  
mA  
V
Input voltage threshold when input current is  
reduced  
EN2 = LO, EN1 = X  
4.35  
4.5  
4.63  
VO(REG)  
180mV  
VO(REG)  
100mV  
VO(REG) –  
30mV  
(’72, ’73, ’74)  
V
V
V
Output voltage threshold when charging current is  
reduced  
VDPPM  
(’75, '79)  
4.2  
4.3  
4.4  
VBAT = 3.6V, RILIM = 1.5k, RLOAD = 10Ω → 2Ω  
V
OUT VBAT  
–40mV  
VBSUP1  
Enter battery supplement mode  
VBAT = 3.6V, RILIM = 1.5k, RLOAD = 2Ω → 10Ω  
VOUT ≥  
VBAT–20mV  
VBSUP2  
VO(SC1)  
VO(SC2)  
Exit battery supplement mode  
V
V
Output short-circuit detection threshold, power-on  
VIN > VUVLO and VIN > VBAT + VIN(DT)  
VIN > VUVLO and VIN > VBAT + VIN(DT)  
0.8  
0.9  
1
Output short-circuit detection threshold, supplement  
mode VBAT – VOUT > VO(SC2) indicates short-circuit  
200  
250  
300  
mV  
tDGL(SC2)  
tREC(SC2)  
Deglitch time, supplement mode short circuit  
Recovery time, supplement mode short circuit  
250  
60  
µs  
ms  
4
Submit Documentation Feedback  
Copyright © 2008–2009, Texas Instruments Incorporated  
Product Folder Link(s): bq24072 bq24073 bq24074 bq24075, bq24079  
 
bq24072, bq24073  
bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
ELECTRICAL CHARACTERISTICS (continued)  
Over junction temperature range (0° TJ 125°C) and the recommended supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
BATTERY CHARGER  
IBAT  
Source current for BAT pin short-circuit detection  
BAT pin short-circuit detection threshold  
VBAT = 1.5V  
VBAT rising  
4
1.6  
7.5  
1.8  
11  
2
mA  
V
VBAT(SC)  
('72, '73, '74, '75)  
('79)  
4.16  
4.059  
2.9  
4.20  
4.100  
3
4.23  
4.141  
3.1  
V
VBAT(REG)  
Battery charge voltage  
VLOWV  
Pre-charge to fast-charge transition threshold  
Deglitch time on pre-charge to fast-charge transition  
Deglitch time on fast-charge to pre-charge transition  
VIN > VUVLO and VIN > VBAT + VIN(DT)  
V
tDGL1(LOWV)  
tDGL2(LOWV)  
25  
ms  
ms  
25  
VBAT(REG) > VBAT > VLOWV, VIN = 5 V CE = LO,  
EN1 = LO, EN2 = HI  
Battery fast charge current range  
Battery fast charge current  
300  
1500  
mA  
A
ICHG  
CE = LO, EN1= LO, EN2 = HI,  
VBAT > VLOWV, VIN = 5 V, IINmax > ICHG, no load on OUT pin,  
thermal loop and DPPM loop not active  
KISET/RISET  
KISET  
Fast charge current factor  
Pre-charge current  
797  
890  
KPRECHG/RISET  
88  
975  
AΩ  
A
IPRECHG  
KPRECHG  
Pre-charge current factor  
70  
106  
AΩ  
A
CE = LO, (EN1, EN2) (LO, LO),  
0.09×ICHG  
0.1×ICHG  
0.11×ICHG  
VBAT > VRCH, t < tMAXCH, VIN = 5 V, DPPM loop and thermal  
loop not active  
Termination comparator detection threshold  
(internally set)  
ITERM  
CE = LO, (EN1, EN2) = (LO, LO),  
0.027×ICHG  
72  
0.033×ICHG 0.040×ICHG  
VBAT > VRCH, t < tMAXCH, VIN = 5 V, DPPM loop and thermal  
loop not active  
IBIAS(ITERM)  
ITERM  
Current for external termination-setting resistor  
VIN > VUVLO and VIN > VBAT + VIN(DT)  
75  
78  
µA  
Termination current threshold (externally set)  
(bq24074)  
A
KITERM × RITERM / RISET  
USB500 or ISET mode(EN1, EN2) (LO, LO)  
A
0.0225  
0.0300  
0.0375  
0.012  
CE = LO, VBAT > VRCH, t < tMAXCH, VIN = 5 V, DPPM loop and  
thermal loop not active  
K Factor for termination detection threshold  
(externally set) (bq24074)  
KITERM  
USB100 mode (EN1, EN2) = (LO, LO),  
CE = LO, VBAT > VRCH, t < tMAXCH, VIN = 5 V, DPPM loop and  
thermal loop not active  
0.008  
0.0100  
25  
tDGL(TERM)  
VRCH  
tDGL(RCH)  
tDGL(NO-IN)  
Deglitch time, termination detected  
ms  
V
VBAT(REG)  
–140mV  
VBAT(REG)  
–100mV  
VBAT(REG)  
–60mV  
Recharge detection threshold  
VIN > VUVLO and VIN > VBAT + VIN(DT)  
Deglitch time, recharge threshold detected  
Delay time, input power loss to OUT LDO turn-off  
62.5  
20  
ms  
ms  
VBAT = 3.6 V. Time measured from  
VIN: 5 V 3 V 1 µs fall-time  
IBAT(DET)  
tDET  
Sink current for battery detection  
Battery detection timer  
VBAT = 2.5V  
5
7.5  
10  
mA  
ms  
BAT high or low  
250  
BATTERY CHARGING TIMERS  
tPRECHG  
tMAXCHG  
tPRECHG  
tMAXCHG  
KTMR  
Pre-charge safety timer value  
TMR = floating  
1440  
1800  
18000  
2160  
s
s
Charge safety timer value  
Pre-charge safety timer value  
Charge safety timer value  
Timer factor  
TMR = floating  
14400  
21600  
18 k< RTMR < 72 kΩ  
18 k< RTMR < 72 kΩ  
RTMR × KTMR  
10×RTMR ×KTMR  
48  
s
s
36  
60  
s/kΩ  
BATTERY-PACK NTC MONITOR(1)  
INTC  
NTC bias current  
VIN > UVLO and VIN > VBAT + VIN(DT)  
Battery charging, VTS Falling  
72  
75  
78  
µA  
mV  
mV  
mV  
mV  
ms  
V
VHOT  
High temperature trip point  
270  
300  
330  
VHYS(HOT)  
VCOLD  
Hysteresis on high trip point  
Battery charging, VTS Rising from VHOT  
Battery charging, VTS Rising  
30  
2100  
Low temperature trip point  
2000  
2200  
VHYS(COLD)  
tDGL(TS)  
VDIS(TS)  
Hysteresis on low trip point  
Battery charging, VTS Falling from VCOLD  
TS fault detected to charger disable  
TS unconnected  
300  
Deglitch time, pack temperature fault detection  
TS function disable threshold (bq24072, bq24073)  
50  
VIN - 200mV  
THERMAL REGULATION  
TJ(REG)  
Temperature regulation limit  
125  
155  
20  
°C  
°C  
°C  
TJ(OFF)  
Thermal shutdown temperature  
Thermal shutdown hysteresis  
TJ Rising  
TJ(OFF-HYS)  
(1) These numbers set trip points of 0°C and 50°C while charging, with 3°C hysteresis on the trip points, with a Vishay Type 2 curve NTC  
with an R25 of 10 k.  
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SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
ELECTRICAL CHARACTERISTICS (continued)  
Over junction temperature range (0° TJ 125°C) and the recommended supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
LOGIC LEVELS ON EN1, EN2, CE, SYSOFF, TD  
VIL  
VIH  
IIL  
Logic LOW input voltage  
Logic HIGH input voltage  
Input sink current  
0
0.4  
6
V
V
1.4  
VIL= 0V  
1
µA  
µA  
IIH  
Input source current  
VIH= 1.4V  
10  
LOGIC LEVELS ON PGOOD, CHG  
VOL  
Output LOW voltage  
ISINK = 5 mA  
0.4  
V
RGT PACKAGE  
(Top View)  
16 15 14 13  
16 15 14 13  
16 15 14 13  
1
2
3
4
1
12  
11  
12  
1
2
3
4
12  
ILIM  
OUT  
OUT  
CHG  
ILIM  
OUT  
OUT  
CHG  
TS  
BAT  
BAT  
CE  
TS  
ILIM  
OUT  
OUT  
CHG  
TS  
BAT  
BAT  
CE  
2
bq24072  
bq24073  
11  
10  
9
11  
10  
9
BAT  
bq24075  
bq24074  
3
bq24079 10  
BAT  
4
9
CE  
5
6
7
8
5
6
7
8
5
6
7
8
PIN FUNCTIONS  
PIN  
NO.  
I/O  
DESCRIPTION  
NAME  
'72, '73  
'74  
'75, '79  
External NTC Thermistor Input. Connect the TS input to the NTC thermistor in the battery pack. TS monitors  
a 10kNTC thermistor. For applications that do not utilize the TS function, connect a 10kfixed resistor  
from TS to VSS to maintain a valid voltage level on TS.  
TS  
1
1
1
I
Charger Power Stage Output and Battery Voltage Sense Input. Connect BAT to the positive terminal of the  
battery. Bypass BAT to VSS with a 4.7 µF to 47 µF ceramic capacitor.  
BAT  
2, 3  
4
2, 3  
4
2, 3  
4
I/O  
Charge Enable Active-Low Input. Connect CE to a high logic level to place the battery charger in standby  
mode. In standby mode, OUT is active and battery supplement mode is still available. Connect CE to a low  
logic level to enable the battery charger. CE is internally pulled down with ~285 k. Do not leave CE  
unconnected to ensure proper operation.  
CE  
I
EN2  
EN1  
5
6
5
6
5
6
I
I
Input Current Limit Configuration Inputs. Use EN1 and EN2 control the maximum input current and enable  
USB compliance. See Table 2 for the description of the operation states. EN1 and EN2 are internally pulled  
down with 285 k. Do not leave EN1 or EN2 unconnected to ensure proper operation.  
Open-drain Power Good Status Indication Output. PGOOD pulls to VSS when a valid input source is  
detected. PGOOD is high-impedance when the input power is not within specified limits. Connect PGOOD to  
the desired logic voltage rail using a 1k-100kresistor, or use with an LED for visual indication.  
PGOOD  
VSS  
7
8
9
7
8
9
7
8
9
O
Ground. Connect to the thermal pad and to the ground rail of the circuit.  
Open-Drain Charging Status Indication Output. CHG pulls to VSS when the battery is charging. CHG is high  
impedance when charging is complete and when charger is disabled. Connect CHG to the desired logic  
voltage rail using a 1k-100kresistor, or use with an LED for visual indication.  
CHG  
O
System Supply Output. OUT provides a regulated output when the input is below the OVP threshold and  
above the regulation voltage. When the input is out of the operation range, OUT is connected to VBAT except  
when SYSOFF is high (bq24075 and bq24079 only). Connect OUT to the system load. Bypass OUT to VSS  
with a 4.7 µF to 47 µF ceramic capacitor.  
OUT  
ILIM  
IN  
10, 11  
12  
10, 11  
12  
10, 11  
12  
O
I
Adjustable Current Limit Programming Input. Connect a 1100 to 8 kresistor from ILIM to VSS to program  
the maximum input current (EN2=1, EN1=0). The input current includes the system load and the battery  
charge current. Leaving ILIM unconnected disables all charging.  
Input Power Connection. Connect IN to the external DC supply (AC adapter or USB port). The input operating  
range is 4.35V to 6.6V (bq24072, bq24073, bq24075, and bq24079) or 4.35V to 10.5V (bq23074). The input  
can accept voltages up to 26V without damage but operation is suspended. Connect bypass capacitor 1 µF  
to 10 µF to VSS.  
13  
13  
13  
I
6
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www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
PIN FUNCTIONS (continued)  
PIN  
NO.  
'74  
I/O  
DESCRIPTION  
NAME  
'72, '73  
'75, '79  
Timer Programming Input. TMR controls the pre-charge and fast-charge safety timers. Connect TMR to VSS  
to disable all safety timers. Connect a 18 kto 72 kresistor between TMR and VSS to program the timers  
a desired length. Leave TMR unconnected to set the timers to the default values.  
TMR  
14  
14  
14  
I
I
I
I
Termination Disable Input. Connect TD high to disable charger termination. Connect TD to VSS to enable  
charger termination. TD is checked during startup only and cannot be changed during operation. See the TD  
section in this datasheet for a description of the behavior when termination is disabled. TD is internally pulled  
down to VSS with ~285 k. Do not leave TD unconnected to ensure proper operation.  
TD  
15  
Termination Current Programming Input. Connect a 0 to 15 kresistor from ITERM to VSS to program the  
termination current. Leave ITERM unconnected to set the termination current to the default 10% termination  
threshold.  
ITERM  
SYSOFF  
15  
System Enable Input. Connect SYSOFF high to turn off the FET connecting the battery to the system output.  
When an adapter is connected, charging is also disabled. Connect SYSOFF low for normal operation.  
SYSOFF is internally pulled up to VBAT through a large resistor (~5 M). Do not leave SYSOFF unconnected  
to ensure proper operation.  
15  
Fast Charge Current Programming Input. Connect a 590 to 3 kresistor from ISET to VSS to program the  
fast charge current level. Charging is disabled if ISET is left unconnected. While charging, the voltage at ISET  
reflects the actual charging current and can be used to monitor charge current. See the SubSec2 1.1 section  
for more details.  
ISET  
16  
16  
16  
I/O  
There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device.  
The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not  
use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all  
times.  
Thermal  
Pad  
Table 1. EN1/EN2 Settings  
EN2  
EN1  
Maximum input current into IN pin  
100 mA. USB100 mode  
0
0
1
1
0
1
0
1
500 mA. USB500 mode  
Set by an external resistor from ILIM to VSS  
Standby (USB suspend mode)  
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SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
SIMPLIFIED BLOCK DIAGRAM  
250mV  
VBAT  
VO(SC1)  
OUT-SC1  
OUT-SC2  
tDGL(SC2)  
Q1  
IN  
OUT  
ISET  
EN2  
Short Detect  
225mV  
Precharge  
VIN-LOW  
2.25V  
Fastcharge  
USB100  
USB500  
TJ  
ILIM  
VREF- ILIM  
TJ(REG)  
USB-susp  
Short Detect  
VDPPM  
VO(REG)  
VOUT  
Q2  
EN2  
EN1  
VBAT(REG)  
BAT  
VBAT  
VOUT  
CHARGEPUMP  
SYSOFF  
bq24075  
bq24079  
IBIAS- ITERM  
40mV  
Supplement  
VLOWV  
225mV  
(’72, ’73, ’75)  
ITERM  
bq24074  
VRCH  
VBAT(SC)  
~3V  
I TERM-floating  
VIN  
INTC  
BAT-SC  
VBAT + V  
IN-DT  
tDGL(NO-IN)  
VHOT  
TS  
tDGL(TS)  
tDGL(PGOOD)  
Charge Control  
VUVLO  
VOVP  
VCOLD  
tBLK(OVP)  
VDIS(TS)  
EN1  
EN2  
USB Suspend  
TD  
(bq24072,  
bq24073)  
CE  
CHG  
Halt timers  
Reset timers  
VIPRECHG  
VICHG  
Dynamically  
Controlled  
Oscillator  
PGOOD  
VISET  
Fast-Charge  
Timer  
Timer fault  
TMR  
Pre-Charge  
Timer  
~100mV  
Timers disabled  
8
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bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
TYPICAL CHARACTERISTICS  
VIN = 6V, EN1=1, EN2=0, bq24073 application circuit, TA = 25°C, unless otherwise noted.  
ADAPTER PLUG-IN  
BATTERY CONNECTED  
BATTERY DETECTION  
BATTERY INSERTED  
BATTERY DETECTION  
BATTERY REMOVED  
RLOAD = 10Ω  
VIN  
VCHG  
5 V/div  
VCHG  
5 V/div  
1 A/div  
5 V/div  
1 A/div  
Charging Initiated  
VOUT  
4.4 V  
500 mV/div  
5 V/div  
VBAT  
3.6 V  
IBAT  
IBAT  
VPGOOD  
2 V/div  
2 V/div  
Battery  
Removed  
VBAT  
VBAT  
500 mA/div  
IBAT  
Battery Inserted  
Battery Detection Mode  
400 ms/div  
Battery Detection Mode  
400 ms/div  
4 ms/div  
Figure 1.  
Figure 2.  
Figure 3.  
ENTERING AND EXITING BATTERY  
SUPPLEMENT MODE  
RLOAD = 25TO 4.5Ω  
bq24074  
ENTERING AND EXITING BATTERY  
SUPPLEMENT MODE  
RLOAD = 20TO 4.5Ω  
bq24072  
ENTERING AND EXITING DPPM  
MODE  
RLOAD = 20to 9Ω  
1 A/div  
IOUT  
IOUT  
500 mA/div  
IOUT  
1 A/div  
500 mA/div  
IBAT  
IBAT  
Supplement Mode  
500 mA/div  
Supplement Mode  
IBAT  
500 mA/div  
200 mV/div  
VOUT  
3.825 V  
200 mV/div  
VOUT  
4.4 V  
VBAT  
VOUT  
4.4 V  
VBAT  
3.8 V  
3.6 V  
500 mV/div  
Tracking to VBAT +225 mV  
1 ms/div  
400 ms/div  
1 ms/div  
Figure 4.  
Figure 5.  
Figure 6.  
SYSTEM ON/OFF WITH INPUT  
CONNECTED  
OVP FAULT  
VIN = 6V to 15V  
RLOAD = 10Ω  
VIN = 6V  
CHARGER ON/OF USING CE  
bq24075, bq24079  
VCE  
5 V/div  
VSYSOFF  
5 V/div  
10 V/div  
VIN  
VCHG  
5 V/div  
1 V/div  
VOUT  
VOUT  
5.5 V  
4.4 V  
VBAT  
2 V/div  
VBAT  
VBAT  
4 V  
500 mV/div  
3.6 V  
4.2 V  
Mandatory Precharge  
500 mA/div  
500 mA/div  
IBAT  
IBAT  
1 A/div  
IBAT  
400 ms/div  
10 ms/div  
40 ms/div  
Figure 7.  
Figure 8.  
Figure 9.  
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bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
VIN = 6V, EN1=1, EN2=0, bq24073 application circuit, TA = 25°C, unless otherwise noted.  
SYSTEM ON/OFF WITH INPUT NOT  
CONNECTED  
VIN = 0V  
DROPOUT VOLTAGE  
vs  
bq24075, bq24079  
THERMAL REGULATION  
TEMPERATURE  
600  
500  
400  
0.7  
0.6  
IL = 1 A  
VSYSOFF  
5 V/div  
0.5  
0.4  
0.3  
VBAT  
4 V  
2 V/div  
300  
200  
VOUT  
Battery Powering  
System  
0.2  
0.1  
0
System Power Off  
IBAT  
500 mA/div  
100  
0
4 ms/div  
120  
125  
130  
135  
140  
145  
125  
0
25  
100  
50  
75  
Temperature - o  
C
TJ - Junction Temperature - °C  
Figure 10.  
Figure 11.  
bq24072  
Figure 12.  
DROPOUT VOLTAGE  
vs  
TEMPERATURE  
NO INPUT SUPPLY  
bq24072  
OUTPUT REGULATION VOLTAGE  
OUTPUT REGULATION VOLTAGE  
vs  
vs  
BATTERY VOLTAGE  
TEMPERATURE  
4.6  
4.4  
120  
3.80  
3.78  
3.76  
3.74  
3.72  
3.70  
3.68  
3.66  
3.64  
3.62  
3.60  
VIN = 5 V  
VIN = 5 V,  
VBAT = 3.5 V,  
IL = 1 A  
IL = 1 A  
100  
80  
4.2  
4
VBAT = 3 V  
3.8  
3.6  
3.4  
3.2  
3
60  
40  
VBAT = 3.9 V  
20  
0
125  
2
0
50  
75  
100  
3
4.5  
25  
2.5  
3.5  
4
0
25  
50  
75  
100  
125  
TJ - Junction Temperature - °C  
VBAT - Battery Voltage - V  
TJ - Junction Temperature - °C  
Figure 13.  
Figure 14.  
Figure 15.  
bq24073/ 74  
bq24075, bq24079  
OUTPUT REGULATION VOLTAGE  
OUTPUT REGULATION VOLTAGE  
BAT REGULATION VOLTAGE  
vs  
vs  
vs  
TEMPERATURE  
TEMPERATURE  
TEMPERATURE  
4.45  
4.43  
4.40  
4.38  
4.35  
5.75  
5.70  
5.65  
5.60  
4.210  
4.205  
4.200  
4.195  
VIN = 6 V,  
IL = 1 A  
VIN = 5 V,  
IL = 1 A  
5.55  
5.50  
5.45  
5.40  
4.190  
4.185  
4.180  
5.35  
4.33  
4.30  
5.30  
5.25  
0
50  
75  
100  
125  
25  
0
25  
50  
75  
100  
125  
30  
25  
10  
15  
20  
0
5
TJ - Junction Temperature - °C  
TJ - Junction Temperature - °C  
TJ - Junction Temperature - °C  
Figure 16.  
Figure 17.  
Figure 18.  
10  
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www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
TYPICAL CHARACTERISTICS (continued)  
VIN = 6V, EN1=1, EN2=0, bq24073 application circuit, TA = 25°C, unless otherwise noted.  
bq24072/ 73/ 75/ 79  
OVERVOLTAGE PROTECTION  
THRESHOLD  
bq24074  
OVERVOLTAGE PROTECTION  
THRESHOLD  
bq24074  
INPUT CURRENT LIMIT  
vs  
vs  
vs  
TEMPERATURE  
TEMPERATURE  
INPUT VOLTAGE  
6.70  
6.65  
6.60  
6.55  
10.70  
10.65  
10.60  
10.55  
10.50  
10.45  
800  
700  
600  
500  
10.5 V  
RILIM  
6.6 V  
VI Rising  
VI Rising  
USB500  
400  
300  
VI Falling  
10.40  
10.35  
10.30  
10.25  
10.20  
VI Falling  
200  
6.50  
6.45  
USB100  
100  
0
5
6
7
8
9
10  
0
25  
75  
125  
0
25  
50  
75  
100  
125  
50  
100  
VI - Input Voltage - V  
TJ - Junction Temperature - °C  
TJ - Junction Temperature - °C  
Figure 19.  
Figure 20.  
Figure 21.  
FASTCHARGE CURRENT  
vs  
BATTERY VOLTAGE  
FASTCHARGE CURRENT  
vs  
BATTERY VOLTAGE  
PRECHARGE CURRENT  
vs  
BATTERY VOLTAGE  
310  
305  
300  
295  
290  
105  
104  
1.05  
1.03  
RISET = 900 W  
RISET = 900 W  
RISET = 3 kW  
103  
102  
101  
100  
99  
1.01  
0.99  
98  
0.97  
0.95  
97  
285  
280  
96  
95  
3.6  
3
3.8  
2
2.2  
2.4  
2.6  
2.8  
3
3.4  
4
4.2  
3
3.2  
3.4  
3.6  
3.8  
4
4.2  
3.2  
VBAT - Battery Voltage - V  
VBAT - Battery Voltage - V  
VBAT - Battery Voltage - V  
Figure 22.  
Figure 23.  
Figure 24.  
PRECHARGE CURRENT  
vs  
BATTERY VOLTAGE  
31.5  
RISET = 3 kW  
31  
30.5  
30  
29.5  
29  
28.5  
2
2.2  
2.4  
2.6  
2.8  
3
VBAT - Battery Voltage - V  
Figure 25.  
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bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
APPLICATION CIRCUITS  
VIN = UVLO to VOVP, IFASTCHG = 800mA, IIN(MAX) = 1.3A, Battery Temperature Charge Range = 0°C to 50°C, 6.25  
hour Fastcharge Safety Timer  
R4  
1.5 kW  
R5  
1.5 kW  
SYSTEM  
Adaptor  
DC+  
IN  
OUT  
C2  
4.7 mF  
C1  
1 mF  
GND  
VSS  
bq24072  
bq24073  
HOST  
EN2  
EN1  
TS  
TD  
CE  
BAT  
C3  
4.7 mF  
PACK+  
TEMP  
R1  
46.4 kW  
R2  
1.18 kW  
R3  
1.13 kW  
PACK-  
Figure 26. Using bq24072/ bq24073 in a Host Controlled Charger Application  
12  
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bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
VIN = UVLO to VOVP, IFASTCHG = 800mA, IIN(MAX) = 1.3A, ITERM = 110mA, Battery Temperature Charge  
Range = 0°C to 50°C, Safety Timers disabled  
R4  
R5  
1.5 kW  
1.5 kW  
SYSTEM  
Adaptor  
DC+  
IN  
OUT  
C2  
4.7 mF  
C1  
1 mF  
GND  
VSS  
bq24074  
EN2  
EN1  
TS  
TMR  
CE  
BAT  
C3  
4.7mF  
PACK+  
TEMP  
R1  
4.12 kW  
R2  
1.18 kW  
R3  
1.13 kW  
PACK-  
Figure 27. Using bq24074 in a Stand Alone Charger Application  
VIN = UVLO to VOVP, IFASTCHG = 800mA, IIN(MAX) = 1.3A, Battery Temperature Charge Range = 0°C to 50°C,  
6.25 hour Fastcharge Safety Timer  
R4  
1.5 kW  
R5  
1.5 kW  
SYSTEM  
Adaptor  
DC+  
IN  
OUT  
C2  
4.7 mF  
C1  
1 mF  
GND  
VSS  
bq24075  
bq24079  
HOST  
EN2  
EN1  
TS  
SYSOFF  
CE  
BAT  
C3  
4.7 mF  
PACK+  
TEMP  
R1  
46.4 kW  
R2  
1.18 kW  
R3  
1.13 kW  
PACK-  
Figure 28. Using bq24075 or bq24079 to Disconnect the Battery from the System  
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EXPLANATION OF DEGLITCH TIMES AND COMPARATOR HYSTERESIS  
Figures not to scale  
V
OVP  
V
- V  
hys(OVP)  
OVP  
V
IN  
Typical Input Voltage  
Operating Range  
t < t  
DGL(OVP)  
V
+ V  
IN(DT)  
BAT  
V
+ V  
- V  
IN(DT) hys(INDT)  
BAT  
UVLO  
UVLO - V  
hys(UVLO)  
PGOOD  
t
DGL(PGOOD)  
t
t
DGL(OVP)  
DGL(NO-IN)  
t
DGL(PGOOD)  
Figure 29. Power-Up, Power-Down, Power Good Indication  
t
V
DGL1(LOWV)  
BAT  
V
LOWV  
t < t  
DGL1(LOWV)  
t
DGL2(LOWV)  
t
t < t  
DGL2(LOWV)  
DGL1(LOWV)  
I
CHG  
Fast-Charge  
Fast-Charge  
Pre-Charge  
I
PRE-CHG  
Pre-Charge  
Figure 30. Pre- to Fast-Charge, Fast- to Pre-Charge Transition – tDGL1(LOWV), tDGL2(LOWV)  
V
BAT  
V
RCH  
Re-Charge  
t < t  
DGL(RCH)  
t
DGL(RCH)  
Figure 31. Recharge – tDGL(RCH)  
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Turn  
Q2 OFF  
Force  
Q2 ON  
Force  
Q2 ON  
Turn  
Q2 OFF  
t
t
REC(SC2)  
REC(SC2)  
V
- V  
OUT  
BAT  
Recover  
V
O(SC2)  
t
t
t < t  
t < t  
DGL(SC2)  
DGL(SC2)  
DGL(SC2)  
DGL(SC2)  
Figure 32. OUT Short-Circuit – Supplement Mode  
V
COLD  
V
- V  
hys(COLD)  
COLD  
Suspend  
Charging  
Resume  
Charging  
t < t  
t
DGL(TS)  
DGL(TS)  
V
TS  
V
- V  
hys(HOT)  
HOT  
V
HOT  
Figure 33. Battery Pack Temperature Sensing – TS Pin. Battery Temperature Increasing  
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SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
DETAILED FUNCTIONAL DESCRIPTION  
The bq2407x devices are integrated Li-Ion linear chargers and system power path management devices targeted  
at space-limited portable applications. The device powers the system while simultaneously and independently  
charging the battery. This feature reduces the number of charge and discharge cycles on the battery, allows for  
proper charge termination and enables the system to run with a defective or absent battery pack. It also allows  
instant system turn-on even with a totally discharged battery. The input power source for charging the battery  
and running the system can be an AC adapter or a USB port. The devices feature Dynamic Power Path  
Management (DPPM), which shares the source current between the system and battery charging, and  
automatically reduces the charging current if the system load increases. When charging from a USB port, the  
input dynamic power management (VIN-DPM) circuit reduces the input current if the input voltage falls below a  
threshold, preventing the USB port from crashing. The power-path architecture also permits the battery to  
supplement the system current requirements when the adapter cannot deliver the peak system currents.  
UNDERVOLTAGE LOCKOUT (UVLO)  
The bq2407X family remains in power down mode when the input voltage at the IN pin is below the undervoltage  
threshold (UVLO).  
During the power down mode the host commands at the control inputs (CE, EN1 and EN2) are ignored. The Q1  
FET connected between IN and OUT pins is off, and the status outputs CHG and PGOOD are high impedance.  
The Q2 FET that connects BAT to OUT is ON. (If SYSOFF is high, Q2 is off). During power down mode, the  
VOUT(SC2) circuitry is active and monitors for overload conditions on OUT.  
POWER ON  
When VIN exceeds the UVLO threshold, the bq2407x powers up. While VIN is below VBAT + VIN(DT), the host  
commands at the control inputs (CE, EN1 and EN2) are ignored. The Q1 FET connected between IN and OUT  
pins is off, and the status outputs CHG and PGOOD are high impedance. The Q2 FET that connects BAT to  
OUT is ON. (If SYSOFF is high, Q2 is off). During this mode, the VOUT(SC2) circuitry is active and monitors for  
overload conditions on OUT.  
Once VIN rises above VBAT + VIN(DT), PGOOD is driven low to indicate the valid power status and the CE, EN1,  
and EN2 inputs are read. The device enters standby mode if (EN1 = EN2 = HI) or if an input overvoltage  
condition occurs. In standby mode, Q1 is OFF and Q2 is ON so OUT is connected to the battery input. (If  
SYSOFF is high, FET Q2 is off). During this mode, the VOUT(SC2) circuitry is active and monitors for overload  
conditions on OUT.  
When the input voltage at IN is within the valid range: VIN > UVLO AND VIN > VBAT + VIN(DT) AND VIN < VOVP, and  
the EN1 and EN2 pins indicate that the USB suspend mode is not enabled [(EN1, EN2) (HI, HI)] all internal  
timers and other circuit blocks are activated. The device then checks for short-circuits at the ISET and ILIM pins.  
If no short conditions exists, the device switches on the input FET Q1 with a 100mA current limit to checks for a  
short circuit at OUT. When VOUT is above VSC, the FET Q1 switches to the current limit threshold set by EN1,  
EN2 and RILIM and the device enters into the normal operation. During normal operation, the system is powered  
by the input source (Q1 is regulating), and the device continuously monitors the status of CE, EN1 and EN2 as  
well as the input voltage conditions.  
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PGOOD = Hi-Z  
CHG = Hi-Z  
BATTFET ON  
UVLO<VIN<VOVP  
and  
VIN>VBAT+VIN(DT)  
No  
Yes  
PGOOD = Low  
Yes  
Yes  
EN1=EN2=1  
No  
ILIM or ISET short?  
No  
Begin Startup  
IIN(MAX) 100mA  
Yes  
VOUT short?  
No  
Input Current  
Limit set by EN1  
and EN2  
No  
CE = Low  
Yes  
Begin Charging  
Figure 34. Startup Flow Diagram  
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SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
OVERVOLTAGE PROTECTION (OVP)  
The bq2407x accepts inputs up to 28V without damage. Additionally, an overvoltage protection (OVP) circuit is  
implemented that shuts off the internal LDO and discontinues charging when VIN > VOVP for a period long than  
tDGL(OVP). When in OVP, the system output (OUT) is connected to the battery and PGOOD is high impedance.  
Once the OVP condition is removed, a new power on sequence starts (See the SubSec2 0.1 section). The safety  
timers are reset and a new charge cycle will be indicated by the CHG output.  
DYNAMIC POWER-PATH MANAGEMENT  
The bq2407x features an OUT output that powers the external load connected to the battery. This output is  
active whenever a source is connected to IN or BAT. The following sections discuss the behavior of OUT with a  
source connected to IN to charge the battery and a battery source only.  
INPUT SOURCE CONNECTED (ADAPTER or USB)  
With a source connected, the dynamic power-path management (DPPM) circuitry of the bq2407x monitors the  
input current continuously. The OUT output for the bq24073/ 74/ 75/ 79 is regulated to a fixed voltage (VO(REG)).  
For the bq24072, OUT is regulated to 200mV above the voltage at BAT. When the BAT voltage falls below 3.2V,  
OUT is clamped to 3.4V. This allows for proper startup of the system load even with a discharged battery. The  
current into IN is shared between charging the battery and powering the system load at OUT. The bq2407x has  
internal selectable current limits of 100mA (USB100) and 500mA (USB500) for charging from USB ports, as well  
as a resistor-programmable input current limit.  
The bq2407x is USB IF compliant for the inrush current testing. The USB spec allows up to 10µF to be hard  
started, which establishes 50µC as the maximum inrush charge value when exceeding 100mA. The input current  
limit for the bq2407x prevents the input current from exceeding this limit, even with system capacitances greater  
than 10µF. Note that the input capacitance to the device must be selected small enough to prevent a violation  
(<10µF), as this current is not limited. Figure 35 demonstrates the startup of the bq2407x and compares it to the  
USB-IF specification.  
10μC  
50μC  
100 μs/div  
Figure 35. USB-IF Inrush Current Test  
The input current limit selection is controlled by the state of the EN1 and EN2 pins as shown in Table 1. When  
using the resistor-programmable current limit, the input current limit is set by the value of the resistor connected  
from the ILIM pin to VSS, and is given by the equation:  
IIN-MAX = KILIM/RILIM  
The input current limit is adjustable up to 1.5A. The valid resistor range is 1.1 kto 8 k.  
When the IN source is connected, priority is given to the system load. The DPPM and Battery Supplement  
modes are used to maintain the system load. Figure 37 and Figure 38 illustrate examples of the DPPM and  
supplement modes. These modes are explained in detail in the following sections.  
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Input DPM Mode (VIN-DPM)  
The bq2407x utilizes the VIN-DPM mode for operation from current-limited USB ports. When EN1 and EN2 are  
configured for USB100 (EN2=0, EN1=0) or USB500 (EN2=0, EN2=1) modes, the input voltage is monitored. If  
VIN falls to VIN-DPM, the input current limit is reduced to prevent the input voltage from falling further. This prevents  
the bq2407x from crashing poorly designed or incorrectly configured USB sources. Figure 36 shows the VIN-DPM  
behavior to a current limited source. In this figure, the input source has a 400mA current limit and the device is in  
USB500 mode (EN1=1, EN2=0).  
I
OUT  
200mA/div  
Input collapses  
V
IN  
(5V)  
500mV/div  
Input regulated to V  
IN_DPM  
USB500 Current Limit  
200mA/div  
200mA/div  
I
Input current limit is  
reduced to prevent  
crashing the supply  
IN  
I
BAT  
4 ms/div  
Figure 36. VIN-DPM Waveform  
DPPM Mode  
When the sum of the charging and system load currents exceeds the maximum input current (programmed with  
EN1, EN2 and ILIM pins), the voltage at OUT decreases. Once the voltage on the OUT pin falls to VDPPM, the  
bq2407x enters DPPM mode. In this mode, the charging current is reduced as the OUT current increases in  
order to maintain the system output. Battery termination is disabled while in DPPM mode.  
Battery Supplement Mode  
While in DPPM mode, if the charging current falls to zero and the system load current increases beyond the  
programmed input current limit, the voltage at OUT reduces further. When the OUT voltage drops below the  
VBSUP1 threshold, the battery supplements the system load. The battery stops supplementing the system load  
when the voltage at OUT rises above the VBSUP2 threshold.  
During supplement mode, the battery supplement current is not regulated (BAT-FET is fully on), however there is  
a short circuit protection circuit built in. Figure 5 demonstrates supplement mode. If during battery supplement  
mode, the voltage at OUT drops VO(SC2) below the BAT voltage, the OUT output is turned off if the overload  
exists after tDGL(SC2). The short circuit recovery timer then starts counting. After tREC(SC2), OUT turns on and  
attempts to restart. If the short circuit remains, OUT is turned off and the counter restarts. Battery termination is  
disabled while in supplement mode.  
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SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
1200 mA  
900 mA  
A
400 mA  
0 mA  
900 mA  
500 mA  
0 mA  
500 mA  
0 mA  
-300 mA  
3.8 V  
3.7 V  
~3.6 V  
DPPM Loop Active  
Supplement Mode  
Figure 37. bq24072 DPPM and Battery Supplement Modes (VOREG = VBAT + 225mV, VBAT = 3.6V)  
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1200 mA  
900 mA  
A
400 mA  
0 mA  
900 mA  
500 mA  
0 mA  
500 mA  
0 mA  
-300 mA  
4.4 V  
4.3 V  
DPPM Loop Active  
Supplement Mode  
~3.6 V  
Figure 38. bq24073 DPPM and Battery Supplement Modes (VOREG = 4.4V, VBAT = 3.6V)  
INPUT SOURCE NOT CONNECTED  
When no source is connected to the IN input, OUT is powered strictly from the battery. During this mode the  
current into OUT is not regulated, similar to Battery Supplement Mode, however the short circuit circuitry is  
active. If the OUT voltage falls below the BAT voltage by 250mV for longer than tDGL(SC2), OUT is turned off. The  
short circuit recovery timer then starts counting. After tREC(SC2), OUT turns on and attempts to restart. If the short  
circuit remains, OUT is turned off and the counter restarts. This ON/OFF cycle continues until the overload  
condition is removed.  
BATTERY CHARGING  
Set CE low to initiate battery charging. First, the device checks for a short-circuit on the BAT pin by sourcing  
IBAT(SC) to the battery and monitoring the voltage. When the BAT voltage exceeds VBAT(SC), the battery charging  
continues. The battery is charged in three phases: conditioning pre-charge, constant current fast charge (current  
regulation) and a constant voltage tapering (voltage regulation). In all charge phases, an internal control loop  
monitors the IC junction temperature and reduces the charge current if an internal temperature threshold is  
exceeded.  
Figure 39 illustrates a normal Li-Ion charge cycle using the bq2407x:  
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PRECHARGE  
CC FAST CHARGE  
CV TAPER  
DONE  
V
BAT(REG)  
I
O(CHG)  
Battery Current  
Battery Voltage  
V
LOWV  
CHG = Hi-z  
I
(PRECHG)  
I
(TERM)  
Figure 39. Typical Charge Cycle  
In the pre-charge phase, the battery is charged at with the pre-charge current (IPRECHG). Once the battery voltage  
crosses the VLOWV threshold, the battery is charged with the fast-charge current (ICHG). As the battery voltage  
reaches VBAT(REG), the battery is held at a constant voltage of VBAT(REG) and the charge current tapers off as the  
battery approaches full charge. When the battery current reaches ITERM, the CHG pin indicates charging done by  
going high-impedance.  
Note that termination detection is disabled whenever the charge rate is reduced because of the actions of the  
thermal loop, the DPPM loop or the VIN(LOW) loop.  
The value of the fast-charge current is set by the resistor connected from the ISET pin to VSS, and is given by  
the equation  
ICHG = KISET/RISET  
The charge current limit is adjustable up to 1.5A. The valid resistor range is 590to 3 k. Note that if ICHG is  
programmed as greater than the input current limit, the battery will not charge at the rate of ICHG, but at the  
slower rate of IIN(MAX) (minus the load current on the OUT pin, if any). In this case, the charger timers will be  
proportionately slowed down.  
CHARGE CURRENT TRANSLATOR  
When the charger is enabled, internal circuits generate a current proportional to the charge current at the ISET  
input. The current out of ISET is 1/400 (±10%) of the charge current. This current, when applied to the external  
charge current programming resistor, RISET, generates an analog voltage that can be monitored by an external  
host to calculate the current sourced from BAT.  
VISET = ICHARGE / 400 × RISET  
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Begin Charging  
Yes  
Battery short detected?  
No  
Start Precharge  
CHG = Low  
No  
No  
tPRECHARGE  
Elapsed?  
VBAT > VLOWV  
Yes  
End Charge  
Flash CHG  
Start Fastcharge  
CHARGE set by ISET  
I
No  
No  
tFASTCHARGE  
Elapsed?  
IBAT < ITERM  
Yes  
End Charge  
Flash CHG  
Charge Done  
CHG = Hi-Z  
TD = Low  
(72, ’73 Only)  
No  
(’74, ’75 = YES)  
Yes  
Termination Reached  
BATTFET Off  
Wait for VBAT < VRCH  
No  
VBAT < VRCH  
Yes  
Run Battery Detection  
No  
Battery Detected?  
Yes  
Figure 40. Battery Charging Flow Diagram  
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ADJUSTABLE TERMINATION THRESHOLD (ITERM Input, bq24074)  
The termination current threshold in the bq24074 is user-programmable. Set the termination current by  
connecting a resistor from ITERM to VSS. For USB100 mode (EN1 = EN2 = Low), the termination current value  
is calculated as:  
ITERM = 0.01 × RITERM/ RISET  
In the other input current limit modes (EN1 EN2), the termination current value is calculated as:  
ITERM = 0.03 × RITERM/ RISET  
The termination current is programmable up to 50% of the fastcharge current. The RITERM resistor must be less  
than 15 k. Leave ITERM unconnected to select the default internally set termination current.  
TERMINATION DISABLE (TD Input, bq24072, bq24073)  
The bq24072 and bq24073 contain a TD input that allows termination to be enabled/ disabled. Connect TD to a  
logic high to disable charge termination. When termination is disabled, the device goes through the pre-charge,  
fast-charge and CV phases, then remains in the CV phase. During the CV phase, the charger maintains the  
output voltage at BAT equal to VBAT(REG), and charging current does not terminate. The charge current is set by  
ICHG or IINmax, whichever is less. Battery detection is not performed. The CHG output is high impedance once  
the current falls below ITERM and does not go low until the input power or CE are toggled. When termination is  
disabled, the pre-charge and fast-charge safety timers are also disabled. Battery pack temperature sensing (TS  
pin functionality) is disabled if the TD pin is high and the TS pin is unconnected or pulled up to VIN.  
BATTERY DETECTION AND RECHARGE  
The bq2407x automatically detects if a battery is connected or removed. Once a charge cycle is complete, the  
battery voltage is monitored. When the battery voltage falls below VRCH, the battery detection routine is run.  
During battery detection, current (IBAT(DET)) is pulled from the battery for a duration tDET to see if the voltage on  
BAT falls below VLOWV. If not, charging begins. If it does, then it indicates that the battery is missing or the  
protector is open. Next, the precharge current is applied for tDET to close the protector if possible. If VBAT < VRCH  
,
then the protector closed and charging is initiated. If VBAT > VRCH, then the battery is determined to be missing  
and the detection routine continues.  
BATTERY DISCONNECT (SYSOFF Input, bq24075, bq24079)  
The bq24075 and bq24079 feature a SYSOFF input that allows the user to turn the FET Q2 off and disconnect  
the battery from the OUT pin. This is useful for disconnecting the system load from the battery, factory  
programming where the battery is not installed or for host side impedance track fuel gauging, such as bq27500,  
where the battery open circuit voltage level must be detected before the battery charges or discharges. The  
/CHG output remains low when SYSOFF is high. Connect SYSOFF to VSS, to turn Q2 on for normal operation.  
SYSOFF is internally pulled to VBAT through ~5 Mresistor.  
DYNAMIC CHARGE TIMERS (TMR Input)  
The bq2407x devices contain internal safety timers for the pre-charge and fast-charge phases to prevent  
potential damage to the battery and the system. The timers begin at the start of the respective charge cycles.  
The timer values are programmed by connecting a resistor from TMR to VSS. The resistor value is calculated  
using the following equation:  
tPRECHG = KTMR × RTMR  
tMAXCHG = 10 × KTMR × RTMR  
Leave TMR unconnected to select the internal default timers. Disable the timers by connecting TMR to VSS.  
Note that timers are suspended when the device is in thermal shutdown, and the timers are slowed proportionally  
to the charge current when the device enters thermal regulation. For the bq24072 and bq24073, the timers are  
disabled when TD is connected to a high logic level.  
During the fast charge phase, several events increase the timer durations.  
1. The system load current activates the DPPM loop which reduces the available charging current  
2. The input current is reduced because the input voltage has fallen to VIN(LOW)  
3. The device has entered thermal regulation because the IC junction temperature has exceeded TJ(REG)  
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During each of these events, the internal timers are slowed down proportionately to the reduction in charging  
current. For example, if the charging current is reduced by half for two minutes, the timer clock is reduced to half  
the frequency and the counter counts half as fast resulting in only one minute of "counting" time.  
If the pre charge timer expires before the battery voltage reaches VLOWV, the bq2407x indicates a fault condition.  
Additionally, if the battery current does not fall to ITERM before the fast charge timer expires, a fault is indicated.  
The CHG output flashes at approximately 2 Hz to indicate a fault condition. The fault condition is cleared by  
toggling CE or the input power, entering/ exiting USB suspend mode, or an OVP event.  
STATUS INDICATORS (PGOOD, CHG)  
The bq2407x contains two open-drain outputs that signal its status. The PGOOD output signals when a valid  
input source is connected. PGOOD is low when (VBAT + VIN(DT)) < VIN < VOVP. When the input voltage is outside  
of this range, PGOOD is high impedance.  
The charge cycle after power-up, CE going low, or exiting OVP is indicated with the CHG pin on (low - LED on),  
whereas all refresh (subsequent) charges will result in the CHG pin off (open - LED off). In addition, the CHG  
signals timer faults by flashing at approximately 2 Hz.  
PGOOD STATUS INDICATOR  
Input State  
VIN < VUVLO  
PGOOD Output  
Hi impedance  
Hi impedance  
Low  
VUVLO < VIN < VIN(DT)  
VIN(DT) < VIN < VOVP  
VIN > VOVP  
Hi impedance  
CHG STATUS INDICATOR  
Charge State  
Charging  
CHG Output  
Low (for first charge cycle)  
Flashing at 2Hz  
Charging suspended by thermal loop  
Safety timers expired  
Charging done  
Recharging after termination  
IC disabled or no valid input power  
Battery absent  
Hi impedance  
THERMAL REGULATION AND THERMAL SHUTDOWN  
The bq2407x contain a thermal regulation loop that monitors the die temperature. If the temperature exceeds  
TJ(REG), the device automatically reduces the charging current to prevent the die temperature from increasing  
further. In some cases, the die temperature continues to rise despite the operation of the thermal loop,  
particularly under high VIN and heavy OUT system load conditions. Under these conditions, if the die  
temperature increases to TJ(OFF), the input FET Q1 is turned OFF. FET Q2 is turned ON to ensure that the  
battery still powers the load on OUT. Once the device die temperature cools by TJ(OFF-HYS), the input FET Q1 is  
turned on and the device returns to thermal regulation. Continuous overtemperature conditions result in a  
"hiccup" mode. During thermal regulation, the safety timers are slowed down proportionately to the reduction in  
current limit.  
Note that this feature monitors the die temperature of the bq2407x. This is not synonymous with ambient  
temperature. Self heating exists due to the power dissipated in the IC because of the linear nature of the battery  
charging algorithm and the LDO associated with OUT. A modified charge cycle with the thermal loop active is  
shown in Figure 41. Battery termination is disabled during thermal regulation.  
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bq24072, bq24073  
bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
PRECHARGE  
THERMAL  
CC FAST  
CHARGE  
CV TAPER  
DONE  
REGULATION  
V
I
O(REG)  
O(CHG)  
Battery Voltage  
Battery Current  
V
(LOWV)  
HI-z  
I
(PRECHG)  
I
(TERM)  
T
J(REG)  
IC Junction Temperature, T  
J
Figure 41. Charge Cycle Modified by Thermal Loop  
26  
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Product Folder Link(s): bq24072 bq24073 bq24074 bq24075, bq24079  
bq24072, bq24073  
bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
BATTERY PACK TEMPERATURE MONITORING  
The bq2407x features an external battery pack temperature monitoring input. The TS input connects to the NTC  
thermistor in the battery pack to monitor battery temperature and prevent dangerous over-temperature  
conditions. During charging, INTC is sourced to TS and the voltage at TS is continuously monitored. If, at any  
time, the voltage at TS is outside of the operating range (VCOLD to VHOT), charging is suspended. The timers  
maintain their values but suspend counting. When the voltage measured at TS returns to within the operation  
window, charging is resumed and the timers continue counting. When charging is suspended due to a battery  
pack temperature fault, the CHG pin remains low and continues to indicate charging.  
For the bq24072 and bq24073, battery pack temperature sensing is disabled when termination is disabled (TD =  
High) and the voltage at TS is greater than VDIS(TS). For applications that do not require the TS monitoring  
function, connect a 10kresistor from TS to VSS to set the TS voltage at a valid level and maintain charging.  
The allowed temperature range for 103AT-2 type thermistor is 0°C to 50°C. However, the user may increase the  
range by adding two external resistors. See Figure 42 for the circuit details. The values for RT1 and RT2 are  
calculated using the following equations:  
-1500μA ´(RHOT + RCOLD) ± 20 ´ 5625μA2 ´ (RCOLD-RHOT)2 + 105μW ´(RCOLD -RHOT)  
RT1 =  
3000μA  
(2)  
1 V ´ (R1 + RHOT)  
RT2 =  
250 μA ´ RT1 + 250 μA ´ RHOT - 1 V  
(3)  
RHOT and RCOLD are the thermistor resistance at the desired hot and cold temperatures, respectively. Note  
that the temperature window cannot be tightened more than using only the thermistor connected to TS, it  
can only be extended.  
INTC  
bq2407x  
RT1  
PACK+  
TS  
TEMP  
+
VCOLD  
RT2  
PACK-  
+
VHOT  
Figure 42. Extended TS Pin Thresholds  
Copyright © 2008–2009, Texas Instruments Incorporated  
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bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
APPLICATIONS INFORMATION  
bq2407x CHARGER DESIGN EXAMPLE  
See Figure 26 to Figure 28 for Schematics of the Design Example.  
Requirements  
Supply voltage = 5V  
Fast charge current of approximately 800 mA; ISET - pin 16  
Input Current Limit =1.3A; ILIM - pin 12  
Termination Current Threshold = 110mA; ITERM – pin 15 (bq24074 only)  
Safety timer duration, Fast-Charge = 6.25 hours; TMR – pin 14  
TS – Battery Temperature Sense = 10kNTC (103AT-2)  
Calculations  
Program the Fast Charge Current (ISET):  
RISET = KISET / ICHG  
KISET = 890 Afrom the electrical characteristics table.  
RISET = 890A/0.8A = 1.1125 kΩ  
Select the closest standard value, which for this case is 1.13k. Connect this resistor between ISET (pin 16) and  
VSS  
.
Program the Input Current Limit (ILIM)  
RILIM = KILIM / II_MAX  
KILIM = 1550 Afrom the electrical characteristics table.  
RISET = 1550A/ 1.3A = 1.192 kΩ  
Select the closest standard value, which for this case is 1.18 k. Connect this resistor between ILIM (pin 12) and  
VSS  
.
Program the Termination Current Threshold (ITERM) (bq24074 only)  
RITERM = ITERM × RISET / 0.030  
RISET = 1.13 kfrom the above calculation.  
RITERM = 110mA × 1.13 k/ 0.030 = 4.143 kΩ  
Select the closest standard value, which for this case is 4.12k. Connect this resistor between ITERM (pin 15)  
and VSS. Note that when in USB100 mode (EN1 = EN2 = VSS), the termination threshold is 1/3 of the normal  
threshold.  
Program 6.25-hour Fast-Charge Safety Timer (TMR)  
RTMR = tMAXCHG / (10 × KTMR  
)
KTMR = 48 s/kfrom the electrical characteristics table.  
RTMR = (6.25 hr × 3600 s/hr) / (10 × 45 s/k) = 46.8kΩ  
Select the closest standard value, which for this case is 46.4 k. Connect this resistor between TMR (pin 2) and  
VSS  
.
TS Function  
Use a 10kNTC thermistor in the battery pack (103AT-2). For applications that do not require the TS monitoring  
function, connect a 10kresistor from TS to VSS to set the TS voltage at a valid level and maintain charging.  
28  
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bq24072, bq24073  
bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
CHG and PGOOD  
LED Status: connect a 1.5kresistor in series with a LED between OUT and CHG to indicate charging status.  
Connect a 1.5kresistor in series with a LED between OUT and PGOOD to indicate when a valid input source is  
connected.  
Processor Monitoring Status: connect a pullup resistor (on the order of 100 k) between the processor’s power  
rail and CHG and PGOOD  
Termination Disable (TD) (bq24072, bq24073 only)  
Connect TD high to disable termination. Connect TD low to enable termination.  
System ON/OFF (SYSOFF) (bq24075 or bq24079 only)  
Connect SYSOFF high to disconnect the battery from the system load. Connect SYSOFF low for normal  
operation  
SELECTING IN, OUT AND BAT pin CAPACITORS  
In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin,  
input, output and battery pins. Using the values shown on the application diagram, is recommended. After  
evaluation of these voltage signals with real system operational conditions, one can determine if capacitance  
values can be adjusted toward the minimum recommended values (DC load application) or higher values for fast  
high amplitude pulsed load applications. Note if designed high input voltage sources (bad adaptors or wrong  
adaptors), the capacitor needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values  
so a 16V capacitor may be adequate for a 30V transient (verify tested rating with capacitor manufacturer).  
THERMAL PACKAGE  
The bq24072/3/4/5 family is packaged in a thermally enhanced MLP package. The package includes a thermal  
pad to provide an effective thermal contact between the IC and the printed circuit board (PCB). The power pad  
should be directly connected to the VSS pin. Full PCB design guidelines for this package are provided in the  
application note entitled: QFN/SON PCB Attachment Application Note (SLUA271). The most common measure  
of package thermal performance is thermal impedance (θJA ) measured (or modeled) from the chip junction to the  
air surrounding the package surface (ambient). The mathematical expression for θJA is:  
θJA = (TJ - T) / P  
Where:  
TJ = chip junction temperature  
T = ambient temperature  
P = device power dissipation  
Factors that can influence the measurement and calculation of θJA include:  
1. Whether or not the device is board mounted  
2. Trace size, composition, thickness, and geometry  
3. Orientation of the device (horizontal or vertical)  
4. Volume of the ambient air surrounding the device under test and airflow  
5. Whether other surfaces are in close proximity to the device being tested  
Due to the charge profile of Li-Ion batteries the maximum power dissipation is typically seen at the beginning of  
the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack voltage  
increases to 3.4V within the first 2 minutes. The thermal time constant of the assembly typically takes a few  
minutes to heat up so when doing maximum power dissipation calculations, 3.4V is a good minimum voltage to  
use. This is verified, with the system and a fully discharged battery, by plotting temperature on the bottom of the  
PCB under the IC (pad should have multiple vias), the charge current and the battery voltage as a function of  
time. The fast charge current will start to taper off if the part goes into thermal regulation.  
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bq24074, bq24075, bq24079  
SLUS810DSEPTEMBER 2008REVISED JUNE 2009................................................................................................................................................. www.ti.com  
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal  
PowerFET. It can be calculated from the following equation when a battery pack is being charged :  
P = [V(IN) – V(OUT)] × I(OUT) + [V(OUT) – V(BAT)] × I(BAT)  
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is  
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage  
and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or  
higher than normal input source voltage. With that said, the IC will still perform as described, if the thermal loop  
is always active.  
Half-Wave Adaptors  
Some adapters implement a half rectifier topology, which causes the adapter output voltage to fall below the  
battery voltage during part of the cycle. To enable operation with adapters under those conditions, the bq2407x  
family keeps the charger on for at least 20 msec (typical) after the input power puts the part in sleep mode. This  
feature enables use of external adapters using 50 Hz networks. The input must not drop below the UVLO voltage  
for the charger to work properly. Thus, the battery voltage should be above the UVLO to help prevent the input  
from dropping out. Additional input capacitance may be needed.  
Sleep Mode  
When the input is between UVLO and VIN(DT), the device enters sleep mode. After entering sleep mode for  
>20mS the internal FET connection between the IN and OUT pin is disabled and pulling the input to ground will  
not discharge the battery, other than the leakage on the BAT pin. If one has a full 1000mAHr battery and the  
leakage is 10µA, then it would take 1000mAHr/10µA = 100000 hours (11.4 years) to discharge the battery. The  
battery’s self discharge is typically 5 times higher than this.  
Layout Tips  
To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter  
capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq2407x, with short  
trace runs to both IN, OUT and GND (thermal pad).  
All low-current GND connections should be kept separate from the high-current charge or discharge paths  
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the  
power ground path.  
The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum  
charge current in order to avoid voltage drops in these traces  
The bq2407x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad  
to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is  
also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full  
PCB design guidelines for this package are provided in the application note entitled: QFN/SON PCB  
Attachment Application Note (SLUA271).  
30  
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Product Folder Link(s): bq24072 bq24073 bq24074 bq24075, bq24079  
 
bq24072, bq24073  
bq24074, bq24075, bq24079  
www.ti.com................................................................................................................................................. SLUS810DSEPTEMBER 2008REVISED JUNE 2009  
Revision History  
Changes from Original (September 2008) to Revision A ............................................................................................... Page  
Changed device Features...................................................................................................................................................... 1  
Changed Description. ............................................................................................................................................................ 1  
Changed Typical Application Circuit ...................................................................................................................................... 1  
Changed description of CHG pin........................................................................................................................................... 6  
Changed SYSOFF Description.............................................................................................................................................. 7  
Changed the Simplified Block Diagram ................................................................................................................................. 8  
Added Figure 4 through Figure 11......................................................................................................................................... 9  
Changed APPLICATION CIRCUITS section. ...................................................................................................................... 12  
Added Using bq24075 to Disconnect the Battery from the System, Figure 28. .................................................................. 13  
Changed DETAILED FUNCTIONAL DESCRIPTION section.............................................................................................. 16  
Changed text in section - STATUS INDICATORS (PGOOD, CHG).................................................................................... 25  
Changed Table - CHG STATUS INDICATOR..................................................................................................................... 25  
Changed Equation 2 and Equation 3................................................................................................................................... 27  
Changed section - Half-Wave Adaptors .............................................................................................................................. 30  
Changes from Revision A (December 2008) to Revision B ........................................................................................... Page  
Changed VBAT(REG) max value From 4.24 V To: 4.23 V ......................................................................................................... 5  
Changes from Revision B (January 2009) to Revision C ............................................................................................... Page  
Changed Maximum input current factor values. ................................................................................................................... 4  
Changes from Revision C (March 2009) to Revision D .................................................................................................. Page  
Added Device number bq24079. ........................................................................................................................................... 1  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
2-Jul-2009  
PACKAGING INFORMATION  
Orderable Device  
BQ24072RGTR  
BQ24072RGTRG4  
BQ24072RGTT  
BQ24072RGTTG4  
BQ24073RGTR  
BQ24073RGTRG4  
BQ24073RGTT  
BQ24073RGTTG4  
BQ24074RGTR  
BQ24074RGTRG4  
BQ24074RGTT  
BQ24074RGTTG4  
BQ24075RGTR  
BQ24075RGTRG4  
BQ24075RGTT  
BQ24075RGTTG4  
BQ24079RGTR  
BQ24079RGTT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
QFN  
RGT  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
2-Jul-2009  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Jul-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
BQ24072RGTR  
BQ24072RGTT  
BQ24073RGTR  
BQ24073RGTT  
BQ24074RGTR  
BQ24074RGTT  
BQ24075RGTR  
BQ24075RGTT  
BQ24079RGTR  
BQ24079RGTT  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
3000  
250  
330.0  
180.0  
330.0  
180.0  
330.0  
180.0  
330.0  
180.0  
330.0  
180.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
1.1  
1.1  
1.1  
1.1  
1.1  
1.1  
1.1  
1.1  
1.1  
1.1  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
Q2  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Jul-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ24072RGTR  
BQ24072RGTT  
BQ24073RGTR  
BQ24073RGTT  
BQ24074RGTR  
BQ24074RGTT  
BQ24075RGTR  
BQ24075RGTT  
BQ24079RGTR  
BQ24079RGTT  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
QFN  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
RGT  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
3000  
250  
346.0  
190.5  
346.0  
190.5  
346.0  
190.5  
346.0  
190.5  
346.0  
190.5  
346.0  
212.7  
346.0  
212.7  
346.0  
212.7  
346.0  
212.7  
346.0  
212.7  
29.0  
31.8  
29.0  
31.8  
29.0  
31.8  
29.0  
31.8  
29.0  
31.8  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
Pack Materials-Page 2  
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配单直通车
BQ24072RGTTG4产品参数
型号:BQ24072RGTTG4
Brand Name:Texas Instruments
是否Rohs认证:符合
生命周期:Obsolete
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:QFN
包装说明:QFN-16
针数:16
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:5.18
Is Samacsys:N
可调阈值:YES
模拟集成电路 - 其他类型:POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码:S-PQCC-N16
JESD-609代码:e4
长度:3 mm
湿度敏感等级:2
信道数量:1
功能数量:1
端子数量:16
最高工作温度:85 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN
封装等效代码:LCC16,.12SQ,20
封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260
电源:4.5/6.3 V
认证状态:Not Qualified
座面最大高度:1 mm
子类别:Power Management Circuits
最大供电电流 (Isup):1.5 mA
最大供电电压 (Vsup):26 V
最小供电电压 (Vsup):4.35 V
标称供电电压 (Vsup):5 V
表面贴装:YES
温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD
端子节距:0.5 mm
端子位置:QUAD
阈值电压标称:6.6
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mm
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