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    产品型号BQ29410DCT3RE6的Datasheet PDF文件预览

    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    VOLTAGE PROTECTION FOR 2-, 3-, OR 4-CELL Li-Ion BATTERIES  
    nd  
    (2 -LEVEL PROTECTION)  
    FEATURES  
    FUNCTION  
    •
    2-, 3-, or 4-Cell Secondary Protection  
    Low Power Consumption ICC < 2 µA  
    [VCELL(ALL) < V(PROTECT)  
    Each cell in a multiple-cell pack is compared to an  
    internal reference voltage. If one cell reaches an  
    overvoltage condition, the protection sequence  
    begins. The bq2941x device starts charging an  
    external capacitor through the CD pin. When the CD  
    pin voltage reaches 1.2 V, the OUT pin changes  
    from a low level to a high level.  
    •
    ]
    •
    Fixed High Accuracy Overvoltage Protection  
    Threshold  
    – bq29410 = 4.35 V  
    – bq29411 = 4.40 V  
    DCT PACKAGE  
    (TOP VIEW)  
    – bq29412 = 4.45 V  
    – bq29413 = 4.50 V  
    1
    2
    3
    4
    8
    OUT  
    VDD  
    CD  
    VC1  
    VC2  
    VC3  
    – bq29414 = 4.55 V  
    7
    6
    5
    – bq29415 = 4.60 V  
    •
    •
    •
    Programmable Delay Time of Detection  
    High Power Supply Ripple Rejection  
    Stable During Pulse Charge Operation  
    VC4  
    GND  
    PW PACKAGE  
    (TOP VIEW)  
    APPLICATIONS  
    •
    2nd-Level Overvoltage Protection in Li-Ion  
    Battery Packs in:  
    1
    2
    3
    4
    8
    7
    6
    5
    VC1  
    OUT  
    VC2  
    VC3  
    GND  
    VDD  
    CD  
    – Notebook Computers  
    – Portable Instrumentation  
    – Portable Equipment  
    VC4  
    DESCRIPTION  
    The bq2941x is a secondary overvoltage protection  
    IC for 2-, 3-, or 4-cell lithium-ion battery packs that  
    incorporates a high-accuracy precision overvoltage  
    detection circuit. It includes a programmable delay  
    circuit for overvoltage detection time.  
    Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
    Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
    UNLESS OTHERWISE NOTED this document contains  
    Copyright © 2005–2006, Texas Instruments Incorporated  
    PRODUCTION DATA information current as of publication date.  
    Products conform to specifications per the terms of Texas  
    Instruments standard warranty. Production processing does not  
    necessarily include testing of all parameters.  
    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
    during storage or handling to prevent electrostatic damage to the MOS gates.  
    ORDERING INFORMATION(1)  
    PACKAGE(3)  
    (2)  
    TA  
    V(PROTECT)  
    MSOP (DCT)  
    bq29410DCT3R  
    bq29410DCTR  
    bq29410DCTT  
    bq29411DCT3R  
    bq29411DCTR  
    bq29411DCTT  
    bq29412DCT3R  
    bq29412DCTR  
    bq29412DCTT  
    bq29413DCTR  
    bq29413DCTT  
    bq29414DCTR(4)  
    bq29414DCTT(4)  
    bq29415DCTR(4)  
    bq29415DCTT(4)  
    SYMBOL  
    SSOP (PW)  
    bq29410PW  
    bq29410PWR  
    4.35 V  
    CJG  
    bq29410PWG4  
    bq29410PWRG4  
    bq29411PW  
    bq29411PWR  
    4.40 V  
    4.45 V  
    CJH  
    CJJ  
    bq29411PWG4  
    bq29411PWRG4  
    bq29412PW  
    bq29412PWR  
    –40°C to 110°C  
    bq29412PWG4  
    bq29412PWRG4  
    4.50 V  
    4.55 V  
    4.60 V  
    CJk  
    CJL  
    CJM  
    bq29413PW  
    bq29414PW(4)  
    bq29415PW(4)  
    bq29413PWR  
    bq29414PWR(4)  
    bq29415PWR(4)  
    (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
    Web site at www.ti.com.  
    (2) Contact your local Texas Instruments representative or sales office for alternative overvoltage threshold options.  
    (3) The "R" suffix indicates tape-and-reel packaging.  
    (4) Product Preview  
    ABSOLUTE MAXIMUM RATINGS  
    over operating free-air temperature range unless otherwise noted(1)(2)  
    UNIT  
    Supply voltage range  
    Input voltage range  
    VDD  
    –0.3 V to 28 V  
    –0.3 V to 28 V  
    VC1, VC2, VC3, VC4  
    VC1 TO VC2, VC2 TO VC3, VC3 TO VC4, VC4 TO GND  
    –0.3 V to 8 V  
    OUT  
    CD  
    –0.3 V to 28 V  
    Output voltage range  
    –0.3 V to 28 V  
    Continuous total power dissipation  
    Storage temperature range, Tstg  
    Lead temperature (soldering, 10 s)  
    See Dissipation Rating Table  
    –65°C to 150°C  
    300°C  
    (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
    only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
    conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
    (2) All voltages are with respect to ground of this device except the differential voltage of VC1-VC2, VC2-VC3, VC3-VC4, and VC4-GND.  
    PACKAGE DISSIPATION RATINGS  
    TA = 25°C  
    POWER RATING  
    DERATING FACTOR  
    ABOVE TA = 25°C  
    TA = 70°C  
    POWER RATING  
    TA = 85°C  
    POWER RATING  
    PACKAGE  
    DCT  
    PW  
    412 mW  
    525 mW  
    3.3 mW/°C  
    4.2 mW/°C  
    264 mW  
    336 mW  
    214 mW  
    273 mW  
    2
    Submit Documentation Feedback  
    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    RECOMMENDED OPERATING CONDITIONS  
    MIN NOM  
    MAX UNIT  
    VDD  
    VI  
    Supply voltage  
    4
    25  
    VDD  
    5
    V
    VC1, VC2, VC3, VC4  
    0
    Input voltage range  
    V
    VCn – VC (n=1), (n=1, 2, 3), VC4 – GND  
    0
    td(CD) Delay time capacitance  
    0.22  
    µF  
    Ω
    RIN  
    CIN  
    RVD  
    CVD  
    TA  
    Voltage-monitor filter resistance  
    Voltage-monitor filter capacitance  
    100  
    0.01  
    0
    1k  
    0.1  
    µF  
    kΩ  
    µF  
    °C  
    Supply-voltage filter resistance  
    Supply-voltage filter capacitance  
    Operating ambient temperature range  
    1
    0.1  
    –40  
    110  
    ELECTRICAL CHARACTERISTICS  
    over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)  
    PARAMETER  
    TEST CONDITION  
    MIN NOM MAX UNIT  
    TA = 25°C  
    25  
    25  
    35  
    50  
    80  
    Overvoltage detection  
    accuracy  
    V(OA)  
    TA = –20°C to 85°C  
    TA = –40°C to 110°C  
    bq29410  
    mV  
    4.35  
    4.40  
    4.45  
    4.50  
    4.55  
    4.60  
    bq29411  
    bq29412  
    Overvoltage  
    V(PROTECT)  
    V
    detection voltage(1)  
    bq29413  
    bq29414  
    bq29415  
    Overvoltage detection  
    hysteresis(1)  
    Vhys  
    IIN  
    300  
    mV  
    µA  
    V2, V3 , VC4 input ,VDD = VC1  
    VC1 = VC2 = VC3 = VC4 = 3.5 V (see Figure 1)  
    Input current  
    0.3  
    2
    Overvoltage detection delay  
    time  
    tD1  
    VDD = VC1, CD = 0.22 µF  
    VDD = VC1, CD = 1 V  
    1
    5
    1.5  
    12  
    S
    I(CD_dis)  
    CD GND clamp current  
    µA  
    VDD = VC1,  
    VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V  
    (see Figure 1)  
    2
    3
    ICC  
    Supply current  
    µA  
    V
    VDD = VC1,  
    VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 2.3 V  
    (see Figure 1)  
    1.5  
    2.5  
    VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND =  
    V(PROTECT)Max, VDD = VC1, IOH = 0 mA  
    7
    2
    V(OUT)  
    OUT pin drive voltage  
    VC1 = VC2 = VC3 = VC4 = V(PROTECT)Max,  
    VDD = 4.3 V, TA = 0°C to 70°C, IOH = 40 µA  
    1.5  
    –1  
    5
    2.5  
    OUT = 3 V,  
    VC1 = VC2 = VC3 = VC4 = 4.7 V  
    IOH  
    IOL  
    High-level output current  
    Low-level output current  
    mA  
    µA  
    OUT = 0.1 V, VDD = VC1,  
    VC1–VC2 = VC2–VC3 = VC3–VC4 = VC4–GND = 3.5 V  
    (1) Levels of the overvoltage detection and the hysteresis can be adjusted. For assistance, contact a Texas Instruments sales  
    representative.  
    3
    Submit Documentation Feedback  
    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    OUT  
    7
    VC1
    VC2
    VDD  
    CD  
    VC3
    GND
    3
    4
    VC4  
    Figure 1. ICC, IIN Measurement (DCT Package)  
    Terminal Functions  
    TERMINAL  
    DESCRIPTION  
    MSOP  
    (DCT)  
    TSSOP  
    (PW)  
    NAME  
    8
    7
    6
    5
    4
    3
    2
    1
    1
    2
    3
    4
    5
    6
    7
    8
    VC1  
    VC2  
    VC3  
    GND  
    VC4  
    CD  
    Sense voltage input for most positive cell  
    Sense voltage input for second most positive cell  
    Sense voltage input for third most positive cell  
    Ground pin  
    Sense voltage input for least positive cell  
    An external capacitor is connected to determine the programmable delay time  
    Power supply  
    VDD  
    OUT  
    Output  
    4
    Submit Documentation Feedback  
    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    FUNCTIONAL BLOCK DIAGRAM  
    R
    VD  
    C
    VD  
    VDD  
    VC1  
    VC2  
    R
    R
    IN  
    I
    = 0.2 A (TYP)  
    CD  
    C
    IN  
    IN  
    C
    IN  
    VC3  
    OUT  
    R
    R
    IN  
    C
    IN  
    VC4  
    1.2 V (TYP)  
    IN  
    C
    IN  
    GND  
    CD  
    C(DELAY)  
    OVERVOLTAGE PROTECTION  
    When one of the cell voltages exceeds V(PROTECT), an internal current source begins to charge the capacitor,  
    C(DELAY), connected to the CD pin. If the voltage at the CD pin, VCD, reaches 1.2 V, the OUT pin is activated and  
    transitions high. An externally connected NCH FET is activiated and blows the external fuse in the positive  
    battery rail; see the functional block diagram.  
    If all cell voltages fall below V(PROTECT) before the voltage at pin CD reaches 1.2 V, the delay time does not run  
    out. An internal switch clamps the CD pin to GND and discharges the capacitor, C(DELAY), and secures the full  
    delay time for the next occurring overvoltage event.  
    Once the pin OUT is activated, it transitions back from high to low after all battery cells reach V(PROTECT)– Vhys.  
    DELAY TIME CALCULATION  
    The delay time is calculated as follows:  
    ƪ1.2 V   C(DELAY)ƫ  
    t
    +
    d
    I
    CD  
    ƪtd   ICDƫ  
    C
    +
    (DELAY)  
    1.2 V  
    Where I(CD) = CD current source = 0.18 µA  
    5
    Submit Documentation Feedback  
    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    V
    (PROTECT)  
    V
    - V  
    hys  
    (PROTECT)  
    Cell Voltage  
    (VCn - VC(n-1),  
    VC4 - GND)  
    1.2 V  
    CD  
    t
    DELAY  
    OUT  
    t = (1.2 V x C  
    )/I  
    d
    DELAY CD  
    Figure 2. Timing for Overvoltage Sensing  
    APPLICATION INFORMATION  
    BATTERY CONNECTIONS  
    The following diagrams show the DCT package device in different cell configurations.  
    OUT  
    7
    OUT  
    7
    VC1  
    VC2  
    VC1  
    VC2  
    VDD  
    CD  
    VDD  
    CD  
    VC3
    3
    4
    VC3
    3
    4
    VC4  
    GND  
    VC4  
    GND  
    Figure 3. 4-Series Cell Configuration  
    Figure 4. 3-Series Cell Configuration  
    (Connect together VC1 and VC2)  
    6
    Submit Documentation Feedback  
    bq29410, bq29411, bq29412  
    bq29413, bq29414, bq29415  
    www.ti.com  
    SLUS669D–AUGUST 2005–REVISED OCTOBER 2006  
    APPLICATION INFORMATION (continued)  
    8
    7
    1
    2
    OUT  
    VC1  
    VC2  
    VC3  
    GND  
    VDD  
    CD  
    3
    6
    5
    4
    VC4  
    Figure 5. 2-Series Cell Configuration  
    CELL CONNECTIONS  
    To prevent incorrect output activation, the following connection sequences must be used.  
    4-Series Cell Configuration  
    •
    •
    VC1(=VDD) → VC2 → VC3 → VC4 → GND or  
    GND → VC4 → VC3 → VC2 → VC1(=VDD)  
    3-Series Cell Configuration  
    •
    •
    VC1(=VC2=VDD) → VC3 → VC4 → GND or  
    GND → VC4 → VC3 → VC1(=VC2=VDD)  
    2-Series Cell Configuration  
    •
    •
    VC1(=VC2=VC3=VDD) → VC4 → GND or  
    GND → VC4 → VC1(=VC2=VC3=VDD)  
    7
    Submit Documentation Feedback  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    12-Jan-2007  
    PACKAGING INFORMATION  
    Orderable Device  
    BQ29410DCT3R  
    BQ29410DCT3RE6  
    BQ29410DCTR  
    Status (1)  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    Package Package  
    Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
    Qty  
    Type  
    Drawing  
    SM8  
    DCT  
    8
    8
    8
    8
    8
    8
    3000  
    Pb-Free  
    (RoHS)  
    CU SNBI  
    Level-1-260C-UNLIM  
    SM8  
    SM8  
    SM8  
    SM8  
    SM8  
    DCT  
    DCT  
    DCT  
    DCT  
    DCT  
    3000  
    Pb-Free  
    (RoHS)  
    CU SNBI  
    Level-1-260C-UNLIM  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29410DCTRG4  
    BQ29410DCTT  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29410DCTTG4  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29410PW  
    BQ29410PWR  
    BQ29410PWRG4  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    TSSOP  
    TSSOP  
    TSSOP  
    PW  
    PW  
    PW  
    8
    8
    8
    150  
    TBD  
    TBD  
    CU NIPDAU Level-1-220C-UNLIM  
    CU NIPDAU Level-1-220C-UNLIM  
    2000  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29411DCT3R  
    BQ29411DCT3RE6  
    BQ29411DCTR  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    SM8  
    SM8  
    SM8  
    SM8  
    SM8  
    SM8  
    DCT  
    DCT  
    DCT  
    DCT  
    DCT  
    DCT  
    8
    8
    8
    8
    8
    8
    3000  
    Pb-Free  
    (RoHS)  
    CU SNBI  
    Level-1-260C-UNLIM  
    3000  
    Pb-Free  
    (RoHS)  
    CU SNBI  
    Level-1-260C-UNLIM  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29411DCTRG4  
    BQ29411DCTT  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29411DCTTG4  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29411PW  
    BQ29411PWR  
    BQ29411PWRG4  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    TSSOP  
    TSSOP  
    TSSOP  
    PW  
    PW  
    PW  
    8
    8
    8
    150  
    TBD  
    TBD  
    CU NIPDAU Level-1-220C-UNLIM  
    CU NIPDAU Level-1-220C-UNLIM  
    2000  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29412DCT3R  
    ACTIVE  
    ACTIVE  
    SM8  
    SM8  
    DCT  
    DCT  
    8
    8
    3000  
    Pb-Free  
    (RoHS)  
    CU SNBI  
    CU SNBI  
    Call TI  
    Level-1-260C-UNLIM  
    Level-1-260C-UNLIM  
    Call TI  
    BQ29412DCT3RE6  
    3000  
    Pb-Free  
    (RoHS)  
    BQ29412DCT3T  
    BQ29412DCTR  
    PREVIEW  
    ACTIVE  
    8
    8
    TBD  
    SM8  
    SM8  
    SM8  
    SM8  
    DCT  
    DCT  
    DCT  
    DCT  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29412DCTRG4  
    BQ29412DCTT  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    8
    8
    8
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29412DCTTG4  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    BQ29412PW  
    ACTIVE  
    ACTIVE  
    TSSOP  
    TSSOP  
    PW  
    PW  
    8
    8
    150  
    TBD  
    CU NIPDAU Level-1-220C-UNLIM  
    BQ29412PWG4  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    Addendum-Page 1  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    12-Jan-2007  
    Orderable Device  
    Status (1)  
    Package Package  
    Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
    Qty  
    Type  
    Drawing  
    BQ29412PWR  
    ACTIVE  
    ACTIVE  
    TSSOP  
    TSSOP  
    PW  
    8
    8
    2000  
    TBD  
    CU NIPDAU Level-1-220C-UNLIM  
    BQ29412PWRG4  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29413DCTR  
    BQ29413DCTRG4  
    BQ29413DCTT  
    BQ29413DCTTG4  
    BQ29413PW  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    ACTIVE  
    SM8  
    SM8  
    DCT  
    DCT  
    DCT  
    DCT  
    PW  
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    8
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    SM8  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29413PWG4  
    BQ29413PWR  
    PW  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29413PWRG4  
    BQ29414DCTR  
    BQ29414DCTRG4  
    BQ29414DCTT  
    BQ29414DCTTG4  
    BQ29414PW  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    DCT  
    DCT  
    DCT  
    DCT  
    PW  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    SM8  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29414PWG4  
    BQ29414PWR  
    PW  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29414PWRG4  
    BQ29415DCTR  
    BQ29415DCTRG4  
    BQ29415DCTT  
    BQ29415DCTTG4  
    BQ29415PW  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    DCT  
    DCT  
    DCT  
    DCT  
    PW  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    SM8  
    250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
    no Sb/Br)  
    TSSOP  
    TSSOP  
    TSSOP  
    TSSOP  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29415PWG4  
    BQ29415PWR  
    PW  
    150 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    BQ29415PWRG4  
    PW  
    2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
    no Sb/Br)  
    Addendum-Page 2  
    PACKAGE OPTION ADDENDUM  
    www.ti.com  
    12-Jan-2007  
    (1) The marketing status values are defined as follows:  
    ACTIVE: Product device recommended for new designs.  
    LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
    NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
    a new design.  
    PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
    OBSOLETE: TI has discontinued the production of the device.  
    (2)  
    Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
    http://www.ti.com/productcontent for the latest availability information and additional product content details.  
    TBD: The Pb-Free/Green conversion plan has not been defined.  
    Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
    for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
    at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
    Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
    package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
    compatible) as defined above.  
    Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
    retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
    (3)  
    MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
    temperature.  
    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
    provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
    accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
    reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
    incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
    information may not be available for release.  
    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
    to Customer on an annual basis.  
    Addendum-Page 3  
    MECHANICAL DATA  
    MPDS049B – MAY 1999 – REVISED OCTOBER 2002  
    DCT (R-PDSO-G8)  
    PLASTIC SMALL-OUTLINE PACKAGE  
    0,30  
    0,15  
    M
    0,13  
    0,65  
    8
    5
    0,15 NOM  
    2,90  
    2,70  
    4,25  
    3,75  
    Gage Plane  
    PIN 1  
    INDEX AREA  
    0,25  
    1
    4
    0° – 8°  
    0,60  
    0,20  
    3,15  
    2,75  
    1,30 MAX  
    Seating Plane  
    0,10  
    0,10  
    0,00  
    4188781/C 09/02  
    NOTES: A. All linear dimensions are in millimeters.  
    B. This drawing is subject to change without notice.  
    C. Body dimensions do not include mold flash or protrusion  
    D. Falls within JEDEC MO-187 variation DA.  
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    MECHANICAL DATA  
    MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
    PW (R-PDSO-G**)  
    PLASTIC SMALL-OUTLINE PACKAGE  
    14 PINS SHOWN  
    0,30  
    0,19  
    M
    0,10  
    0,65  
    14  
    8
    0,15 NOM  
    4,50  
    4,30  
    6,60  
    6,20  
    Gage Plane  
    0,25  
    1
    7
    0°–8°  
    A
    0,75  
    0,50  
    Seating Plane  
    0,10  
    0,15  
    0,05  
    1,20 MAX  
    PINS **  
    8
    14  
    16  
    20  
    24  
    28  
    DIM  
    3,10  
    2,90  
    5,10  
    4,90  
    5,10  
    4,90  
    6,60  
    6,40  
    7,90  
    9,80  
    9,60  
    A MAX  
    A MIN  
    7,70  
    4040064/F 01/97  
    NOTES: A. All linear dimensions are in millimeters.  
    B. This drawing is subject to change without notice.  
    C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
    D. Falls within JEDEC MO-153  
    POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
    IMPORTANT NOTICE  
    Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
    enhancements, improvements, and other changes to its products and services at any time and to  
    discontinue any product or service without notice. Customers should obtain the latest relevant information  
    before placing orders and should verify that such information is current and complete. All products are sold  
    subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
    TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
    accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent  
    TI deems necessary to support this warranty. Except where mandated by government requirements, testing  
    of all parameters of each product is not necessarily performed.  
    TI assumes no liability for applications assistance or customer product design. Customers are responsible  
    for their products and applications using TI components. To minimize the risks associated with customer  
    products and applications, customers should provide adequate design and operating safeguards.  
    TI does not warrant or represent that any license, either express or implied, is granted under any TI patent  
    right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,  
    or process in which TI products or services are used. Information published by TI regarding third-party  
    products or services does not constitute a license from TI to use such products or services or a warranty or  
    endorsement thereof. Use of such information may require a license from a third party under the patents or  
    other intellectual property of the third party, or a license from TI under the patents or other intellectual  
    property of TI.  
    Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
    alteration and is accompanied by all associated warranties, conditions, limitations, and notices.  
    Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not  
    responsible or liable for such altered documentation.  
    Resale of TI products or services with statements different from or beyond the parameters stated by TI for  
    that product or service voids all express and any implied warranties for the associated TI product or service  
    and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
    Following are URLs where you can obtain information on other Texas Instruments products and application  
    solutions:  
    Products  
    Amplifiers  
    Data Converters  
    DSP  
    Interface  
    Applications  
    Audio  
    Automotive  
    Broadband  
    Digital Control  
    Military  
    amplifier.ti.com  
    dataconverter.ti.com  
    dsp.ti.com  
    interface.ti.com  
    logic.ti.com  
    www.ti.com/audio  
    www.ti.com/automotive  
    www.ti.com/broadband  
    www.ti.com/digitalcontrol  
    www.ti.com/military  
    Logic  
    Power Mgmt  
    Microcontrollers  
    Low Power Wireless  
    power.ti.com  
    microcontroller.ti.com  
    www.ti.com/lpw  
    Optical Networking  
    Security  
    Telephony  
    Video & Imaging  
    Wireless  
    www.ti.com/opticalnetwork  
    www.ti.com/security  
    www.ti.com/telephony  
    www.ti.com/video  
    www.ti.com/wireless  
    Mailing Address:  
    Texas Instruments  
    Post Office Box 655303 Dallas, Texas 75265  
    Copyright © 2007, Texas Instruments Incorporated  
    配单直通车
    BQ29410DCT3RE6产品参数
    型号:BQ29410DCT3RE6
    Brand Name：Texas Instruments
    是否无铅： 不含铅
    是否Rohs认证： 符合
    生命周期：Active
    零件包装代码：MSOP
    包装说明：LSSOP,
    针数：8
    Reach Compliance Code：compliant
    ECCN代码：EAR99
    HTS代码：8542.39.00.01
    Factory Lead Time：6 weeks
    风险等级：5.14
    Is Samacsys：N
    可调阈值：NO
    模拟集成电路 - 其他类型：POWER SUPPLY SUPPORT CIRCUIT
    JESD-30 代码：R-PDSO-G8
    JESD-609代码：e6
    长度：2.95 mm
    湿度敏感等级：1
    信道数量：1
    功能数量：1
    端子数量：8
    最高工作温度：110 °C
    最低工作温度：-40 °C
    封装主体材料：PLASTIC/EPOXY
    封装代码：LSSOP
    封装形状：RECTANGULAR
    封装形式：SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
    峰值回流温度（摄氏度）：260
    认证状态：Not Qualified
    座面最大高度：1.3 mm
    最大供电电压 (Vsup)：25 V
    最小供电电压 (Vsup)：4 V
    标称供电电压 (Vsup)：14 V
    表面贴装：YES
    温度等级：INDUSTRIAL
    端子面层：Tin/Bismuth (Sn/Bi)
    端子形式：GULL WING
    端子节距：0.65 mm
    端子位置：DUAL
    处于峰值回流温度下的最长时间：NOT SPECIFIED
    宽度：2.8 mm
    Base Number Matches：1
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