BTA06T-600CWRG全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

BTA/BTB08 and T8 Series



SNUBBERLESS, LOGIC LEVEL & STANDARD

8A TRIACS

MAIN FEATURES:

A2

Symbol

Value

8

Unit

A

G

I

T(RMS)

A1

A2

G

A2

G

A1

V

/V

600 and 800

V

DRM RRM

2

DPAK

(T8-B)

D PAK

(T8-G)

I

5 to 50

mA

GT (Q )

1

A2

DESCRIPTION

Available either in through-hole or surface-mount

packages, the BTA/BTB08 and T8 triac series is

suitable for general purpose AC switching. They

can be used as an ON/OFF function in

applications such as static relays, heating

regulation, induction motor starting circuits... or for

phase control operation in light dimmers, motor

speed controllers,...

A1

A2

IPAK

(T8-H)

G

A2

The snubberless versions (BTA/BTB...W and T8

series) are specially recommended for use on

inductive loads, thanks to their high commutation

performances. By using an internal ceramic pad,

the BTA series provides voltage insulated tab

(rated at 2500V RMS) complying with UL

standards (File ref.: E81734)

A1

A2

A1

A2

G

TO-220AB Insulated

(BTA08)

TO-220AB

(BTB08)

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

I

RMS on-state current (full sine wave)

A

T(RMS)

DPAK / D PAK

IPAK / TO-220AB

Tc = 110°C

8

TO-220AB Ins.

F = 50 Hz

Tc = 100°C

t = 20 ms

I

Non repetitive surge peak on-state

current (full cycle, Tj initial = 25°C)

80

84

A

TSM

F = 60 Hz

t = 16.7 ms

tp = 10 ms

45

50

A s

I t

I t Value for fusing

Critical rate of rise of on-state current

dI/dt

F = 120 Hz

Tj = 125°C

A/µs

I

= 2 x I , tr ≤ 100 ns

G

GT

I

Peak gate current

tp = 20 µs

Tj = 125°C

4

1

A

GM

P

Average gate power dissipation

W

G(AV)

T

Storage junction temperature range

Operating junction temperature range

- 40 to + 150

- 40 to + 125

stg

°C

T

j

September 2000 - Ed: 3

1/10

BTA/BTB08 and T8 Series

ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)

■ SNUBBERLESS and LOGIC LEVEL (3 Quadrants)

Symbol

Test Conditions

Quadrant

T8

BTA/BTB08

Unit

T810 T835

TW

SW

CW

BW

I

(1)

mA

V

I - II - III MAX.

10

35

5

10

35

50

GT

V

= 12 V

R = 30 Ω

L

D

1.3

0.2

GT

V

= V

R = 3.3 kΩ I - II - III

MIN.

DRM

L

GD

(2)

V

Tj = 125°C

I

I = 100 mA

MAX.

15

35

10

15

35

50

mA

H

T

I

= 1.2 I

I - III

II

25

30

50

60

10

15

25

30

50

60

70

80

G

GT

L

dV/dt (2)

V

= 67 %V

gate open

D

DRM

MIN.

40

400

20

40

400

1000

V/µs

Tj = 125°C

(dI/dt)c (2) (dV/dt)c = 0.1 V/µs Tj = 125°C

(dV/dt)c = 10 V/µs Tj = 125°C

5.4

2.8

-

3.5

1.5

-

5.4

2.8

-

A/ms

Without snubber

Tj = 125°C

4.5

7

■ STANDARD (4 Quadrants)

Symbol

Test Conditions

Quadrant

BTA/BTB08

Unit

C

B

I

(1)

I - II - III

IV

25

50

100

mA

GT

V

MAX.

V

= 12 V

R = 30 Ω

D

L

ALL

MAX.

MIN.

1.3

0.2

V

GT

V

= V

R = 3.3 kΩ Tj = 125°C

GD

DRM

L

I

(2)

L

I = 500 mA

T

MAX.

25

50

mA

H

I

= 1.2 I

I - III - IV

II

40

80

200

5

50

100

400

10

G

GT

dV/dt (2)

V

= 67 %V

gate open Tj = 125°C

MIN.

V/µs

D

DRM

(dV/dt)c (2) (dI/dt)c = 3.5 A/ms

Tj = 125°C

STATIC CHARACTERISTICS

Symbol

Test Conditions

Tj = 25°C

Value

Unit

V

(2)

I

= 11 A

TM

tp = 380 µs

MAX.

1.55

0.85

50

V

TM

V

Threshold voltage

Tj = 125°C

Tj = 25°C

Tj = 125°C

MAX.

to

R (2)

Dynamic resistance

mΩ

µA

mA

d

I

V

= V

RRM

5

DRM

MAX.

I

1

RRM

Note 1: minimum IGT is guaranted at 5% of IGT max.

Note 2: for both polarities of A2 referenced to A1

2/10

BTA/BTB08 and T8 Series

THERMAL RESISTANCES

Symbol

Parameter

Value

Unit

R

Junction to case (AC)

°C/W

th(j-c)

DPAK / D PAK

IPAK / TO-220AB

1.6

TO-220AB Insulated

D PAK

2.5

45

R

Junction to ambient

°C/W

th(j-a)

S = 1 cm

S = 0.5 cm

DPAK

70

60

TO-220AB

TO-220AB Insulated

IPAK

100

S = Copper surface under tab

PRODUCT SELECTOR

Voltage (xxx)

Package

Part Number

Sensitivity

Type

600 V

800 V

BTA/BTB08-xxxB

BTA/BTB108-xxxBW

BTA/BTB08-xxxC

BTA/BTB08-xxxCW

BTA/BTB08-xxxSW

BTA/BTB08-xxxTW

T810-xxxB

X

50 mA

25 mA

35 mA

10 mA

5 mA

Standard

Snubberless

Standard

TO-220AB

DPAK

Snubberless

Logic level

Snubberless

10 mA

35mA

T810-xxxH

IPAK

T835-xxxB

DPAK

T835-xxxG

T835-xxxH

X

35 mA

Snubberless

D PAK

IPAK

BTB: non insulated TO-220AB package

3/10

BTA/BTB08 and T8 Series

ORDERING INFORMATION

BT A 08 - 600 BW

TRIAC

SERIES

SENSITIVITY &TYPE

B: 50mA STANDARD

BW: 50mA SNUBBERLESS

C: 25mA STANDARD

CW: 35mA SNUBBERLESS

SW: 10mA LOGIC LEVEL

TW: 5mA LOGIC LEVEL

INSULATION:

A: insulated

B: non insulated

VOLTAGE:

600: 600V

800: 800V

CURRENT:8A

T 8 10 - 600 B (-TR)

TRIAC

SERIES

PACKAGE:

B: DPAK

CURRENT:8A

G: D²PAK

VOLTAGE:

PACKING MODE:

H: IPAK

600: 600V

800: 800V

Blank:Tube

-TR: DPAK / D²PAK

Tape & Reel

SENSITIVITY:

10: 10mA

35: 35mA

OTHER INFORMATION

Part Number

Base

quantity

Packing

mode

Marking

Weight

BTA/BTB08-xxxyz

T8yy-xxxB

BTA/BTB08xxxyz

T8yyxxx

2.3 g

0.3 g

0.4 g

1.5 g

250

75

Bulk

Tube

T8yy-xxxB-TR

T8yy-xxxH

T8yyxxx

2500

75

Tape & reel

Tube

T8yyxxx

T8yy-xxxG

T8yyxxx

50

Tube

T8yy-xxxG-TR

T8yyxxx

1000

Tape & reel

Note: xxx = voltage, yy = sensitivity, z = type

4/10

BTA/BTB08 and T8 Series

Fig. 1: Maximum power dissipation versus RMS

Fig. 2-1: RMS on-state current versus case

on-state current (full cycle).

temperature (full cycle).

P (W)

IT(RMS) (A)

10

9

10

9

BTB/T8

8

7

BTA

6

5

4

3

2

1

0

6

5

4

3

2

IT(RMS)(A)

Tc(°C)

1

0

25

50

75

100

125

0

1

2

3

4

5

6

7

8

Fig. 2-2: RMS on-state current versus ambient

temperature (printed circuit board FR4, copper

thickness: 35µm),full cycle.

Fig. 3: Relative variation of thermal impedance

versus pulse duration.

IT(RMS) (A)

K=[Zth/Rth]

3.5

1E+0

Zth(j-c)

D²PAK

DPAK/IPAK

Zth(j-a)

3.0

(S=1cm²

)

2.5

2.0

1.5

1.0

0.5

0.0

1E-1

DPAK

(S=0.5cm²

)

TO-220AB/D PAK

Zth(j-a)

1E-2

Tamb(°C)

tp(s)

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2 5E+2

0

25

50

75

100

125

Fig. 4: On-state characteristics (maximum

values).

Fig. 5: Surge peak on-state current versus

number of cycles.

ITM (A)

ITSM (A)

100

90

80

Tj=Tj max

Tj max.

Vto = 0.85 V

Rd = 50 mΩ

t=20ms

70

One cycle

60

Non repetitive

Tj initial=25°C

50

10

Repetitive

Tc=100°C

40

Tj=25°C

30

20

10

VTM(V)

Number of cycles

0

1

10

100

1000

0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

5/10

BTA/BTB08 and T8 Series

Fig. 6: Non-repetitive surge peak on-state

current for a sinusoidal pulse with width

tp < 10ms, and corresponding value of I t.

Fig. 7: Relative variation of gate trigger current,

holding current and latching current versus

junction temperature (typical values).

IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C]

ITSM (A),I t (A s)

2.5

1000

Tj initial=25°C

2.0

IGT

dI/dt limitation:

50A/µs

ITSM

1.5

100

IH & IL

1.0

I t

0.5

tp (ms)

Tj(°C)

40 60

10

0.0

-40 -20

0.01

0.10

1.00

10.00

0

20

80 100 120 140

Fig. 8-1: Relative variation of critical rate of

decrease of main current versus (dV/dt)c (typical

values). Snubberless & Logic Level Types

Fig. 8-2: Relative variation of critical rate of

decrease of main current versus (dV/dt)c (typical

values). Standard Types

(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c

2.0

1.8

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

TW

C

1.6

B

1.4

T835/CW/BW

1.2

1.0

0.8

T810/SW

0.6

0.4

(dV/dt)c (V/µs)

1.0 10.0

(dV/dt)c (V/µs)

1.0

0.2

0.0

0.1

10.0

100.0

0.1

100.0

2

Fig. 9: Relative variation of critical rate of

decrease of main current versus junction

temperature.

Fig. 10: DPAK and D PAK Thermal resistance

junction to ambient versus copper surface under

tab (printed circuit board FR4, copper thickness:

35 µm).

(dI/dt)c [Tj] / (dI/dt)c [Tj specified]

Rth(j-a) (°C/W)

6

100

90

80

70

60

50

40

30

5

4

3

2

DPAK

D PAK

20

10

0

1

Tj(°C)

S(cm )

0

4

8

12 16 20 24 28 32 36 40

0

25

50

75

100

125

6/10

BTA/BTB08 and T8 Series

PACKAGE MECHANICAL DATA

DPAK (Plastic)

DIMENSIONS

REF.

Millimeters

Inches

Min.

Max

Min.

Max.

A

A1

A2

B

2.20

0.90

0.03

0.64

5.20

0.45

0.48

6.00

6.40

4.40

9.35

2.40

1.10

0.23

0.90

5.40

0.60

6.20

6.60

4.60

10.10

0.086

0.035

0.001

0.025

0.204

0.017

0.018

0.236

0.251

0.173

0.368

0.094

0.043

0.009

0.035

0.212

0.023

0.244

0.259

0.181

0.397

B2

C

R

C2

D

R

E

G

H

L2

L4

R

0.80 typ.

0.031 typ.

0.60

1.00

0.023

0.039

0.2 typ.

0.007 typ.

V2

0°

8°

0°

8°

FOOTPRINT DIMENSIONS (in millimeters)

DPAK (Plastic)

6.7

3

1.6

2.3 2.3

7/10

BTA/BTB08 and T8 Series

PACKAGE MECHANICAL DATA

D PAK (Plastic)

DIMENSIONS

Millimeters

Min. Typ. Max. Min. Typ. Max.

REF.

Inches

A

E

C2

L2

L3

A

A1

A2

B

4.30

2.49

0.03

0.70

1.25

0.45

1.21

8.95

10.00

4.88

15.00

1.27

1.40

4.60 0.169

2.69 0.098

0.23 0.001

0.93 0.027

0.181

0.106

0.009

0.037

D

L

B2

C

1.40

0.048 0.055

0.60 0.017

1.36 0.047

9.35 0.352

10.28 0.393

5.28 0.192

15.85 0.590

1.40 0.050

1.75 0.055

0.024

0.054

0.368

0.405

0.208

0.624

0.055

0.069

A1

C2

D

B2

B

R

C

E

G

L

A2

2.0 MIN.

L2

L3

R

FLAT ZONE

0.40

0.016

V2

0°

8°

0°

8°

FOOTPRINT DIMENSIONS (in millimeters)

D PAK (Plastic)

16.90

10.30

5.08

1.30

3.70

8.90

8/10

BTA/BTB08 and T8 Series

PACKAGE MECHANICAL DATA

IPAK (Plastic)

DIMENSIONS

REF.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

A

A1

A3

B

2.2

0.9

2.4

1.1

0.086

0.035

0.027

0.025

0.204

0.094

0.043

0.051

0.035

0.212

0.033

A

E

C2

0.7

1.3

B2

0.64

5.2

0.9

L2

B2

B3

B5

B6

C

5.4

0.85

0.3

0.035

D

0.95

0.6

6.2

6.6

4.6

0.037

0.023

0.244

0.260

0.181

0.641

0.370

0.047

0.45

0.48

6

0.017

0.019

0.236

0.252

0.173

H

B3

L1

C2

D

B6

L

A1

B

V1

E

6.4

4.4

15.9

9

G

H

16.3 0.626

B5

C

L

9.4

1.2

1

0.354

0.031

G

A3

L1

L2

V1

0.8

0.031 0.039

10°

9/10

BTA/BTB08 and T8 Series

PACKAGE MECHANICAL DATA

TO-220AB Ins.

DIMENSIONS

B

C

REF.

Millimeters

Inches

b2

Min. Typ. Max. Min. Typ. Max.

L

A

a1

a2

B

15.20

15.90 0.598

0.625

F

3.75

0.147

I

13.00

10.00

0.61

1.23

4.40

0.49

2.40

6.20

3.75

14.00 0.511

10.40 0.393

0.88 0.024

1.32 0.048

4.60 0.173

0.70 0.019

2.72 0.094

2.70 0.094

6.60 0.244

3.85 0.147

0.551

0.409

0.034

0.051

0.181

0.027

0.107

0.106

0.259

0.151

A

b1

b2

C

l4

c2

a1

c1

c2

e

l3

l2

a2

F

I

I4

L

15.80 16.40 16.80 0.622 0.646 0.661

b1

M

2.65

1.14

2.95 0.104

1.70 0.044

0.116

0.066

c1

e

l2

l3

M

2.60

0.102

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences

of use ofsuch information nor for any infringement of patents or other rights of third parties which may result from its use. No license isgranted

by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject

to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not

authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

 The ST logo is a registered trademark of STMicroelectronics

STMicroelectronics GROUP OF COMPANIES

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Singapore - Spain - Sweden - Switzerland - United Kingdom

http://www.st.com

10/10

型号:	BTA06T-600CWRG
Brand Name：	STMicroelectronics
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	TO-220AB
包装说明：	FLANGE MOUNT, R-PSFM-T3
针数：	3
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8541.30.00.80
风险等级：	2.13
外壳连接：	ISOLATED
配置：	SINGLE
关态电压最小值的临界上升速率：	750 V/us
最大直流栅极触发电流：	35 mA
最大直流栅极触发电压：	1.3 V
最大维持电流：	35 mA
JEDEC-95代码：	TO-220AB
JESD-30 代码：	R-PSFM-T3
最大漏电流：	1 mA
元件数量：	1
端子数量：	3
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR
封装形式：	FLANGE MOUNT
峰值回流温度（摄氏度）：	NOT SPECIFIED
认证状态：	Not Qualified
最大均方根通态电流：	6 A
断态重复峰值电压：	600 V
子类别：	TRIACs
表面贴装：	NO
端子形式：	THROUGH-HOLE
端子位置：	SINGLE
处于峰值回流温度下的最长时间：	NOT SPECIFIED
触发设备类型：	SNUBBERLESS TRIAC
Base Number Matches：	1

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