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    产品型号BTA08_10的Datasheet PDF文件预览

    BTA08, BTB08  
    T810, T835  
    Snubberless™, logic level and standard 8 A Triacs  
    A2  
    Features  
    ■ On-state rms current, I  
    8 A  
    T(RMS)  
    G
    ■ Repetitive peak off-state voltage, V  
    /V  
    DRM RRM  
    A1  
    600 to 800 V  
    A2  
    A2  
    ■ Triggering gate current, I  
    5 to 50 mA  
    GT (Q1)  
    A1  
    A2  
    G
    Description  
    A1  
    A2  
    G
    D2PAK  
    (T8-G)  
    Available either in through-hole or surface-mount  
    packages, the BTA08, BTB08 and T8 triac series  
    is suitable for general purpose AC switching. They  
    can be used as an ON/OFF function in  
    IPAK  
    (T8-H)  
    A2  
    applications such as static relays, heating  
    regulation, induction motor starting circuits... or  
    for phase control operation in light dimmers,  
    motor speed controllers,...  
    A1  
    A2  
    G
    DPAK  
    (T8-B)  
    The snubberless versions (BTA/BTB...W and T8  
    series) are specially recommended for use on  
    inductive loads, thanks to their high commutation  
    performances.  
    A2  
    Logic level versions are designed to interface  
    directly with low power drivers such as  
    microcontrollers.  
    A1  
    A2  
    A1  
    A2  
    G
    G
    TO-220AB Insulated  
    (BTA08)  
    TO-220AB  
    (BTB08)  
    By using an internal ceramic pad, the BTA series  
    provides voltage insulated tab (rated at 2500  
    V
    ) complying with UL standards (file ref.:  
    RMS  
    E81734).  
    March 2010  
    Doc ID 7472 Rev 7  
    1/12  
    www.st.com  
    12  
    Characteristics  
    BTA08, BTB08 and T8 Series  
    1
    Characteristics  
    Table 1.  
    Symbol  
    Absolute maximum ratings  
    Parameter  
    Value  
    Unit  
    IPAK/D2PAK/DPAK/  
    TO-220AB  
    Tc = 110 °C  
    IT(RMS) On-state rms current (full sine wave)  
    8
    A
    TO-220AB Ins.  
    F = 50 Hz  
    Tc = 100 °C  
    t = 20 ms  
    80  
    84  
    36  
    Non repetitive surge peak on-state current  
    (full cycle, Tj initial = 25 °C)  
    ITSM  
    A
    F = 60 Hz  
    t = 16.7 ms  
    ²
    ²
    ²
    I t  
    I t value for fusing  
    tp = 10 ms  
    A s  
    Critical rate of rise of on-state current IG = 2  
    dI/dt  
    x IGT  
    tr ≤ 100 ns  
    ,
    F = 120 Hz  
    tp = 20 µs  
    Tj = 125 °C  
    50  
    A/µs  
    IGM  
    Peak gate current  
    Tj = 125 °C  
    Tj = 125 °C  
    4
    1
    A
    PG(AV) Average gate power dissipation  
    W
    Tstg  
    Tj  
    Storage junction temperature range  
    Operating junction temperature range  
    - 40 to + 150  
    - 40 to + 125  
    °C  
    Table 2.  
    Symbol  
    Electrical characteristics (T = 25 °C, unless otherwise specified)  
    Snubberless and logic level (3 quadrants)  
    j
    T8  
    BTA08 / BTB08  
    Test conditions  
    Quadrant  
    Unit  
    T810 T835 TW  
    SW  
    CW BW  
    (1)  
    IGT  
    I - II - III  
    I - II - III  
    MAX.  
    MAX.  
    10  
    35  
    5
    10  
    35  
    50  
    mA  
    V
    VD = 12 V RL = 30 Ω  
    VGT  
    VGD  
    1.3  
    0.2  
    VD = VDRM RL = 3.3 kΩ  
    Tj = 125 °C  
    I - II - III  
    MIN.  
    V
    (2)  
    IH  
    IT = 100 mA  
    MAX.  
    15  
    25  
    30  
    35  
    50  
    60  
    10  
    10  
    15  
    15  
    25  
    30  
    35  
    50  
    60  
    50  
    70  
    80  
    mA  
    I - III  
    II  
    IL  
    IG = 1.2 IGT  
    MAX.  
    MIN.  
    mA  
    VD = 67 %VDRM gate open  
    Tj = 125 °C  
    dV/dt (2)  
    40  
    400  
    20  
    40  
    400 1000  
    V/µs  
    (dV/dt)c = 0.1 V/µs Tj = 125 °C  
    (dV/dt)c = 10 V/µs Tj = 125 °C  
    5.4  
    2.8  
    -
    -
    -
    3.5  
    5.4  
    -
    -
    -
    -
    (dI/dt)c  
    MIN.  
    1.5 2.98  
    A/ms  
    (2)  
    Without snubber  
    Tj = 125 °C  
    4.5  
    -
    -
    4.5  
    7
    2/12  
    Doc ID 7472 Rev 7  
    BTA08, BTB08 and T8 Series  
    Characteristics  
    Table 3.  
    Symbol  
    Standard (4 quadrants)  
    Test conditions  
    BTA08 / BTB08  
    Quadrant  
    Unit  
    C
    B
    I - II - III  
    IV  
    25  
    50  
    50  
    100  
    (1)  
    IGT  
    MAX.  
    mA  
    VD = 12 V, RL = 33 Ω  
    VGT  
    VGD  
    ALL  
    ALL  
    MAX.  
    MIN.  
    1.3  
    0.2  
    V
    V
    VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C  
    (2)  
    IH  
    IT = 500 mA  
    MAX.  
    25  
    40  
    50  
    50  
    mA  
    I - III - IV  
    II  
    IL  
    IG = 1.2 IGT  
    MAX.  
    mA  
    80  
    100  
    400  
    dV/dt (2) VD = 67 %VDRM gate open  
    (dV/dt)c  
    Tj = 125 °C  
    MIN.  
    MIN.  
    200  
    V/µs  
    V/µs  
    (dI/dt)c = 5.3 A/ms  
    Tj = 125 °C  
    5
    10  
    (2)  
    Table 4.  
    Symbol  
    Static characteristics  
    Test conditions  
    Value  
    Unit  
    (1)  
    VTM  
    ITM = 11 A, tp = 380 µs  
    Threshold voltage  
    Tj = 25 °C  
    MAX.  
    MAX.  
    MAX.  
    1.55  
    0.85  
    50  
    5
    V
    V
    (2)  
    Vt0  
    Tj = 125 °C  
    Tj = 125 °C  
    Tj = 25 °C  
    Tj = 125 °C  
    (2)  
    Rd  
    Dynamic resistance  
    mΩ  
    µA  
    mA  
    IDRM  
    IRRM  
    VDRM = VRRM  
    MAX.  
    1
    1. minimum IGT is guaranted at 5% of IGT max.  
    2. for both polarities of A2 referenced to A1.  
    Table 5.  
    Symbol  
    Thermal resistance  
    Parameter  
    Value  
    Unit  
    IPAK / D2PAK / DPAK / TO-220AB  
    TO-220AB Insulated  
    D2PAK  
    1.6  
    2.5  
    45  
    Rth(j-c) Junction to case (AC)  
    Rth(j-a) Junction to ambient  
    °C/W  
    ²
    S = 1 cm  
    ²
    S = 0.5 cm DPAK  
    TO-220AB / TO-220AB Insulated  
    70  
    °C/W  
    60  
    IPAK  
    100  
    S = Copper surface under tab.  
    Doc ID 7472 Rev 7  
    3/12  
    Characteristics  
    BTA08, BTB08 and T8 Series  
    Figure 1.  
    Maximum power dissipation versus Figure 2.  
    rms on-state current (full cycle)  
    On-state rms current versus case  
    temperature (full cycle)  
    P(W)  
    I (A)  
    T(RMS)  
    10  
    10  
    9
    9
    8
    7
    6
    5
    4
    3
    2
    1
    0
    BTB / T8  
    8
    7
    BTA  
    6
    5
    4
    3
    2
    1
    I (A)  
    T(RMS)  
    T (°C)  
    C
    0
    0
    25  
    50  
    75  
    100  
    125  
    0
    1
    2
    3
    4
    5
    6
    7
    8
    Figure 3.  
    On-state rms current versus  
    ambient temperature (full cycle)  
    Figure 4.  
    Relative variation of thermal  
    impedance versus pulse  
    duration  
    I
    (A)  
    T(RMS)  
    K=[Z /R  
    ]
    th th  
    3.5  
    3.0  
    2.5  
    2.0  
    1.5  
    1.0  
    0.5  
    0.0  
    1E+0  
    1E-1  
    1E-2  
    1E-3  
    printed circuit board FR4, copper thickness: 35 µm  
    Z
    th(j-c)  
    D2PAK  
    DPAK/IPAK  
    (S=1CM2)  
    Z
    th(j-a)  
    TO-220AB/D2PAK  
    Z
    th(j-a)  
    DPAK  
    (S=0.5CM2)  
    t (s)  
    p
    T (°C)  
    C
    1E-3  
    1E-2  
    1E-1  
    1E+0  
    1E+1  
    1E+2  
    5E+2  
    0
    25  
    50  
    75  
    100  
    125  
    Figure 5.  
    On-state characteristics  
    (maximum values)  
    Figure 6.  
    Surge peak on-state current  
    versus number of cycles  
    I
    (A)  
    TM  
    I (A)  
    TSM  
    100  
    90  
    80  
    70  
    60  
    50  
    40  
    30  
    20  
    10  
    0
    Tj max.  
    Vto = 0.85V  
    Rd = 50 mΩ  
    Tj = Tj max.  
    t=20ms  
    One cycle  
    Non repetitive  
    Tj initial=25°C  
    10  
    Tj = 25°C.  
    Repetitive  
    TC=110°C  
    V
    (V)  
    TM  
    Number of cycles  
    1
    0.5  
    1.0  
    1.5  
    2.0  
    2.5  
    3.0  
    3.5  
    4.0  
    4.5  
    5.0  
    1
    10  
    100  
    1000  
    4/12  
    Doc ID 7472 Rev 7  
    BTA08, BTB08 and T8 Series  
    Characteristics  
    Figure 7.  
    Non-repetitive surge peak on-state  
    current for a sinusoidal  
    Figure 8.  
    Relative variation of gate trigger  
    current  
    I
    ,I ,I [T ] / I ,I ,I [T =25°C]  
    H L j GT H L j  
    I
    (A), I2t (A2s)  
    GT  
    TSM  
    2.5  
    2.0  
    1.5  
    1.0  
    0.5  
    0.0  
    1000  
    100  
    Tj initial=25°C  
    holding current and latching current  
    versus junction temperature (typical values)  
    IGT  
    dI/dt limitation:  
    50A/µs  
    ITSM  
    360°  
    IH & IL  
    I2t  
    α
    pulse with width tp < 10 ms and corresponding value of I2t  
    T (°C)  
    j
    t (ms)  
    p
    10  
    -40  
    -20  
    0
    20  
    40  
    60  
    80  
    100  
    120  
    140  
    0.01  
    0.10  
    1.00  
    10.00  
    Figure 9.  
    Relative variation of critical rate of Figure 10. Relative variation of critical rate of  
    decrease of main current versus  
    (dV/dt)c (typical values)  
    decrease of main current versus  
    (dV/dt)c (typical values)  
    (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
    (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
    2.0  
    1.8  
    1.6  
    1.4  
    1.2  
    1.0  
    0.8  
    0.6  
    0.4  
    2.2  
    2.0  
    1.8  
    1.6  
    1.4  
    1.2  
    1.0  
    0.8  
    0.6  
    0.4  
    0.2  
    0.0  
    Standard types  
    Snubberless and Logic level types  
    TW  
    C
    T835/CW/BW  
    B
    T810/SW  
    (dV/dt)c (V/µs)  
    (dV/dt)c (V/µs)  
    0.1  
    1.0  
    10.0  
    100.0  
    0.1  
    1.0  
    10.0  
    100.0  
    Figure 11. Relative variation of critical rate of Figure 12. DPAK and D2PAK thermal resistance  
    decrease of main current versus  
    junction temperature  
    junction to ambient versus copper  
    surface under tab  
    R
    (°C/W)  
    th(j-a)  
    (dI/dt)c [T ] / (dI/dt)c [T specified]  
    j
    j
    100  
    90  
    80  
    70  
    60  
    50  
    40  
    30  
    20  
    10  
    0
    6
    5
    4
    3
    2
    printed circuit board FR4, copper thickness: 35 µm  
    DPAK  
    D2PAK  
    1
    S(cm²)  
    T (°C)  
    j
    0
    0
    25  
    50  
    75  
    100  
    125  
    0
    4
    8
    12  
    16  
    20  
    24  
    28  
    32  
    36  
    40  
    Doc ID 7472 Rev 7  
    5/12  
    Package information  
    BTA08, BTB08 and T8 Series  
    2
    Package information  
    ●
    ●
    Epoxy meets UL94, V0  
    Lead-free packages  
    In order to meet environmental requirements, ST offers these devices in different grades of  
    ®
    ®
    ECOPACK packages, depending on their level of environmental compliance. ECOPACK  
    specifications, grade definitions and product status are available at: www.st.com.  
    ®
    ECOPACK is an ST trademark.  
    2
    Table 6.  
    D PAK dimensions  
    Dimensions  
    Millimeters  
    Min. Typ. Max. Min. Typ. Max.  
    Ref.  
    Inches  
    A
    4.30  
    4.60 0.169  
    2.69 0.098  
    0.23 0.001  
    0.93 0.027  
    0.181  
    0.106  
    0.009  
    0.037  
    A
    A1 2.49  
    A2 0.03  
    E
    C2  
    L2  
    B
    0.70  
    B2 1.25 1.40  
    0.45  
    C2 1.21  
    D
    0.048 0.055  
    L
    C
    0.60 0.017  
    1.36 0.047  
    9.35 0.352  
    10.28 0.393  
    5.28 0.192  
    15.85 0.590  
    1.40 0.050  
    1.75 0.055  
    0.024  
    0.054  
    0.368  
    0.405  
    0.208  
    0.624  
    0.055  
    0.069  
    L3  
    A1  
    B2  
    B
    R
    C
    D
    E
    G
    L
    8.95  
    10.00  
    4.88  
    G
    A2  
    2mm min.  
    FLAT ZONE  
    15.00  
    L2 1.27  
    L3 1.40  
    R
    V2  
    0.40  
    0.016  
    V2  
    0°  
    8°  
    0°  
    8°  
    Figure 13. Footprint (dimensions in mm)  
    16.90  
    10.30  
    5.08  
    1.30  
    3.70  
    8.90  
    6/12  
    Doc ID 7472 Rev 7  
    BTA08, BTB08 and T8 Series  
    Package information  
    Dimensions  
    Table 7.  
    DPAK dimensions  
    Ref.  
    Millimeters  
    Inches  
    Min.  
    Max.  
    Min.  
    Max.  
    A
    A1  
    A2  
    B
    2.20  
    0.90  
    0.03  
    0.64  
    5.20  
    0.45  
    0.48  
    6.00  
    6.40  
    4.40  
    9.35  
    2.40  
    1.10  
    0.23  
    0.90  
    5.40  
    0.60  
    0.60  
    6.20  
    6.60  
    4.60  
    10.10  
    0.086  
    0.035  
    0.001  
    0.025  
    0.204  
    0.017  
    0.018  
    0.236  
    0.251  
    0.173  
    0.368  
    0.094  
    0.043  
    0.009  
    0.035  
    0.212  
    0.023  
    0.023  
    0.244  
    0.259  
    0.181  
    0.397  
    E
    A
    B2  
    C2  
    L2  
    B2  
    C
    D
    R
    H
    L4  
    C2  
    D
    A1  
    R
    B
    G
    C
    E
    A2  
    G
    0.60 MIN.  
    H
    V2  
    L2  
    L4  
    V2  
    0.80 typ.  
    0.031 typ.  
    0.60  
    0°  
    1.00  
    8°  
    0.023  
    0°  
    0.039  
    8°  
    Figure 14. Footprint (dimensions in mm)  
    1.6  
    6.7  
    3
    3
    2.3  
    6.7  
    2.3  
    1.6  
    Doc ID 7472 Rev 7  
    7/12  
    Package information  
    Table 8.  
    BTA08, BTB08 and T8 Series  
    Dimensions  
    IPAK dimensions  
    Ref.  
    Millimeters  
    Inches  
    Min. Typ. Max. Min. Typ. Max.  
    A
    2.20  
    2.40 0.086  
    1.10 0.035  
    1.30 0.027  
    0.90 0.025  
    5.40 0.204  
    0.95  
    0.094  
    0.043  
    0.051  
    0.035  
    0.212  
    0.037  
    A1 0.90  
    A3 0.70  
    B
    0.64  
    A
    E
    B2 5.20  
    C2  
    B2  
    B3  
    B5  
    L2  
    0.30  
    0.035  
    D
    C
    0.45  
    0.60 0.017  
    0.60 0.019  
    6.20 0.236  
    6.60 0.252  
    0.023  
    0.023  
    0.244  
    0.260  
    C2 0.48  
    H
    B3  
    L1  
    L
    D
    E
    6
    A1  
    B
    V1  
    6.40  
    e
    2.28  
    0.090  
    0.634  
    B5  
    C
    e
    G
    H
    4.40  
    4.60 0.173  
    0.181  
    A3  
    G
    16.10  
    L
    9
    9.40 0.354  
    1.20 0.031  
    1
    0.370  
    0.047  
    L1  
    L2  
    V1  
    0.8  
    0.80  
    10°  
    0.031 0.039  
    10°  
    8/12  
    Doc ID 7472 Rev 7  
    BTA08, BTB08 and T8 Series  
    Package information  
    TO-220AB (NIns. and Ins. 20-up) dimensions  
    Dimensions  
    Millimeters  
    Min. Typ. Max. Min. Typ. Max.  
    Ref.  
    Inches  
    A
    15.20  
    15.90 0.598  
    0.625  
    a1  
    3.75  
    0.147  
    C
    B
    a2 13.00  
    10.00  
    14.00 0.511  
    10.40 0.393  
    0.88 0.024  
    1.32 0.048  
    4.60 0.173  
    0.70 0.019  
    2.72 0.094  
    2.70 0.094  
    6.60 0.244  
    3.85 0.147  
    0.551  
    0.409  
    0.034  
    0.051  
    0.181  
    0.027  
    0.107  
    0.106  
    0.259  
    0.151  
    Ø I  
    b2  
    B
    L
    F
    b1 0.61  
    b2 1.23  
    A
    I4  
    C
    4.40  
    l3  
    l2  
    c1 0.49  
    c2 2.40  
    c2  
    a1  
    a2  
    e
    F
    2.40  
    6.20  
    M
    c1  
    b1  
    ØI 3.75  
    e
    I4 15.80 16.40 16.80 0.622 0.646 0.661  
    L
    2.65  
    1.14  
    1.14  
    2.95 0.104  
    1.70 0.044  
    1.70 0.044  
    0.116  
    0.066  
    0.066  
    l2  
    l3  
    M
    2.60  
    0.102  
    Doc ID 7472 Rev 7  
    9/12  
    Ordering information  
    BTA08, BTB08 and T8 Series  
    3
    Ordering information  
    Figure 15. Ordering information scheme (BTA08 and BTB08 series)  
    BT  
    A 08 - 600 BW (RG)  
    Triac series  
    Insulation  
    A = insulated  
    B = non insulated  
    Current  
    08 = 8A  
    Voltage  
    600 = 600V  
    800 = 800V  
    Sensitivity and type  
    B = 50mA Standard  
    C = 25mA Standard  
    SW = 10mA Logic Level  
    BW = 50mA Snubberless  
    CW = 35mA Snubberless  
    TW = 5mA Logic Level  
    Packing mode  
    RG = Tube  
    Figure 16. Ordering information scheme (T8 series)  
    T
    8 10 - 600 B (-TR)  
    Triac series  
    Current  
    8 = 8A  
    Sensitivity  
    10 = 10 mA  
    35 = 35 mA  
    Voltage  
    600 = 600 V  
    800 = 800 V  
    Package  
    B = DPAK  
    H = IPAK  
    G = D2PAK  
    R = I2PAK  
    Packing mode  
    Blanck = Tube  
    -TR = Tape and reel  
    Table 9.  
    Product Selector  
    Voltage (xxx)  
    Part Number  
    Sensitivity  
    Type  
    Package  
    600 V  
    800 V  
    BTA/BTB08-xxxB  
    BTA/BTB08-xxxBW  
    BTA/BTB08-xxxC  
    BTA/BTB08-xxxCW  
    BTA/BTB08-xxxSW  
    BTA/BTB08-xxxTW  
    T810-xxxG  
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    X
    50 mA  
    50 mA  
    25 mA  
    35 mA  
    10 mA  
    5 mA  
    Standard  
    TO-220AB  
    Snubberless TO-220AB  
    Standard TO-220AB  
    Snubberless TO-220AB  
    Logic level  
    Logic Level  
    Logic Level  
    Logic Level  
    Snubberless  
    Snubberless  
    Snubberless  
    TO-220AB  
    TO-220AB  
    D2PAK  
    IPAK  
    10 mA  
    10 mA  
    35 mA  
    35 mA  
    35 mA  
    T810-xxxH  
    T835-xxxB  
    DPAK  
    D2PAK  
    T835-xxxG  
    T835-xxxH  
    IPAK  
    BTB: non insulated TO-220AB package  
    10/12  
    Doc ID 7472 Rev 7  
    BTA08, BTB08 and T8 Series  
    Ordering information  
    4
    Ordering information  
    Table 10. Ordering information  
    Order code  
    Marking  
    Package  
    Weight Base qty Delivery mode  
    BTA/BTB08-xxxyzRG  
    T8yy-xxxG  
    BTA/BTB08-xxxyz  
    T8yyxx  
    TO-220AB  
    2.3 g  
    1.5 g  
    50  
    50  
    Tube  
    Tube  
    D2PAK  
    T8yy-xxxG-TR  
    T8yy-xxxB  
    T8yyxx  
    1000  
    75  
    Tape and reel  
    Tube  
    T8yyxx  
    DPAK  
    IPAK  
    0.3 g  
    0.4 g  
    T8yy-xxxB-TR  
    T8yy-xxxH  
    T8yyxx  
    2500  
    75  
    Tape and reel  
    Tube  
    T8yyxx  
    xxx = voltage, yy = sensitivity, z = type  
    5
    Revision history  
    Table 11. Document revision history  
    Date  
    Revision  
    Changes  
    Apr-2002  
    5A  
    Last update.  
    TO-220AB delivery mode changed from bulk to tube.  
    ECOPACK statement added.  
    13-Feb-2006  
    10-Mar-2010  
    6
    7
    Updated ECOPACK statement and Figure 16.  
    Doc ID 7472 Rev 7  
    11/12  
    BTA08, BTB08 and T8 Series  
    Please Read Carefully:  
    Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
    right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
    time, without notice.  
    All ST products are sold pursuant to ST’s terms and conditions of sale.  
    Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
    liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
    No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
    document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
    or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
    third party products or services or any intellectual property contained therein.  
    UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED  
    WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
    WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS  
    OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
    UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT  
    RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING  
    APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,  
    DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE  
    GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.  
    Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
    any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
    liability of ST.  
    ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
    Information in this document supersedes and replaces all information previously supplied.  
    The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
    © 2010 STMicroelectronics - All rights reserved  
    STMicroelectronics group of companies  
    Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
    Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
    www.st.com  
    12/12  
    Doc ID 7472 Rev 7  
    配单直通车
    BTA1-03-03-1-B-SB产品参数
    型号:BTA1-03-03-1-B-SB
    是否Rohs认证： 不符合
    生命周期：Active
    IHS 制造商：TE CONNECTIVITY LTD
    Reach Compliance Code：unknown
    风险等级：5.66
    相关军用规格：MIL-DTL-26482; MIL-DTL-83723
    连接器支架类型：CONNECTOR ACCESSORY
    DIN 符合性：NO
    IEC 符合性：NO
    MIL 符合性：YES
    材料：ALUMINUM ALLOY
    军用连接器配件名称：BACKSHELL
    外壳尺寸：03
    Base Number Matches：1
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