BU3150AF各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

CMOS LDO Regulators for Portable Equipments

1ch 200mA

CMOS LDO Regulators

BUTA2WNVX series, BUTA2WHFV series

No.11020ECT01

●Description

BU□□TA2WNVX /HFV series is high-performance FULL CMOS regulator with 200-mA output, which is mounted on

microminiature package SSON004X1216 (1.2 mm  1.6 mm  0.6 mm) &HVSOF5(1.6mm  1.6mm  0.6mm). It has

excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 40 µA.

It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.

Microminiature package SSON004X1216 & HVSOF5 with built-in heatsink is adopted for the package, which contributes to

the space-saving design of the set.

●Features

1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products）

2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT1.8 V))

3) Compatible with small ceramic capacitor (CIN=Co=1.0 µF)

4) Low current consumption: 40 µA

5) ON/OFF control of output voltage

6) With built-in overcurrent protection circuit and overheat protection circuit

7) With built-in output discharge circuit

8) Adopting microminiature power package SSON004X1216

●Applications

Battery-powered portable equipment, etc.

●Line up

■ 200 mA BU□□TA2WNVX / HFV series

Product Name

BU□□TA2WNVX

BU□□TA2WHFV

1.5 1.8 2.5 2.6 2.7 2.8 2.85 2.9 3.0 3.1 3.2 3.3 3.4

Package

SSON004X1216

HVSOF5

○

Model name: BH□□TA2W□□□

a

b

Symbol

Contents

Specification of output voltage

□□

15

Output voltage (V)

1.5V(Typ.)

□□

28

Output voltage (V)

2.8V(Typ.)

□□

32

33

34

-

Output voltage (V)

3.2V(Typ.)

a

18

1.8V(Typ.)

2J

2.85V(Typ.)

2.9V(Typ.)

3.3V(Typ.)

25

2.5V(Typ.)

29

3.4V(Typ.)

-

26

2.6V(Typ.)

30

3.0V(Typ.)

-

27

2.7V(Typ.)

31

3.1V(Typ.)

:SSON004X1216

:HVSOF5

NVX

HFV

b

Package

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Absolute maximum rating

Parameter

Symbol

Ratings

Unit

V

Maximum applied power voltage VMAX

-0.3

~

+6.5

Pd1

220*¹(SSON004X1216)

410*²(HVSOF5)

Power dissipation

Pd2

mW

℃

Maximum junction temperature TjMAX

+125

Operational temperature range

Storage temperature range

Topr

Tstg

-40

-55

~

+85

℃

~

+125

℃

*1

*2

When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.

Reduced to 2.2 mW/C when used at Ta=25C or higher.

When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.

Reduced to 4.1 mW/C when used at Ta=25C or higher.

●Recommended operating range (Do not exceed Pd.)

Parameter

Symbol

VIN

Ratings

Unit

V

Input power supply voltage

Maximum output current

2.5

~

5.5

IMAX

200

mA

●Recommended operating conditions

Ratings

Typ.

Parameter

Symbol

CIN

Unit

μF

Conditions

Min.

Max.

A ceramic capacitor is

recommended.

Input capacitor

0.5*³

1.0

－

A ceramic capacitor is

recommended.

Output capacitor

CO

0.5*³

－

μF

*3

Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics,

DC device characteristics, and change with time into consideration.

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Electrical characteristics

(Unless otherwise specified Ta=25℃, VIN=VOUT+1.0 V (VIN=3.5 V on VOUT=1.8-V and1.5-V products),

STBY=1.5 V, CIN=1.0 µF, CO=1.0 µF)

Limits

Parameter

Symbol

Unit

V

Conditions

IOUT=10 μA, VOUT≥2.5 V

IOUT=10 μA, VOUT<2.5 V

IOUT=0mA

Min.

Typ.

Max.

VOUT

×0.99

VOUT

×1.01

Output voltage

VOUT

-25 mV

VOUT

+25 mV

Circuit current

IIN

-

40

-

95

1

μA

Circuit current (at STBY)

STBY=0 V

ISTBY

VRR=-20 dBv, fRR=1 kHz,

IOUT=10 mA, 1.5 V≤VOUT≤1.8 V

70

Ripple rejection

RR

55

-

dB

VRR=-20 dBv,fRR=1 kHz,

IOUT=10 mA, 2.5 V≤VOUT

65

2.5 V≤VOUT≤2.6 V

(VIN=0.98*VOUT, IOUT=200 mA)

-

400

360

330

300

2

800

720

660

600

20

mV

mA

Ω

2.7 V≤VOUT≤2.85 V

(VIN=0.98*VOUT, IOUT=200 mA)

Input/Output voltage difference

VSAT

2.9 V≤VOUT≤3.1 V

(VIN=0.98*VOUT,IOUT=200 mA)

-

3.2 V≤VOUT≤3.4 V

(VIN=0.98*VOUT, IOUT=200 mA)

-

VIN=VOUT+1.0 V to 5.5 V,

IOUT=10 μA

Line regulation

Load regulation

VDL

VDLO

ILMAX

ISHORT

RDSC

RSTB

-

IOUT=0.01 mA to 100 mA

Vo=VOUT*0.8

-

10

80

Overcurrent protection detection

current

250

20

500

400

70

700

150

80

Output short-circuit current

Output discharge resistance

Standby pull-down resistance

Vo=0 V

VIN=4.0 V, STBY=0 V

40

1000

2000

kΩ

ON

Standby control

OFF

VSTBH

VSTBL

1.5

-

5.5

0.3

V

-0.3

* This product does not have radiation-proof design.

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Block diagram, recommended circuit diagram, and pin configuration diagram

BH□□TA2WNVX

VIN

4/3

VREF

VOUT

Co

Cin

1

1/4

OCP

2

GND

VSTBY

STBY

Discharge

3/1

Recommended ceramic capacitor for Cin & Co

Murata Manufacturing Co., Ltd.

GRM188B11A105KA61D

Fig.1 Recommended circuit diagram

BU□□TA2WNVX(SSON004X1216)

4

3

PIN No.

Symbol

Function

Voltage output

1

2

3

4

VOUT

GND

STBY

VIN

Grounding

ON/OFF control of output voltage

(High: ON, Low: OFF)

1

2

Power input

BU□□TA2WHFV(HVSOF5)

PIN No.

Symbol

STBY

GND

VIN

Function

5

4

3

ON/OFF control of output voltage

(High:ON, Low:OFF)

1

2

3

4

5

Grounding

Power input

Voltage output

No Connect

2

1

VOUT

N.C.

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Input/Output terminal equivalent circuit schematic

1pin (VOUT)

2pin (GND)

3pin (STBY)

4pin (VIN)

VIN

VOUT

STBY

Fig.２ Input/Output equivalent circuit

●About input/output capacitor

Capacity value of ceramic capacitor - DC bias characteristics

Example

(

)

It is recommended to place a capacitor as close as possible to the

pins between the input terminal and GND or between the output

terminal and GND.

10-V withstand voltage

B1characteristics

GRM188B11A105KA61D

10

0

The capacitor between the input terminal and GND becomes valid

when source impedance increases or when wiring is long. The

larger the capacity of the output capacitor between the output

terminal and GND is, the better the stability and characteristics in

output load fluctuation become. However, please check the status

of actual implementation. Ceramic capacitors generally have

variation, temperature characteristics, and direct current bias

characteristics and the capacity value also decreases with time

depending on the usage conditions. It is recommended to select a

ceramic capacitor upon inquiring about detailed data of the related

manufacturer.

10-V withstand voltage

B characteristics

-10

-20

-30

-40

-50

-60

-70

-80

-90

-100

6.3-V withstand voltage

B characteristics

10-V withstand voltage

F characteristics

4-V withstand voltage

X6S characteristics

10-V withstand voltage

F characteristics

0

0.5

1

1.5

2

2.5

3

3.5

4

DC Bias Voltage [V]

Fig.3 Capacity – bias characteristics

●About the equivalent series resistance (ESR) of a ceramic capacitor

Capacitors generally have ESR (equivalent series resistance) and it

operates stably in the ESR-IOUT area shown on the right. Since

ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.

generally have different ESR, please check the ESR of the

capacitor to be used and use it within the stability area range shown

in the right graph for evaluation of the actual application.

100

Unstable area

10

1

0.1

Stability area

0.01

0

50

100

150

200

IOUT [mA]

Fig.4 Stability area characteristics (Example)

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)

100

80

60

40

20

0

1.55

1.8

1.5

1.2

0.9

0.6

0.3

0.0

1.54

1.53

1.52

1.51

1.50

1.49

1.48

1.47

1.46

1.45

IO=0uA

IO=100uA

IO=50mA

IO=200mA

IO=0uA

IO=100uA

IO=50mA

IO=200mA

Temp=-40°C

Temp=25°C

IO=0uA

Temp=25°C

VIN = STBY

Temp=25°C

VIN = STBY

Temp=85°C

VIN = STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

1.25 1.35 1.45 1.55 1.65 1.75 1.85 1.95 2.05 2.15 2.25

Vin Voltage (V)

Fig. 5 Output Voltage

Fig. 6 Line Regulation

Fig. 7 Circuit Current IGND

120

110

100

90

10

8

140

120

100

80

Temp=85°C

Temp=25°C

Temp=85°C

Temp=25°C

6

80

Temp=-40°C

60

40

20

0

4

70

Temp=-40°C

Temp=25°C

Temp=85°C

Temp=-40°C

60

2

IO=200mA

VIN = 3.5V

50

VIN = STBY

STBY = 1.5V

VIN = STBY

40

0

0.05

0.1

0.15

0.2

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

Output Current (A)

Vin Voltage (V)

STBY Voltage (V)

Fig. 8 Circuit Current IGND

Fig. 9 STBY Input Current

Fig. 10 IOUT - IGND

2.00

1.75

1.50

1.25

1.00

0.75

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

0.00

1.55

1.54

1.53

1.52

1.51

1.50

1.49

1.48

1.47

1.46

1.45

VIN=5.5V

Temp=25°C

Temp=-40°C

VIN=3.5V

VIN=2.5V

Temp=85°C

Temp=25°C

Temp=-40°C

0.50

0.25

Temp=85°C

VIN = 3.5V

Temp=25°C

STBY = 1.5V

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0

0.5

1

1.5

0

0.05

0.1

0.15

0.2

Output Current (A)

STBY Voltage (V)

Output Current (A)

Fig. 11 Load Regulation

Fig. 12 OCP Threshold

Fig. 13 STBY Threshold

1.000

0.900

0.800

0.700

0.600

0.500

0.400

0.300

0.200

0.100

0.000

-0.100

1.55

1.54

1.53

1.52

1.51

1.50

1.49

1.48

1.47

1.46

1.45

50.00

40.00

30.00

20.00

10.00

0.00

VIN=3.5V

STBY=0V

VIN=3.5V

STBY=1.5V

Io=0.1mA

STBY=1.5V

Io=0mA

-40

-15

10

35

60

85

-40

-15

10

35

60

85

-40

-15

10

35

60

85

Temp (°C)

Fig. 14 VOUT vs. Temp

Fig. 15 IGND vs. Temp

Fig. 16 IGND vs. Temp (STBY)

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU15TA2WNVX /HFV (Ta=25ºC unless otherwise specified.)

80

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

80

70

60

50

40

30

20

10

0

f=0.1kHz

70

60

50

40

30

20

10

0

Co=1.0μF

Cin=1.0μF

Iout=10mA

temp=25℃

f=1kHz

f=10kHz

f=100kHz

Co=1.0μF

Cin=none

Vin= 3.5V

Io=10mA

Ta = 25℃

Iout=10mA

temp=25℃

2.5

3.5

4.5

5.5

0.1

1

10

Frequency f [kHz]

100

0.1

1

10

100

1000

Input Voltage VIN[V]

Frequency (kHz)

Fig. 19 Output Noise Spectral Density

vs. Freq.

Fig. 17 Ripple Rejection vs. Freq.

Fig. 18 Ripple Rejection vs. VIN

(Iout=10 mA)

Fig. 20 Load Response

Fig. 21 Load Response

Fig. 22 Load Response

Fig. 23 Load Response

Fig. 24 Load Response

Current Pulse=10 kHz

Fig. 25 Load Response

Current Pulse=10 kHz

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)

Fig. 26 Load Response

Current Pulse=100 kHz

Fig. 27 Load Response

Current Pulse=100 kHz

Fig. 28 Startup Time

Iout = 0 mA

Fig. 29 Startup Time

Iout = 200 mA

Fig. 30 Startup Time (STBY=VIN)

Iout = 0 mA

Fig. 31 Startup Time (STBY=VIN)

Iout = 200mA

Fig. 32 Discharge Time

Iout = 0 mA

Fig. 33 VIN Response

Iout = 10 mA

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

3.5

100

80

60

40

20

0

1.85

1.84

IO=0uA

3.0

IO=100uA

1.83

IO=50mA

2.5

2.0

1.5

1.0

0.5

0.0

1.82

1.81

1.80

1.79

1.78

1.77

1.76

1.75

IO=200mA

IO=0uA

IO=100uA

IO=50mA

IO=200mA

Temp=-40°C

Temp=25°C

IO=0uA

Temp=25°C

VIN = STBY

Temp=25°C

VIN = STBY

Temp=85°C

VIN = STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

1.75

1.85

1.95

2.05

2.15

2.25

2.35

Vin Voltage (V)

Fig. 34 Output Voltage

Fig. 35 Line Regulation

Fig. 36 Circuit Current IGND

10

8

120

140

120

100

80

110

Temp=85°C

Temp=25°C

100

90

Temp=25°C

6

80

70

Temp=-40°C

60

4

Temp=-40°C

Temp=25°C

Temp=85°C

40

60

50

2

VIN = 3.5V

IO=200mA

20

STBY = 1.5V

VIN = STBY

4.5

40

0

0.05

0.1

0.15 0.2

0

0.5

1

1.5

2

2.5

3

3.5

4

5

5.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

Output Current (A)

STBY Voltage (V)

Vin Voltage (V)

Fig. 37 Circuit Current IGND

Fig. 38 STBY Input Current

Fig. 39 IOUT - IGND

1.85

3.50

3.00

2.50

2.00

1.50

1.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

1.84

1.83

1.82

1.81

1.80

1.79

1.78

1.77

1.76

1.75

Temp=25°C

VIN=5.5V

Temp=-40°C

VIN=3.5V

Temp=85°C

Temp=25°C

Temp=-40°C

Temp=85°C

VIN=2.5V

VIN = 3.5V

Temp=25°C

0.50

0.00

STBY = 1.5V

0

0.05

0.1

0.15

0.2

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0

0.5

1

1.5

Output Current (A)

STBY Voltage (V)

Fig. 40 Load Regulation

Fig. 41 OCP Threshold

Fig. 42 STBY Threshold

1.000

0.900

0.800

0.700

0.600

0.500

0.400

0.300

0.200

0.100

0.000

-0.100

50.00

40.00

30.00

1.85

1.84

1.83

1.82

1.81

1.80

1.79

1.78

1.77

1.76

1.75

20.00

10.00

0.00

VIN=3.5V

STBY=0V

VIN=3.5V

STBY=1.5V

Io=0mA

STBY=1.5V

Io=0.1mA

-40

-15

10

35

60

85

-40

-15

10

35

60

85

-40

-15

10

35

60

85

Temp (°C)

Fig. 43 VOUT vs Temp

Fig. 44 IGND vs Temp

Fig. 45 IGND vs Temp (STBY)

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

80

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

80

70

60

50

40

30

20

10

0

f=0.1kHz

Co=1.0μF

Cin=1.0μF

Iout=10mA

temp=25℃

70

60

50

40

30

20

10

0

f=1kHz

f=10kHz

f=100kHz

Co=1.0μF

Cin=none

Vin= 3.5V

Io=10mA

Ta = 25℃

Iout=10mA

temp=25℃

2.5

3.5

4.5

5.5

0.1

1

10

Frequency f [kHz]

100

0.1

1

10

100

1000

Input Voltage VIN[V]

Frequency (kHz)

Fig. 46 Ripple Rejection VS Freq.

Fig. 48 Output Noise Spectrl

Density VS Freq.

Fig. 47 Ripple Rejection VS VIN

Fig. 49 Load Response

Fig. 50 Load Response

Fig. 51 Load Response

Fig. 52 Load Response

⇔

Fig. 53 Load Response

Current Pulse=10kHz

Fig. 54 Load Response

Current Pulse=10kHz

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

⇔

Fig. 55 Load Response

Current Pulse=100kHz

Fig. 56 Load Response

Current Pulse=100kHz

Fig. 57 Start Up Time

Iout = 0mA

Fig. 58 Start Up Time

Iout = 200mA

Fig. 59 Start Up Time (STBY=VIN)

Iout = 0mA

Fig. 60 Start Up Time(STBY=VIN)

Iout = 200mA

Fig. 61 Discharge Time

Iout = 0mA

Fig. 62 VIN Response

Iout = 10mA

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2011.01 - Rev.C

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Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

3.5

100

80

60

40

20

0

2.55

2.54

2.53

3.0

2.5

IO=0uA

IO=100uA

2.52

IO=50mA

IO=200mA

2.51

2.50

2.49

2.48

2.47

2.46

2.45

2.0

1.5

1.0

0.5

0.0

IO=0uA

IO=100uA

IO=50mA

IO=200mA

Temp.=-40°C

Temp.=25°C

IO=0uA

Temp.=25°C

VIN=STBY

Temp.=25°C

Temp.=85°C

VIN=STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

2.4

2.5

2.6

2.7

2.8

2.9

3

Vin Voltage (V)

Fig. 63 Output Voltage

Fig. 65 Circuit Current IGND

Fig. 64 Line Regulation

10

8

120

0.50

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

110

Temp.=-40°C

Temp.=85°C

Temp.=25°C

Temp.=85°C

Temp.=25°C

100

Temp.=25°C

90

6

80

Temp.=-40°C

4

Temp.=-40°C

Temp.=85°C

70

60

50

2

VIN=0.98*VOUT

STBY=1.5V

0

40

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.05

0.1

0.15

0.2

0

0.05

0.1

0.15

0.2

Output Current (A)

STBY Voltage (V)

Output Current (A)

Fig. 66 Dropout Voltage

Fig. 67 STBY Input Current

Fig. 68 IOUT - IGND

2.55

2.54

2.53

2.52

2.51

2.50

2.49

2.48

2.47

2.46

2.45

3.00

2.50

2.00

1.50

1.00

0.50

0.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

Temp.=25°C

VIN=5.5V

VIN=3.5V

Temp.=85°C

VIN=3.0V

Temp.=85°C

Temp.=25°C

Temp.=-40°C

VIN=3.5V

Temp.=-40°C

Temp.=25°C

STBY=1.5V

0

0.05

0.1

0.15

0.2

0

0.1

0.2

0.3

0.4

0.5

0.6

0

0.5

1

1.5

Output Current (A)

STBY Voltage (V)

Fig. 69 Load Regulation

Fig. 70 OCP Threshold

Fig. 71 STBY Threshold

2.55

2.54

2.53

2.52

2.51

2.50

1.000

0.900

0.800

0.700

0.600

50.00

40.00

30.00

VIN=3.5V

STBY=1.5V

Io=0.1mA

VIN=3.5V

STBY=1.5V

Io=0mA

0.500

0.400

2.49

2.48

2.47

2.46

2.45

20.00

10.00

0.00

0.300

0.200

0.100

0.000

-0.100

VIN=3.5V

STBY=0V

-40

-15

10

35

60

85

-40

-15

10

35

60

85

-40

-15

10

35

60

85

Temp. (°C)

Fig. 72 VOUT vs Temp

Fig. 73 IGND vs Temp

Fig. 74 IGND vs Temp (STBY)

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2011.01 - Rev.C

12/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

80

1.2

1

80

f=0.1kHz

Co=1.0μF

Cin=1.0μF

Iout=10mA

temp=25℃

70

60

f=1kHz

60

0.8

0.6

0.4

0.2

0

50

f=10kHz

50

40

30

20

10

0

40

30

20

10

0

f=100kHz

Co=1.0μF

Cin=none

Iout=10mA

temp=25℃

Vin= 3.5V

Io=10mA

Ta = 25℃

2.5

3.5

4.5

5.5

0.1

1

10

Frequency f [kHz]

100

0.1

1

10

100

1000

Input Voltage VIN[V]

Frequency (kHz)

Fig. 77 Output Noise Spectrl

Density VS Freq.

Fig. 76 Ripple Rejection VS VIN

Fig. 75 Ripple Rejection VS Freq.

IOUT=0mA 100mA

→

IOUT=100mA 0mA

→

Fig. 79 Load Response

Fig. 78 Load Response

Fig. 81 Load Response

Fig. 80 Load Response

⇔

Fig. 83 Load Response

Current Pulse=10kHz

Fig. 82 Load Response

Current Pulse=10kHz

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2011.01 - Rev.C

13/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

⇔

Fig. 84 Load Response

Current Pulse=100kHz

Fig. 85 Load Response

Current Pulse=100kHz

Fig. 88 Start Up Time (STBY=VIN)

Iout = 0mA

Fig. 87 Start Up Time

Iout = 200mA

Fig. 86 Start Up Time

Iout = 0mA

Fig. 89 Start Up Time(STBY=VIN)

Iout = 200mA

Fig. 91 VIN Response

Iout = 10mA

Fig. 90 Discharge Time

Iout = 0mA

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2011.01 - Rev.C

14/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

100

80

60

40

20

0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

2.85

2.84

2.83

2.82

2.81

2.80

2.79

2.78

2.77

2.76

2.75

IO=0uA

VIN = STBY

IO=100uA

IO=50mA

IO=200mA

IO=0uA

IO=100uA

IO=50mA

IO=200mA

Temp.=-40°C

Temp.=25°C

Temp.=85°C

Temp.=25°C

VIN = STBY

Temp.=25°C

VIN = STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

2.7

2.8

2.9

3

3.1

3.2

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

Vin Voltage (V)

Fig. 92 Output Voltage

Fig. 94 Circuit Current IGND

Fig. 93 Line Regulation

10

8

0.40

0.35

0.30

0.25

0.20

0.15

120

110

Temp.=85°C

100

Temp.=85°C

Temp.=25°C

90

6

Temp.=25°C

Temp.=-40°C

80

Temp.=-40°C

4

70

Temp.=-40°C

60

0.10

0.05

0.00

2

VIN = 3.8V

STBY 1.5V

VIN=0.98 x VOUT

50

40

VIN = STBY

=

STBY = 1.5V

0

0.05

0.1

0.15

0.2

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.05

0.1

0.15

0.2

Output Currnt (A)

STBY Voltage (V)

Output Current (A)

Fig. 95 Dropout Voltage

Fig. 96 STBY Input Current

Fig. 97 IOUT - IGND

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

3.50

3.00

2.85

2.84

2.83

2.82

2.81

2.80

2.79

2.78

2.77

2.76

2.75

VIN=3.8V

VIN = 3.8V

STBY

=

1.5V

VIN=3.8V

2.50

2.00

1.50

1.00

VIN=5.5V

Temp.=-40°C

VIN=3.3V

Temp.=85°C

Temp.=25°C

Temp.=-40°C

Temp.=85°C

Temp.=25°C

Temp=25°C

STBY = 1.5V

0.50

0.00

0

0.1

0.2

0.3

0.4

0.5

0.6

0

0.05

0.1

0.15

0.2

0

0.5

1

1.5

Output Current (A)

Output Currnt (A)

STBY Voltage (V)

Fig. 98 Load Regulation

Fig. 99 OCP Threshold

Fig. 100 STBY Threshold

50.00

1.000

0.900

0.800

0.700

0.600

2.85

2.84

2.83

2.82

2.81

2.80

2.79

2.78

2.77

2.76

2.75

40.00

30.00

0.500

0.400

20.00

10.00

0.00

0.300

VIN=3.8V

STBY=0V

VIN=3.8V

STBY=1.5V

Io=0mA

0.200

0.100

0.000

-0.100

VIN=3.8V

STBY=1.5V

Io=0.1mA

-40

-15

10

35

60

85

-40

-15

10

35

60

85

-40

-15

10

35

60

85

Temp. (°C)

Fig. 101 VOUT vs Temp

Fig. 102 IGND vs Temp

Fig. 103 IGND vs Temp (STBY)

www.rohm.com

2011.01 - Rev.C

15/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

80

1.6

1.4

1.2

1

80

f=0.1kHz

70

Co=1.0μF

Cin=1.0μF

Iout=10mA

temp=25℃

70

60

f=1kHz

60

50

f=10kHz

40

30

20

10

0

40

30

20

10

0

0.8

0.6

0.4

0.2

0

f=100kHz

Co=1.0μF

Cin=none

Iout=10mA

temp=25℃

Vin= 3.8V

Io=10mA

Ta = 25℃

2.8

3.8

4.8

0.1

1

10

Frequency f [kHz]

100

0.1

1

10

100

1000

Input Voltage VIN[V]

Frequency (kHz)

Fig. 106 Output Noise Spectrl

Density VS Freq.

Fig. 105 Ripple Rejection VS VIN

Fig. 104 Ripple Rejection VS Freq.

Fig. 108 Load Response

Fig. 107 Load Response

Fig. 110 Load Response

Fig.109 Load Response

⇔

Fig. 112 Load Response

Current Pulse=10kHz

Fig. 111 Load Response

Current Pulse=10kHz

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2011.01 - Rev.C

16/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

⇔

Fig. 113 Load Response

Current Pulse=100kHz

Fig. 114 Load Response

Current Pulse=100kHz

Fig. 116 Start Up Time

Iout = 200mA

Fig. 115 Start Up Time

Fig. 117 Start Up Time (STBY=VIN)

Iout = 0mA

Fig. 118 Start Up Time(STBY=VIN)

Iout = 200mA

Fig.120 VIN Response

Iout = 10mA

Fig. 119 Discharge Time

Iout = 0mA

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2011.01 - Rev.C

17/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU30TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

3.5

3.05

100

80

60

40

20

0

3.04

IO=0uA

3.0

2.5

2.0

1.5

1.0

0.5

0.0

IO=100uA

IO=50mA

IO=200mA

3.03

3.02

3.01

3.00

2.99

2.98

2.97

2.96

2.95

IO=0uA

IO=100uA

IO=50mA

IO=200mA

Temp.=-40°C

IO=0uA

Temp.=25°C

Temp.=85°C

Temp.=25°C

VIN=STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

2.9

3

3.1

3.2

3.3

3.4

3.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

Vin Voltage (V)

Fig. 121 Output Voltage

Fig. 123 Circuit Current IGND

Fig. 122 Line Regulation

0.40

0.35

0.30

0.25

0.20

0.15

10

8

120

110

Temp.=25°C

Temp.=85°C

Temp.=25°C

Temp.=85°C

Temp.=25°C

100

Temp.=85°C

90

6

80

Temp.=-40°C

Temp=-40°C

4

70

0.10

0.05

60

50

40

2

VIN=0.98*VOUT

STBY=1.5V

VIN=STBY

0.00

0

0.05

0.1

0.15

0.2

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.05

0.1

0.15

0.2

Output Current (A)

STBY Voltage (V)

Output Current (A)

Fig. 124 Dropout Voltage

Fig. 125 STBY Input Current

Fig. 126 IOUT - IGND

3.50

3.05

3.04

3.03

3.02

3.01

3.00

2.99

2.98

2.97

2.96

2.95

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

VIN=4.0V

3.00

Temp.=25°C

VIN=5.5V

VIN=4.0V

2.50

2.00

1.50

1.00

0.50

0.00

VIN=3.5V

Temp.=85°C

Temp.=25°C

Temp.=-40°C

VIN=4.0V

Temp.=25°C

STBY=1.5V

Temp.=85°C

STBY=1.5V

0

0.1

0.2

0.3

0.4

0.5

0.6

0

0.05

0.1

0.15

0.2

0

0.5

1

1.5

Output Current (A)

STBY Voltage (V)

Fig. 127 Load Regulation

Fig.128 OCP Threshold

Fig. 129 STBY Threshold

1.000

0.900

0.800

0.700

0.600

3.05

3.04

3.03

3.02

3.01

3.00

50.00

40.00

30.00

VIN=4.0V

STBY=1.5V

Io=0.1mA

0.500

0.400

VIN=4.0V

STBY=0V

Io=0mA

2.99

2.98

2.97

2.96

2.95

20.00

10.00

0.00

0.300

0.200

0.100

0.000

-0.100

VIN=4.0V

STBY=1.5V

Io=0mA

-40

-15

10

35

60

85

-40

-15

10

35

60

85

-40

-15

10

35

60

85

Temp. (°C)

Fig. 131 IGND vs Temp

Fig. 132 IGND vs Temp (STBY)

Fig. 130 VOUT vs Temp

www.rohm.com

2011.01 - Rev.C

18/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU30TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

80

1.6

1.4

1.2

1

80

f=0.1kHz

70

Co=1.0μF

Cin=1.0μF

Iout=10mA

temp=25℃

70

60

f=1kHz

60

50

40

30

20

10

0

50

40

30

20

10

0

f=10kHz

0.8

0.6

0.4

0.2

0

f=100kHz

Co=1.0μF

Cin=none

Vin= 4.0V

Io=10mA

Ta = 25℃

Iout=10mA

temp=25℃

3

4

5

0.1

1

10

Frequency f [kHz]

100

0.1

1

10

100

1000

Input Voltage VIN[V]

Frequency (kHz)

Fig. 133 Ripple Rejection VS Freq.

Fig. 134 Ripple Rejection VS VIN

Fig. 135 Output Noise Spectrl

Density VS Freq.

Fig. 136 Load Response

Fig. 137 Load Response

Fig. 138 Load Response

Fig. 139 Load Response

Fig. 140 Load Response

Current Pulse=10kHz

Fig. 141 Load Response

Current Pulse=10kHz

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2011.01 - Rev.C

19/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU30TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

Fig. 142 Load Response

Current Pulse=100kHz

Fig. 143 Load Response

Current Pulse=100kHz

Fig. 144 Start Up Time

Fig. 145 Start Up Time

Iout = 200mA

Fig. 146 Start Up Time (STBY=VIN)

Iout = 0mA

Fig. 147 Start Up Time(STBY=VIN)

Iout = 200mA

Fig. 148 Discharge Time

Iout = 0mA

Fig. 149 VIN Response

Iout = 10mA

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2011.01 - Rev.C

20/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

100

80

60

40

20

0

3.35

3.34

3.33

3.32

3.31

3.30

3.29

3.28

3.27

3.26

3.25

IO=0uA

IO=100uA

IO=50mA

IO=200mA

IO=0uA

IO=100uA

IO=50mA

IO=200mA

Temp.=-40°C

Temp.=25°C

IO=0uA

Temp.=25°C

VIN = STBY

Temp=25°C

VIN = STBY

Temp.=85°C

VIN = STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

3.2

3.3

3.4

3.5

3.6

3.7

Vin Voltage (V)

Fig. 150 Output Voltage

Fig. 152 Circuit Current IGND

Fig. 151 Line Regulation

0.35

0.30

0.25

0.20

0.15

0.10

10

8

120

110

Temp.=85°C

Temp.=25°C

Temp.=85°C

100

Temp.=25°C

90

6

Temp.=25°C

Temp.=-40°C

80

Temp.=-40°C

4

70

60

2

VIN=0.98 x VOUT

STBY = 1.5V

VIN = 4.3V

0.05

0.00

50

40

STBY = 1.5V

VIN = STBY

4.5

0

0.05

0.1

0.15

0.2

0.5

1

1.5

2

2.5

3

3.5

4

5

5.5

0

0.05

0.1

0.15

0.2

Output Current (A)

V_STBYVoltage (V)

Output Current (A)

Fig. 153 Dropout Voltage

Fig. 154 STBY Input Current

Fig. 155 IOUT - IGND

3.35

3.34

3.33

3.32

3.31

3.30

3.29

3.28

3.27

3.26

3.25

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

VIN=4.3V

3.00

2.50

2.00

1.50

1.00

VIN=3.8V

VIN=5.5V

Temp.=25°C

Temp.=-40°C

VIN=4.3V

Temp.=85°C

Temp.=25°C

Temp.=-40°C

Temp.=85°C

STBY = 1.5V

VIN = 4.3V

0.50

0.00

Temp=25

℃

STBY = 1.5V

0

0.05

0.1

0.15

0.2

0

0.1

0.2

0.3

0.4

0.5

0.6

0

0.5

1

1.5

Output Current (A)

STBY Voltage (V)

Output Current (A)

Fig. 156 Load Regulation

Fig. 158 STBY Threshold

Fig. 157 OCP Threshold

3.35

3.34

3.33

3.32

3.31

50.00

40.00

30.00

1.000

0.900

0.800

0.700

0.600

0.500

0.400

3.30

3.29

3.28

3.27

3.26

3.25

20.00

10.00

0.00

0.300

0.200

0.100

0.000

-0.100

VIN=4.3V

STBY=0V

VIN=4.3V

STBY=1.5V

Io=0mA

STBY=1.5V

Io=0.1mA

-40

-15

10

35

60

85

-40

-15

10

35

60

85

-40

-15

10

35

60

85

Temp. (°C)

Fig. 159 VOUT vs Temp

Fig. 160 IGND vs Temp

Fig. 161 IGND vs Temp (STBY)

www.rohm.com

2011.01 - Rev.C

21/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

80

1.8

1.6

1.4

1.2

1

80

70

60

50

40

30

20

10

0

f=1kHz

Co=1.0μF

Cin=1.0μF

Iout=10mA

temp=25℃

70

60

50

40

30

20

10

0

f=0.1kHz

f=10kHz

0.8

0.6

0.4

0.2

0

f=100kHz

Co=1.0μF

Cin=none

Vin= 4.3V

Io=10mA

Ta = 25℃

Iout=10mA

temp=25℃

3.3

4.3

Input Voltage VIN[V]

5.3

0.1

1

10

Frequency f [kHz]

100

0.1

1

10

100

1000

Frequency (kHz)

Fig. 163 Ripple Rejection VS VIN

Fig. 164 Output Noise Spectrl

Density VS Freq.

Fig. 162 Ripple Rejection VS Freq.

Fig. 165 Load Response

Fig. 166 Load Response

Fig. 167 Load Response

Fig. 168 Load Response

Fig. 169 Load Response

Current Pulse=10kHz

Fig. 170 Load Response

Current Pulse=10kHz

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2011.01 - Rev.C

22/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)

Fig. 172 Load Response

Current Pulse=100kHz

Fig. 171 Load Response

Current Pulse=100kHz

Fig. 173 Start Up Time

Fig. 174 Start Up Time

Iout = 200mA

Fig. 175 Start Up Time (STBY=VIN)

Iout = 0mA

Fig. 178 VIN Response

Iout = 10mA

Fig. 176 Start Up Time(STBY=VIN)

Iout = 200mA

Fig. 177 Discharge Time

Iout = 0mA

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2011.01 - Rev.C

23/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●About power dissipation (Pd)

As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of

IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the

implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is

recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original

IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be

sure to prepare sufficient margin within power dissipation for usage.

Calculation of the maximum internal power consumption of IC (PMAX)

PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)

Measurement conditions

Evaluation Board 1

(Single-side Board)

40

Evaluation Board 2

(Double-side Board)

40

20

40 20

Layout of Board for

Measurement

(Unit: mm)

Top Layer (Top View)

40

20

IC Implementation Position

40

40 20

Bottom Layer (Top View)

Measurement State

With board implemented (Wind speed 0 m/s)

Glass epoxy resin (Single-side board)

40 mm x 40 mm x 0.8 mm

With board implemented (Wind speed 0 m/s)

Board Material

Board Size

Glass epoxy resin (Double-side board)

40 mm x 40 mm x 0.8 mm

Metal (GND) wiring rate: Approx. 25%

Metal (GND) wiring rate: Approx 25%

Diameter 0.5 mm  12 holes

1250 mW

Top layer

Metal (GND) wiring rate: Approx. 25%

Wiring Rate

Bottom layer Metal (GND) wiring rate: Approx 0%

0 holes

Through Hole

Power Dissipation

1100 mW

Thermal Resistance

θja=91℃/W

θja=80℃/W

www.rohm.com

2011.01 - Rev.C

24/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

○SSON004X1216

1500

1250 mW

* Please design the margin so that PMAX becomes is than Pd

(PMAXPd) within the usage temperature range.

Evaluation board 2

(Double-side board)

1000

500

0

1100 mW

- Standard ROHM board -

Size: 70 mm  70 mm  1.6 mm

Material: Glass epoxy board

Evaluation board 1

(Single-side board)

Standard ROHM board

220 mW

0

25

50

75

100

125

Ta (

)

℃

Fig.179 SSON004X1216

Power dissipation heat reduction characteristics

(Reference)

○HVSOF5

* Please design the margin so that PMAX

becomes is than Pd (PMAXPd) within

the usage temperature range.

Fig.180 HVSOF5

Power dissipation heat reduction characteristics

(Reference)

www.rohm.com

2011.01 - Rev.C

25/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●DEVICE TYPE & Mark

○SSON004X1216

○HVSOF5

Device type: BUXXTA2WHFV

Device type: BUXXTA2WNVX

a

package

output

voltage

XX

HVSOF5

BA

SSON004X1216

15

18

25

26

27

28

2J

29

30

31

32

33

34

1.5V typ.

1.8V typ.

2.5V typ.

2.6V typ.

2.7V typ.

2.8V typ.

2.85V typ.

2.9V typ.

3.0V typ.

3.1V typ.

3.2V typ.

3.3V typ.

3.4V typ.

AA

AB

AC

AD

AE

AF

AG

AH

AJ

BB

BD

BE

BF

a

BG

BH

BJ

BK

AK

AL

BL

BM

BN

BP

AM

AN

www.rohm.com

2011.01 - Rev.C

26/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

○SSON004X1216

Mark

Lot No.

○HVSOF5

Mark

Lot No.

www.rohm.com

2011.01 - Rev.C

27/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Notes for use

・About absolute maximum rating

Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are

exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety

measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.

・About GND potential

Please be sure that the potential of the GND terminal is the lowest in any operating condition.

・About thermal design

Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into

consideration.

・About short between pins and misattachment

Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Misattachment

may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GNDs may also

lead to a break.

・About operation in a strong electromagnetic field

Please note that usage in a strong electromagnetic field may cause malfunction.

・About common impedance

Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple

as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.

・About STBY terminal voltage

Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each

channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen

the transition time. This may cause malfunction or failure. When shorting the VIN terminal and STBY terminal for usage,

the status will be “STBY=VIN＝LOW” at turning the power OFF, and discharge of the VOUT terminal cannot operate,

which means voltage may remain for a certain time in the VOUT terminal. Since turning the power ON again in this state

may cause overshoot, turn the power ON for use after the VOUT terminal is completely discharged.

・About overcurrent protection circuit

Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protection circuit

is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit

operates continuously.

・About thermal shutdown

Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal

breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at

emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in

which protection works.

●About reverse current

Reverse current

For applications on which reverse current is assumed to flow into IC,

it is recommended to prepare a path to let the current out by putting

a bypass diode between the VIN-VOUT terminals.

VIN

OUT

STBY

GND

Fig.181 Example of bypass diode connection

●About testing on a set board

When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for

each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the assembly

process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig in a testing

process, please do so after turning the power OFF and remove it after turning the power OFF.

www.rohm.com

2011.01 - Rev.C

28/29

Technical Note

BUTA2WNVX series, BUTA2WHFV series

●Ordering part number

B U

1 5

T A 2

W

N V X - T R

Packaging and forming specification

TR: Embossed tape and reel

Output voltage

Part No.

Lineup

Shutdown Swich Package

W : Includes

15: 1.5V 29: 2.9V

18: 1.8V 30: 3.0V

25: 2.5V 31: 3.1V

26: 2.6V 32: 3.2V

27: 2.7V 33: 3.3V

28: 2.8V 34: 3.4V

2J: 2.85V

NVX : SSON004X1216

switch

HFV : HVSOF5

SSON004X1216

1.2 0.1

Tape

Embossed carrier tape

5000pcs

Quantity

TR

Direction

of feed

1PIN MARK

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

S

0.08

S

+0.05

0.65 0.1

0.2

-

0.04

1

2

4

3

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

1pin

0.75 0.1

Reel

(Unit : mm)

∗

HVSOF5

1.6 0.05

1.0 0.05

(0.8)

(0.3)

Tape

Embossed carrier tape

Quantity

3000pcs

TR

Direction

of feed

5

1

4

3

4

5

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

3

2 1

2

1pin

0.13 0.05

S

0.1

S

0.5

0.22 0.05

M

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

0.08

Reel

(Unit : mm)

∗

www.rohm.com

2011.01 - Rev.C

29/29

Notice

N o t e s

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content speciﬁed herein is subject to change for improvement without notice.

The content speciﬁed herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the speciﬁcations,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information speciﬁed in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information speciﬁed herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products speciﬁed in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, ofﬁce-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products speciﬁed in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, ﬁre or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, ﬁre control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology speciﬁed herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1120

A

型号:	BU31P-TCS-LE
是否无铅：	含铅
是否Rohs认证：	不符合
生命周期：	Active
Reach Compliance Code：	unknown
风险等级：	5.4
其他特性：	PANEL MOUNTABLE
连接器类型：	BOARD CONNECTOR
联系完成配合：	TIN
联系完成终止：	TIN
触点材料：	COPPER ALLOY
DIN 符合性：	NO
滤波功能：	NO
IEC 符合性：	NO
JESD-609代码：	e3
MIL 符合性：	NO
制造商序列号：	TCS
插接信息：	MULTIPLE MATING PARTS AVAILABLE
混合触点：	NO
安装类型：	CABLE
装载的行数：	1
选件：	GENERAL PURPOSE
端接类型：	IDC
触点总数：	31
UL 易燃性代码：	94V-0
Base Number Matches：	1

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