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产品型号BV1HD090FJ-C的Datasheet PDF文件预览

Automotive IPD series  
1ch High-side Switch IC  
BV1HD090FJ-C  
Features  
Product Summary  
AEC-Q100 qualified (Note 1)  
Wide Operating Input Range  
4.5V to 36V  
90m  
Built-in overcurrent limiting circuit (OCP)  
Built-in thermal shutdown circuit (TSD)  
Built-in open load detection function (at output OFF)  
Direct control enabled from CMOS logic IC, etc.  
Built-in under voltage lockout function  
Built-in Output State Pin  
On-state Resistance (Tj=25°C, Typ)  
Overcurrent limit (Tj=25°C, Typ)  
Active Clamp Energy (Tj=150°C)  
5.5A  
68mJ  
On-Resistance RON=90m(Typ)  
Package  
W(Typ) x D(Typ) x H(Max)  
4.90mm x 6.00mm x 1.65mm  
(VBB=14V, Tj=25°C, IOUT=0.5A)  
SOP-J8  
Monolithic power management IC with the control  
block (CMOS) and power MOS FET mounted on a  
single chip  
Enables operation at low voltage down to 4.2V  
(Note 1:Grade1)  
General Description  
BV1HD090FJ-C is an automotive 1ch high side switch IC,  
which has built-in overcurrent limiting circuit(OCP),  
thermal shutdown circuit(TSD), open load detection  
function (OLD) and under voltage lockout function  
(UVLO). It is also equipped with the diagnostic output  
when detecting an error (ST).  
SOP-J8  
Applications  
Onboard vehicle device (engine ECU, air conditioner,  
body-control etc )  
Block Diagram  
Fige 1. Block Diagram  
Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays  
www.rohm.com  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 14 • 001  
1/20  
Daattaasshheeeett  
BV1HD090FJ-C  
Pin Configurations  
( Top view )  
1
IN  
ST  
8
7
6
5
VBB  
VBB  
VBB  
VBB  
2
GND  
OUT  
3
4
Figure 2. Pin Configurations  
Pin Descriptions  
Pin No.  
Unit  
IN  
Function  
1
Input pin. This input has a pull-down resister.  
Self-diagnostic output terminal, which outputs “Low” at overcurrent or  
2
ST  
overtemperature, and “High” at open load. It has an n-channel open drain circuit  
structure.  
GND pin  
3
4
GND  
OUT  
VBB  
Output terminal, which limits the output current to protect the IC when the load is  
short-circuited and current exceeding the overcurrent detection value (2.7A min)  
flows to the output terminal.  
5, 6, 7, 8  
Power Supply Voltage  
Definition  
IBB  
IIN  
VDS  
VBB  
IN  
IOUT  
VBB  
VIN  
OUT  
IST  
ST  
VOUT  
GND  
VST  
GND  
Figure 3. Voltage/Current Definition  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
2/20  
Daattaasshheeeett  
BV1HD090FJ-C  
Absolute Maximum Ratings (Tj = 25°C)  
Parameter  
Symbol  
Rating  
Unit  
VBB-OUT Voltage  
VDS  
VBB  
VIN  
45 (internal limit)  
40  
V
V
Power Supply Voltage  
Input Voltage  
-0.3 to +7.0  
-0.3 to +7.0  
V
Diagnostic Output Voltage  
Output Current  
VST  
IOUT  
IST  
V
(Note 1)  
9.0(Internal limit IOC  
10  
)
A
Diagnostic Output Current  
Junction Temperature Range  
Storage Temperature Range  
Maximum Junction Temperature  
mA  
°C  
°C  
°C  
Tj  
-40 to +150  
-55 to +150  
+150  
Tstg  
Tjmax  
Active Clamp Energy (single pulse)  
Tj(start)=25°C(Note 2)  
EAS(25°C)  
242  
68  
mJ  
mJ  
Active Clamp Energy (single pulse)  
Tj(start)=150°C(Note 2) (Note 3)  
EAS(150°C)  
(Note 1) Internally limited by the overcurrent limiting circuit. Value is a maximum.  
(Note 2) Maximum Active clamp energy, using single non-repetitive pulse of IAR = 1.5A and VBB = 14V.  
During demagnetization of inductive loads, energy must be dissipated in the BV1HD090FJ-C.  
This energy can be calculated with following equation:  
ꢁꢂ = ꢄꢂ ×ꢅ ꢅ× [ꢅ  
ꢈ  
ꢉꢉ ꢄꢂ  
× ꢁꢌ  
ꢅ× ln ꢊ1 −  
ꢍ + ꢁꢌ  
]
ꢈ  
ꢉꢉ ꢄꢂ  
Following equation simplifies under the assumption of RL=0.  
1
2
ꢉꢉ  
ꢁꢂ  
=
ꢅ× ꢆꢅ ×ꢅ× (ꢅ1 ꢅ  
ꢅ)  
ꢉꢉ ꢄꢂ  
(Note 3) This active clamp energy is guaranteed by design.  
Recommended Operating Conditions (Tj= -40°C to +150°C)  
Parameter  
Symbol  
VBB  
Min  
4.5  
Typ  
14  
Max  
36  
Unit  
Power Supply Voltage  
V
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
3/20  
Datashheeeett  
BV1HD090FJ-C  
Thermal Resistance(Note 1)  
Parameter  
Symbol  
Typ  
Unit  
Condition  
SOP-J8  
143.7  
86.9  
67.5  
°C / W  
°C / W  
°C / W  
1s(Note 2)  
2s(Note 3)  
Between Junction and Surroundings Temperature  
Thermal Resistance  
θJA  
2s2p(Note 4)  
(Note 1) The thermal impedance is based on JESD51 - 2A (Still - Air) standard. It is used the chip of BV1HD090FJ-C  
(Note 2) JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s)  
(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)  
(Note 3) JESD51 -5 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 2-layer (2s)  
(Top copper foil: ROHM recommended footprint + wiring to measure /  
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, 2 oz. copper (top & reverse sidee) )  
(Note 4) JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer (2s2p)  
(Top copper foil: ROHM recommended footprint + wiring to measure /  
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,  
copper (top & reverse side / inner layers) 2oz. / 1oz.)  
PCB Layout 1 Layer (1s)  
Footprint Only  
Figure 4. PCB Layout 1 Layer (1s)  
Dimension  
Value  
Board Finish Thickness  
Board Dimension  
1.57 mm ± 10%  
76.2 mm x 114.3 mm  
FR4  
Board Material  
Copper Thickness (Top/Bottom Layers)  
0.070mm (Cu:2oz)  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
4/20  
Datashheeeett  
BV1HD090FJ-C  
PCB Layout 2 Layers (2s)  
Top Layer  
Bottom Layer  
Cross Section  
Top Layer  
Bottom Layer  
Figure 5. PCB Layout 2 Layers (2s)  
Dimension  
Value  
1.60 mm ± 10%  
76.2 mm x 114.3 mm  
FR4  
Board Finish Thickness  
Board Dimension  
Board Material  
Copper Thickness (Top/Bottom Layers)  
0.070mm (Cu + Plating)  
PCB Layout 4 Layers(2s2p)  
Top Layer  
2nd Layer  
3rd Layer  
Bottom Layer  
Cross Section  
Top Layer  
2nd/3rd/Bottom Layers  
Figure 6. PCB Layout 4 Layers (2s2p)  
Dimension  
Value  
1.60 mm ± 10%  
76.2 mm x 114.3 mm  
FR4  
Board Finish Thickness  
Board Dimension  
Board Material  
Copper Thickness (Top/Bottom Layers)  
Copper Thickness (Inner Layers)  
0.070mm (Cu + Plating)  
0.035mm  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
5/20  
Datashheeeett  
BV1HD090FJ-C  
Thermal Resistance (Single Pulse)  
Figure 7. Thermal Resistance  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
6/20  
Daattaasshheeeett  
BV1HD090FJ-C  
Electrical Characteristics  
(Unless otherwise specified Tj = -40 °C to +150 °C, VBB = 4.5V to 36V)  
Unit  
Conditions  
Parameter  
Symbol  
Min  
Typ  
Max  
Power Supply  
VBB=14V, VIN=0V, VOUT=0V,  
Tj=25°C  
IBBS1  
-
-
200  
250  
330  
500  
µA  
µA  
Standby Current  
VBB=14V, VIN=0V, VOUT=0V,  
Tj=150°C  
IBBS2  
Bias Current  
IBB  
-
-
-
3.0  
3.6  
0.2  
6.0  
4.2  
-
mA  
V
VBB=14V, VIN=5V, VOUT=open  
Under Voltage Lockout Threshold  
Under Voltage Hysteresis Threshold  
Input  
VUVLO  
VUVHYS  
V
High-Level Input Voltage  
Low-Level Input Voltage  
Input Hysteresis  
VINH  
VINL  
2.8  
-
-
-
V
V
-
-
1.5  
-
VINHYS  
IINH  
0.4  
50  
-
V
High-Level Input Current  
Low-Level Input Current  
Power MOS  
-
150  
+10  
μA  
μA  
VIN=5V  
VIN=0V  
IINL  
-10  
RON1  
RON2  
RON3  
-
-
-
90  
160  
-
120  
215  
500  
mΩ  
mΩ  
mΩ  
VBB=8V to 36V, Tj=25°C  
VBB=8V to 36V, Tj=150°C  
VBB=4.2V  
On-State Resistance  
VBB=14V, VIN=0V, VOUT=0V,  
Tj=25°C  
-
130  
160  
-90  
200  
μA  
μA  
μA  
μA  
IOUTL1  
IOUTL2  
IOUTH3  
IOUTH4  
VBB=14V, VIN=0V, VOUT=0V,  
Tj=150°C  
-
250  
Leak Current  
Slew Rate  
VBB=14V, VIN=0V, VOUT=VBB  
Tj=25°C  
,
-160  
-400  
-
-
VBB=14V, VIN=0V, VOUT=VBB  
Tj=150°C  
,
-110  
SRON  
SROFF  
tOUTON  
tOUTOFF  
VDS  
0.23  
0.53  
-
0.70  
1.60  
30  
-
-
V/μs  
V/μs  
μs  
VBB=14V, RL=10, Tj=25°C  
VBB=14V, RL=10, Tj=25°C  
VBB=14V, RL=10, Tj=25°C  
VBB=14V, RL=10, Tj=25°C  
VIN=0V, IOUT=-10mA  
Propagation Delay at ON  
Propagation Delay at OFF  
Output Clamp Voltage  
Output States  
90  
60  
56.5  
-
20  
μs  
45  
50  
V
VBB=6V to 36V,  
VIN=0V, IST=-0.6mA  
ST ON Voltage  
VSTL  
ISTH  
-
-10  
-
-
-
0.3  
-
V
ST Leak Current  
μA  
μs  
VIN=5V, VST=5V  
Diagnostic Output Delay Time at Input  
ON  
tSTON  
11  
33  
VBB=14V, RL=10, Tj=25°C  
Diagnostic Output Delay Time at Input  
OFF  
tSTOFF  
-
30  
90  
μs  
VBB=14V, RL=10, Tj=25°C  
Protection Circuit  
Overcurrent Detection Current  
Overcurrent Detection OFF Time  
Overcurrent Detection ON Duty  
Open Load Detection Resistance (Note1)  
Open Load Detection Voltage (Note1)  
TSD Detection Temperature(Note2)  
TSD Hysteresis(Note2)  
IOC  
tOCOFF  
DOC  
2.7  
5.5  
550  
-
9.0  
1100  
30  
A
μs  
%
-
-
ROLD  
VOLD  
6
-
36  
kΩ  
V
VIN=0V  
VIN=0V  
1.5  
175  
-
-
2.5  
205  
-
TTSD  
190  
15  
°C  
°C  
TTSDHYS  
(Note1) The detectable power voltage range for open load is VBB 6V.  
(Note2) This temperature is guaranteed by design.  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
7/20  
Daattaasshheeeett  
BV1HD090FJ-C  
Typical Performance Curves  
(Unless otherwise specified VBB =14V, VIN=5V, Tj=25°C)  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
6.0  
5.0  
VBB=14V  
4.0  
IBB  
IBB  
3.0  
2.0  
1.0  
IBBS  
IBBS  
0.0  
-50  
0
50  
100  
150  
0
10  
20  
30  
40  
Junction Temperature: Tj [°C]  
Power Supply Voltage : VBB [V]  
Figure 9. Circuit Current vs. Temperature  
Figure 8. Circuit Current vs. Power Supply Voltage  
4.0  
3.0  
2.0  
1.0  
0.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
VINH  
VINL  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Junction Temperature : Tj [°C]  
Figure 10. Under Voltage Lockout Threshold  
vs. Temperature  
Figure 11. Input Threshold Voltage vs. Temperature  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
8/20  
Daattaasshheeeett  
BV1HD090FJ-C  
Typical Performance Curves - continued  
600  
500  
400  
300  
200  
100  
0
150  
120  
90  
60  
30  
0
-50  
0
50  
100  
150  
0
10  
20  
30  
40  
Power Supply Voltage : VBB [V]  
Junction Temperature : Tj [°C]  
Figure 13. On-state Resistance vs. Power Supply Voltage  
Figure 12. Input Current vs. Temperature  
250  
300  
250  
200  
150  
100  
50  
VBB=14V  
200  
150  
100  
50  
0
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Junction Temperature : Tj [°C]  
Figure 14. On-state Resistance vs. Temperature  
Figure 15. Leak Current vs. Temperature  
www.rohm.com  
© 2016 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0GBG0BD00150-1-2  
27.Dec.2016 Rev.001  
9/20  
Daattaasshheeeett  
BV1HD090FJ-C  
Typical Performance Curves - continued  
0
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
VBB=14V  
-100  
-200  
-300  
-400  
SROFF  
SRON  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Junction Temperature : Tj [°C]  
Figure 16. Leak Current vs. Temperature  
Figure 17. Slew Rate vs. Tempareture  
100  
80  
60  
40  
20  
0
60  
50  
40  
30  
20  
10  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Junction Temperature : Tj [°C]  
Figure 19. Propagation Delay at OFF  
vs. Temperature  
Figure 18. Propagation Delay at ON  
vs. Temperature  
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Typical Performance Curves - continued  
60  
55  
50  
45  
40  
0.30  
0.25  
0.20  
0.15  
0.10  
0.05  
0.00  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Junction Temperature : Tj [°C]  
Figure 21. ST ON Voltage vs. Temperature  
Figure 20. Output Clamp Voltage vs. Temperature  
50  
40  
30  
20  
10  
0
9.0  
8.0  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
VBB=14V  
tSTOFF  
tSTON  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Junction Temperature : Tj [°C]  
Figure 22. Diagnostic Output Delay Time  
vs. Temperature  
Figure 23. Overcurrent Detection vs. Temperature  
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Typical Performance Curves - continued  
1200  
1000  
800  
600  
400  
200  
0
35  
30  
25  
20  
15  
10  
5
0
-50  
0
50  
100  
150  
0
10  
20  
30  
40  
Junction Temperature : Tj [°C]  
Power Supply Voltage : VBB [V]  
Figure 24. Overcurrent Detection Off Time  
vs. Temperature  
Figure 25. Open Detection Resistance vs.  
Power Supply Voltage  
35  
30  
25  
20  
15  
10  
5
10000  
1000  
100  
Tj(start)=25°C  
Tj(start)=150°C  
10  
0
0.0  
1.0  
2.0  
-50  
0
50  
100  
150  
Output Current : IOUT [A]  
Junction Temperature : Tj [°C]  
Figure 26. Open Detection Resistance vs. Temperature  
Figure 27. Active Clamp Energy vs. Output Current  
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Measurement Circuit  
VBB  
VBB  
V
ST  
IN  
OUT  
IOUT  
VIN  
GND  
Figure 29. Under Voltage Lockout Threshold  
Under Voltage Hysteresis Threshold  
High-Level Input Voltage  
Low-Level Input Voltage  
Figure 30. On-state Resistance  
Output Clamp Voltage  
Figure 28. Standby Current  
Bias Current  
High-level Input Current  
Low-level Input Current  
Input Hysteresis  
TSD Detection Temperature  
TSD Hysteresis  
VBB  
VBB  
ST  
V
OUT  
IN  
1k  
VIN  
GND  
Figure 32. Slew Rate  
Propagation Delay at ON  
Propagation Delay at OFF  
Diagnostic Output Delay Time  
at Input ON  
Figure 33. ST ON Voltage  
Figure 31. Leak Current  
Diagnostic Output Delay Time  
at Input OF  
VBB  
VBB  
VBB  
VBB  
10k  
5V  
10k  
ST  
IN  
ST  
Monitor  
V
5V  
OUT  
OUT  
A
IN  
A
Monitor  
GND  
GND  
VIN  
VIN  
VOUT  
Figure 34. Overcurrent Detection Current  
Overcurrent Detection OFF Time  
Overcurrent Detection ON Duty  
Figure 35. Open Load Detection Resistance  
Open Load Detection Voltage  
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Measurement conditions  
Figure 36. Slew Rate  
Figure 37. Diagnostic Output Delay Time  
I/O Pin Truth Table  
Diagnostic Output  
(ST)  
Error Detection  
Reset Condition  
Operating Status  
Input Signal  
Output Level  
Low  
High  
Low  
High  
Low  
High  
Low  
High  
Low  
High  
Low  
High  
Low  
Low  
Low  
Low  
High  
High  
Normal  
-
Low  
Overtemperature  
Overcurrent  
Self-Reset  
Self-Reset  
Self-Reset  
Low  
Low  
Switching  
High  
Open Load Detected  
High  
Timing Chart  
Figure 38. Timing Chart  
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I/O Equivalent Circuits  
IN  
ST  
OUT  
ST  
100  
Resistance values shown in the diagrams above represent a typical limit, respectively  
Figure 39. I/O Equivalent Circuits  
Application Circuits  
5V  
CVBB  
RSTPU  
VBB  
ST  
BV1HD090  
OUT  
MCU  
RL  
IN  
GND  
RGND  
DGND  
Figure 40. Application Circuits  
Symbol  
RSTPU  
Value  
10kΩ  
1kΩ  
Purpose  
ST terminal is open drain output. ST terminal is pulled up by MCU  
power supply.  
Current limitation during reverse battery.  
RGND  
CVBB  
DGND  
100nF  
-
Filter of the voltage spikes on the VBB line.  
Protection of the BV1HD090FJ-C during reverse battery.  
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Precautions for use  
1. Ground Wiring Pattern  
When both small signal ground and large current ground are provided, it is recommended to isolate the large current  
ground pattern from the small signal ground pattern and ground at one point at the reference point of the set PCB so  
as to prevent change of the small signal ground voltage caused by the pattern wiring resistance and large current.  
Also, pay attention not to change the voltage of ground wiring pattern of the external parts. When wiring the ground  
line, be sure to set it to low impedance.  
2. Thermal Design  
The generated calorific value Pc is determined by Pc VDS×IOUT+VBB×IBB, using VBB - OUT potential difference  
(VDS), amperage flowing through load (IOUT) and operating current (IBB).  
In consideration of the thermal resistance value in the actual service condition, complete the thermal design having  
sufficient margins.  
Should the project be used in the condition exceeding Tjmax = 150 °C, the essential IC properties may be  
deteriorated.  
Since the thermal resistance value described in this specification is measured in the PCB conditions and  
environments recommended by JEDEC, you should remember that the value in the actual service environments may  
differ from that.  
3. Absolute Maximum Rating  
If the temperature value exceeds the absolute maximum rating due to overvoltage applied or rise in temperature, the  
IC may be broken. If a special mode is assumed where a short circuit between terminals or an excess of the absolute  
maximum rating may occur, it is recommended to take physical safety measures such as fuses.  
4. Inspection Using a Set PCB  
In the assembly process, apply grounding as a measure against IC damage caused by static electricity and pay  
special attention during transportation and storage.  
When connecting the IC to or removing the IC from the mount board in the inspection process, be sure to turn OFF  
the power supply. If a terminal to which a capacitor is connected is included, residual charge may apply stress to the  
IC. To avoid this, be sure to discharge electricity before performing the following inspection.  
5. Mis-mounting and Short Circuit Between Terminals  
When mounting the IC on the PCB, pay special attention to the IC direction, displacement and short circuit between  
terminals. Mis-mounting or short circuit between terminals may cause IC damage.  
6. Ceramic Capacitor Characteristic Variation  
When using a ceramic capacitor as the external component, determine the constant in consideration of lowering of  
nominal capacity due to direct current bias and change of capacity caused by thermal conditions.  
7. Thermal Shut Down Function  
The IC integrates the thermal shut down function. When the IC chip temperature exceeds 190°C (Typ), the function  
turns OFF the output and sets the diagnostic output (ST) to Low. When the temperature becomes lower than 175°C  
(Typ), the IC returns to the normal operation.  
The thermal shut down function is provided only in order to shut down a thermal runaway, not in order to protect or  
secure the IC. Since the thermal shut down function turns ON in the state exceeding the absolute maximum rating, be  
sure to avoid designing a set PCB pre-requiring use of this function.  
8. Overcurrent Protection Function  
The IC integrates the overcurrent protection function. When overcurrent flows, the function limits the output current to  
5.5A (Typ), turns OFF the output if the limited state continues for 3μs (Typ) or longer and sets the diagnostic output  
(ST) to Low. If the output OFF state continues for 550μs (Typ), the IC resets itself. During the erroneous state  
where overcurrent flows, the function turns ON/OFF the output repeatedly.  
The overcurrent protection function is to protect the IC from damage caused only by a sudden abnormality such as a  
load short circuit and short circuit between terminals. Be sure to avoid designing a set PCB pre-requiring use of this  
function.  
9. Active Clamp Operation  
The IC integrates the active clamp circuit to internally absorb the counter electromotive force generated when the  
inductive load is turned OFF. When the active clamp operates, VBB - OUT voltage becomes 50V (Typ) and the IC chip  
temperature rises. However, since this is the operation at IN=0V, the thermal shut down function does not turn ON. To  
drive the inductive load, refer to Figure. 27 to determine the load which will be below the active clamp tolerance dose.  
10. Power Supply Line  
Since the power supply line where large current flows may influence the normal operation, design the power supply  
line so that the power supply pattern wiring resistance will become smaller.  
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11. Reverse Connection of Power Connector (VBB - GND)  
A reverse connection of the power connector (between VBB and GND) incurs a risk to break the IC.  
In order to prevent the IC from damage at reverse connection, take an appropriate measure, for example, to insert a  
diode and resistor between the GND terminal of the PCB ground and that of the IC, or to insert a diode between VBB  
of the power supply and that of the IC. (Refer to Figure No.40)  
12. Power Terminal in The Open State  
When the power terminal (VBB) becomes open at ON (IN=High), the output is switched to OFF irrespective of input  
voltage.  
If an inductive load is connected, the active clamp operates when VBB is open, and then becomes the same potential  
as that on the ground and the output voltage drops down to - 50V (Typ).  
13. GND Terminal in The Open State  
When the GND terminal becomes open at ON (IN=High), the output is switched to OFF irrespective of input voltage. If  
an inductive load is connected, the active clamp operates when the GND terminal is open.  
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Ordering Information  
B V 1 H D 0 9  
0
F
J
-
CE2  
Part Number  
Package  
FJ:SOP-J8  
Packaging and forming specification  
C : Automotive product  
E2 : Embossed tape and reel  
Marking Diagrams  
SOP-J8(TOP VIEW)  
Part Number Marking  
LOT Number  
1PIN MARK  
Part Number Marking  
1HD90  
Package  
SOP-J8  
Orderable Part Number  
BV1HD090FJ-CE2  
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Physical Dimension, Tape and Reel Information  
Package Name  
SOP-J8  
<Tape and Reel information>  
Tape  
Embossed carrier tape  
2500pcs  
Quantity  
E2  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
Direction of feed  
1pin  
Reel  
O rder quantity needs to be multiple of the minimum quantity.  
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Revision History  
Date  
Revision  
001  
Changes  
27.Dec.2016  
New Release  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of  
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning  
residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.003  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.  
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s  
representative.  
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  
配单直通车
BV1HD090FJ-CE2产品参数
型号:BV1HD090FJ-CE2
是否Rohs认证: 符合
生命周期:Active
包装说明:,
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:13 weeks
风险等级:2.26
接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIED
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