TH97/10561QM
TW00/17276EM
IATF 0060636
SGS TH07/1033
ULTRA FAST LOW-LOSS
BYD77AA - BYD77GA
CONTROLLED AVALANCHE RECTIFIERS
SMA (DO-214AC)
PRV : 50 - 400 Volts
Io : 2.0 Amperes
1.1 ± 0.3
FEATURES :
* Glass passivated junction chip
* High maximum operating temperature
* Low leakage current
0.2 ± 0.07
1.2 ± 0.2
2.1 ± 0.2
* Excellent stability
* Smallest surface mount rectifier outline
* Pb / RoHS Free
2.6 ± 0.15
MECHANICAL DATA :
* Case : SMA Molded plastic
2.0 ± 0.2
* Epoxy : UL94V-O rate flame retardant
* Lead : Lead Formed for Surface Mount
* Polarity : Color band denotes cathode end
* Mounting position : Any
Dimensions in millimeters
* Weight : 0.067 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specified
BYD BYD BYD BYD BYD BYD BYD
77AA 77BA 77CA 77DA 77EA 77FA 77GA
RATING
SYMBOL
UNIT
VRRM
VR
Maximum Repetitive Peak Reverse Voltage
Maximum Continuous Reverse Voltage
50
50
55
100
100
110
2.0 (1)
0.85(2)
150
150
165
200
200
220
250
250
275
300
300
400
400
440
V
V
V
Min. Reverse Avalanche Breakdown Voltage @ IR = 0.1 mA
Maximum Average Forward Current
V(BR)R-min
330
1.85 (1)
0.80 (2)
IF(AV)
A
IFSM
IFRM
VF
25
Maximum Non-Repetitive Peak Forward Surge Current (Note 3)
Maximum Repetitive Peak Forward Current at Ttp = 105 °C
Maximum Forward Voltage at IF = 1.0 A ; TJ = 25 °C
A
A
15
13
0.98
1.05
V
Maximum Reverse Current at VR =VRRMmax
TJ = 25 °C
IR
1.0
μA
TJ = 165 °C
IR(H)
Trr
100
μA
25
50
Maximum Reverse Recovery Time (Note 4)
Thermal Resistance from Junction to Tie-Point
ns
30
Rth j-tp
Rth j-a
TJ
K / W
K / W
°C
150
Thermal Resistance from Junction to Ambient (Note 5)
Junction Temperature Range
- 65 to + 175
- 65 to + 175
TSTG
Storage Temperature Range
°C
Notes :
(1) Ttp = 105 °C; see Fig. 1and 2; averaged over any 20 ms period; see also Fig.5 and 6
(2) Tamb = 60 °C; PCB mounting ; see Fig. 3 and 4; averaged over any 20 ms period; see also Fig.5 and 6
(3) t=10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax
(4) Reverse Recovery Test Conditions : IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
(5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≤ 40 μm.
Page 1 of 3
Rev. 00 : February 13, 2008