HOTTECH CHIP CERAMIC CAPACITORS
4. DIELECTRIC CHARACTERISTIC INTRODUCTION AND TEST METHOD
ITEM
STANDARD
TEST METHOD
COG：
Capacitance
0.5PF-47uF
C≤1000PF ：1MHz±10%
1.0±0.2Vrms
B=±0.1PF C=±0.25PF D=±0.5.PF
Tolerance
F=±1%
G=±2%
J=±5%
C＞1000PF：1KHz±10%
1.0±0.2Vrms
K=±10%
M=±20%
Rated Voltage
16、25、50、100、200、500、1000、2000 V(DC)
X7R/X5R：
Dissipation
Factor
COG/NPO
X7R/X5R
DF≤0.15%
1KHz±10% 1.0±0.2Vrms
Y5V/Z5U：
DF≤2.5%(≥50V) ,≤3.0%(25V) ,≤
3.5%(16V)
1KHz±10% 1.0±0.2Vrms ≤10uF
Y5V/Z5U
COG/NPO
X7R/X5R
Y5V/Z5U
DF ≤ 7%(C ≥ 100nF)
3.5%(C<100nF)
. ≤
120Hz 0.5±0.2Vrms
＞10uF
C≤10NF IR＞50000MΩ;
C＞10NF IR＞5000ΩF
C≤25NF IR＞10000MΩ;
C＞25NF RXC＞100ΩF
C≤25NF IR＞4000MΩ;
C＞25NF RXC＞100ΩF
Test voltage: rated
Time: 1 minute
Temperature: 18-25℃
Humidity: <80%
Insulation
Resistanc（e IR）
Apply 2.5x rated voltage to both terminations
for 5 seconds, charge and discharge current are
less than 50mA. (This test doesn’t apply to
high-voltage MLCC)
Dielectric
withstanding
voltage
No damage after test
No damage after test
Termination
Adhesion
Test Condition: 5N 10±1S
No damage after test and capacitance tolerance shall not be After soldering capacitor on the PCB, 1mm per
Bending
Strength
more than 10%
1 second of bending for this PCB shall be
applied.
Completely immerse the capacitor in the
molthen rosin for 2s and then put it in the
10mm molthen solder with a temperature of
235±5℃（265±5℃）for 2(5)s. after that
pick it up, clean the solvent and inspect it
under 10x or more microscope.
Temperature
Time
235±5℃
Solderability
1±1S
≥95
Cover
Tempertaure
Time
265±5℃
1±1S
≥95
≤0.5% or 0.5PF
Resistance to
soldering Heat
Cover
△C/C
Dielectric
△C/C
COG/NPO
X7R/X5R
≤±10%
Y5V/Z5U
Temperature: -55 ± 3 ℃ ~125 ± 3 ℃
COG/X7R
≤1%
≤±30%
Temperature
Cycling
-25±3℃~85±3℃ Y5V
-10±3℃~85±3℃ Z5U
Cycle times: 5 times per 30s
Resume time: 24h
No damage after test
Page:P11-P3
GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.