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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC

(Commercial & Automotive Grade)

Overview

KEMET’s high voltage surface mount MLCCs in C0G dielectric

feature a 125°C maximum operating temperature and are

considered “stable.” The Electronics Industries Alliance (EIA)

characterizes C0G dielectric as a Class I material. Components

of this classiﬁcation are temperature compensating and are

suited for resonant circuit applications or those where Q and

stability of capacitance characteristics are required. C0G

exhibits no change in capacitance with respect to time and

voltage and boasts a negligible change in capacitance with

reference to ambient temperature. Capacitance change is

limited to ±30ppm/ºC from -55°C to +125°C.

the preferred dielectric choice of design engineers worldwide.

In addition to their use in power supplies, these capacitors

are widely used in industries related to automotive(hybrid),

telecommunications, medical, military, aerospace, semiconductors

and test/diagnostic equipment.

Automotive Grade is available for applications requiring proven,

reliable performance in harsh environments. Whether under-hood

or in-cabin, these capacitors are designed for mission and safety

critical automotive circuits. Stricter testing protocol and inspection

criteria have been established for automotive grade products

in recognition of potentially harsh environmental conditions.

KEMET automotive grade series capacitors meet the demanding

Automotive Electronics Council's AEC–Q200 qualiﬁcation

These devices exhibit low ESR at high frequencies and ﬁnd

conventional use as snubbers or ﬁlters in applications such as

switching power supplies and lighting ballasts. Their exceptional requirements.

performance at high frequencies has made high voltage MLCC's

Ordering Information

C

1210

C

332

J

C

G

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance¹

Failure Rate/

Design

Packaging/Grade

(C-Spec)³

Ceramic

Voltage

Dielectric

Termination Finish²

(L" x W")

Series

0805

1206

1210

1808

1812

1825

2220

2225

C = Standard 2 Signiﬁcant Digits B = ±0.10 pF C = 500 V

+ Number of Zeros C = ±0.25 pF B = 630 V

G = C0G A = N/A

C = 100% Matte Sn Blank = Bulk

L = SnPb (5%

minimum)

TU = 7" Reel

Unmarked

AUTO =

Use 9 for

1.0 – 9.9 pF

D = ±0.5 pF

F = ±1%

G = ±2%

J = ±5%

D = 1,000 V

F = 1,500 V

G = 2,000 V

Z = 2,500 V

H = 3,000 V

Use 8 for

Automotive Grade

7"Reel Unmarked

0.5 – .99 pF

ex. 2.2 pF = 229

ex. 0.5 pF = 508

K = ±10%

M = ±20%

¹Additional capacitance tolerance offerings may be available. Contact KEMET for details.

²SnPb termination ﬁnish option is not available on Automotive Grade product.

^{2, 3}Additional termination ﬁnish options may be available. Contact KEMET for details.

³Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1009_C0G_HV_SMD • 1/8/2013

1

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

100% Tin or SnPb Plate

L

W

B

T

Nickel Plate

S

Conductive Metalization

Electrodes

EIA

Metric

Size

Code

2012

S

L

W

Width

T

B

Mounting

Technique

Size

Code

0805

1206

1210

Separation

Minimum

0.75 (.030)

Length

Thickness

Bandwidth

2.00 (.079) ±0.20 (.008) 1.25 (.049) ±0.20 (.008)

3.20 (.126) ±0.20 (.008) 1.60 (.063) ±0.20 (.008)

3.20 (.126) ±0.20 (.008) 2.50 (.098) ±0.20 (.008)

4.70 (.185) ±0.50 (.020) 2.00 (.079) ±0.20 (.008)

4.50 (.177) ±0.30 (.012) 3.20 (.126) ±0.30 (.012)

4.50 (.177) ±0.30 (.012) 6.40 (.252) ±0.40 (.016)

5.70 (.224) ±0.40 (.016) 5.00 (.197) ±0.40 (.016)

5.60 (.220) ±0.40 (.016) 6.40 (.248) ±0.40 (.016)

0.50 (0.02) ±0.25 (.010)

0.60 (.024) ±0.35 (.014)

Solder Wave or

Solder Reﬂow

3216

3225

4520

4532

4564

5650

5664

1808

1812

See Table 2 for

Thickness

N/A

Solder Reﬂow Only

1825

2220

2225

Beneﬁts

• -55°C to +125°C operating temperature range

• RoHS Compliant

• Preferred capacitance solution at line frequencies & into the

MHz range

• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220, and

2225 case sizes

• DC voltage ratings of 500 V, 630 V,1 KV, 1.5 KV, 2 KV,

2.5 KV, and 3 KV

• No capacitance change with respect to applied rated DC voltage

• Negligible capacitance change with respect to temperature from

-55°C to +125°C

• No capacitance decay with time

• Capacitance offerings ranging from 1 pF to 0.01 μF

• Available capacitance tolerances of ±0.10 pF, ±0.25 pF,

±0.5 pF, ±1%, ±2%, ±5%, ±10%, and ±20%

• No piezoelectric noise

• Non-polar device, minimizing installation concerns

• Commercial & Automotive (AEC-Q200) grades available

• 100% pure matte tin-plated termination ﬁnish allowing for

excellent solderability

• Extremely low ESR and ESL

• High thermal stability

• SnPb plated termination ﬁnish option available upon request (5%

minimum)

• High ripple current capability

Applications

Typical applications include switch mode power supplies (input ﬁlters, resonators, tank circuits, snubbed circuits, output ﬁlters), high

voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in Ćuk

converters. Markets include power supply, LCD ﬂuorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical

equipment/control, LAN/WAN interface, analog and digital modems, and automotive.

C1009_C0G_HV_SMD • 1/8/2013

2

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Qualiﬁcation/Certiﬁcation

Commercial Grade products are subject to internal qualiﬁcation. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test

methods and conditions are referenced in document AEC–Q200, Stress Test Qualiﬁcation for Passive Components. For additional

information regarding the Automotive Electronics Council and AEC–Q200, please visit their website at www.aecouncil.com.

Environmental Compliance

RoHS Compliant (excluding SnPb termination ﬁnish option).

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +125°C

±30 ppm/ºC

0%

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

150% of rated voltage for voltage rating of < 1,000 V

120% of rated voltage for voltage rating of ≥ 1,000 V

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

Dielectric Withstanding Voltage (DWV)

0.1%

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

1,000 megohm microfarads or 100 GΩ

(500 VDC applied for 120 ±5 seconds @ 25°C)

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF

1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Dissipation Factor

(Maximum %)

Capacitance

Insulation

Resistance

Dielectric

C0G

Value

Shift

All

0.5

0.3% or ±0.25 pF 10% of Initial Limit

C1009_C0G_HV_SMD • 1/8/2013

3

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes)

Series

C0805

C1206

C1210

C1808

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Cap

Code

Capacitance

Voltage DC

Capacitance

Tolerance

D

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1.0 – 1.6 pF

1.8 – 4.3 pF

4.7 – 9.1 pF

10 pF

11 pF

12 pF

13 pF

15 pF

16 pF

18 pF

20 pF

22 pF

24 pF

27 pF

30 pF

33 pF

36 pF

39 pF

43 pF

47 pF

51 pF

56 pF

62 pF

68 pF

75 pF

82 pF

109 – 169

189 – 439

479

100

110

B

C

K

M

DG DG DG

LB LB LB LB LB LB LB

D

J

G

F

DG DG DG EG EG EG EG EG FM FM FM FM FM LB LB LB LB LB LB LB

DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LB LB

DG DG DG EF EF EF EG EG FM FM FM FM FM LB LB LB LB LB LC LB

DG DG DG EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC LB

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

101

111

91 pF

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

180 pF

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

121

131

151

DG

EF EF EF EG EG FG FG FG FM FM LA LA LA LA LB LC

EF EF EF EG EG FG FG FG FM FM LA LA LA LA LC LC

161

181

201

221

241

271

301

331

361

391

431

471

EF EG EG EG

EG EG EG EG

EG EG EG

FG FG FG FM FM LA LA LA LA LC LC

FG FG FG FM FM LA LA LA LB LC LC

FG FG FG FK FK LA LA LA LB LC LC

FG FG FG FK FS LA LA LA LB

FG FM FM FS FS LA LB LB LC

EG EG EG

FG FM FM FS FS LA LB LB LC

511

EG EG EG

FG FM FM FS

LA LB LB LC

LA LB LB

561

621

681

EG EG EG

LB LB LB

C

820 pF

1210

C

332

J

C

G

A

C

TU

750 pF

751

K

M

EG

FG FM FM

821

EG EF¹

FG FM FM

Case Size Speciﬁcation/

Capacitance

EG

Failure Rate/

Design

Packaging/Grade

910

C

p

e

F

ramic

911

F

J

Voltage

Dielectr

F

ic

M

FM FM

Terminatio

L

n

B

Fini

L

s

B

h

LB

(L" x W")

Series

Code (pF)

Tolerance

(C-Spec)

Voltage VDC

0805

C = Standard 2 Signiﬁcant Digits B = ±0.10 pF C = 500 V

G = C0G A = N/A

C = 100% Matte Sn Blank = Bulk

Cap

Capacitance

1206

+ Number of Zeros C = ±0.25 pF B = 630 V

L = SnPb (5%

TU = 7" Reel

D F G

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

Z

H

Code

1210

1808

1812

Use 9 for

1.0 – 9.9 pF

Use 8 for

D = ±0.5 pF

D = 1,000 V

F = 1,500 V

minimum)

Unmarked

Series

C0805

C1206

C1210

C1808

F = ±1%

G = ±2%

AUTO =

G = 2,000 V

Z = 2,500 V

H = 3,000 V

Automotive Grade

7"Reel Unmarked

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

1825

0.5 – .99 pF

J = ±5%

K = ±10%

the same form factor (conﬁguration and dimensions).

2220 ex. 2.2 pF = 229

2225

ex. 0.5 pF = 508

M = ±20%

These products are protected under US Patents 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.

xx¹Commercial products only.

C1009_C0G_HV_SMD • 1/8/2013

4

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0805 – 1808 Case Sizes) cont'd

Series

C0805

C1206

C1210

C1808

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Cap

Code

Capacitance

Voltage DC

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

3,000 pF

3,300 pF

102

112

122

132

152

162

182

202

222

302

332

F

G

J

K

M

EG EF¹

FM FM FM

FM FK FK

FM FS FS

FK FS FS

FK

LB LB LB

LC LC LC

LC

FK

FS

LC

Voltage VDC

Cap

Code

Capacitance

Voltage Code

C

B

D

C

B

D

F

G

C

B

D

F

G

C

B

D

F

G

Z

H

Series

C0805

C1206

C1210

C1808

Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes)

Series

C1812

C1825

C2220

C2225

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Capacitance

Code

Voltage DC

Capacitance Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

10 pF

11 pF

12 pF

13 pF

15 pF

16 pF

18 pF

20 pF

22 pF

24 pF

27 pF

30 pF

33 pF

36 pF

39 pF

43 pF

47 pF

51 pF

56 pF

62 pF

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

B

C

D

F

G

J

K

M

GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

68 pF

680

C

1210

C_F^F

332

J

C

G

A

C

TU

75 pF

82 pF

750

GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

M GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

820

F

G

Case Size Speciﬁcation/

Capacitance

Failure Rate/

Packaging/Grade

Ceramic

91 pF

Voltage Dielectric Termination Finish

M GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

910

(L" x W")

Series

Code (pF)

Tolerance

Design

(C-Spec)

Voltage DC

0805

C = Standard 2 Signiﬁcant Digits B = ±0.10 pF C = 500 V

+ Number of Zeros C = ±0.25 pF B = 630 V

G = C0G A = N/A

C = 100% Matte Sn Blank = Bulk

Cap

1206

L = SnPb (5%

minimum)

C2220

TU = 7" Reel

Capacitance

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Code

1210

Use 9 for

1.0 – 9.9 pF

Use 8 for

D = ±0.5 pF

F = ±1%

G = ±2%

D = 1,000 V

C1825

Unmarked

C2225

Series

C1812

1808

1812

1825

F = 1,500 V

G = 2,000 V

AUTO =

Automotive Grade

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

0.5 – .99 pF

J = ±5%

K = ±10%

Z = 2,500 V

H = 3,000 V

7"Reel Unmarked

the same form factor (conﬁguration and dimensions).

2220 ex. 2.2 pF = 229

2225

ex. 0.5 pF = 508

M = ±20%

These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.

xx¹Commercial products only.

C1009_C0G_HV_SMD • 1/8/2013

5

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall (1812 – 2225 Case Sizes) cont'd

Series

C1812

C1825

C2220

C2225

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Cap

Capacitance

Code

Voltage DC

Capacitance Tolerance

Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions

100 pF

110 pF

120 pF

130 pF

150 pF

160 pF

180 pF

200 pF

220 pF

240 pF

270 pF

300 pF

330 pF

360 pF

390 pF

430 pF

470 pF

510 pF

560 pF

620 pF

680 pF

750 pF

820 pF

910 pF

1,000 pF

1,100 pF

1,200 pF

1,300 pF

1,500 pF

1,600 pF

1,800 pF

2,000 pF

2,200 pF

2,400 pF

2,700 pF

3,000 pF

3,300 pF

3,600 pF

3,900 pF

4,300 pF

4,700 pF

5,100 pF

5,600 pF

6,200 pF

6,800 pF

7,500 pF

8,200 pF

101

111

121

131

151

161

181

201

221

241

271

301

331

361

391

431

471

511

561

621

681

751

821

911

102

112

122

132

152

162

182

202

222

242

272

302

332

362

392

432

472

512

562

622

682

752

822

912

F

G

J

K

M

GK GK GK GK GK GK GK HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

GH GH GH GH GH GK

GK GK GK GK GH GK

GK GK GK GK GK GK

GH GH GH GK

GH GH GH

GH GK GK

GK GK GK

HE HE HE HE HE HE HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

HE HE HE HE HE HE HG JP JP JP JP JP JP JP KE KE KE KE KE KE KF

HE HE HE HE HE HE HG JE JE JE JE JE JP JP KE KE KE KE KE KE KF

HE HE HE HE HE HE

HE HE HE HE HG HE

HE HE HE HE HG HG

HE HE HE HG HG HG

HE HE HE HG HG

HE HE HE HG

HE HG HG HG

HE HG HG

JE JE JE JE JE JP

JP JP JP JP JP JP

JE JE JE JP JP JP

JE JP JP JP JP JP

JE JP JP JP JP

JE JP JP JP

JE JP JP

KE KE KE KE KE KE KF

KF KF KF KF KE KE KF

KF KF KF KF KE KF

KE KE KE KF KE KF

KE KE KE KF KF KF

KE KE KE KF KF

KE KE KE KF

KE KE KE

GK GK GK

GK

HE HG HG

JE JP JP

HE HG HG

JP JP JP

GK

HE HG HG

JP JP JP

KE KE KE

GK

HG HG HG

JP JP JP

KE KE KE

GK

HG HG HG

JP JP JP

KE KE KE

GK

HG HG HG

JP JP JP

KE KF KF

GK

HG HG HG

JP JP JP

KE KF KF

HG HG HG

JP JP JP

KE KF KF

HG HG HG

JP JP JP

KE KF KF

HG

JP JP JP

KE KF KF

HG

JP JP JP

KE KF KF

HG

JP

KE KF KF

HG

JP

KE KF KF

HG

JP

KF

HG

JP

KF

¹⁹⁰^,1^,0⁰⁰⁰⁰^p^pFFC

1

10

2

3

10

C ^F

F

332

J

C

G

A

C

KF

TU

Voltage DC

Case Size Speciﬁcation/

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

(C-Spec)

Ceramic

Voltage

Dielectric

Termination Finish

Cap

(L" x W")

Series

Code (pF)

Capacitance

Voltage Code

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

C

B

D

F

G

Z

H

Code

0805

1206

1210

C = Standard 2 Signiﬁcant Digits B = ±0.10 pF C = 500 V

Series C1812

G = C0G A = N/A

C1825

C = 100% Matte Sn Blank = Bulk

C2220

C2225

TU = 7" Reel

+ Number of Zeros C = ±0.25 pF B = 630 V

Use 9 for D = ±0.5 pF D = 1,000 V

L = SnPb (5%

minimum)

Unmarked

AUTO =

Automotive Grade

7"Reel Unmarked

KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within

1808

1.0 – 9.9 pF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

F = 1,500 V

G = 2,000 V

Z = 2,500 V

H = 3,000 V

the same form factor (conﬁguration and dimensions).

1812 Use 8 for

These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.

1825

0.5 – .99 pF

ex. 2.2 pF = 229

ex. 0.5 pF = 508

xx¹Commercial products only.

2220

2225

C1009_C0G_HV_SMD • 1/8/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

DG

EF

EG

FG

FM

FK

FS

LA

LB

LC

GH

GK

HE

HG

JE

0805

1206

1210

1808

1812

1825

2220

2225

1.25 ± 0.15

1.20 ± 0.15

1.60 ± 0.15

1.25 ± 0.15

1.70 ± 0.20

2.10 ± 0.20

2.50 ± 0.20

1.40 ± 0.15

1.60 ± 0.15

2.00 ± 0.15

1.40 ± 0.15

1.60 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

1.40 ± 0.15

1.60 ± 0.20

0

2,500

2,000

2,500

2,000

1,000

10,000

8,000

10,000

8,000

4,000

0

JP

KE

KF

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1009_C0G_HV_SMD • 1/8/2013

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1210¹

1808

1812

1825

2220

2225

2012

3216

3225

4520

4532

4564

5650

5664

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1.60

1.50

2.30

2.15

2.75

2.70

1.35

1.60

1.75

1.60

1.70

1.90

2.80

2.90

2.30

3.60

6.90

5.50

6.90

5.60

5.65

5.60

7.40

6.90

8.20

8.10

2.90

3.80

3.90

3.30

4.60

7.90

6.50

7.90

1.50

1.40

2.20

2.05

2.65

2.60

1.15

1.40

1.55

1.40

1.50

1.80

2.70

2.80

2.20

3.50

6.80

5.40

6.80

4.70

6.50

6.00

7.30

7.20

2.30

3.20

3.30

2.70

4.00

7.30

5.90

7.30

1.40

1.30

2.10

1.95

2.55

2.50

0.95

1.20

1.35

1.20

1.30

1.70

2.60

2.70

2.10

3.40

6.70

5.30

6.70

4.00

5.80

5.30

6.60

6.50

2.00

2.90

3.00

2.40

3.70

7.00

5.60

7.00

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reﬂow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reﬂow only

Recommended Soldering Proﬁle:

• KEMET recommends following the guidelines outlined in IPC / JEDEC J–STD–020

C1009_C0G_HV_SMD • 1/8/2013

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

Terminal Strength

JIS–C–6429

Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcation 50 X. Conditions:

a) Method B, 4 hours @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

Solderability

J–STD–002

c) Method D, category 3 @ 260°C

Temperature Cycling

Biased Humidity

JESD22 Method JA–104

MIL–STD–202 Method 103

1,000 cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion.

Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC maximum. Add 100 K ohm resistor.

Measurement at 24 hours +/- 2 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at

24 hours +/- 2 hours after test conclusion.

t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours

after test conclusion.

Moisture Resistance

Thermal Shock

MIL–STD–202 Method 106

MIL–STD–202 Method 107

-55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell

time – 15 minutes. Air – Air.

High Temperature Life MIL–STD–202 Method 108 1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with rated voltage applied.

Storage Life

Vibration

MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure

MIL–STD–202 Method 204 points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"

from any secure point. Test from 10 – 2,000 Hz

Mechanical Shock

MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature ﬂuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

C1009_C0G_HV_SMD • 1/8/2013

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Construction

Reference

Item

Material

A

B

C

D

E

Finish

100% Matte Sn SnPb (5% min)

Termination

System

Barrier Layer

Base Metal

Ni

Cu

Inner Electrode

Dielectric Material

Ni

CaZrO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices

• EIA 0402 case size devices

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

C1009_C0G_HV_SMD • 1/8/2013 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA

Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on

reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ 1812

8

KPS 1210

8

KPS 1812 & 2220

Array 0508 & 0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1009_C0G_HV_SMD • 1/8/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitch

F

P₁

A₀,B₀& K₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Single (4 mm) &

Double (8 mm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1009_C0G_HV_SMD • 1/8/2013 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.10

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1009_C0G_HV_SMD • 1/8/2013 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1009_C0G_HV_SMD • 1/8/2013 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

Full Radius,

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

See Note

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shall accommodate tape width

without interference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1009_C0G_HV_SMD • 1/8/2013 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1009_C0G_HV_SMD • 1/8/2013 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Northeast Asia

Hong Kong

Tel: 852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel: 39-051-939111

Shenzhen, China

Tel: 86-755-2518-1306

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

Beijing, China

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Tel: 86-10-5829-1711

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Shanghai, China

Tel: 86-21-6447-0707

Kamen, Germany

Tel: 49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel: 954-766-2800

Taipei, Taiwan

Tel: 886-2-27528585

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

North America

Southeast Asia

Singapore

Southeast

Tel: 65-6586-1900

Lake Mary, FL

Tel: 407-855-8886

Espoo, Finland

Tel: 358-9-5406-5000

Penang, Malaysia

Tel: 60-4-6430200

Northeast

Wilmington, MA

Tel: 978-658-1663

Bangalore, India

Tel: 91-806-53-76817

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1009_C0G_HV_SMD • 1/8/2013 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Other KEMET Resources

Tools

Resource

Location

Conﬁgure A Part: CapEdge

SPICE & FIT Software

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

Search Our FAQs: KnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

Technical Resources (Including Soldering Techniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

Quality Documents

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

Sample Request

Engineering Kit Request

Contact

Resource

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

All product speciﬁcations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speciﬁcally disclaim – any warranty concerning suitability for a speciﬁc customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

C1009_C0G_HV_SMD • 1/8/2013 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500 – 3,000 VDC (Commercial & Automotive Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing

Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.01.11 12:03:56 -05'00'

C1009_C0G_HV_SMD • 1/8/2013 19

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