“I have a privilege to work with Greg on various projects at Surface. Beside being a great manager and mentor, he has a wide knowledge in system design, especially in thermal/power management. Greg designed many sophisticated and elegant thermal/power control algorithms in Surface which handle all extreme user scenarios, bring consistent comfort, performance and most importantly safety for all Surface customers. Without question, Greg is a great asset to have for any company.”
Gregory Nielsen
Redmond, Washington, United States
1K followers
500+ connections
Redmond, Washington, United States
1K followers
500+ connections
About
Lead architect in Microsoft’s cross-platform development team focused on thermal and…
Activity
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I am proud to announce that I have graduated from Northeastern University with an MS in Electrical and Computer Engineering with a concentration in…
I am proud to announce that I have graduated from Northeastern University with an MS in Electrical and Computer Engineering with a concentration in…
Liked by Gregory Nielsen
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Monday was my last day at Intel Corporation after first starting as an intern 25 years ago. It was an incredible and deeply gratifying ride. I'm…
Monday was my last day at Intel Corporation after first starting as an intern 25 years ago. It was an incredible and deeply gratifying ride. I'm…
Liked by Gregory Nielsen
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I'm hiring! At Microsoft, Surface is at the forefront of cutting-edge devices and technology. Do you want to be part of the team who is leading…
I'm hiring! At Microsoft, Surface is at the forefront of cutting-edge devices and technology. Do you want to be part of the team who is leading…
Liked by Gregory Nielsen
Experience
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Education
Patents
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Voltage Regulator for Computing Device
Issued 11936230
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System and Methods for Thermal System Management
Issued 11892893
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Power Supply Unit Control System
Issued 11874717
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Peripheral Interface Power Allocation
Issued 11625088
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Dynamically Adjusting Device Operating Voltage
Issued US 406753-US-NP / 11543872
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Dynamic Voltage Display Driver
Issued 11263967
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Computer Cooling Device Activity Indication
Filed US 410334-US-NP
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Dynamic Peak Power Control
Filed US 409772-US-NP
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Optimized Touch Temperature Thermal Management
Issued US 10852791
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Dynamic Discharge Rate Control
Filed US 409078-US-NP
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Passive Thermal Management Systems With Phase Change Material
Issued US 10798848
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Methods for Temperature and Power Usage Control
Issued US 407475-US-NP
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Shared Cooling For Thermally Connected Components In Electronic Devices
Issued US 10175731
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Dynamic Charge Rate Control of Battery Powered Devices
Filed MS# 413837-US01
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Methods for Providing One or More Predictions of Incoming Behavior of a Computing Device
Filed MS# 413838-US01
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Changing a Mobile Device Feature Set Upon Detecting Attachment of a Case
Filed 412933-US-NP
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Selectively Throttling Subsystems of Battery-Powered Computing Device
Filed 412526-US-NP
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Computing Device Power Burst Limiting
Filed 412448-US-NP
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Fan Speed Control for High Tonality Avoidance
Filed 412367-US-NP
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Ambient Temperature Estimation and Device Optimization
Filed PCT/CN2022/131031
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Dynamic Exhaust Fan Operation to Improve User Experience
Filed 411506-US-NP
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Adaptive Power Control for an Electronic Device
Filed 411056-US-NP
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Relative Sensor Based Thermal Management
Filed US 360361-US-NP
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Power limiting optimization based on user hold position
Filed US 14/039,740
Languages
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English
Native or bilingual proficiency
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Japanese
Full professional proficiency
Recommendations received
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LinkedIn User
6 people have recommended Gregory
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Learn about the latest advancement offered by HDR on Surface devices thanks to this article by Jussi Ropo and Shankar Gomathi Balasubramanian
Learn about the latest advancement offered by HDR on Surface devices thanks to this article by Jussi Ropo and Shankar Gomathi Balasubramanian
Liked by Gregory Nielsen
Other similar profiles
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Theodore Aggelopoulos, MBA
Micron has launched its production-ready HBM3E memory solution, featuring a groundbreaking 36GB capacity in a 12-Hi design. This innovative solution is being sampled to key industry partners like NVIDIA to accelerate AI development. Micron's HBM3E 12-Hi offers superior performance, efficiency, and scalability compared to competitors, making it a crucial component for data-intensive AI applications. Key benefits of Micron's HBM3E 12-Hi include: 🔸Unmatched capacity: 36GB capacity enables larger AI models to run on a single processor, reducing latency and improving performance. 🔸Exceptional efficiency: Lower power consumption compared to competitors, making it ideal for power-sensitive data centers. 🔸Superior performance: High memory bandwidth and pin speed ensure lightning-fast data access for AI accelerators and supercomputers. 🔸Accelerated validation: Fully programmable MBIST capabilities streamline testing and validation, reducing time to market. Micron's HBM3E 12-Hi is a significant advancement in memory technology, poised to revolutionize the AI landscape. #chips #memorychips #HBM3E #AI #memory #micron #technology #innovation #data #performance #efficiency #scalability #semiconductor #semiconductors #semiconductorindustry #semiconductormanufacturing
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Rupert Baines
Really interesting to see this: how Europe is moving up. It is interest to contrast this qualitative survey with the #siliconcatalyst analysys that UK is sixth in Europe in funding value fir silicon investment. And I will put in a plug for our #UKTIN Forward Capabilities paper on recommendations for UK Semiconductor sector: https://lnkd.in/eNNAsCAz
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SemiWiki.com
Intel is in deep trouble, the 18a process is broken, and it is all down hill from here, right? SemiAccurate dug deeply into the 18a rumors for the last 3+ weeks and hunted them all down. #Semiconductor #Semiconductormanufacturing #semiconductors #Semiconductorindustry #SemiEDA #Semiconductortechnology #Semicon #Intel
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Ryan Sagare
🌟 Positive Progress for TSMC's Arizona Fab! 🌟 Exciting news from Bloomberg: TSMC’s first U.S. fab in Arizona is showing promising results! Production yields from their 4nm process are reportedly on par with those from their Taiwan facility. 🔹 Key Updates: 🌍 TSMC’s Arizona fab began producing engineering wafers in April. 🏭 The first fab aims for mass production in early 2025. 🔬 Future fabs will use cutting-edge 2nm technology to meet rising AI demand. With a $6.6 billion subsidy from the U.S. government and a total investment of $65 billion, TSMC is set to bring world-class manufacturing quality to Arizona. 🔗👀 Read more from TrendForce Corporation: https://lnkd.in/gT78JBQs 🔗👀 Read more from Bloomberg (paywall): https://lnkd.in/g85_MiUD #TSMC #Semiconductors #ArizonaFab #TechNews #Innovation #AMD
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John Yenney
Why GBA, what is different?? We don't BULLSHIT you. As a 10 yr College FB coach we will not waste your time. Hiring for $500 million Semiconductor Expansion Contact john@11gba.com to discuss in detail #GBA #EquipmentTechnicians #EngineeringJobs #SemiconductorCareers #CollegeFootballCoach #NoBSHiring #RetentionRates #PositiveCulture #CareerGrowth #TechJobs #PermanentPositions #HighRetention #JobOpportunity #HiringExperience #EngineersWanted #TechTalent #WorkplaceCulture #CareerDevelopment #TeamBuilding #JobStability #EngineeringExcellence #CareerOpportunities #IndustryLeaders #ProfessionalGrowth #SkilledTechnicians #EmployeeRetention #SemiconductorIndustry #Blessed #USA
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John Yenney
Why GBA, what is different?? We don't BULLSHIT you. As a 10 yr College FB coach we will not waste your time. Hiring for $500 million Semiconductor Expansion Contact john@11gba.com to discuss in detail #GBA #EquipmentTechnicians #EngineeringJobs #SemiconductorCareers #CollegeFootballCoach #NoBSHiring #RetentionRates #PositiveCulture #CareerGrowth #TechJobs #PermanentPositions #HighRetention #JobOpportunity #HiringExperience #EngineersWanted #TechTalent #WorkplaceCulture #CareerDevelopment #TeamBuilding #JobStability #EngineeringExcellence #CareerOpportunities #IndustryLeaders #ProfessionalGrowth #SkilledTechnicians #EmployeeRetention #SemiconductorIndustry #Blessed #USA
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John Yenney
Why GBA, what is different?? We don't BULLSHIT you. As a 10 yr College FB coach we will not waste your time. Hiring for $500 million Semiconductor Expansion Contact john@11gba.com to discuss in detail #GBA #EquipmentTechnicians #EngineeringJobs #SemiconductorCareers #CollegeFootballCoach #NoBSHiring #RetentionRates #PositiveCulture #CareerGrowth #TechJobs #PermanentPositions #HighRetention #JobOpportunity #HiringExperience #EngineersWanted #TechTalent #WorkplaceCulture #CareerDevelopment #TeamBuilding #JobStability #EngineeringExcellence #CareerOpportunities #IndustryLeaders #ProfessionalGrowth #SkilledTechnicians #EmployeeRetention #SemiconductorIndustry #Blessed #USA
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Edward Wang
Intel, once the undisputed leader in the semiconductor industry, has faced significant challenges in recent years. The company has struggled with manufacturing delays, lost market share to competitors like AMD and Nvidia, and seen its stock price decline dramatically. These issues have been compounded by the rapid rise of AI technologies, where Intel has lagged behind rivals in developing cutting-edge chips. In response to these challenges, Intel CEO Pat Gelsinger has announced a major restructuring plan aimed at revitalizing the company and improving its competitiveness. This plan builds on Intel's "IDM 2.0" strategy, launched in 2021, which aimed to regain manufacturing leadership and expand into the foundry business. Key points of Intel's latest reconstruction plan include: 1. Foundry Business Expansion - Intel Foundry will become an independent subsidiary within Intel, with its own board. - The company has secured a multi-year, multi-billion-dollar agreement with Amazon Web Services (AWS) for chip production, including an AI fabric chip using Intel 18A technology. - This move opens the possibility for external investment in the foundry business. 2. Government Funding - Intel has been awarded up to $3 billion in funding under the CHIPS and Science Act for the U.S. government's Secure Enclave program. 3. Manufacturing Strategy Adjustments - Projects in Poland and Germany will be paused for approximately two years. - Construction of a new advanced packaging factory in Malaysia will be completed, but startup will be aligned with market conditions. - U.S. manufacturing investments will continue as planned. 4. Product Portfolio Streamlining - Refocusing on the x86 franchise across client, edge, and data center markets. - Reorganizing various business units to improve efficiency and focus. 5. Workforce and Cost Reduction - Continuing with plans to reduce the workforce by approximately 15,000 by the end of the year. - Aiming to reduce or exit about two-thirds of its global real estate by the end of the year. 6. Financial Strategy - Plans to sell part of Intel's stake in Altera to improve its balance sheet and liquidity. This restructuring plan represents Intel's most significant transformation in decades, as the company aims to regain its competitive edge, improve efficiency, and capitalize on emerging opportunities in AI and advanced chip manufacturing. The success of this plan will be crucial for Intel's future in an increasingly competitive semiconductor landscape. Reference: https://lnkd.in/dpjKA74Y
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