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    产品型号BCX56/T1的Datasheet PDF文件预览

    BCP56; BCX56; BC56PA  
    80 V, 1 A NPN medium power transistors  
    Rev. 9 — 25 October 2011  
    Product data sheet  
    1. Product profile  
    1.1 General description  
    NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.  
    Table 1. Product overview  
    Type number[1]  
    Package  
    NXP  
    PNP complement  
    JEITA  
    SC-73  
    SC-62  
    -
    JEDEC  
    BCP56  
    BCX56  
    BC56PA  
    SOT223  
    SOT89  
    SOT1061  
    -
    BCP53  
    BCX53  
    BC53PA  
    TO-243  
    -
    [1] Valid for all available selection groups.  
    1.2 Features and benefits  
    High current  
    Three current gain selections  
    High power dissipation capability  
    Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  
    Leadless very small SMD plastic package with medium power capability (SOT1061)  
    AEC-Q101 qualified  
    1.3 Applications  
    Linear voltage regulators  
    Power management  
    MOSFET drivers  
    Amplifiers  
    Low-side switches  
    Battery-driven devices  
    1.4 Quick reference data  
    Table 2.  
    Quick reference data  
    Symbol Parameter  
    Conditions  
    Min  
    -
    Typ  
    Max  
    80  
    Unit  
    V
    VCEO  
    IC  
    collector-emitter voltage open base  
    collector current  
    -
    -
    -
    -
    -
    -
    -
    1
    A
    ICM  
    hFE  
    peak collector current  
    DC current gain  
    single pulse; tp 1 ms  
    -
    2
    A
    [1]  
    [1]  
    [1]  
    VCE = 2 V; IC = 150 mA  
    VCE = 2 V; IC = 150 mA  
    VCE = 2 V; IC = 150 mA  
    63  
    63  
    100  
    250  
    160  
    250  
    hFE selection -10  
    hFE selection -16  
    [1] Pulse test: tp 300 s; = 0.02.  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    2. Pinning information  
    Table 3.  
    Pinning  
    Pin  
    Description  
    Simplified outline  
    Graphic symbol  
    SOT223  
    1
    2
    3
    4
    base  
    2, 4  
    4
    collector  
    emitter  
    collector  
    1
    1
    2
    3
    3
    sym016  
    SOT89  
    1
    2
    3
    emitter  
    collector  
    base  
    2
    3
    1
    3
    2
    3
    1
    sym042  
    SOT1061  
    1
    2
    3
    base  
    3
    emitter  
    collector  
    1
    2
    sym021  
    1
    2
    Transparent top view  
    3. Ordering information  
    Table 4.  
    Ordering information  
    Type number[1] Package  
    Name  
    Description  
    Version  
    BCP56  
    BCX56  
    BC56PA  
    SC-73  
    SC-62  
    plastic surface-mounted package with increased  
    heatsink; 4 leads  
    SOT223  
    plastic surface-mounted package; exposed die pad for  
    good heat transfer; 3 leads  
    SOT89  
    HUSON3 plastic thermal enhanced ultra thin small outline  
    SOT1061  
    package; no leads; 3 terminals; body 2 2 0.65 mm  
    [1] Valid for all available selection groups.  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    2 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    4. Marking  
    Table 5.  
    Marking codes  
    Type number  
    BCP56  
    Marking code  
    BCP56  
    BCP56/10  
    BCP56/16  
    BH  
    BCP56-10  
    BCP56-16  
    BCX56  
    BCX56-10  
    BCX56-16  
    BC56PA  
    BK  
    BL  
    AZ  
    BC56-10PA  
    BC56-16PA  
    BK  
    BL  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    3 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    5. Limiting values  
    Table 6.  
    Limiting values  
    In accordance with the Absolute Maximum Rating System (IEC 60134).  
    Symbol  
    VCBO  
    VCEO  
    VEBO  
    IC  
    Parameter  
    Conditions  
    open emitter  
    open base  
    Min  
    Max  
    100  
    80  
    5
    Unit  
    V
    collector-base voltage  
    collector-emitter voltage  
    emitter-base voltage  
    collector current  
    -
    -
    -
    -
    -
    V
    open collector  
    V
    1
    A
    ICM  
    peak collector current  
    single pulse;  
    2
    A
    tp 1 ms  
    IB  
    base current  
    -
    -
    0.3  
    0.3  
    A
    A
    IBM  
    peak base current  
    single pulse;  
    tp 1 ms  
    Ptot  
    total power dissipation  
    BCP56  
    Tamb 25 C  
    [1]  
    [2]  
    [3]  
    [1]  
    [2]  
    [3]  
    [1]  
    [2]  
    [3]  
    [4]  
    [5]  
    -
    0.65  
    1.00  
    1.35  
    0.50  
    0.95  
    1.35  
    0.42  
    0.83  
    1.10  
    0.81  
    1.65  
    150  
    W
    W
    W
    W
    W
    W
    W
    W
    W
    W
    W
    C  
    C  
    C  
    -
    -
    BCX56  
    -
    -
    -
    BC56PA  
    -
    -
    -
    -
    -
    Tj  
    junction temperature  
    ambient temperature  
    storage temperature  
    -
    Tamb  
    Tstg  
    55  
    65  
    +150  
    +150  
    [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard  
    footprint.  
    [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.  
    [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.  
    [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.  
    [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    4 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac674  
    006aac675  
    1.5  
    1.5  
    (1)  
    (1)  
    P
    tot  
    P
    tot  
    (W)  
    (W)  
    (2)  
    (3)  
    (2)  
    (3)  
    1.0  
    1.0  
    0.5  
    0.5  
    0.0  
    –75  
    0.0  
    –75  
    –25  
    25  
    75  
    125  
    175  
    (°C)  
    –25  
    25  
    75  
    125  
    175  
    (°C)  
    T
    T
    amb  
    amb  
    (1) FR4 PCB, mounting pad for collector 6 cm2  
    (2) FR4 PCB, mounting pad for collector 1 cm2  
    (3) FR4 PCB, standard footprint  
    (1) FR4 PCB, mounting pad for collector 6 cm2  
    (2) FR4 PCB, mounting pad for collector 1 cm2  
    (3) FR4 PCB, standard footprint  
    Fig 1. Power derating curves SOT223  
    Fig 2. Power derating curves SOT89  
    006aac676  
    2.0  
    P
    (W)  
    tot  
    (1)  
    (2)  
    1.5  
    1.0  
    0.5  
    0.0  
    (3)  
    (4)  
    (5)  
    –75  
    –25  
    25  
    75  
    125  
    175  
    (°C)  
    T
    amb  
    (1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2  
    (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2  
    (3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2  
    (4) FR4 PCB, 4-layer copper, standard footprint  
    (5) FR4 PCB, single-sided copper, standard footprint  
    Fig 3. Power derating curves SOT1061  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    5 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    6. Thermal characteristics  
    Table 7.  
    Symbol  
    Rth(j-a)  
    Thermal characteristics  
    Parameter  
    Conditions  
    Min  
    Typ  
    Max  
    Unit  
    thermal resistance from  
    junction to ambient  
    in free air  
    [1]  
    [2]  
    [3]  
    [1]  
    [2]  
    [3]  
    [1]  
    [2]  
    [3]  
    [4]  
    [5]  
    BCP56  
    BCX56  
    BC56PA  
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    192  
    125  
    93  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    K/W  
    250  
    132  
    93  
    298  
    151  
    114  
    154  
    76  
    Rth(j-sp)  
    thermal resistance from  
    junction to solder point  
    BCP56  
    BCX56  
    BC56PA  
    -
    -
    -
    -
    -
    -
    16  
    16  
    20  
    K/W  
    K/W  
    K/W  
    [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.  
    [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.  
    [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.  
    [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.  
    [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    6 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac677  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    0.75  
    2
    10  
    0.5  
    0.33  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    0.01  
    1
    0
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, standard footprint  
    Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;  
    typical values  
    006aac678  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    2
    10  
    0.75  
    0.5  
    0.33  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    0.01  
    1
    0
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, mounting pad for collector 1 cm2  
    Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;  
    typical values  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    7 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac679  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    2
    10  
    0.75  
    0.5  
    0.33  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    0.01  
    1
    0
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, mounting pad for collector 6 cm2  
    Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223;  
    typical values  
    006aac680  
    3
    10  
    Z
    th(j-a)  
    duty cycle = 1  
    (K/W)  
    0.75  
    0.5  
    2
    10  
    0.33  
    0.2  
    0.1  
    0.05  
    0.02  
    10  
    0.01  
    1
    0
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, standard footprint  
    Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;  
    typical values  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    8 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac681  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    2
    10  
    0.75  
    0.5  
    0.33  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    0.01  
    0
    1
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, mounting pad for collector 1 cm2  
    Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;  
    typical values  
    006aac682  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    2
    duty cycle = 1  
    10  
    0.75  
    0.5  
    0.33  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    1
    0
    0.01  
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, mounting pad for collector 6 cm2  
    Fig 9. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89;  
    typical values  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    9 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac683  
    3
    10  
    Z
    th(j-a)  
    duty cycle = 1  
    (K/W)  
    0.75  
    0.5  
    2
    10  
    0.33  
    0.25  
    0.2  
    0.1  
    0.05  
    10  
    0.02  
    0.01  
    1
    0
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, single-sided copper, standard footprint  
    Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;  
    typical values  
    006aac684  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    2
    10  
    0.75  
    0.5  
    0.33  
    0.25  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    0
    0.01  
    1
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, single-sided copper, mounting pad for collector 1 cm2  
    Fig 11. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;  
    typical values  
    BCP56_BCX56_BC56PA  
    All information provided in this document is subject to legal disclaimers.  
    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    10 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac685  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    2
    10  
    0.75  
    0.5  
    0.33  
    0.25  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    1
    0
    0.01  
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, single-sided copper, mounting pad for collector 6 cm2  
    Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;  
    typical values  
    006aac686  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    duty cycle = 1  
    0.75  
    2
    10  
    0.5  
    0.33  
    0.25  
    0.2  
    0.1  
    10  
    0.05  
    0.02  
    0.01  
    0
    1
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, 4-layer copper, standard footprint  
    Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;  
    typical values  
    BCP56_BCX56_BC56PA  
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    © NXP B.V. 2011. All rights reserved.  
    Product data sheet  
    Rev. 9 — 25 October 2011  
    11 of 22  
    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
    80 V, 1 A NPN medium power transistors  
    006aac687  
    3
    10  
    Z
    th(j-a)  
    (K/W)  
    2
    10  
    duty cycle = 1  
    0.75  
    0.5  
    0.33  
    0.25  
    0.2  
    10  
    0.1  
    0.05  
    0.02  
    1
    0.01  
    0
    –1  
    10  
    –5  
    –4  
    –3  
    –2  
    –1  
    2
    3
    10  
    10  
    10  
    10  
    10  
    1
    10  
    10  
    10  
    t
    p
    (s)  
    FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2  
    Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;  
    typical values  
    7. Characteristics  
    Table 8.  
    Characteristics  
    Tamb = 25 C unless otherwise specified.  
    Symbol Parameter Conditions  
    collector-base cut-off VCB = 30 V; IE = 0 A  
    Min  
    Typ  
    Max  
    100  
    10  
    Unit  
    nA  
    ICBO  
    -
    -
    -
    -
    current  
    VCB = 30 V; IE = 0 A;  
    A  
    Tj = 150 C  
    IEBO  
    hFE  
    emitter-base cut-off  
    current  
    VEB = 5 V; IC = 0 A  
    -
    -
    100  
    nA  
    DC current gain  
    VCE = 2 V  
    [1]  
    [1]  
    [1]  
    IC = 5 mA  
    63  
    63  
    40  
    -
    -
    -
    -
    IC = 150 mA  
    IC = 500 mA  
    VCE = 2 V  
    250  
    -
    DC current gain  
    hFE selection -10  
    hFE selection -16  
    [1]  
    [1]  
    [1]  
    IC = 150 mA  
    IC = 150 mA  
    IC = 500 mA; IB = 50 mA  
    63  
    100  
    -
    -
    -
    -
    160  
    250  
    0.5  
    VCEsat  
    collector-emitter  
    V
    saturation voltage  
    [1]  
    VBE  
    Cc  
    base-emitter voltage  
    VCE = 2 V; IC = 500 mA  
    -
    -
    -
    1
    -
    V
    collector capacitance VCB = 10 V; IE = ie = 0 A;  
    f = 1 MHz  
    6
    pF  
    fT  
    transition frequency  
    VCE = 5 V; IC = 50 mA;  
    f = 100 MHz  
    100  
    180  
    -
    MHz  
    [1] Pulse test: tp 300 s; = 0.02.  
    BCP56_BCX56_BC56PA  
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    006aac691  
    006aaa084  
    300  
    1.6  
    I
    (mA) = 50 45 40 35 30  
    B
    I
    C
    h
    FE  
    (A)  
    1.2  
    25  
    20  
    (1)  
    (2)  
    200  
    15  
    10  
    0.8  
    0.4  
    0
    5
    100  
    (3)  
    0
    10  
    –4  
    –3  
    –2  
    –1  
    10  
    10  
    10  
    1
    10  
    0
    0.4  
    0.8  
    1.2  
    1.6  
    V
    2.0  
    (V)  
    I
    (A)  
    C
    CE  
    VCE = 2 V  
    Tamb = 25 C  
    (1) Tamb = 100 C  
    (2) Tamb = 25 C  
    (3)  
    Tamb = 55 C  
    Fig 15. DC current gain as a function of collector  
    current; typical values  
    Fig 16. Collector current as a function of  
    collector-emitter voltage; typical values  
    006aac692  
    006aac693  
    1.2  
    1
    V
    BE  
    (V)  
    V
    CEsat  
    (1)  
    (V)  
    0.8  
    (2)  
    (3)  
    –1  
    10  
    (1)  
    (2)  
    0.4  
    (3)  
    –2  
    0.0  
    10  
    10  
    –1  
    2
    3
    4
    –1  
    2
    3
    4
    1
    10  
    10  
    10  
    10  
    (mA)  
    10  
    1
    10  
    10  
    10  
    10  
    I (mA)  
    C
    I
    C
    VCE = 2 V  
    amb = 55 C  
    IC/IB = 10  
    (1) Tamb = 100 C  
    (1)  
    T
    (2) Tamb = 25 C  
    (3) Tamb = 100 C  
    (2) Tamb = 25 C  
    (3) Tamb = 55 C  
    Fig 17. Base-emitter voltage as a function of collector  
    current; typical values  
    Fig 18. Collector-emitter saturation voltage as a  
    function of collector current; typical values  
    BCP56_BCX56_BC56PA  
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    8. Test information  
    8.1 Quality information  
    This product has been qualified in accordance with the Automotive Electronics Council  
    (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is  
    suitable for use in automotive applications.  
    9. Package outline  
    6.7  
    6.3  
    3.1  
    2.9  
    1.8  
    1.5  
    4
    1.1  
    0.7  
    7.3 3.7  
    6.7 3.3  
    1
    2
    3
    0.8  
    0.6  
    0.32  
    0.22  
    2.3  
    4.6  
    Dimensions in mm  
    04-11-10  
    Fig 19. Package outline SOT223 (SC-73)  
    4.6  
    4.4  
    1.8  
    1.4  
    1.6  
    1.4  
    2.6  
    2.4  
    4.25  
    3.75  
    1.2  
    0.8  
    1
    2
    3
    0.53  
    0.40  
    0.48  
    0.35  
    0.44  
    0.23  
    1.5  
    3
    Dimensions in mm  
    06-08-29  
    Fig 20. Package outline SOT89 (SC-62/TO-243)  
    BCP56_BCX56_BC56PA  
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    Product data sheet  
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    80 V, 1 A NPN medium power transistors  
    1.3  
    0.65  
    max  
    0.35  
    0.25  
    0.45  
    0.35  
    1
    2
    1.05  
    0.95  
    2.1  
    1.1  
    0.9  
    1.9  
    0.3  
    0.2  
    3
    1.6  
    1.4  
    2.1  
    1.9  
    Dimensions in mm  
    09-11-12  
    Fig 21. Package outline SOT1061 (HUSON3)  
    10. Packing information  
    Table 9.  
    Packing methods  
    The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
    Type  
    number[2]  
    Package  
    Description  
    Packing quantity  
    1000 3000 4000  
    BCP56  
    BCX56  
    SOT223  
    SOT89  
    8 mm pitch, 12 mm tape and reel  
    8 mm pitch, 12 mm tape and reel; T1  
    8 mm pitch, 12 mm tape and reel; T3  
    4 mm pitch, 8 mm tape and reel  
    -115  
    -115  
    -146  
    -
    -
    -135  
    [3]  
    [4]  
    -
    -135  
    -
    -
    -
    BC56PA  
    SOT1061  
    -115  
    [1] For further information and the availability of packing methods, see Section 14.  
    [2] Valid for all available selection groups.  
    [3] T1: normal taping  
    [4] T3: 90rotated taping  
    BCP56_BCX56_BC56PA  
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    Product data sheet  
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    15 of 22  
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    11. Soldering  
    7
    3.85  
    3.6  
    3.5  
    0.3  
    1.3 1.2  
    (4×) (4×)  
    solder lands  
    solder resist  
    4
    6.1  
    3.9  
    7.65  
    solder paste  
    occupied area  
    1
    2
    3
    Dimensions in mm  
    2.3  
    2.3  
    1.2  
    (3×)  
    1.3  
    (3×)  
    6.15  
    sot223_fr  
    Fig 22. Reflow soldering footprint SOT223 (SC-73)  
    8.9  
    6.7  
    1.9  
    solder lands  
    4
    solder resist  
    6.2  
    8.7  
    occupied area  
    Dimensions in mm  
    1
    2
    3
    preferred transport  
    direction during soldering  
    1.9  
    (3×)  
    2.7  
    2.7  
    1.9  
    (2×)  
    1.1  
    sot223_fw  
    Fig 23. Wave soldering footprint SOT223 (SC-73)  
    BCP56_BCX56_BC56PA  
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    Product data sheet  
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    4.75  
    2.25  
    2
    1.9  
    1.2  
    0.2  
    solder lands  
    0.85  
    1.7  
    solder resist  
    1.2  
    4.6  
    4.85  
    solder paste  
    0.5  
    occupied area  
    1
    1.1  
    (3×)  
    (2×)  
    Dimensions in mm  
    1.5  
    1.5  
    0.6  
    (3×)  
    0.7  
    (3×)  
    3.95  
    sot089_fr  
    Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243)  
    6.6  
    2.4  
    3.5  
    solder lands  
    7.6  
    0.5  
    solder resist  
    occupied area  
    1.8  
    (2×)  
    Dimensions in mm  
    preferred transport direction during soldering  
    1.9  
    1.9  
    1.5  
    (2×)  
    0.7  
    5.3  
    sot089_fw  
    Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243)  
    BCP56_BCX56_BC56PA  
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    Product data sheet  
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    BCP56; BCX56; BC56PA  
    NXP Semiconductors  
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    2.1  
    1.3  
    0.5 (2×)  
    0.4 (2×)  
    0.5 (2×) 0.6 (2×)  
    1.05  
    0.6  
    0.55  
    2.3  
    0.25  
    1.1  
    1.2  
    0.25  
    0.25  
    0.4  
    0.5  
    1.6  
    1.7  
    Dimensions in mm  
    solder paste = solder lands  
    solder resist  
    occupied area  
    sot1061_fr  
    Reflow soldering is the only recommended soldering method.  
    Fig 26. Reflow soldering footprint SOT1061 (HUSON3)  
    BCP56_BCX56_BC56PA  
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    18 of 22  
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    12. Revision history  
    Table 10. Revision history  
    Document ID  
    Release date  
    Data sheet status  
    Product data sheet  
    Change notice Supersedes  
    - BC639_BCP56_BCX56 v.8  
    BCP56_BCX56_BC56PA v.9 20111025  
    Modifications:  
    • Type number removed: BC639  
    • Type number added: BC56PA, BC56-10PA and BC56-16PA  
    • Section 1 “Product profile”: updated  
    • Section 2 “Pinning information”: updated  
    • Table 6 and 7: updated according to latest measurements  
    • Figure 1, 2, 4, 5, 7 to 9, 15, 17 and 18: updated  
    • Figure 3, 6, 10 to 14: added  
    • Section 8 “Test information”: added  
    • Section 10 “Packing information”: updated  
    • Section 11 “Soldering”: added  
    • Section 13 “Legal information”: updated  
    BC639_BCP56_BCX56 v.8  
    BC639_BCP56_BCX56 v.7  
    BC639_BCP56_BCX56 v.6  
    20070622  
    20050308  
    20050303  
    Product data sheet  
    Product data sheet  
    Product data sheet  
    -
    BC639_BCP56_BCX56 v.7  
    BC639_BCP56_BCX56 v.6  
    -
    CPCN2004050 BC635_637_639 v.4  
    29  
    BCP54_55_56 v.5  
    BCX54_55_56 v.4  
    BC635_637_639 v.4  
    BCP54_55_56 v.5  
    BCX54_55_56 v.4  
    20011010  
    20030206  
    20011010  
    Product specification  
    Product specification  
    Product specification  
    -
    -
    -
    BC635_637_639 v.3  
    BCP54_55_56 v.4  
    BCX54_55_56 v.3  
    BCP56_BCX56_BC56PA  
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    13. Legal information  
    13.1 Data sheet status  
    Document status[1][2]  
    Product status[3]  
    Development  
    Definition  
    Objective [short] data sheet  
    This document contains data from the objective specification for product development.  
    This document contains data from the preliminary specification.  
    This document contains the product specification.  
    Preliminary [short] data sheet Qualification  
    Product [short] data sheet Production  
    [1]  
    [2]  
    [3]  
    Please consult the most recently issued document before initiating or completing a design.  
    The term ‘short data sheet’ is explained in section “Definitions”.  
    The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
    information is available on the Internet at URL http://www.nxp.com.  
    malfunction of an NXP Semiconductors product can reasonably be expected  
    13.2 Definitions  
    to result in personal injury, death or severe property or environmental  
    damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
    NXP Semiconductors products in such equipment or applications and  
    therefore such inclusion and/or use is at the customer’s own risk.  
    Draft — The document is a draft version only. The content is still under  
    internal review and subject to formal approval, which may result in  
    modifications or additions. NXP Semiconductors does not give any  
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    Applications — Applications that are described herein for any of these  
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    representation or warranty that such applications will be suitable for the  
    specified use without further testing or modification.  
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    full information. For detailed and full information see the relevant full data  
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    shall an agreement be valid in which the NXP Semiconductors product is  
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    Product data sheet.  
    NXP Semiconductors does not accept any liability related to any default,  
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    Semiconductors products in order to avoid a default of the applications and  
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    13.3 Disclaimers  
    Limiting values — Stress above one or more limiting values (as defined in  
    the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
    damage to the device. Limiting values are stress ratings only and (proper)  
    operation of the device at these or any other conditions above those given in  
    the Recommended operating conditions section (if present) or the  
    Characteristics sections of this document is not warranted. Constant or  
    repeated exposure to limiting values will permanently and irreversibly affect  
    the quality and reliability of the device.  
    Limited warranty and liability — Information in this document is believed to  
    be accurate and reliable. However, NXP Semiconductors does not give any  
    representations or warranties, expressed or implied, as to the accuracy or  
    completeness of such information and shall have no liability for the  
    consequences of use of such information.  
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    BCP56_BCX56_BC56PA  
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    Product data sheet  
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    20 of 22  
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    Quick reference data — The Quick reference data is an extract of the  
    product data given in the Limiting values and Characteristics sections of this  
    document, and as such is not complete, exhaustive or legally binding.  
    13.4 Trademarks  
    Notice: All referenced brands, product names, service names and trademarks  
    are the property of their respective owners.  
    14. Contact information  
    For more information, please visit: http://www.nxp.com  
    For sales office addresses, please send an email to: salesaddresses@nxp.com  
    BCP56_BCX56_BC56PA  
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    15. Contents  
    1
    Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
    1.1  
    1.2  
    1.3  
    1.4  
    General description . . . . . . . . . . . . . . . . . . . . . 1  
    Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
    Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
    Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
    2
    Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
    Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
    Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
    Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
    Thermal characteristics . . . . . . . . . . . . . . . . . . 6  
    Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12  
    Test information. . . . . . . . . . . . . . . . . . . . . . . . 14  
    Quality information . . . . . . . . . . . . . . . . . . . . . 14  
    Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14  
    Packing information . . . . . . . . . . . . . . . . . . . . 15  
    Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
    Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19  
    3
    4
    5
    6
    7
    8
    8.1  
    9
    10  
    11  
    12  
    13  
    Legal information. . . . . . . . . . . . . . . . . . . . . . . 20  
    Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20  
    Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
    Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
    Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
    13.1  
    13.2  
    13.3  
    13.4  
    14  
    15  
    Contact information. . . . . . . . . . . . . . . . . . . . . 21  
    Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
    Please be aware that important notices concerning this document and the product(s)  
    described herein, have been included in section ‘Legal information’.  
    © NXP B.V. 2011.  
    All rights reserved.  
    For more information, please visit: http://www.nxp.com  
    For sales office addresses, please send an email to: salesaddresses@nxp.com  
    Date of release: 25 October 2011  
    Document identifier: BCP56_BCX56_BC56PA  
    配单直通车
    BCX56/T1产品参数
    型号:BCX56/T1
    生命周期：Obsolete
    IHS 制造商：NXP SEMICONDUCTORS
    包装说明：,
    Reach Compliance Code：unknown
    ECCN代码：EAR99
    风险等级：5.62
    Base Number Matches：1
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