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产品型号BD9306AFVM-TR的Datasheet PDF文件预览

Large Current External FET Controller Type Switching Regulators  
Single-output Step-up,High-efficiency  
Switching Regulator(Controller Type)  
BD9306AFVM  
Single-output Step-up,High-efficiency  
Switching Regulator(Controller Type)  
No.09028EAT04  
BD9305AFVM  
Description  
BD9305AFVM / BD9306AFVM are 1-channel DC/DC converter controllers. Step-down DC/DC converter can be configured  
by BD9305AFVM, and Step-up DC/DC converter can be configured by BD9306AFVM. In addition, the master slave function,  
which is that the synchronization is possible at the time of multi-connection, is mounted.  
Features  
1) 1ch PWM Control DC/DC Converter Controller  
2) Input Voltage Range:4.2 to 18V  
3) Feed Back Voltage:1.25±1.6%  
4) Oscillating Frequency Variable:100 to 800kHz  
5) Built-in Soft Start Function  
6) Standby Current of 0 A (Typ.)  
7) Built-in Master / Slave Function  
8) Protection Circuit : Under Voltage Lockout Protection Circuit  
Thermal Shutdown Circuit  
Short Protection Circuit of Timer Latch type  
9) MSOP8 Package  
Applications  
TV, Power Supply for the TFT-LCD Panels used for LCD TVs, Back Lights  
DSC, DVC, Printer, DVD ,DVD Recorder, Generally Consumer Equipments etc.  
Absolute maximum ratings (Ta = 25°C)  
Parameter  
Symbol  
Limit  
Unit  
Power supply voltage**  
Vcc  
Pd  
20  
588*  
V
mW  
Power dissipation  
Operating temperature range  
Storage temperature range  
Maximum junction temperature  
Topr  
Tstg  
Tjmax  
-40 to +85  
-55 to +150  
150  
* Reduced by 4.7 mW/°C over 25°C, when mounted on a glass epoxy 4-layer board (70 mm 70 mm 1.6 mm)  
** Must not exceed Pd.  
Recommended Operating Ranges (Ta=-40to +85)  
Limit  
Parameter  
Symbol  
Unit  
Min  
4.2  
Typ  
12  
Max  
18  
Power supply voltage  
Control Voltage  
Vcc  
VENB  
CT  
V
V
Vcc  
1000  
50  
Timing Capacity  
100  
5
pF  
kΩ  
kHz  
Timing Resistance  
Oscillating frequency  
RT  
Fosc  
100  
800  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
1/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Electrical Characteristics (Unless otherwise specified Ta=25,VCC=12V,CT=200pF,RT=20kΩ)  
Limit  
Parameter  
Symbol  
Unit  
Conditions  
Min  
Typ  
Max  
Triangular Waveform Oscillator Block】  
Oscillating frequency  
FOSC  
165  
0.80  
0.20  
220  
0.85  
0.25  
275  
0.90  
0.30  
kHz  
V
Vcc=5V  
Charge Threshold Voltage  
Discharge Threshold Voltage  
VOSC+  
VOSC-  
V
Under-voltage lockout protection circuit】  
Threshold Voltage  
Error amp Block】  
Feed Back Voltage  
Input Bias Current  
VUT  
3.5  
4.2  
V
VFB  
IIB  
1.230  
1.250  
0.05  
50  
1.270  
1
V
µA  
µA  
µA  
FB=1.5V  
COMP Sink Current  
COMP Source Current  
Gate Drive Block】  
ON Resistance  
IOI  
35  
65  
FB=1.5V COMP=1.25V  
FB=1.0V COMP=1.25V  
IOO  
35  
50  
65  
Ron  
VGDL  
VGDH  
MDT  
5
0
0.5  
Ω
V
Gate Drive Voltage L  
Gate Drive Voltage H  
MAX Duty (BD9305AFVM)  
MAX Duty (BD9306AFVM)  
Control Block】  
No Load  
No Load  
Vcc=5V  
Vcc=5V  
Vcc-0.5  
Vcc  
83  
V
100  
%
%
MDT  
ON Voltage  
VON  
VOFF  
IENB  
2
60  
0.3  
90  
V
V
OFF Voltage  
40  
ENB Sink Current  
µA  
ENB=5V  
Soft Start Block】  
Soft Start Time  
TS  
10  
ms  
Timer Latch Protection Circuit】  
Latch Detection COMP Voltage  
Latch Delay OSC Count Number  
Latch Delay Time  
VLC  
CNT  
DLY  
1.5  
1.7  
2200  
10  
1.9  
V
COUNT  
ms  
Overall】  
Standby Current  
ISTB  
ICC  
0
10  
µA  
ENB=0FF  
Average Consumption Current  
1.0  
1.5  
2.5  
mA  
No Switching  
*This product is not designed for protection against radio active rays.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
2/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Electrical Characteristics (Unless otherwise specified,VCC=12V, Ta=25)  
300  
280  
260  
240  
220  
200  
1
0.5  
0
4
3
2
1
0
Ta=85  
Ta=25  
Ta=85  
Ta=25  
Ta=40  
-0.5  
-1  
Ta=-40  
10  
0
5
15  
20  
25  
0
1
2
3
4
5
-40  
-15  
10  
35  
60  
85  
INPUT VOLTAGE:VCC[V]  
INPUT VOLTAGE:VCC[V]  
AMBIENT TEMPERATURE:Ta[  
]
Fig.1 Standby Circuit Current  
Fig.3 Frequency vs Temperature  
Fig.2 Average Consumption Current  
0
-200  
-400  
-600  
-800  
-1000  
1000  
800  
600  
400  
200  
0
100  
80  
60  
40  
20  
0
0
1
2
3
4
5
0
1
2
3
4
5
0
0.5  
1
1.5  
2
2.5  
GD VOLTAGE:VGD[V]  
GD VOLTAGE:VGD[V]  
COMP VOLTAGE:VCOMP[V]  
Fig.5 GD Source Current  
Fig.4 GD Sink Current  
Fig.6 COMP Sink Current  
1.252  
1.250  
1.248  
1.246  
1.244  
0
-20  
0.1  
0.08  
0.06  
0.04  
0.02  
0
-40  
-60  
-80  
-100  
0
0.5  
1
1.5  
2
2.5  
-40  
-15  
10  
35  
60  
85  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
COMP VOLTAGE:VCOMP[V]  
AMBIENT TEMPERATURE:Ta[  
]
FB VOLTAGE:VFB[V]  
Fig.8 Feed Back vs Temperature  
Fig.7 COMP Source Current  
Fig.9 FB Input Bias Current  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
3/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Electrical Characteristics (Unless otherwise specified,Ta=25)  
125  
100  
75  
50  
25  
0
250  
200  
150  
100  
50  
125  
100  
75  
50  
25  
0
Ta=85  
Ta=25  
Ta=-40  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0.0  
2.5  
5.0  
7.5  
10.0  
12.5  
COMP VOLTAGE:VCOMP[V]  
COMP VOLTAGE:VCOMP[V]  
ENB VOLTAGE:VENB[V]  
Fig.12 COMP vs DUTY  
(BD9306AFVM)  
Fig.10 ENB Input Current  
Fig.11 COMP vs DUTY  
(BD9305AFVM)  
90  
90  
86  
82  
78  
74  
70  
88  
86  
84  
82  
80  
ΔV=166mV  
Io=1A  
VCC=12V Vo=5V  
-40  
-15  
10  
35  
60  
85  
200  
300 400  
500  
600 700  
800  
AMBIENT TEMPERATURE[  
]
SWITCHING FREQUENCY[kHz]  
Fig.13 Temperature vs MAX Duty  
(BD9306AFVM)  
Fig.14 Frequency vs MAX Duty  
(BD9306AFVM)  
Fig.15 Load Response  
(BD9305AFVM)  
100  
90  
80  
70  
60  
50  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
ΔV=380mV  
VCC=12V Vo=5V  
Io=SWEEP  
Fsw=220kHz  
Ta=25℃  
VCC=12V Vo=16V  
Io=SWEEP  
Fsw=220kHz  
Ta=25℃  
40  
30  
20  
10  
0
Io=500mA  
VCC=12V Vo=16V  
0.0  
0.5  
1.0  
1.5  
2.0  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
OUTPUT CURRENT[A]  
OUTPUT CURRENT[A]  
Fig.16 Load Response  
(BD9306AFVM)  
Fig.17 Efficiency Characteristics  
(BD9305AFVM)  
Fig.18 Efficiency Characteristics  
(BD9306AFVM)  
www.rohm.com  
2009.05 - Rev.A  
4/14  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9306AFVM, BD9305AFVM  
Block Diagram  
GND  
Vcc  
FB  
COMP  
7
6
8
5
Soft  
Start  
Err  
1.25V  
Vref  
Timer  
Latch  
UVLO  
TSD  
Shut Down  
PWM  
Shut Down  
DRV  
OSC  
VCC  
ENABLE  
2
3
1
4
ENB  
GD  
Vcc  
CT  
RT  
FB  
GND  
COMP  
7
6
8
5
Soft  
Start  
Err  
1.25V  
Vref  
Timer  
Latch  
UVLO  
TSD  
Shut Down  
Shut Down  
PWM  
DRV  
OSC  
ENABLE  
3
2
1
4
ENB  
GD  
RT  
CT  
Fig19. Pin Assignment Diagram & Block Diagram (Above:BD9305AFVM / Below:BD9306AFVM)  
Pin Assignment and Pin Function  
Pin No  
Pin Name  
Function  
Timing Resistance connection Pin  
1
2
3
4
5
6
7
8
RT  
CT  
Timing Capacity connection Pin  
Control Pin  
ENB  
GD  
Gate Drive Output Pin  
Power Supply Pin  
Vcc  
GND  
COMP  
FB  
Ground pin  
Error amp output Pin  
Error amp inversion input Pin  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
5/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Block Diagram / Application Circuit  
10000F  
5.1kΩ  
VCC  
GND  
Vcc  
FB  
COMP  
10uF  
6
8
7
5
Soft  
Start  
Err  
0.5Ω  
1.25V  
Vref  
Timer  
Latch  
UVLO  
(When Output Short,  
Protect Fall VCC)  
TSD  
Shut Down  
Shut Down  
47uH  
Vo  
DRV  
PWM  
OSC  
1kΩ  
VCC  
20uF  
30kΩ  
10kΩ  
470pF  
ENABLE  
1
RT  
2
3
4
ENB  
GD  
CT  
20kΩ  
200pF  
10kΩ  
VCC  
Fig.20 Block Diagram / Application Circuit (BD9305AFVM)  
10000pF  
3.9kΩ  
GND  
Vcc  
FB  
COMP  
10uF  
5
6
8
7
Soft  
Start  
Err  
47uH  
1.25V  
Vref  
Timer  
Latch  
UVLO  
TSD  
Shut Down  
Shut Down  
Vo  
PWM  
DRV  
OSC  
200kΩ  
1kΩ  
20uF  
100pF  
15kΩ  
ENABLE  
3
2
1
4
ENB  
GD  
RT  
CT  
20Ω  
200pF  
10kΩ  
VCC  
Fig.21 Block Diagram / Application Circuit (BD9306AFVM)  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
6/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Block Operation  
Error amplifier (Err)  
It is a circuit that compares the standard voltage of 1.25V (TYP) and the feedback voltage of output voltage.  
The switching Duty is determined by the COMP terminal voltage of this comparison result.  
Oscillator (OSC)  
It is a block, in which the switching frequency is determined by RT and CT, and the triangular wave is determined by RT  
and CT.  
PWM  
The Duty is determined by comparing the output of Error amplifier and the angular wave of Oscillator.  
The switching Duty of BD9306AFVM is limited by the maximum duty ratio that is determined by the internal part, and will  
not be up to 100%.  
DRV  
The gate of the power FET that is connected to the outside is driven by the switching Duty determined by PWM.  
VREF  
It is a block that outputs the internal standard voltage of 2.5V (TYP).  
The internal circuit is entirely the bearer of this standard voltage that is turned ON / OFF by the ENB terminal.  
Protection circuits (UVLO / TSD)  
UVLO (low-voltage Lock Out circuit) shuts down the circuits when the voltage is below 3.5V (MIN).  
Moreover, TSD (temperature protection circuit) shuts down the IC when the temperature reaches 175(TYP).  
Soft Start Circuit  
The Soft Start Circuit limits the current at the time of startup while ramping up the output voltage slowly.  
The overshoot of output voltage and the plunging current can be prevented.  
Timer Latch  
It is an output short protection circuit that detects the output short if the output of error amplifier (COMP voltage) is more  
than 1.7V (TYP). If the COMP voltage becomes more than 1.7V, the counter begins to operate, the LATCH is locked when  
the counter counts to 2200, and the GD output shuts down. (the frequency of counter is determined by RT and CT.)  
Once the LATCH is locked, the GD output does not operate until it is restarted by ENB or VCC. If the output short is  
removed while the Timer latch is counting, the counter is reset.  
Selecting Application Components  
(1) Setting the output L constant (Step Down DC/DC)  
The inductance L to use for output is decided by the rated current ILR and input current maximum value IOMAX of the  
inductance.  
IOMAX + IL should not  
IL  
2
VCC  
reach the rated value level  
ILR  
IL  
IOMAX mean  
current  
Vo  
L
Co  
t
Fig.22 Coil Current Waveform (Step Down DC/DC)  
Fig.23 Output Application Circuit (Step Down DC/DC)  
Adjust so that IOMAX + ΔIL / 2 does not reach the rated current value ILR.  
At this time, IL can be obtained by the following equation.  
1
L
Vo  
Vcc  
1
f
ΔIL=  
X (Vcc-Vo)X  
X
[A]  
Set with sufficient margin because the inductance L value may have the dispersion of ± 30%.  
If the coil current exceeds the rating current ILR of the coil, it may damage the IC internal element.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
7/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
(2) Setting the output L constant (Step Up DC/DC)  
The inductance L to use for output is decided by the rated current ILR and input current maximum value IINMAX of the  
inductance.  
VCC  
IINMAX+ΔIL should not  
2
IL  
reach the rated value level  
L
IL  
Vo  
IINMAX mean  
current  
Co  
t
Fig.24 Coil Current Waveform (Step Up DC/DC)  
Fig.25 Output Application Circuit (Step Up DC/DC)  
Adjust so that IINMAX + ΔIL / 2 does not reach the rated current value ILR.  
At this time, IL can be obtained by the following equation.  
1
L
Vo-Vcc  
Vo  
1
ΔIL=  
Vcc X  
X
[A]  
Where, f is the switching frequency  
Set with sufficient margin because the inductance L value may have the dispersion of ± 30%.  
If the coil current exceeds the rating current ILR of the coil, it may damage the IC internal element.  
(3) Setting the output capacitor  
For the capacitor C to use for the output, select the capacitor which has the larger value in the ripple voltage VPP  
allowance value and the drop voltage allowance value at the time of sudden load change.  
Output ripple voltage is decided by the following equation.  
ΔIL  
2Co  
Vo  
Vcc  
1
f
ΔVPP = ΔIL X RESR +  
X
X
[V]  
(Step Down DC/DC)  
(Step Up DC/DC)  
1
fCo  
Vcc  
Vo  
ΔIL  
2
ΔVPP  
=
ILMAX X RESR +  
X
X (ILMAX -  
) [V]  
Perform setting so that the voltage is within the allowable ripple voltage range.  
For the drop voltage during sudden load change; VDR, please perform the rough calculation by the following equation.  
ΔI  
Co  
VDR =  
X 10μ sec [V]  
However, 10 s is the rough calculation value of the DC/DC response speed. Please set the capacitance considering the  
sufficient margin so that these two values are within the standard value range.  
(4)Setting of feedback resistance constant  
For both BD9305AFVM (step down) and BD9306AFVM (step up), please refer to the following formula for setting of  
feedback resistance.  
We recommend 10kΩ~330kΩ as the setting range. If a resistance below 10kΩ is set, a drop in voltage efficiency will be  
caused; if a resistance more than 330kΩ is set, the offset voltage becomes large because of the internal error amplifier’s  
input bias current of 0.05µA(Typ). Please set the maximum setting voltage of BD9306AFVM (step up) in such a way that  
Duty : (Vo - Vcc) / Vo is less than 70%.  
Reference Voltage 1.25V  
Vo  
R1  
R1 + R2  
R2  
FB  
x 1.25  
[V]  
Vo =  
8
ERR  
R2  
Fig.26 Feedback Resistance Setting  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
8/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
(5) Setting of oscillation frequency  
The angular wave oscillation frequency can be set by respectively connecting resistor and condenser to RT (1 pin) and CT  
(2 pins). The currents to charge and discharge the condenser of CT are determined by RT.  
Please refer to the following drawing for setting the RT’s resistor and the CT’s condenser.  
RT:5~50kΩ, CT:100~1000pF, and the frequency range of 100kHz~800kHz are recommended.  
Please pay attention to that, the switching will stop if your setting is off this range.  
10000  
Ta=25℃  
VCC=12V  
1000  
100  
10  
CT=100pF  
CT=200pF  
CT=470pF  
CT=1000pF  
1
10  
100  
RT [k]  
Fig.27 Frequency Setting  
(6)Selection of input condenser  
For DC/DC converter, the condenser at the input side is also necessary because peak current is flowing between input  
and output. Therefore, we recommend the low ESR condenser with over 10μF and below 100mas the input condenser.  
If a selected condenser is off this range, excessively large ripple voltage will overlaps with the input voltage, which may  
cause IC malfunction.However, this condition varies with negative overcurrent, input voltage, output voltage, inductor’s  
value, and switching frequency, so please be sure to do the margin check with actual devices.  
(7)Selection of output rectifier diode  
We recommend the Schottky barrier diode as the diode for rectification at the output stage of DC/DC converter. Please be  
careful to choose the maximum inductor current, the maximum output voltage and the power supply voltage.  
step-down DC/DC>  
IL  
2
Maximum inductor current  
Power supply voltage  
IOMAX  
Diode’s rated current  
Diode’s rated voltage  
Diode’s rated current  
Diode’s rated voltage  
VCC  
step-up DC/DC>  
IL  
2
Maximum inductor current  
IINMAX  
Maximum output voltage  
VOMAX  
Furthermore, each parameter has a deviation of 30%~40%, so please design in such a way that you have left a  
sufficient margin for deviation in your design.  
(8)Setting of Power FET  
If step-down DC/DC is configured by BD9305AFVM, Pch FET is necessary; if step-up DC/DC is configured by  
BD9306AFVM, Nch FET is necessary.  
Please pay attention to the following conditions when you choose.  
step-down DC/DC>  
IL  
2
Maximum inductor current  
IOMAX  
FET’s rated current  
Power supply voltage  
VCC  
Power supply voltage  
Gate capacity ()  
FET’s rated voltage  
VCC  
CGATE  
FET’s gate ON voltage  
2000pF  
step-up DC/DC>  
IL  
2
Maximum inductor current  
IINMAX  
FET’s rated current  
Maximum output voltage  
Power supply voltage  
VOMAX  
VCC  
FET’s rated voltage  
FET’s gate ON voltage  
Gate capacity ()  
CGATE  
2000pF  
Furthermore, each parameter has a deviation of 30%~40%, so please design in such a way that you have left a sufficient  
margin for deviation in your design.  
() If Gate capacity becomes large, the switch’s switching speed gets slow, which may cause generation of heat and breakdown,  
so please check thoroughly with actual devices.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
9/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
(9) Phase compensation  
Phase Setting Method  
The following conditions are required in order to ensure the stability of the negative feedback circuit.  
Phase lag should be 150° or lower during gain 1 (0 dB) (phase margin of 30° or higher).  
Because DC/DC converter applications are sampled using the switching frequency, the overall GBW should be set to 1/10  
the switching frequency or lower. The target application characteristics can be summarized as follows:  
Phase lag should be 150° or lower during gain 1 (0 dB) (phase margin of 30° or higher).  
The GBW at that time (i.e., the frequency of a 0-dB gain) is 1/10 of the switching frequency or below.  
In other words, because the response is determined by the GBW limitation, it is necessary to use higher switching  
frequencies to raise response.  
One way to maintain stability through phase compensation involves canceling the secondary phase lag (-180°) caused by  
LC resonance with a secondary phase advance (by inserting 2 phase advances).  
The GBW (i.e., the frequency with the gain set to 1) is determined by the phase compensation capacitance connected to  
the error amp. Increase the capacitance if a GBW reduction is required.  
(a) Standard integrator (low-pass filter)  
(b) Open loop characteristics of integrator  
(a)  
A
-20 dB/decade  
Gain  
[dB]  
COMP  
GBW(b)  
A
Feedback  
R
0
F
F
FB  
0
C
-90°  
Phase  
[ ° ]  
-90  
Phase margin  
-180°  
-180  
Fig. 28  
1
2πRCA  
Fig. 29  
1
2πRC  
Point (a) fa =  
[Hz]  
Point (b) fb = GBW =  
[Hz]  
The error amp performs phase compensation of types (a) and (b), making it act as a low-pass filter.  
For DC/DC converter applications, R refers to feedback resistors connected in parallel.  
From the LC resonance of output, the number of phase advances to be inserted is two.  
1
LC resonant frequency fp =  
[Hz]  
2πLC  
Vo  
1
R4  
C1  
Phase advance  
Phase advance  
fz1 =  
fz2 =  
[Hz]  
[Hz]  
R1  
R2  
2πC1R1  
COMP  
1
A
2πC2R3  
R3  
C2  
Fig. 30  
Set a phase advancing frequency close to the LC resonant frequency for the purpose of canceling the LC resonance.  
()If high-frequency noise is generated in the output, FB is affected through condenser C1.  
Therefore, please insert the resistor R4=1kΩ or so, which is in series with condenser C1.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
10/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Example of application  
We recommend the application circuit examples with confidence, but hope that you will thoroughly check the characteristics  
over again when putting them to use.  
When you change the external circuit constant and use, please make a decision to leave a sufficient margin after taking  
into consideration the deviation etc. of external components and ROHM IC, in terms of not only the static characteristic but  
also the transient characteristic.  
Moreover, please understand that our company can not confirm fully with regard to the patent right.  
Master Slave Function>  
The master slave function, which is that the synchronous switching is possible by using these IC of BD9305AFVM /  
BD9306AFVM through their multi-connection, is mounted. The following drawing shows an example of connection circuit  
in which BD9305AFVM is connected on the master side and BD9306AFVM is connected on the slave side.  
VCC  
CTL1  
CTL2  
BD9305AFVM  
BD9306AFVM  
(Master Side)  
(Slave Side)  
CTL0  
Vo2  
RT  
CT  
Vo1  
Fig.31 Master Slave Application Circuit  
In the above-mentioned circuit, BD9306AFVM, which is synchronized with the switching frequency determined by RT and  
CT of BD9305AFVM that is the master, operates.In addition, the ON/OFF of output can be controlled by connecting the  
switch to the COMP terminal. (Refer to the following table)  
Control signal correspondence table  
Output state  
Control signal  
Vo1  
OFF  
OFF  
ON  
Vo2  
OFF  
ON  
CTL0  
Low  
CTL1  
CTL2  
High  
High  
High  
High  
Low  
Low  
Low  
High  
Low  
OFF  
ON  
ON  
The same in either case of High / Low.  
Similarly in the case of connecting three or more than three, synchronization is possible by connecting the CT terminal of  
Master and the CT terminal of Slave  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
11/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
I/O Equivalent Circuit Diagram Fig.32  
1.RT  
VCC  
4.GD  
VCC  
VREF  
A
VCC(BD9305AFVM)  
GND(BD9306AFVM)  
A:  
2.CT  
VCC  
7.COMP  
VCC  
VREF  
VREF  
3.ENB  
8.FB  
VCC  
VREF  
Fig. 32  
www.rohm.com  
2009.05 - Rev.A  
12/14  
© 2009 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BD9306AFVM, BD9305AFVM  
Notes for use  
1) Absolute maximum ratings  
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may  
result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such  
damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special  
mode where the absolute maximum ratings may be exceeded is anticipated.  
2) GND potential  
Ensure a minimum GND pin potential in all operating conditions.  
3) Setting of heat  
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.  
4) Pin short and mistake fitting  
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in  
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by the  
presence of a foreign object may result in damage to the IC.  
5) Actions in strong magnetic field  
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.  
6) Testing on application boards  
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.  
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure,  
and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or  
removing it from a jig or fixture during the inspection process.  
7) Ground wiring patterns  
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,  
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage  
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the  
GND wiring patterns of any external components.  
8)Regarding input pin of the IC  
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.  
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of  
parasitic elements.For example, when the resistors and transistors are connected to the pins shown as follows, a parasitic  
diode or a transistor operates by inverting the pin voltage and GND voltage.  
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result  
of the IC's architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC  
malfunction and damage. For these reasons, it is necessary to use caution so that the IC is not used in a way that will  
trigger the operation of parasitic elements such as by the application of voltages lower than the GND (P substrate) voltage  
to input and output pins.  
Example of a SimpleMonolithic IC Architecture  
Resistor  
Transistor (NPN)  
(Pin B)  
B
E
(Pin A)  
C
E
C
(Pin B)  
B
GND  
GND  
N
P
P
P+  
P+  
P+  
Parasitic  
elements  
P+  
N
N
N
P
N
N
N
(Pin A)  
P substrate  
GND  
Parasitic elements  
GND  
Parasitic  
elements  
Parasitic elements  
GND  
Fig. 33  
9) Overcurrent protection circuits  
An overcurrent protection circuit designed according to the output current is incorporated for the prevention of IC damage  
that may result in the event of load shorting. This protection circuit is effective in preventing damage due to sudden and  
unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or  
transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capacity has negative  
characteristics to temperatures.  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
13/14  
Technical Note  
BD9306AFVM, BD9305AFVM  
Ordering part number  
B D  
9
3
0
6
A
F
V M  
-
T
R
Part No.  
Part No.  
9306A  
9305A  
Package  
Packaging and forming specification  
TR: Embossed tape and reel  
FVM: MSOP8  
MSOP8  
<Tape and Reel information>  
2.9 0.1  
(MAX 3.25 include BURR)  
Tape  
Embossed carrier tape  
3000pcs  
+
6°  
4°  
Quantity  
4°  
8
7
6
5
TR  
Direction  
of feed  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
1
2
3
4
1PIN MARK  
+0.05  
1pin  
+0.05  
0.145  
–0.03  
0.475  
S
0.22  
–0.04  
0.08  
S
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
0.65  
Reel  
(Unit : mm)  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
2009.05 - Rev.A  
14/14  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,  
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of  
any of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2009 ROHM Co., Ltd. All rights reserved.  
R0039  
A
配单直通车
BD9306AFVM-TR产品参数
型号:BD9306AFVM-TR
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
零件包装代码:MSOP
包装说明:VSSOP, TSSOP8,.16
针数:8
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:0.89
模拟集成电路 - 其他类型:SWITCHING CONTROLLER
控制模式:VOLTAGE-MODE
控制技术:PULSE WIDTH MODULATION
最大输入电压:18 V
最小输入电压:4.2 V
标称输入电压:12 V
JESD-30 代码:R-PDSO-G8
长度:2.9 mm
功能数量:1
端子数量:8
最高工作温度:85 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:VSSOP
封装等效代码:TSSOP8,.16
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified
座面最大高度:0.9 mm
子类别:Switching Regulator or Controllers
表面贴装:YES
切换器配置:SINGLE
最大切换频率:800 kHz
温度等级:INDUSTRIAL
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.8 mm
Base Number Matches:1
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